RFID electronic tag based on mixed bumps
By adopting a hybrid bump structure and conductive particles in RFID electronic tags, the problem of chip being stolen is solved, the chip's anti-transfer effect is achieved, and the anti-counterfeiting ability of RFID electronic tags is improved.
Patent Information
- Application Number
- CN202421747041.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-23
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-07-23
AI Technical Summary
Existing RFID electronic tags cannot prevent the chip from being stolen separately, resulting in limited anti-counterfeiting capabilities.
Using an RFID electronic tag design based on hybrid bumps, a special electrical connection structure is formed by setting an anisotropic conductive glue and conductive particles between the chip and the antenna, and a grid skeleton and conductive filler in the hybrid bump structure.
When trying to repackage the chip, due to the action of a special solvent, the pressure bearing capacity of the mixed bump structure is reduced, resulting in damage and the chip cannot be used again, achieving the chip's anti-transfer effect and improving the anti-counterfeiting ability of RFID electronic tags.
Smart Images
Figure CN222784901U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of RFID electronic tags, in particular to an RFID electronic tag based on a hybrid convex block. Background Art
[0002] RFID electronic tags are mainly composed of two parts: electronic tag chip and electronic tag antenna. FlipChip technology is used to connect the two. The tag can be bound to the object by attachment to prove the identity of the object. It is often used in product traceability, anti-counterfeiting and other fields.
[0003] However, in order to prevent the electronic tags from being stolen and transferred, most of the existing RFID electronic tags are made of fragile paper or ceramic materials as the substrate, and the antenna is designed with fragile lines. At the same time, fragile cuts are reserved during processing to prevent the tag from being transferred as a whole. However, this method can only prevent the transfer of the entire chip. When transferring the chip alone, a special solvent can be used to dissolve the conductive glue around the chip, so as to completely remove the chip and re-flip the chip onto a new antenna so that the chip can be reused. However, it is impossible to prevent the chip from being stolen alone, resulting in limited anti-counterfeiting capabilities of RFID electronic tags. Utility Model Content
[0004] The utility model aims to solve the problem that the existing RFID electronic tags cannot prevent the chip from being stolen alone, resulting in limited anti-counterfeiting ability of the RFID electronic tags.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] An RFID electronic tag based on a hybrid bump, the RFID electronic tag comprising: an electronic tag chip and an electronic tag antenna,
[0007] Anisotropic conductive adhesive ACA is arranged between the electronic tag chip and the electronic tag antenna, and adheres to the electronic tag chip and the electronic tag antenna;
[0008] A hybrid bump structure is arranged on a side of the electronic tag chip close to the electronic tag antenna and is fixedly connected to the electronic tag chip to prevent the electronic tag chip from being reused;
[0009] A plurality of conductive particles are arranged inside the anisotropic conductive adhesive ACA; the conductive particles located between the hybrid bump structure and the electronic tag antenna are deformed by pressure, so that the electronic tag chip and the electronic tag antenna are electrically connected.
[0010] Preferably, the hybrid bump structure comprises:
[0011] A grid skeleton, wherein the grid skeleton is in the shape of a three-dimensional grid structure, and a plurality of hollow parts are present inside the grid skeleton;
[0012] The conductive filler is arranged in the hollow part and is used to fill the hollow part.
[0013] Preferably, the conductive filler has electrical conductivity and has the same solubility as the anisotropic conductive adhesive ACA, so that the conductive filler can be dissolved synchronously with the anisotropic conductive adhesive ACA.
[0014] Preferably, the three-dimensional grid structure is composed of a plurality of groups of conductive metal materials intersecting to form the hollow portion.
[0015] Preferably, the electronic tag antenna includes:
[0016] A conductive loop coil is arranged on a side of the grid frame away from the electronic tag chip;
[0017] The antenna substrate is arranged on a side of the conductive loop coil away from the grid frame and is fixedly connected to the conductive loop coil.
[0018] Preferably, the pressure direction of the conductive particles is the same as the current flow direction between the electronic tag chip and the electronic tag antenna.
