HUD liquid crystal display module with high heat dissipation capability

Abstract

The utility model discloses an HUD liquid crystal display module with high heat dissipation capability, which comprises a rear iron stand, a lower polaroid, a lower substrate, an upper substrate, an upper polaroid and a surface iron stand which are sequentially overlapped from bottom to top, the rear iron stand comprises a bottom plate and a side wall extending upwards from the edge of the bottom plate, a driving IC and an FPC are bound on the upper surface of the lower substrate, and the surface iron stand is provided with an upper polaroid and a lower polaroid. The bottom plate and the lower polaroid are pasted and fixed through a double-faced adhesive tape and a heat-conducting double-faced adhesive tape, a notch is formed in the side, located on the driving IC, of the double-faced adhesive tape, so that the double-faced adhesive tape is in a [shape, the heat-conducting double-faced adhesive tape is located at the notch of the double-faced adhesive tape, and the heat-conducting double-faced adhesive tape and the double-faced adhesive tape are spliced into a square shape. According to the liquid crystal display module, on the premise that the structure and fixation of a product are not affected, heat near the position of the driving IC can be rapidly conducted to the rear iron frame for heat dissipation, then the temperature of the liquid crystal display module is rapidly reduced, the quality of the product is improved, and the service life of the product is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal display, and more specifically, to a HUD liquid crystal display module with high heat dissipation capacity. Background Art

[0002] The structure of a conventional HUD liquid crystal display module is that a TFT liquid crystal display screen is fixed on a rear iron frame through a circle of double-sided adhesive, and then a front iron frame is buckled. The backlight part is independently arranged on the client structure. Such a backlight has extremely high brightness, and after irradiating on the HUD liquid crystal display screen, a large amount of heat energy will be generated, resulting in an increase in the temperature of the liquid crystal display screen, seriously affecting its normal operation. Especially in the position of the driving IC of the liquid crystal display screen, because heat is also generated when the driving IC works, the problem becomes more serious after the heat generated by this part is superimposed with the heat caused by the backlight. Summary of the Utility Model

[0003] The technical problem to be solved by the utility model is how to improve the heat dissipation capacity at the position of the driving IC of the liquid crystal display screen.

[0004] The technical problem to be solved by the utility model is realized through the following technical solutions:

[0005] To solve the above technical problem, the utility model provides a HUD liquid crystal display module with high heat dissipation capacity, which includes a rear iron frame, a lower polarizer, a lower substrate, an upper substrate, an upper polarizer and a front iron frame that are sequentially stacked from bottom to top. The rear iron frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate. A driving IC and an FPC are bonded to the upper surface of the lower substrate. The bottom plate and the lower polarizer are fixedly pasted through a double-sided adhesive and a heat-conducting double-sided adhesive. The double-sided adhesive is provided with a notch on one side of the driving IC, so that the shape of the double-sided adhesive is "匚-shaped", and the heat-conducting double-sided adhesive is located at the notch of the double-sided adhesive, and the heat-conducting double-sided adhesive and the double-sided adhesive are spliced into a "口-shaped".

[0006] As a preferred embodiment of the HUD liquid crystal display module with high heat dissipation capacity provided by the utility model, the distance between the connection positions of the heat-conducting double-sided adhesive and the double-sided adhesive is 0.5 mm.

[0007] As a preferred embodiment of the HUD liquid crystal display module with high heat dissipation capacity provided by the utility model, the thickness of the heat-conducting double-sided adhesive is equal to the thickness of the double-sided adhesive.

[0008] As a preferred embodiment of the HUD liquid crystal display module with high heat dissipation capacity provided by the utility model, the rear iron frame and the front iron frame are buckled and fixed to each other.

[0009] As a preferred embodiment of the HUD liquid crystal display module with high heat dissipation capability provided by the utility model, the surface iron frame includes a top plate and a side extending downward from the edge of the top plate, the side close to the FPC is provided with an escape opening for avoiding the FPC, and the top plate located above the FPC and the driver IC is provided with a bending pressure bone formed by bending.

[0010] As a preferred implementation of the HUD liquid crystal display module with high heat dissipation capability provided by the utility model, the dimension of each side of the avoidance is 0.5 mm to 1 mm larger than the dimension of each side of the FPC.

[0011] As a preferred implementation of the HUD liquid crystal display module with high heat dissipation capability provided by the utility model, the width of the bending compression bone is 1 mm to 2 mm.

[0012] As a preferred implementation of the HUD liquid crystal display module with high heat dissipation capability provided by the utility model, the length of the bent compression bone is more than 4 mm greater than the length of the avoidance opening.

[0013] As a preferred implementation of the HUD liquid crystal display module with high heat dissipation capability provided by the utility model, the distance between the lower surface of the bent pressure bone and the upper surfaces of the FPC and the driver IC is greater than 0.2 mm.

[0014] As a preferred implementation of the HUD liquid crystal display module with high heat dissipation capability provided by the utility model, a protective glue is provided on the upper surface of the lower substrate extending outward, and the protective glue covers the FPC and the driver IC located on the upper surface of the lower substrate.

