Power equipment and circuit board structure thereof
By adopting a split circuit board structure in power equipment, dividing transistors and other components into multiple groups, and laying them on independent circuit boards, the problem of excessive area of PCB boards in existing power equipment is solved, and the overall volume reduction of the circuit board structure and the convenience of PCBA processing is achieved.
Patent Information
- Application Number
- CN202421611296.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-07-08
AI Technical Summary
The area of PCB boards of existing power equipment is too large, which leads to difficulty in processing PCBA, excessive projection of finished products of the machine, and the overall appearance is bulky and inconsistent.
Using a split circuit board structure, transistors and other components are divided into multiple groups, and transistors on the high-voltage side and low-voltage side are arranged on the independent first circuit board, and control circuits are arranged on the second circuit board, and the two boards are connected through a wiring line.
It reduces the overall volume of the circuit board and reduces the difficulty of PCBA processing. It is suitable for most PCBA processing track widths, saves human resources, makes full use of the radiator, and reduces product costs.
Smart Images
Figure CN222776383U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of circuit board arrangement of electric equipment, and in particular relates to a circuit board structure of electric equipment. Background Art
[0002] Inverters, photovoltaic and storage devices and other power equipment often use more power components, including many transistors (such as diodes, triodes, MOSFET or IGBT, etc.). In the existing PCB all-in-one machine layout, the PCB board puts these power components on the same PCB board, which will cause the PCB single board area to be too large, causing difficulties in PCBA processing, the finished product projection of the machine is too large, and the overall appearance of the machine is bulky and uncoordinated. Utility Model Content
[0003] In order to solve the above technical problems, the utility model provides an improved circuit board structure of electric equipment, which has a smaller overall size and reduces the difficulty of PCBA processing. The utility model also provides an electric equipment using the circuit board structure, which has a smaller overall volume and fully utilizes the heat sink.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A circuit board structure of an electric device comprises a first circuit board, a second circuit board and a plurality of components, wherein the plurality of components comprises a plurality of transistors, wherein the plurality of transistors are arranged on the first circuit board, and a heat sink is provided on the first circuit board or in contact with the heat sink; and a control circuit of the electric device is provided on the second circuit board.
[0006] In a preferred embodiment, the second circuit board is provided with a control circuit of the power device and other circuits that do not include transistors. In other words, the circuits of the power device that do not include transistors are all provided on the second circuit board.
[0007] In a preferred embodiment, the multiple transistors are divided into multiple groups, the voltages of the transistors in each group are equal or the voltage difference is within a set range, the transistors of the first group of transistors are arranged in the first area of the first circuit board, and the transistors of the second group of transistors are arranged in the second area of the first circuit board, and the first area and the second area are spaced apart.
[0008] In a more preferred embodiment, the first circuit board further has a third area, the third area is located between the first area and the second area, and driving circuits for the transistors of the first group of transistors and the second group of transistors are arranged in the third area.
[0009] In a more preferred embodiment, a low-voltage side input circuit is further provided on the first circuit board, and the low-voltage side input circuit is arranged adjacent to the first area, and the output end of the low-voltage side input circuit and the first group of transistors are electrically connected via a line on the first circuit board.
[0010] In a further preferred embodiment, a low-voltage side inductor is further arranged on the first region, and the low-voltage side inductor is inserted in the middle of the first group of transistors.
[0011] In a more preferred embodiment, components with or without voltage difference with the second group of transistors are interspersed in the middle of the second group of transistors. That is, other components are interspersed in the middle of the second group of transistors to reduce extra wiring, shorten the loop, and improve EMC.
[0012] In a further preferred embodiment, the high-voltage side components include high-voltage side BUS capacitors.
[0013] In a more preferred embodiment, the first group of transistors includes transistors of a BUCK circuit, a BOOST circuit or a low-voltage rectifier circuit, and the second group of transistors includes transistors of a high-voltage side rectifier bridge or an inverter bridge.
[0014] In a preferred embodiment, the second circuit board is also provided with one or more of a communication circuit, a power supply circuit, an output circuit, and a voltage and / or current sampling circuit.
[0015] In a preferred embodiment, the first circuit board and the second circuit board are electrically connected via a flat cable. In a more preferred embodiment, the flat cable includes a power signal flat cable for transmitting a power signal, and a threading hole is provided in the middle of the second circuit board for the power signal flat cable to pass through.
[0016] The utility model also adopts the following technical solutions:
[0017] An electric power device comprises the circuit board structure.
[0018] In a specific embodiment, the power equipment includes an inverter, a photovoltaic storage integrated machine or a photovoltaic combiner box.
[0019] The above solution adopted by the utility model has the following advantages:
[0020] The circuit board structure of the utility model reduces the size of the PCBA of the circuit board, so that the overall volume of the circuit board structure is smaller, and the size of the PCBA is suitable for the track width of most PCBA processing, saving human resources, making full use of the heat sink, and reducing product costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 It is a structural diagram of a first circuit board according to an embodiment of the utility model.
[0023] Figure 2 4 is a structural diagram of a second circuit board according to an embodiment of the utility model.
