Heat dissipation device

Abstract

The utility model discloses a heat dissipation device which comprises a first shell, a second shell, a heat dissipation pipe, a liquid injection opening, a first capillary liquid absorption core structure, a second capillary liquid absorption core structure, a third capillary liquid absorption core structure and a working medium. In addition, the filling thickness of the second capillary wick structure can be increased, so that the contact area of the second capillary wick structure and the third capillary wick structure is increased, the heat exchange efficiency is improved, meanwhile, a steam opening is formed in the heat dissipation pipe, a gaseous working medium can be rapidly transmitted to the inner surface of the heat dissipation pipe, and the heat diffusion speed is increased. Meanwhile, the first capillary wick structure, the second capillary wick structure and the third capillary wick structure are connected into a whole, the water return efficiency is improved, the heat dissipation effect is improved, and finally the heat dissipation performance of the whole device is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device. Background Art

[0002] A temperature spreader is a highly efficient heat conduction element, mainly used in the heat dissipation system of electronic equipment, including a rectangular shell and a capillary structure on the wall of its internal chamber, and the internal chamber of the shell is filled with a liquid working medium. One side of the shell, namely the evaporation zone, is attached to a heating component such as a chip to absorb the heat generated by the heating component, so that the liquid working medium absorbs heat in the evaporation zone of the shell and is converted into a vapor state. The vapor state working medium is cooled in the condensation zone and condensed into a liquid working medium. The liquid working medium then flows back to the evaporation zone through gravity or a capillary structure to continue the vapor-liquid circulation, so as to achieve the effect of uniform temperature heat dissipation.

[0003] The heat dissipation principle of the heat pipe is similar to that of the vapor chamber. The main method is to fill the hollow part of the heat pipe with metal powder and form a capillary structure on the inner wall of the heat pipe through sintering. When the working medium is heated and evaporated from the evaporation end of the heat pipe, it diffuses to the condensation end of the heat pipe and is cooled and condensed into liquid, and then flows back to the evaporation part through the capillary structure.

[0004] As electronic devices are becoming increasingly miniaturized, high-performance, and integrated, existing electronic devices that are only equipped with a single heat pipe or a temperature-averaging plate can no longer meet the demand. Combining a heat pipe with a temperature-averaging plate to achieve both temperature uniformity and remote heat conduction or heat dissipation can effectively solve the heat dissipation problem of high-power electronic devices. However, how to further optimize the structure on this basis to significantly improve the heat conduction efficiency is still a topic worth studying. Utility Model Content

[0005] In order to solve the above problems, the utility model provides a heat dissipation device, comprising:

[0006] A first shell body, on which a plurality of through holes are formed, and the first shell body is formed with an annular fixing block at the through holes;

[0007] A second shell body, which is opposite to the first shell body and covers and forms an airtight space together. A receiving groove is provided on one side of the second shell body in the airtight space. A bearing layer is provided in the receiving groove. A plurality of annular heat dissipation blocks are formed on the bearing layer.

[0008] A first capillary wick structure is disposed in the airtight space and formed on the surface of the bearing layer and the annular heat sink block;

[0009] The second capillary wick structure is arranged in the airtight space and fills the annular space of the annular heat sink;

[0010] The heat dissipation pipe is a hollow pipe body, one end of the heat dissipation pipe is fixed in the annular space of the annular heat dissipation block, and the other end passes through the through hole of the first shell and is fixed by the annular fixing block. At least two steam ports are also opened at one end of the heat dissipation pipe close to the annular heat dissipation block;

[0011] The third capillary wick structure is arranged on the inner wall of the heat dissipation pipe;

[0012] A liquid injection port, provided on the first shell or the second shell and communicated with the airtight space;

[0013] The working medium is filled into the airtight space through the liquid injection port.

[0014] Preferably, the two steam ports are arranged opposite to each other at one end of the heat dissipation pipe.

[0015] Preferably, the plurality of annular heat dissipation blocks are arranged vertically and horizontally, and each row or column of the annular heat dissipation blocks are connected by a connecting member.

