Binding PAD structure
By setting up an observation window in the middle area of the PAD body, the problem of not being able to directly observe the connection between ACF conductive particles and PAD is solved, efficient detection and quality control are achieved, and production costs are reduced.
Patent Information
- Application Number
- CN202421398853.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-19
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-06-19
AI Technical Summary
Since the bound PAD on the glass substrate is usually covered with an opaque metal coating, the connection between the conductive particles of the ACF and the PAD cannot be directly observed from the appearance after the binding is completed, resulting in poor connection.
The observation window is set up in the middle area of the PAD body so that after the IC is bound to the PAD body, the explosion effect of the conductive particles of the heterosquamous conductive film can be viewed through the observation window.
Through the observation window, the connection between ACF conductive particles and the PAD body is directly observed without relying on complex detection equipment, which improves detection efficiency, reduces production costs, and promptly detects binding abnormalities, improving product quality.
Smart Images
Figure CN222784651U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display screens, and more specifically, to a binding PAD structure. Background Art
[0002] With the rapid development of liquid crystal display technology, liquid crystal displays (LCD) have been widely used in various electronic products such as televisions, computers, mobile phones, tablet computers, etc. In the manufacturing process of LCD, the bonding of integrated circuits (IC) and glass substrates is a crucial link. This bonding is usually achieved through anisotropic conductive film (ACF), which is a special conductive material that can conduct electrical signals in a specific direction.
[0003] However, the traditional bonding method has a significant challenge: since the bonding PAD on the glass substrate is usually covered with an opaque metal coating, the connection between the conductive particles of the ACF and the PAD cannot be directly observed from the appearance after the bonding is completed. When there is a problem with the connection between the ACF and the PAD, such as the conductive particles fail to fully explode, resulting in poor connection, this will directly affect the display effect and performance of the LCD. Therefore, we have improved this and proposed a bonding PAD structure.
[0004] For example, a Chinese patent (publication number CN207851696U) discloses a COG structure that is easy to detect. Its specification discloses: In the COG structure, the chip is bonded to the glass substrate by hot pressing of ACF, and the first pin at the bottom thereof is electrically connected to the second pin (generally corresponding to the first pin) provided by the circuit arranged on the glass substrate through the conductive material (such as a conductive gold ball) on the ACF. ACF generally contains a heat-curing adhesive layer. During hot pressing, the adhesive layer solidifies and the chip and the glass substrate are bonded to each other, and the conductive material contained in the adhesive layer is pressed and fixed between the chip and the glass substrate to generate an electrical connection in the vertical direction. However, since the chip often has a certain width, in the actual hot pressing process, if the hot pressing head is tilted, the hot pressing pressure on one side of the chip will be low, so that the conductive material in the ACF cannot be fully pressed, which will cause poor contact between the chip and the glass substrate circuit. This poor contact generally needs to be discovered on the terminal product, thereby increasing the cost of detection. The above patents can prove the defects of the prior art. Utility Model Content
[0005] The technical problem to be solved by the embodiments of the present invention is that since the binding PAD on the glass substrate is usually covered with an opaque metal coating, the connection between the conductive particles of the ACF and the PAD cannot be directly observed from the appearance after the binding is completed.
[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:
[0007] A binding PAD structure comprises: a liquid crystal display module, a PAD body is arranged on the liquid crystal display module, and an observation window is arranged in the middle area of the PAD body, so that the blasting effect of conductive particles of anisotropic conductive adhesive film can be viewed through the observation window after the IC is bound to the PAD body.
[0008] As an improved manner of the utility model, the liquid crystal display screen module includes a lower glass, and the PAD body is arranged on the lower glass.
[0009] As an improved manner of the utility model, a lower polarizer is arranged on one side of the lower glass, an upper glass is arranged on the side of the lower glass away from the lower polarizer, and an upper polarizer is arranged on the side of the upper glass away from the lower glass.
[0010] As an improved manner of the utility model, a soldering pad is further provided on the lower glass, and the soldering pad is located below the PAD body.
[0011] As an improved manner of the utility model, a positioning mark is also provided on the lower glass, the positioning mark is located on one side of the PAD body, and the positioning mark is used for positioning during IC binding.
[0012] As an improvement of the utility model, an auxiliary component is further provided on the lower glass, and the auxiliary component is used for protection before the PAD body is bound, and the auxiliary component is also used for limiting the position when the IC is bound.
[0013] As an improved manner of the utility model, the auxiliary component includes protective glue, and the protective glue is bonded to the lower glass.
