Immersed liquid cooling heat dissipation structure

Abstract

The utility model discloses an immersed liquid cooling heat dissipation structure, comprising a liquid cooling cabinet and an electronic device immersed in the cooling liquid of the liquid cooling cabinet, the liquid cooling cabinet is internally provided with a heat dissipation part located at one side of the electronic device, and the heat dissipation part comprises an ultrasonic generator immersed in the cooling liquid of the liquid cooling cabinet and a transducer. The heat dissipation component can emit ultrasonic waves to the electronic equipment so as to enhance the heat dissipation effect on the electronic equipment. The ultrasonic cooling device can act on cooling liquid through ultrasonic waves, the heat conduction efficiency of the cooling liquid is improved, the cooling liquid is fully disturbed, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of immersion liquid cooling and heat dissipation, in particular to an immersion liquid cooling and heat dissipation structure. Background Art

[0002] With the advancement of technology, the performance requirements of electronic equipment are getting higher and higher, resulting in a significant increase in the heat generation and heat flux density of electronic components. The power consumption caused by cooling electronic components will also increase exponentially. At present, the power of a single CPU chip has reached 300-400W, and the power of a single GPU chip is as high as 700-800W. The power of a single cabinet is expected to exceed 30KW in 2025. Excessive heat dissipation is concentrated in a small cabinet. How to fully dissipate the heat without damaging the temperature uniformity of each server or even each chip is a problem that immersion liquid cooling cabinets must solve as soon as possible.

[0003] Immersion cooling technology in related technologies often determines a single-point threshold, and then adjusts the liquid pump to increase the flow rate and flow field disturbance to improve the heat dissipation effect in the liquid pool. However, as chip functions become more and more powerful, their power will inevitably soar step by step. Once the power of electronic equipment reaches a certain level, adjusting the liquid pump alone cannot fully disturb the liquid pool flow field, that is, it is impossible to effectively dissipate the liquid pool flow field, which will affect the working performance of the electronic equipment. Utility Model Content

[0004] The utility model aims to solve one of the technical problems in the related art to a certain extent. To this end, the utility model provides an immersion liquid cooling heat dissipation structure.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an immersion liquid cooling heat dissipation structure, including a liquid cooling cabinet and an electronic device immersed in the cooling liquid of the liquid cooling cabinet, a heat dissipation component located on one side of the electronic device is provided in the liquid cooling cabinet, the heat dissipation component includes an ultrasonic generator and a transducer immersed in the cooling liquid of the liquid cooling cabinet, and the heat dissipation component can emit ultrasonic waves to the electronic device to enhance the heat dissipation effect on the electronic device.

[0006] In this technical solution, by setting an ultrasonic generator and a transducer in the liquid cooling cabinet, ultrasonic waves can be emitted to the electronic equipment in the coolant, and the ultrasonic waves can increase the heat dissipation effect. During the propagation of ultrasonic waves in water, high-intensity sound wave vibrations will be generated in the liquid. These vibrations will cause tiny bubbles in the coolant, and these bubbles will expand and contract rapidly, forming a "cavitation" phenomenon. In the cavitation phenomenon, the rapid expansion and closure of bubbles will produce high temperature and high pressure in a very small space, and high temperature and high pressure will enhance the transfer and dissipation of liquid heat, thereby improving the heat dissipation effect. In addition, ultrasonic vibrations can also generate a large number of eddy currents and solution heat conduction, which can increase the heat transfer rate of the liquid, promote the flow of the liquid and enhance the heat conduction mechanism, thereby improving the thermal conductivity of the liquid. By combining the effects of ultrasonic waves and immersion liquid cooling, the heat dissipation effect can be further improved, and the upper threshold limit of liquid cooling can be increased, which can be suitable for the heat dissipation needs of high-power electronic equipment.

[0007] Furthermore, a plurality of electronic devices and heat dissipation components corresponding to the electronic devices are arranged in the liquid cooling cabinet, and the plurality of electronic devices and the heat dissipation components are alternately distributed in sequence, thereby ensuring a good heat dissipation effect of each electronic device.

[0008] Furthermore, the ultrasonic waves of the multiple heat dissipation components are emitted in the same direction, and the flow direction of the coolant in the liquid cooling cabinet is the same as the propagation direction of the ultrasonic waves, thereby avoiding excessive attenuation of ultrasonic energy caused by propagation in the opposite direction and improving the heat dissipation effect.