[0024] in,
[0025] 1. first circuit board; 101. interconnection terminal; 11. first area; 12. second area; 13. third area;
[0026] 2. Second circuit board; 201. Interconnection terminal; 202. Threading hole;
[0027] 3. Support column;
[0028] 20. Low-voltage side input circuit; 30. First group of transistors; 40. Second group of transistors; 50. Drive circuit; 60. Control circuit; 70. Power supply circuit; 80. Output circuit; 90. High-voltage input circuit; 100. Communication circuit; 300. Inductor; 400. Capacitor. DETAILED DESCRIPTION
[0029] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0030] This embodiment relates to a circuit board structure of an electric power device. The electric power device may be an inverter, a photovoltaic storage integrated device or a photovoltaic combiner box. Figure 1 and Figure 2 As shown, the circuit board structure of the power equipment includes a first circuit board 1, a second circuit board 2 and a plurality of components. The first circuit board 1 and the second circuit board 2 are independently arranged and can be connected by a support plate or a support column 3 and physically separated from each other. The plurality of components include a plurality of transistors, and the plurality of transistors are arranged on the first circuit board 1. The first circuit board 1 is provided with a heat sink or is in contact with the heat sink. The second circuit board 2 is provided with a control circuit 60 of the power equipment and other circuits that do not contain transistors.
[0031] like Figure 1 As shown, the first circuit board 1 is provided with the low-voltage side input circuit of the power equipment, all transistors, transistor drivers, sampling circuits between transistors, and temperature sampling circuits. All transistors are arranged on the same first circuit board 1, so that the heat sink can be fully utilized to improve the heat dissipation efficiency. At the same time, the size of the heat sink can be reduced while ensuring the heat dissipation effect of the transistors, thereby reducing the weight of the power equipment and reducing the cost of the power equipment.
[0032] Further, a plurality of transistors are divided into a plurality of groups, including a first group of transistors 30 and a second group of transistors 40, the voltage of each group of transistors is equal or the voltage difference is within a set range, the first group of transistors 30 is a low-voltage side transistor, and the second group of transistors 40 is a high-voltage side transistor. Each transistor of the first group of transistors 30 is arranged in the first area 11 of the first circuit board 1, and each transistor of the second group of transistors 40 is arranged in the second area 12 of the first circuit board 1, and the first area 11 and the second area 12 are arranged at intervals. The transistors are divided into two rows (or two columns) according to high and low voltages (tubes with large pressure differences), and the transistors in the same row belong to the same voltage, the electrical circuit is shorter, the safety distance is smaller, the effective copper plating area is larger, the impedance is reduced, the current of the copper foil is larger, and the temperature can also be reduced. The high and low voltages are divided and do not interfere with each other, so that the EMC effect is better. In some other embodiments, the positions of the first group of transistors 30 and the second group of transistors 40 can be interchanged.
[0033] Furthermore, the first circuit board 1 also has a third area 13, and the third area 13 is located between the first area 11 and the second area 12. The driving circuit 50 (including driving IC, etc.) for the transistors of the first group of transistors 30 and the second group of transistors 40 is arranged in the third area 13. The transistor drive is placed between the two rows of transistors. On the one hand, it makes the overall driving circuit shorter. On the other hand, the lengths of the driving circuits of different transistors are closer, and the EMC effect is better. On the other hand, this layout just separates the transistors to prevent the heat from being concentrated in the transistors, and reduces the probability of problems caused by overheating of the transistors, so that the power equipment can work better. The third area 13 is provided with the driving circuit 50 for the transistor to shorten the overall length of the driving line, and also takes into account the driving lengths between different transistors, so that the transistor drive can be as synchronized as possible.
[0034] A low-voltage side input circuit 20 is also provided on the first circuit board 1, and the low-voltage side input circuit 20 is arranged adjacent to the first region 11, and the output end of the low-voltage side input circuit 20 and the first group of transistors 30 are electrically connected through the line on the first circuit board 1. A low-voltage side inductor 300 is also arranged on the first region 11, and the low-voltage side inductor 300 is interspersed in the middle of the first group of transistors 30.
[0035] High-voltage side components are also arranged on the second area 12, and the high-voltage side components are inserted in the middle of the second group of transistors 40. The high-voltage side components include a high-voltage side BUS capacitor 400. The high-voltage side components can be components of any voltage, that is, other components are inserted in the middle of the second group of transistors to reduce additional wiring, shorten the loop, and improve EMC.
[0036] The first group of transistors 30 includes transistors of a BUCK circuit, a BOOST circuit or a low-voltage rectifier circuit, and the second group of transistors 40 includes transistors of a high-voltage side rectifier bridge or an inverter bridge.
[0037] like Figure 2 As shown, the second circuit board 2 is also provided with one or more of a communication circuit 100, a power circuit 70, an output circuit 80, and a voltage and / or current sampling circuit. Furthermore, the second circuit board 2 is used to set all other circuits other than the components of the first circuit board 1, including a high-voltage input circuit 90, a communication circuit 100, a control circuit 60, a power circuit 70, an output circuit 80, and various other voltage and current sampling circuits. There are no components on the second circuit board 2 that require heat sinks for heat dissipation.