[0014] As an improved manner of the utility model, an isolation film is provided in the middle of the protective adhesive, and the isolation film covers the PAD body.
[0015] As an improvement of the utility model, a tearing handle is fixedly connected to one end of the protective glue.
[0016] Compared with the prior art, the embodiments of the present invention mainly have the following beneficial effects:
[0017] In order to solve the problem in the prior art that the binding PAD on the glass substrate is usually covered with a layer of opaque metal coating, which makes it impossible to directly observe the connection between the conductive particles of the ACF and the PAD from the appearance after the binding is completed, the present application sets an observation window in the middle area of the PAD body, so that the blasting effect of the conductive particles of the anisotropic conductive adhesive film can be viewed through the PAD body after the IC is bound to the PAD body, thereby improving efficiency. Through this design of the present application, after the binding is completed, there is no need to rely on any complex detection equipment, and the connection between the ACF conductive particles and the PAD body can be directly observed by the naked eye. This intuitive detection greatly improves the detection efficiency and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A schematic diagram of the structure of the binding PAD structure provided in this application;
[0019] Figure 2 A stack diagram of the binding PAD structure provided for this application;
[0020] Figure 3 A schematic diagram of the structure of a rectangular transparent observation window bound to a PAD structure provided in this application;
[0021] Figure 4 A schematic diagram of the structure of a cross-shaped transparent observation window for binding a PAD structure provided in this application;
[0022] Figure 5 A schematic diagram of the structure of a parallelogram transparent observation window with a PAD structure provided in this application;
[0023] Figure 6 A schematic diagram of the structure of a circular transparent observation window for binding a PAD structure provided in this application;
[0024] Figure 7 A schematic diagram of the structure of a triangular transparent observation window bound to a PAD structure provided in this application;
[0025] Figure 8 A schematic diagram of the structure of the auxiliary components for binding the PAD structure provided in this application.
[0026] Indicated in the figure:
[0027] 1. LCD display module; 101. Lower glass; 102. Lower polarizer; 103. Upper glass; 104. Upper polarizer; 105. Solder pad; 2. Binding PAD; 201. Observation window; 3. Auxiliary components; 301. Protective glue; 302. Isolation film; 303. Tear handle; 4. Positioning mark. DETAILED DESCRIPTION
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention belongs; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Reference to "embodiments" herein means that specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0029] As described in the background technology, the traditional bonding method has a significant challenge: since the bonding PAD on the glass substrate is usually covered with an opaque metal coating, the connection between the conductive particles of the ACF and the PAD cannot be directly observed from the appearance after the bonding is completed. When problems occur in the connection between the ACF and the PAD, such as the conductive particles fail to fully explode, resulting in poor connection, this will directly affect the display effect and performance of the LCD.
[0030] In order to solve this technical problem, the utility model provides a binding PAD structure.
[0031] Specifically, please refer to Figure 1 , the binding PAD structure specifically includes:
[0032] The LCD module 1 is provided with a PAD body 2, and an observation window 201 is provided in the middle area of the PAD body 2, so that the blasting effect of the conductive particles of the anisotropic conductive adhesive film can be viewed through the observation window 201 after the IC is bound to the PAD body 2.
[0033] The binding PAD structure provided by the utility model sets an observation window 201 in the middle area of the PAD body 2, and the blasting effect of the conductive particles of the anisotropic conductive adhesive film can be viewed through the PAD body 2 after the IC is bound to the PAD body 2, thereby improving efficiency. Through this design of the application, after the binding is completed, there is no need to rely on any complex detection equipment, and the connection between the ACF conductive particles and the PAD body 2 can be directly observed by the naked eye. This intuitive detection greatly improves the detection efficiency and reduces the production cost.
[0034] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.
[0035] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.
[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0037] Embodiment 1 of the utility model binding PAD structure
[0038] Please refer to Figure 1 The utility model binds the PAD structure comprises: a liquid crystal display module 1, a PAD body 2 is arranged on the liquid crystal display module 1, and an observation window 201 is arranged in the middle area of the PAD body 2, so that the blasting effect of the conductive particles of the anisotropic conductive adhesive film can be viewed from the observation window 201 after the IC is bound to the PAD body 2;
[0039] The present application sets an observation window 201 in the middle area of the PAD body 2, so that the blasting effect of the conductive particles of the anisotropic conductive adhesive film can be viewed after the IC is bound to the PAD body 2, thereby improving efficiency. Through this design of the present application, after the binding is completed, there is no need to rely on any complex detection equipment, and the connection between the ACF conductive particles and the PAD body 2 can be directly observed by the naked eye. This intuitive detection greatly improves the detection efficiency and reduces production costs.