[0009] Furthermore, the distance between the ultrasonic wave transmitting end of the heat dissipation component and the electronic device is 1 to 10 cm, so as to improve the heat dissipation effect and avoid the influence of the ultrasonic wave attenuation caused by the long distance on the heat dissipation effect.

[0010] Furthermore, the heat dissipation component includes a box body, which is arranged in parallel with the electronic equipment at an interval, the ultrasonic generator and the transducer are both arranged on the box body and the ultrasonic generator and the transducer are electrically connected, and the heat dissipation component is detachably installed in the liquid cooling cabinet through the box body.

[0011] Furthermore, one end of the liquid cooling cabinet is an open structure, and a support plate and a handle are respectively provided on both sides of the box body. The handle is arranged on the support plate, and the support plate is supported at the edge of the opening of the liquid cooling cabinet. A gap is reserved between the bottom plate of the box body and the bottom wall of the liquid cooling cabinet, and a top plate is provided on the top of the box body, and a power socket and a switch are provided on the top plate.

[0012] Furthermore, each heat dissipation component includes a plurality of transducers, and the plurality of transducers are arranged in a distributed array, thereby increasing the area of ​​the ultrasonic emission source.

[0013] Furthermore, the transducer is fixed on the box body by one or more connection methods including gluing, thread connection and welding.

[0014] Furthermore, the flow direction of the coolant in the liquid cooling cabinet is the same as the propagation direction of the ultrasonic wave.

[0015] Furthermore, the cover plate on the side of the electronic device facing the transducer can be removed so that the ultrasonic wave can directly act on the electrical components inside the electronic device.

[0016] Furthermore, the liquid cooling cabinet is provided with an input pipeline and an output pipeline, a pump body is provided at the inlet end of the input pipeline, and a temperature detection component and a valve body are provided on the input pipeline and the output pipeline, and the temperature detection component is communicatively connected with the pump body.

[0017] These features and advantages of the utility model will be disclosed in detail in the following specific embodiments and drawings. The best implementation or means of the utility model will be fully presented in conjunction with the drawings, but it is not a limitation of the technical solution of the utility model. In addition, these features, elements and components appearing in each of the following texts and drawings are multiple, and are marked with different symbols or numbers for convenience, but all represent components with the same or similar structure or function. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described below in conjunction with the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the overall system structure of a liquid cooling heat dissipation structure according to one embodiment of the present invention;

[0020] Figure 2 A schematic diagram of the cavitation effect during the internal propagation of ultrasound in one embodiment of the present invention;

[0021] Figure 3 This is a top view of a liquid cooling cabinet according to one embodiment of the present invention (the direction of the arrow in the figure is the direction of ultrasonic emission);

[0022] Figure 4 A side view schematic diagram of the location of a heat dissipation component in a liquid cooling cabinet according to one embodiment of the present invention;

[0023] Figure 5 A schematic top view of a heat dissipation component according to one embodiment of the present invention;

[0024] Figure 6 One of the present invention Figure 2 A local enlarged view (the arrow in the figure indicates the direction of ultrasonic emission).

[0025] in,

[0026] 1. Liquid cooling cabinet; 11. Input pipeline; 12. Output pipeline; 13. Temperature detection component; 14. Valve body; 15. Pump body; 16. Cooling liquid;

[0027] 2. Electronic equipment;

[0028] 3. Heat dissipation component; 31. Box body; 311. Ultrasonic generator; 312. Transducer; 313. Support plate; 314. Handle; 315. Power socket; 316. Switch; 317. Top plate. DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments based on the embodiments are intended to be used to explain the present invention and cannot be understood as limiting the present invention.

[0030] References in this specification to "one embodiment" or "an example" or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment itself may be included in at least one embodiment of the present patent disclosure. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily refer to the same embodiment.