[0019] The beneficial effect proposed by the utility model is that when a special solvent dissolves the conductive adhesive around the chip, the special solvent will simultaneously dissolve the anisotropic conductive adhesive ACA and part of the structure in the hybrid bump structure, thereby reducing the pressure-bearing capacity of the hybrid bump structure. During secondary packaging, since the flip chip technology will produce a certain force on the hybrid bump structure, the hybrid bump structure will be crushed and damaged, and the conductive particles cannot be squeezed to the extent of generating a current path, so that the electronic tag chip cannot be used again, thereby achieving the purpose of chip anti-transfer and improving the anti-counterfeiting ability. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of the structure of the utility model;
[0021] Figure 2 for Figure 1 A schematic cross-sectional plan view of the middle part of the connection structure;
[0022] Figure 3 for Figure 2 A three-dimensional enlarged schematic diagram of the middle grid skeleton;
[0023] Figure 4 for Figure 2 Schematic diagram of the connection structure at A in the middle.
[0024] In the figure: 1. Electronic tag chip, 2. Anisotropic conductive adhesive ACA, 3. Grid skeleton, 4. Conductive filler, 5. Conductive particles, 6. Antenna substrate, 7. Conductive loop coil. DETAILED DESCRIPTION
[0025] The utility model is further described below in conjunction with the accompanying drawings:
[0026] This embodiment:
[0027] See also Figure 1-4 In this embodiment: an RFID electronic tag based on a hybrid bump, the RFID electronic tag includes: an electronic tag chip 1, an electronic tag antenna, an anisotropic conductive adhesive ACA2, a hybrid bump structure and a plurality of conductive particles 5.
[0028] In this embodiment, the anisotropic conductive adhesive ACA2 is disposed between the electronic tag chip 1 and the electronic tag antenna, and is adhered to the electronic tag chip 1 and the electronic tag antenna.
[0029] In this embodiment, the electronic tag chip 1 can be attached to the electronic tag antenna by applying anisotropic conductive adhesive ACA2.
[0030] The hybrid bump structure is arranged on a side of the electronic tag chip 1 close to the electronic tag antenna and is fixedly connected to the electronic tag chip 1 to prevent the electronic tag chip 1 from being reused.
[0031] In this embodiment, after the anisotropic conductive adhesive ACA2 is dissolved by a special solvent, the hardness of the hybrid bump structure itself will be reduced, so that when the electronic tag chip 1 is packaged again, the hybrid bump structure will be damaged, making the electronic tag chip 1 unusable.
[0032] A plurality of conductive particles 5 are disposed inside the anisotropic conductive adhesive ACA2; the conductive particles 5 located between the hybrid bump structure and the electronic tag antenna are deformed by pressure, so that the electronic tag chip 1 and the electronic tag antenna are electrically connected.
[0033] In this embodiment, when the electronic tag chip 1 is packaged, the conductive particles 5 are squeezed by utilizing the cooperation between the hybrid bump and the electronic tag antenna. The squeezed conductive particles 5 are deformed and current can flow.
[0034] like Figure 2 and Figure 3 As shown, the hybrid bump structure includes: a grid skeleton 3 and a conductive filler 4 .
[0035] Specifically, the grid skeleton 3 is in the shape of a three-dimensional grid structure, and there are multiple hollow parts inside the grid skeleton 3.
[0036] In this embodiment, the three-dimensional grid structure grid skeleton 3 has limited pressure bearing capacity and cannot be reused.
[0037] The conductive filler 4 is disposed in the hollow portion to fill the hollow portion.
[0038] In this embodiment, the filler may be a conductive resin, or other materials having the same properties as the anisotropic conductive adhesive ACA2. After filling, the pressure bearing capacity of the grid skeleton 3 is improved so that the grid skeleton 3 will not be damaged during the packaging process.
[0039] The conductive filler 4 has electrical conductivity and has the same solubility as the anisotropic conductive adhesive ACA2, so that the conductive filler 4 can be dissolved synchronously with the anisotropic conductive adhesive ACA2.
[0040] The three-dimensional grid structure is composed of a plurality of groups of conductive metal materials intersecting each other to form the hollow part.
[0041] In this embodiment, the conductive metal material can be copper or gold, or other conductive materials, and form the hollow part. The existence of the hollow part can reduce the pressure-bearing capacity of the grid skeleton 3. The shape of the hollow part can be a quadrilateral or other shapes. There are no specific requirements, as long as the internal hollow part is satisfied.
[0042] like Figure 1 As shown, the electronic tag antenna includes: a conductive loop coil 7 and an antenna substrate 6.