[0040] Specifically, when the ACF and the PAD are bonded by heat pressing, the conductive particles will explode under the action of heat pressing to form an electrical connection with the PAD body 2. If the conductive particles explode sufficiently and are well connected with the PAD body 2, a uniform distribution of conductive particles will be presented at the observation window 201. On the contrary, if the conductive particles explode insufficiently and are poorly connected with the PAD body 2, an obvious connection defect will appear at the observation window 201.
[0041] The design of this application also helps to timely discover problems in the binding process and repair them. In the manufacturing process of LCD, once the ACF binding is abnormal, it will directly affect the display effect and performance of the LCD. Through the design of this patent, the binding abnormality can be discovered in time and repaired or replaced at the first time, thereby avoiding the production of defective products and improving product quality.
[0042] Since the design of the observation window 201 reduces the area of the metal coating, the PAD body 2 is made thinner and lighter, which is beneficial to reducing the overall weight of the LCD and improving the portability of the product.
[0043] Further, such as Figure 2As shown, the liquid crystal display module 1 includes a lower glass 101 , and the PAD body 2 is arranged on the lower glass 101 .
[0044] Further, such as Figure 2 As shown, a lower polarizer 102 is disposed on one side of the lower glass 101 , an upper glass 103 is disposed on the side of the lower glass 101 away from the lower polarizer 102 , and an upper polarizer 104 is disposed on the side of the upper glass 103 away from the lower glass 101 .
[0045] Further, such as Figure 1 As shown, a solder pad 105 is also provided on the lower glass 101, and the solder pad 105 is located below the PAD body 2. The solder pad 105 is used to achieve connection with the FPC. This design ensures good communication and collaborative work between the LCD module and other electronic components.
[0046] Further, such as Figure 1 As shown, a positioning mark 4 is also provided on the lower glass 101 . The positioning mark 4 is located on one side of the PAD body 2 . The positioning mark 4 is used for positioning during IC binding, thereby improving the accuracy of IC binding.
[0047] Embodiment 2 of the utility model binding PAD structure
[0048] The utility model further binds the PAD structure, such as Figure 8 As shown, an auxiliary component 3 is also provided on the lower glass 101. The auxiliary component 3 is used to protect the PAD body 2 before binding, reduce the influence of adverse factors in the external environment on the PAD body 2 before binding, and the auxiliary component 3 is also used for limiting the IC during binding, reduce the position deviation during IC hot pressing, and thus improve the binding quality of the IC.
[0049] Further, such as Figure 8 As shown, the auxiliary component 3 includes a protective glue 301, and the protective glue 301 is bonded to the lower glass 101. The protective glue 301 fixes the IC, thereby reducing the position deviation of the IC during hot pressing.
[0050] Further, such as Figure 8 As shown, an isolation film 302 is arranged in the middle of the protective glue 301 , and the isolation film 302 covers the PAD body 2 . The arrangement of the PAD body 2 can prevent the protective glue 301 from directly contacting the PAD body 2 , resulting in residual glue on the PAD body 2 .
[0051] Further, such as Figure 8 As shown, a tearing handle 303 is fixedly connected to one end of the protective glue 301 , and the setting of the tearing handle 303 can facilitate the peeling off of the protective glue 301 .
[0052] Embodiment 3 of the utility model binding PAD structure
[0053] The utility model further binds the PAD structure, such as Figure 3 As shown, the shape of the observation window 201 is a rectangle, which has clear boundaries and symmetry, so that when the observer checks the connection between the ACF conductive particles and the PAD body 2, it is easier to locate and identify the position of the observation window 201, so as to quickly judge the binding quality; the rectangle is one of the common shapes in the manufacturing industry, and its standardization is high, which is convenient for quality control and standardized management in the production process. The use of a rectangular setting can reduce production difficulty and improve production efficiency; the rectangular observation window 201 can more effectively utilize the space on the PAD body 2 and avoid unnecessary waste. At the same time, the symmetry of the rectangle also makes the design more beautiful and coordinated.
[0054] Embodiment 4 of the utility model binding PAD structure
[0055] The utility model further binds the PAD structure, such as Figure 4 As shown, the shape of the observation window 201 is a cross. The cross-shaped design enables the observation window 201 to cover multiple key positions on the PAD body 2, so that after IC binding, the blasting effect and connection status of the ACF conductive particles at different positions can be observed more comprehensively and intuitively through this window; due to the wide coverage of the cross-shaped observation window 201, production personnel do not need to frequently move their sights or change the observation angle to check the connection quality of multiple key positions at one time. This greatly improves the detection efficiency and reduces the production cost; the cross-shaped design has a clear center point and symmetry axis, so that the observer can quickly locate the key area on the PAD body 2 when viewing, reducing the detection errors caused by inaccurate positioning.