[0016] Preferably, the surfaces of the bearing layer, the annular heat sink block and the connector are all provided with crisscross V-shaped grooves, which divide the surfaces of the bearing layer, the annular heat sink block and the connector into a plurality of parallelogram blocks.

[0017] Preferably, the first capillary wick structure is disposed in the airtight space and formed on the V-shaped groove and the surface of the parallelogram block.

[0018] Preferably, the V-groove depth is 0.1 to 10 mm.

[0019] Preferably, the first capillary wick, the second capillary wick structure and the third capillary wick structure are all copper powder.

[0020] Preferably, the copper powder is powder particles with a size of greater than or equal to 60 meshes and less than or equal to 500 meshes.

[0021] Preferably, the porosity of the copper powder is greater than or equal to 10% and less than or equal to 50%.

[0022] Preferably, the working medium is any one of methanol, ethanol, acetone and pure water.

[0023] The beneficial effect is that compared with simply combining the heat pipe with the temperature equalizing plate, the present application arranges multiple annular heat dissipation blocks on the bearing layer, fixes the heat pipe in the annular heat dissipation blocks, arranges a first capillary wick structure on the bearing layer and the surface of the annular heat dissipation block, fills a second capillary wick structure of a certain thickness in the annular heat dissipation block, and forms a third capillary wick structure on the inner wall surface of the heat pipe, so that the first capillary wick structure, the second capillary wick structure and the third capillary wick structure can be connected into one piece to form a composite capillary wick structure, thereby accelerating the transfer of the working medium from the bearing layer to the heat pipe, and improving The water return efficiency and heat dissipation effect of the heat dissipation device are improved. In addition, the additional annular heat dissipation block can fix the heat dissipation pipe on the one hand, and can also increase the filling thickness of the second capillary wick structure on the other hand, thereby increasing the contact area between the second capillary wick structure and the third capillary wick structure, and improving the heat exchange efficiency. Finally, at least two steam ports are opened at one end of the heat dissipation pipe close to the annular heat dissipation block, so that the gaseous working medium is further quickly transmitted to the inner surface of the heat dissipation pipe, the heat diffusion speed is accelerated, and the heat conduction efficiency of the entire heat dissipation device is greatly improved. Through the above design, the heat dissipation performance of the device is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0025] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0026] Figure 2 This is a schematic diagram of the explosion structure of the utility model Figure 1 ;

[0027] Figure 3 This is a schematic diagram of the structure of the heat dissipation pipe and the annular heat dissipation block of the utility model;

[0028] Figure 4 This is a schematic diagram of the explosion structure of the utility model Figure 2 ;

[0029] In the figure:

[0030] 1. first housing; 11. annular fixing block;

[0031] 2. Second shell; 21. Bearing layer; 22. Annular heat sink; 221. Annular space; 23. Connector;

[0032] 3. Heat dissipation pipe; 31. Steam outlet;

[0033] 4. Liquid injection port. DETAILED DESCRIPTION

[0034] The following will disclose multiple embodiments of the present invention with drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. In other words, in some embodiments of the present invention, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0035] It should be noted that all directional indications such as up, down, left, right, front, back... in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, in the present utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present utility model. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0037] Example

[0038] See also Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the overall structure of the utility model. Figure 2 This is a schematic diagram of the explosion structure of the utility model Figure 1The present application provides a heat dissipation device, including a first shell 1, a second shell 2, a heat dissipation pipe 3, a liquid injection port 4, a first capillary wick structure, a second capillary wick structure, a third capillary wick structure and a working medium, wherein the first shell 1 is provided with a plurality of through holes, and the first shell 1 is provided with an annular fixing block 11 at the through holes; the second shell 2 is relatively covered with the first shell 1 and together forms an airtight space, and a thermal contact surface is provided on a side of the second shell 2 facing away from the airtight space, and the thermal contact surface is used to place a heat source such as a chip, and the second shell 2 is in the airtight space. A receiving groove is provided on one side, a bearing layer 21 is provided in the receiving groove, and a plurality of annular heat dissipation blocks 22 are formed on the bearing layer 21; a first capillary wick structure is provided in the airtight space and formed on the bearing layer 21 and the surface of the annular heat dissipation block 22; a second capillary wick structure is provided in the airtight space and filled in the annular space 221 of the annular heat dissipation block 22, and the filling thickness of the second capillary wick structure can be increased according to the height of the annular heat dissipation block 22, so as to increase the contact area between the second capillary wick structure and the third capillary wick structure and improve the thermal conductivity efficiency.