[0015] The utility model has the following beneficial effects:

[0016] Since the double-sided adhesive is provided with a notch on one side of the driver IC, and the thermal conductive double-sided adhesive is located at the notch of the double-sided adhesive, the thermal conductive double-sided adhesive has great advantages in thermal conductivity compared to ordinary double-sided adhesive because it uses glass fiber as its base material. It can make the product's structure and fixation not affected, and the heat near the driver IC position can be more quickly transferred to the rear iron frame for heat dissipation, thereby quickly reducing the temperature of the liquid crystal display module and improving the quality and service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 The present invention is a schematic structural diagram of a HUD liquid crystal display module with high heat dissipation capability provided by the present invention.

[0019] Figure 2 for Figure 1 Top view of the rear iron frame, double-sided adhesive and thermal double-sided tape.

[0020] Figure 3 for Figure 1 Schematic diagram of the improved structure of the middle surface iron frame.

[0021] Description of Figure Numbers:

[0022] Rear iron frame 1; lower base plate 2; upper base plate 3; surface iron frame 4; bottom plate 11; side wall 12; driver IC 5; FPC 6; double-sided adhesive 7; thermal conductive double-sided adhesive 8;

[0023] Top plate 41; side edge 42; avoidance opening 43; bending compression bone 44. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0027] The utility model provides a HUD liquid crystal display module with high heat dissipation capacity, which comprises a rear iron frame, a lower polarizer, a lower substrate, an upper substrate, an upper polarizer and a front iron frame that are sequentially stacked from bottom to top. The rear iron frame comprises a bottom plate and side walls extending upward from the edge of the bottom plate. A driving IC and an FPC are bonded to the upper surface of the lower substrate. The bottom plate and the lower polarizer are fixedly pasted through a double-sided adhesive and a heat-conducting double-sided adhesive. The double-sided adhesive is provided with a notch on one side of the driving IC, so that the shape of the double-sided adhesive is "C-shaped". The heat-conducting double-sided adhesive is located at the notch of the double-sided adhesive, and the heat-conducting double-sided adhesive and the double-sided adhesive are spliced into a "square shape".

[0028] Since the double-sided adhesive is provided with a notch on one side of the driving IC, and the heat-conducting double-sided adhesive is located at the notch of the double-sided adhesive, and the heat-conducting double-sided adhesive has a glass fiber as the base material, which has great advantages in heat conduction compared with ordinary double-sided adhesives. It can make the heat near the position of the driving IC be conducted to the rear iron frame for heat dissipation more quickly on the premise that the structure and fixation of the product are not affected, thereby quickly reducing the temperature of the liquid crystal display module and improving the quality and service life of the product.

[0029] In order to enable those skilled in the art to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the drawings. The present invention will be described in detail below with reference to the drawings and embodiments. Examples of the embodiments are shown in the drawings, in which the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0030] Please refer to Figure 1 and Figure 2, a HUD liquid crystal display module with high heat dissipation capacity provided by the present utility model, which includes a rear iron frame 1, a lower polarizer, a lower substrate 2, an upper substrate 3, an upper polarizer and a front iron frame 4 sequentially stacked from bottom to top. The rear iron frame 1 includes a bottom plate 11 and side walls 12, and the side walls 12 extend upward from the edge of the bottom plate 11. A driving IC 5 and an FPC 6 are bonded to the upper surface of the lower substrate 2. The bottom plate 11 and the lower polarizer are fixedly pasted through a double-sided adhesive 7 and a heat-conducting double-sided adhesive 8. The double-sided adhesive 7 is provided with a notch on one side of the driving IC 5, so that the shape of the double-sided adhesive 7 is "C-shaped". The heat-conducting double-sided adhesive 8 is located at the notch of the double-sided adhesive 7, and the heat-conducting double-sided adhesive 8 and the double-sided adhesive 7 are spliced into a "square shape". Since the double-sided adhesive 7 is provided with a notch on one side of the driving IC 5, and the heat-conducting double-sided adhesive 8 is located at the notch of the double-sided adhesive 7, and the heat-conducting double-sided adhesive 8 is based on glass fiber, it has great advantages in heat conduction compared with ordinary double-sided adhesives. It can make the product conduct the heat near the position of the driving IC 5 to the rear iron frame for heat dissipation more quickly on the premise that the structure and fixation are not affected, thereby quickly reducing the temperature of the liquid crystal display module and improving the quality and service life of the product.

[0031] Further, the distance between the connection points of the heat-conducting double-sided adhesive 8 and the double-sided adhesive 7 is 0.5 mm to avoid interference between the heat-conducting double-sided adhesive 8 and the double-sided adhesive 7.

[0032] Further, the thickness of the heat-conducting double-sided adhesive 8 is equal to the thickness of the double-sided adhesive 7 so that the structure and fixation of the product are not affected.

[0033] Further, the rear iron frame 1 and the front iron frame 4 are fastened and fixed to each other.