[0038] In a specific example, the first circuit board 1 and the second circuit board 2 are arranged up and down, and connected by a support column 3 and a support plate. The first circuit board 1 and the second circuit board 2 are electrically connected through a cable. Furthermore, the cable includes a power signal cable for transmitting power signals, and a threading hole 202 is provided in the middle of the second circuit board 2 for the power signal cable to pass through, thereby shortening the connection distance, reducing the impact on EMC, and optimizing EMC. The power signal cable is connected to the above-mentioned inductor 300, and the natural need for jumpers of the inductor 300 is utilized to separate the power device and the functional circuit, reduce the connection between boards, reduce the weight of the finished product, and reduce the cost; reduce the workload of the wiring personnel, make wiring easier, and reduce labor costs. In addition, the first circuit board 1 and the second circuit board 2 are respectively arranged with interconnection terminals 101 and 201, and the interconnection terminals 101 on the first circuit board 1 and the interconnection terminals 201 on the second circuit board 2 are electrically connected through small signal cables. The interconnection terminals 101 on the first circuit board 1 and the interconnection terminals 201 on the second circuit board 2 are located on the same side, and are preferably arranged vertically opposite to each other for easy wiring operations. The communication terminals are also on the same side of the interconnection terminals for easy external communication and communication with other circuit boards, and wiring errors are less likely to occur.
[0039] The materials of the substrates of the first circuit board 1 and the second circuit board 2 include glass fiber board, paper substrate, metal substrate, ceramic substrate, etc. The shape of the PCB can be rectangular, circular, or irregular.
[0040] In the above circuit board structure, all transistors are placed on one board, and the heat sink is used as much as possible to reduce the projected area of the box, thereby reducing the volume of the box and improving product competitiveness. The natural need for jumpers of inductor 300 is utilized to separate power devices and functional circuits, reduce connections between boards, reduce the weight of finished products, and reduce costs. Reduce the workload of wiring personnel, make wiring easier, and reduce labor costs. Effectively improve the efficiency and accuracy of PCB design. This embodiment is conducive to reducing the volume of finished products and the size of PCBs, so that this size is suitable for the track width of most PCBA processing, saves human resources, disperses the heat transfer of pipes, makes full use of heat sinks, reduces product costs, and reduces the workload of other functional modules (heat, EMC).
[0041] As shown in this specification and claims, the terms "comprises" and "include" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the relevant listed items.
[0042] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the accompanying drawings.
[0043] The above embodiment is only for illustrating the technical concept and features of the utility model, and is a preferred embodiment. Its purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and it cannot be used to limit the protection scope of the utility model. Any equivalent transformation or modification made according to the principle of the utility model should be included in the protection scope of the utility model.
Claims
1. A circuit board structure of an electric power device, comprising a first circuit board, a second circuit board and a plurality of components, characterized in that: The multiple components include multiple transistors, and the multiple transistors are arranged on the first circuit board. The first circuit board is provided with a heat sink or is in contact with the heat sink; the second circuit board is provided with a control circuit of the power equipment.
2. The circuit board structure according to claim 1, characterized in that: The multiple transistors are divided into multiple groups, the voltages of the transistors in each group are equal or the voltage difference is within a set range, the transistors of the first group of transistors are arranged in the first area of the first circuit board, and the transistors of the second group of transistors are arranged in the second area of the first circuit board, and the first area and the second area are spaced apart.
3. The circuit board structure according to claim 2, characterized in that: The first circuit board further has a third area, which is located between the first area and the second area, and driving circuits for the transistors of the first group of transistors and the second group of transistors are arranged in the third area.
4. The circuit board structure according to claim 2, characterized in that: A low-voltage side input circuit is also provided on the first circuit board. The low-voltage side input circuit is arranged adjacent to the first area. The output end of the low-voltage side input circuit is electrically connected to the first group of transistors via a line on the first circuit board.
5. The circuit board structure according to claim 4, characterized in that: A low-voltage side inductor is also arranged on the first region, and the low-voltage side inductor is inserted in the middle of the first group of transistors.
6. The circuit board structure according to claim 2 or 4, characterized in that: Components having or not having a voltage difference with the second group of transistors are interspersed in the middle of the second group of transistors.
7. The circuit board structure according to claim 6, characterized in that: The high-voltage side components include a high-voltage side BUS capacitor.
8. The circuit board structure according to claim 2, characterized in that: The first group of transistors includes transistors of a BUCK circuit, a BOOST circuit or a low-voltage rectifier circuit, and the second group of transistors includes transistors of a high-voltage side rectifier bridge or an inverter bridge.
9. The circuit board structure according to claim 1, characterized in that: The second circuit board is also provided with one or more of a communication circuit, a power supply circuit, an output circuit, a voltage and / or current sampling circuit; the first circuit board and the second circuit board are electrically connected via a cable, the cable includes a power signal cable for transmitting a power signal, and a threading hole is provided in the middle of the second circuit board for the power signal cable to pass through.
10. An electric power device, characterized in that: The invention comprises a circuit board structure as claimed in any one of claims 1 to 9.