[0039] See also Figure 3 , Figure 3The schematic diagram of the heat dissipation pipe and the annular heat dissipation block structure of the utility model. The heat dissipation pipe 3 is a hollow tube body, one end of the heat dissipation pipe 3 is fixed in the annular space 221 of the annular heat dissipation block 22, and the other end passes through the through hole of the first shell 1 and is fixed by the annular fixing block 11. The heat dissipation pipe 3 is also provided with at least two steam ports 31 at one end close to the annular heat dissipation block 22. The steam ports facilitate the gaseous working medium to enter the inner cavity of the heat dissipation pipe. Preferably, the two steam ports 31 are arranged opposite to each other at one end of the heat dissipation pipe 3, which is conducive to the formation of convection and accelerated diffusion of the gaseous working medium; the third capillary wick structure is arranged on the inner wall surface of the heat dissipation pipe 3; the first capillary wick structure, the second capillary wick structure and the third capillary wick structure are all copper powder, and the copper powder is powder particles greater than or equal to 60 meshes and less than or equal to 500 meshes. The copper powder particles of this mesh number can not only form The rough surface is formed to improve the bonding strength between the copper powder and the bearing layer, the annular heat sink, and the heat pipe, and the thermal resistance performance of the temperature equalizer can be optimized. If the copper powder particle size is too small, the coolant flow resistance will be too large, and if the copper powder particle size is too large, the capillary force will be too small. Therefore, the copper powder mesh number needs to be within an appropriate range; the porosity of the copper powder is greater than or equal to 10% and less than or equal to 50%. If the copper powder porosity is too small, it is not conducive to the diffusion of the working medium. If the porosity is too large, the structure will be discontinuous, which will make the thermal stability worse. The working medium heat conduction effect is best when the copper powder porosity is within this range; the liquid injection port 4 is provided on the first shell 1 or the second shell 2, and is connected to the airtight space; the working medium is filled into the airtight space through the liquid injection port 4, and the working medium is any one of methanol, ethanol, acetone, and pure water. The working medium filling height is 5 to 20% of the depth of the airtight space. Experiments have shown that the heat dissipation performance of the temperature equalizer is optimal when the working medium filling height is 5-20% of the depth of the airtight space. As the working medium filling height increases, the heat transfer coefficient of the working medium condensation surface will first increase and then decrease, thereby limiting the overall heat transfer performance in a limited space.

[0040] See also Figure 4 , Figure 4 This is a schematic diagram of the explosion structure of the utility model Figure 2 . Multiple annular heat sink blocks 22 are arranged vertically and horizontally, and each row or column of annular heat sink blocks 22 is connected by a connector 23. The connector connects several annular heat sink blocks in series. In the process of making the heat sink device, the number of times and time of placing the annular heat sink blocks can be saved, thereby improving work efficiency. The surfaces of the bearing layer 21, the annular heat sink blocks 22 and the connector 23 are all provided with criss-cross V-grooves, and the depth of the V-grooves is 0.1 to 10 mm. The criss-cross V-grooves divide the surfaces of the bearing layer 21, the annular heat sink blocks 22 and the connector 23 into multiple parallelogram blocks. These V-grooves guide the circulation of the working medium in the airtight space, so that the heat at the heat source can be more evenly transferred to all corners of the device, thereby improving the heat dissipation effect of the temperature equalizing plate. The first capillary wick structure is arranged in the airtight space and formed on the V-grooves and the surfaces of the parallelogram blocks.