[0056] Embodiment 5 of the utility model binding PAD structure
[0057] The utility model further binds the PAD structure, such as Figure 5As shown, the shape of the observation window 201 is a parallelogram, and at this time the shape of the PAD body 2 is also a parallelogram. The parallelogram design allows the PAD body 2 and the observation window 201 to be arranged more flexibly in a limited space, especially in some liquid crystal display modules 1 of specific shapes or sizes. This design can maximize the use of space and reduce unnecessary waste; the parallelogram structure has a certain stability and balance, which helps the PAD body 2 to maintain the stability of its shape and position when subjected to external forces, thereby improving the connection reliability between the PAD body 2 and the IC; the design of the parallelogram observation window 201 allows observers to more intuitively observe the distribution of ACF conductive particles on the PAD body 2, especially when it is necessary to focus on the connection quality in a specific direction or angle, this design can provide more accurate observation results.
[0058] Embodiment 6 of the utility model binding PAD structure
[0059] The utility model further binds the PAD structure, such as Figure 6 As shown, the shape of the observation window 201 is circular. The circular observation window 201 provides a 360-degree viewing angle, so that production personnel can observe the connection between the ACF conductive particles and the PAD body 2 without blind spots. This all-round viewing angle helps to more accurately judge the binding quality and reduce the possibility of missed detection and false detection; compared with other shapes, the circular design can disperse stress more evenly when subjected to force and reduce stress concentration, which helps to protect the observation window 201 and the surrounding materials and extend the service life; the circular design is more visually beautiful and simple, adding an elegant element to the LCD display module 1.
[0060] Embodiment 7 of the utility model binding PAD structure
[0061] The utility model further binds the PAD structure, such as Figure 7 As shown, the shape of the observation window 201 is a triangle. The triangular design is visually unique and attractive. This design not only conforms to modern aesthetic trends, but also enhances the overall texture of the product. As a basic and stable geometric shape, the design of the triangle helps to enhance the stability of the observation window 201 and its surrounding structures. This stability can ensure that during long-term use, the observation window 201 is not easily deformed or damaged, thereby maintaining its good observation effect.
[0062] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.
Claims
1. A binding PAD structure, characterized in that: include: A liquid crystal display screen module (1), wherein a PAD body (2) is arranged on the liquid crystal display screen module (1), and an observation window (201) is arranged in the middle area of the PAD body (2), so that the explosion effect of the conductive particles of the anisotropic conductive adhesive film can be viewed through the observation window (201) after the IC is bound to the PAD body (2).
2. The binding PAD structure according to claim 1, characterized in that: The liquid crystal display screen module (1) comprises a lower glass (101), and the PAD body (2) is arranged on the lower glass (101).
3. The binding PAD structure according to claim 2, characterized in that: A lower polarizer (102) is provided on one side of the lower glass (101), an upper glass (103) is provided on a side of the lower glass (101) away from the lower polarizer (102), and an upper polarizer (104) is provided on a side of the upper glass (103) away from the lower glass (101).
4. The binding PAD structure according to claim 3, characterized in that: A soldering pad (105) is also provided on the lower glass (101), and the soldering pad (105) is located below the PAD body (2).
5. The binding PAD structure according to claim 3, characterized in that: A positioning mark (4) is also provided on the lower glass (101), the positioning mark (4) is located on one side of the PAD body (2), and the positioning mark (4) is used for positioning during IC binding.
6. The binding PAD structure according to claim 3, characterized in that: An auxiliary component (3) is also provided on the lower glass (101), and the auxiliary component (3) is used for protecting the PAD body (2) before binding, and the auxiliary component (3) is also used for limiting the position when IC is bound.
7. The binding PAD structure according to claim 6, characterized in that: The auxiliary component (3) comprises a protective adhesive (301), and the protective adhesive (301) is bonded to the lower glass (101).
8. The binding PAD structure according to claim 7, characterized in that: An isolation film (302) is provided in the middle of the protective glue (301), and the isolation film (302) covers the PAD body (2).
9. The binding PAD structure according to claim 7 or 8, characterized in that: A tearing handle (303) is fixedly connected to one end of the protective glue (301).
Citation Information
Patent Citations
COG structure convenient to detect
CN207851696U