[0034] Please refer to Figure 3 , as a further optimized solution of Embodiment 1, in this embodiment, the front iron frame 4 includes a top plate 41 and side edges 42 extending downward from the edge of the top plate 41. An avoidance opening 43 for avoiding the FPC 6 is provided on the side edge 42 on the side close to the FPC 6. A bent pressing rib 44 is provided on the top plate 41 located above the FPC 6 and the driving IC 5. Since the side edge 42 on the side close to the FPC 6 is provided with an avoidance opening 43 for avoiding the FPC 6, while increasing the bending space of the FPC 6, it also avoids the problem that the arching force when the FPC 6 is bent pushes up the side edge 42 of the front iron frame 4, improves the dimensional qualification rate of the liquid crystal display module, avoids interference when the client assembles the casing, and ensures smooth assembly of the client and the casing. At the same time, since the top plate 41 located above the FPC 6 and the driving IC 5 is provided with a bent pressing rib 44 formed by bending, it ensures that the front iron frame 4 has sufficient strength and avoids a decrease in strength due to the opening of the avoidance opening 43.

[0035] Furthermore, the dimension of each side of the avoidance opening 43 is 0.5 mm to 1 mm larger than the dimension of each side of the FPC 6 , so as to avoid interference between the avoidance opening 43 and the FPC 6 .

[0036] Furthermore, the width of the bending pressure bone 44 is 1mm to 2mm. The length of the bending pressure bone 44 is more than 4mm longer than the length of the avoidance opening 43. In this embodiment, the single-side length of the bending pressure bone 44 is more than 2mm longer than the single-side length of the avoidance opening 43, that is, the left side of the bending pressure bone 44 is 2mm longer than the left side of the avoidance opening 43, and the right side of the bending pressure bone 44 is 2mm longer than the right side of the avoidance opening 43. This ensures that the surface iron frame 4 has better strength.

[0037] Furthermore, the distance between the lower surface of the bending pressure bone 44 and the upper surfaces of the FPC6 and the driving IC5 is greater than 0.2 mm to avoid the hidden danger of interference between the bending pressure bone 44 and the driving IC5 and the FPC6.

[0038] Furthermore, a protective glue is provided on the upper surface of the lower substrate 2 extending outward, and the protective glue covers the FPC 6 and the driving IC 5 located on the upper surface of the lower substrate 2 to protect the FPC 6 and the driving IC 5 .

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A HUD liquid crystal display module with high heat dissipation capability, characterized in that: It includes a rear iron frame, a lower polarizer, a lower substrate, an upper substrate, an upper polarizer and a front iron frame which are sequentially stacked from bottom to top. The rear iron frame includes a bottom plate and side walls extending upward from the edge of the bottom plate. A driving IC and an FPC are bonded to the upper surface of the lower substrate. The bottom plate and the lower polarizer are fixedly pasted through a double-sided adhesive and a heat-conducting double-sided adhesive. The double-sided adhesive is provided with a notch on one side of the driving IC, so that the shape of the double-sided adhesive is "C-shaped". The heat-conducting double-sided adhesive is located at the notch of the double-sided adhesive, and the heat-conducting double-sided adhesive and the double-sided adhesive are spliced into a "square shape".

2. The HUD liquid crystal display module with high heat dissipation capability according to claim 1, characterized in that: The distance between the connection points of the heat-conducting double-sided adhesive and the double-sided adhesive is 0.5 mm.

3. The HUD liquid crystal display module with high heat dissipation capability according to claim 1, characterized in that: The thickness of the heat-conducting double-sided adhesive is equal to the thickness of the double-sided adhesive.

4. The HUD liquid crystal display module with high heat dissipation capability according to claim 1, characterized in that: The rear iron frame and the front iron frame are fixed by buckling with each other.

5. The HUD liquid crystal display module with high heat dissipation capability according to claim 1, characterized in that: The front iron frame includes a top plate and side edges extending downward from the edge of the top plate. An avoidance opening for avoiding the FPC is provided on the side edge close to the FPC. A bent pressing rib is provided on the top plate located above the FPC and the driving IC.

6. The HUD liquid crystal display module with high heat dissipation capability according to claim 5, characterized in that: The size of each side of the avoidance opening is 0.5 mm to 1 mm larger than the size of each side of the FPC.

7. The HUD liquid crystal display module with high heat dissipation capability according to claim 5, characterized in that: The width of the bent pressing rib is 1 mm to 2 mm.

8. The HUD liquid crystal display module with high heat dissipation capability according to claim 5, characterized in that: The length of the bent pressing rib is more than 4 mm larger than the length of the avoidance opening.

9. The HUD liquid crystal display module with high heat dissipation capability according to claim 5, characterized in that: The distance between the lower surface of the bent pressing rib and the upper surfaces of the FPC and the driving IC is greater than 0.2 mm.

10. The HUD liquid crystal display module with high heat dissipation capability according to claim 5, characterized in that: A protective adhesive is provided on the upper surface of the lower substrate extending outward, and the protective adhesive covers the FPC and the driving IC located on the upper surface of the lower substrate.

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