[0043] The conductive loop coil 7 is disposed on a side of the mesh frame 3 away from the electronic tag chip 1 ; the antenna substrate 6 is disposed on a side of the conductive loop coil 7 away from the mesh frame 3 , and is fixedly connected to the conductive loop coil 7 .
[0044] In this embodiment, the conductive loop coil 7 can enable the electronic tag chip 1 to form a loop.
[0045] The pressure direction of the conductive particles 5 is the same as the current flow direction between the electronic tag chip 1 and the electronic tag antenna.
[0046] In this embodiment, Figure 2 As shown, when the electronic tag chip 1 is packaged on the electronic tag antenna from top to bottom, the grid skeleton 3 will squeeze part of the conductive particles 5, causing the conductive particles 5 in this part to deform, thereby generating a vertical current path.
[0047] Working principle:
[0048] When the hybrid bump-based RFID electronic tag is in use, the electronic tag chip 1 is placed from top to bottom on the corresponding position of the conductive loop coil 7; and the electronic tag chip 1 is adhered to the conductive loop coil 7 using anisotropic conductive adhesive ACA2; during this process, the hybrid bump structure will squeeze part of the conductive particles 5; causing this part of the conductive particles 5 to deform, thereby generating a vertical current path; allowing the electronic tag chip 1 to form a loop with the conductive loop coil 7 through the hybrid bump structure and part of the conductive particles 5.
[0049] When the special solvent dissolves the conductive glue around the chip, the special solvent will dissolve the anisotropic conductive glue ACA2 and the conductive filler 4 on the grid skeleton 3 simultaneously; and the grid skeleton 3 without the conductive filler 4 will have multiple hollow parts; causing the pressure bearing capacity of the grid skeleton 3 to be seriously reduced. Although the electronic tag chip 1 can be removed at this time, during the secondary packaging, the flip chip technology will produce a certain force on the grid skeleton 3, causing the grid skeleton 3 to be crushed and damaged, and unable to reach the length of squeezing the conductive particles 5, so that no current path will be generated, making the electronic tag chip 1 unable to be used again, achieving the purpose of anti-counterfeiting and completing the use of this device.
[0050] Although the present invention has been shown and described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein within the scope of the claims.
Claims
1. An RFID electronic tag based on a hybrid bump, the RFID electronic tag comprising: The electronic tag chip (1) and the electronic tag antenna are characterized by: Anisotropic conductive adhesive ACA (2), arranged between the electronic tag chip (1) and the electronic tag antenna, and adhered to the electronic tag chip (1) and the electronic tag antenna; A hybrid bump structure, arranged on a side of the electronic tag chip (1) close to the electronic tag antenna and fixedly connected to the electronic tag chip (1), for preventing the electronic tag chip (1) from being reused; A plurality of conductive particles (5) are arranged inside the anisotropic conductive adhesive ACA (2); the conductive particles (5) located between the hybrid bump structure and the electronic tag antenna are deformed by pressure, so that the electronic tag chip (1) and the electronic tag antenna are electrically connected.
2. The RFID electronic tag based on hybrid bump according to claim 1 is characterized in that: The hybrid bump structure comprises: A grid skeleton (3), wherein the grid skeleton (3) is in the shape of a three-dimensional grid structure, and a plurality of hollow parts are present inside the grid skeleton (3); A conductive filler (4) is arranged in the hollow portion and is used to fill the hollow portion.
3. The RFID electronic tag based on hybrid bump according to claim 2 is characterized in that: The conductive filler (4) has electrical conductivity and has the same solubility as the anisotropic conductive adhesive ACA (2), so that the conductive filler (4) can be dissolved synchronously with the anisotropic conductive adhesive ACA (2).
4. The RFID electronic tag based on hybrid bump according to claim 2, characterized in that: The three-dimensional grid structure is composed of a plurality of groups of conductive metal materials intersecting each other to form the hollow part.
5. The RFID electronic tag based on hybrid bump according to claim 2, characterized in that: The electronic tag antenna comprises: A conductive loop coil (7) is arranged on a side of the grid frame (3) away from the electronic tag chip (1); The antenna substrate (6) is arranged on a side of the conductive loop coil (7) away from the grid frame (3), and is fixedly connected to the conductive loop coil (7).
6. The RFID electronic tag based on hybrid bump according to claim 1, characterized in that: The pressure direction of the conductive particles (5) is the same as the current flow direction between the electronic tag chip (1) and the electronic tag antenna.