[0041] In summary, the present application can be attached to electronic devices to cool the electronic devices, and is particularly suitable for chips. Compared with simply combining the heat pipe 3 with the temperature equalizing plate, the present application provides a plurality of annular heat dissipation blocks 22 on the bearing layer 21, fixes the heat dissipation block 3 in the annular heat dissipation block 22, and provides a first capillary wick structure on the surface of the bearing layer and the annular heat dissipation block 22. At the same time, a plurality of annular heat dissipation blocks 22 are provided on the bearing layer 21, and a second capillary wick structure of a certain thickness is filled in the annular heat dissipation block 22. In this way, the first capillary wick structure, the second capillary wick structure and the third capillary wick structure can be connected into one piece to form a composite capillary wick structure. , accelerate the transfer of the working medium from the bearing layer 21 to the heat pipe 3, improve the water return efficiency and heat dissipation effect of the heat dissipation device, in addition, the addition of the annular heat dissipation block 22 can fix the heat pipe 3 on the one hand, and on the other hand, it can also increase the filling thickness of the second capillary wick structure, thereby increasing the contact area between the second capillary wick structure and the third capillary wick structure, and improving the heat exchange efficiency, and finally at least two steam ports 31 are opened at one end of the heat pipe 3 close to the annular heat dissipation block 22, so that the gaseous working medium can be further quickly transmitted to the inner surface of the heat pipe 3, so that the heat conduction efficiency of the entire heat dissipation device is greatly improved, and the heat dissipation performance of the device is greatly improved through the above comprehensive design.

[0042] The above is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A first shell (1) having a plurality of through holes formed thereon, wherein the first shell (1) has an annular fixing block (11) formed at the through holes; A second shell (2), which is opposite to and covers the first shell (1) and together forms an airtight space, wherein a receiving groove is provided on one side of the second shell (2) in the airtight space, a bearing layer (21) is provided in the receiving groove, and a plurality of annular heat dissipation blocks (22) are formed on the bearing layer (21); A first capillary wick structure is arranged in the airtight space and formed on the surface of the bearing layer (21) and the annular heat sink (22); A second capillary wick structure is disposed in the airtight space and fills the annular space (221) of the annular heat dissipation block (22); A heat dissipation pipe (3) which is a hollow pipe body, one end of the heat dissipation pipe (3) is fixed in the annular space (221) of the annular heat dissipation block (22), and the other end passes through the through hole of the first shell (1) and is fixed by the annular fixing block (11), and at least two steam ports (31) are provided at one end of the heat dissipation pipe (3) close to the annular heat dissipation block (22); A third capillary wick structure is arranged on the inner wall surface of the heat dissipation pipe (3); A liquid injection port (4), provided on the first shell (1) or the second shell (2), and communicated with the airtight space; The working medium is filled into the airtight space through the liquid injection port (4).

2. The heat dissipation device according to claim 1, characterized in that: The two steam ports (31) are arranged opposite to each other at one end of the heat dissipation pipe (3).

3. The heat dissipation device according to claim 1, characterized in that: The plurality of annular heat dissipation blocks (22) are arranged vertically and horizontally, and each row or column of the annular heat dissipation blocks (22) are connected by a connecting piece (23).

4. The heat dissipation device according to claim 3, characterized in that: The surfaces of the bearing layer (21), the annular heat dissipation block (22) and the connecting piece (23) are all provided with crisscrossing V-shaped grooves, and the crisscrossing V-shaped grooves divide the surfaces of the bearing layer (21), the annular heat dissipation block (22) and the connecting piece (23) into a plurality of parallelogram blocks.

5. The heat dissipation device according to claim 4, characterized in that: The first capillary wick structure is arranged in the airtight space and formed on the surface of the V-shaped groove and the parallelogram block.

6. The heat dissipation device according to claim 5, characterized in that: The V-shaped groove has a depth of 0.1 to 10 mm.

7. The heat dissipation device according to claim 1, characterized in that: The first capillary wick, the second capillary wick structure and the third capillary wick structure are all made of copper powder.

8. The heat dissipation device according to claim 7, characterized in that: The copper powder is powder particles with a size of greater than or equal to 60 meshes and less than or equal to 500 meshes.

9. The heat dissipation device according to claim 7, characterized in that: The porosity of the copper powder is greater than or equal to 10% and less than or equal to 50%.

10. The heat dissipation device according to claim 1, characterized in that: The working medium is any one of methanol, ethanol, acetone and pure water.

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