[0031] See attached Figure 2-6 One of the embodiments of the utility model discloses an immersion liquid cooling heat dissipation structure, including a liquid cooling cabinet 1 and an electronic device 2 immersed in a cooling liquid 16 of the liquid cooling cabinet 1. A heat dissipation component 3 located on one side of the electronic device 2 is provided in the liquid cooling cabinet 1. The heat dissipation component 3 includes an ultrasonic generator 311 and a transducer 312 immersed in the cooling liquid 16 of the liquid cooling cabinet 1. The heat dissipation component 3 can emit ultrasonic waves to the electronic device 2 to enhance the heat dissipation effect on the electronic device 2.

[0032] In this embodiment, by arranging an ultrasonic generator 311 and a transducer 312 in the liquid cooling cabinet 1, ultrasonic waves can be emitted to the electronic device 2 in the cooling liquid 16. Ultrasonic waves can increase the heat dissipation effect. Since ultrasonic waves will generate high-intensity sound wave vibrations in the liquid during the propagation in the water. These vibrations will cause the cooling liquid 16 to produce tiny bubbles, which will expand and contract rapidly, forming a "cavitation" phenomenon. In the cavitation phenomenon, the rapid expansion and closure of bubbles will produce high temperature and high pressure in a very small space. High temperature and high pressure will enhance the transfer and dissipation of liquid heat, thereby improving the heat dissipation effect. In addition, ultrasonic vibrations can also generate a large number of eddy currents and solution heat conduction, which can increase the heat transfer rate of the liquid, promote the flow of the liquid and enhance the heat conduction mechanism, thereby improving the thermal conductivity of the liquid. By combining ultrasonic waves with the effect of immersion liquid cooling heat dissipation, the heat dissipation effect can be further improved, and the threshold upper limit of liquid cooling heat dissipation can be increased, which can be suitable for the heat dissipation requirements of high-power electronic equipment 2.

[0033] When the ultrasonic wave in this embodiment acts on the liquid, a large number of small bubbles can be generated. One reason is that tensile stress occurs locally in the liquid and forms negative pressure. The reduction in pressure makes the gas originally dissolved in the liquid supersaturated and escapes from the liquid to form small bubbles. Another reason is that the strong tensile stress "teares" the liquid into a cavity, which is called cavitation. The cavity contains liquid vapor or another gas dissolved in the liquid, or even a vacuum. The small bubbles formed by cavitation will continue to move, grow or suddenly burst with the vibration of the surrounding medium. The temperature of the cold liquid around the heat source of the electrical device is reduced by the liquid cavitation effect and the improvement of thermal conductivity, thereby reducing the temperature of the heat source.

[0034] The heat dissipation structure in this embodiment is generally suitable for the heat dissipation requirements of high-power electronic devices 2. On the one hand, it can increase the cooling threshold of the coolant 16 by changing the flow rate or flow rate of the coolant 16, just like the liquid-cooled heat dissipation structure in the prior art. However, there is a certain threshold upper limit for improving the heat dissipation effect in the liquid pool by increasing the flow rate and increasing the flow field disturbance. Another aspect of this embodiment is that by setting a heat dissipation component 3, ultrasonic waves can be emitted by an ultrasonic generator 311 and a transducer 312 to increase the disturbance of the coolant 16. At the same time, when ultrasonic waves propagate in the liquid, cavitation will occur, the thermal conduction efficiency of the liquid will be improved, and the heat dissipation capacity of the coolant 16 will be increased to meet the heat dissipation requirements of high-power electronic devices 2.

[0035] Since a plurality of electronic devices 2 are generally arranged in the liquid cooling cabinet 1, and the propagation distance of ultrasound in the liquid is limited to a certain extent, and the energy will gradually weaken as it propagates, combined with the working principle of ultrasound enhancing the heat dissipation effect mentioned above, it can be seen that the closer the distance of the ultrasound to the heat source, the better the heat dissipation effect on the heat source, and the farther the distance of the ultrasound from the heat source, the worse the heat dissipation effect on the heat source. In order to achieve a better heat dissipation effect, a plurality of electronic devices 2 and heat dissipation components 3 corresponding to the electronic devices 2 are arranged in the liquid cooling cabinet 1 of the utility model, and the plurality of electronic devices 2 and the heat dissipation components 3 are alternately distributed in sequence. Moreover, when setting, the distance between the ultrasonic transmitting end of the heat dissipation component 3 and the electronic device 2 is set to 1 to 10 cm. In this way, the heat dissipation effect of each electronic device 2 (heat source) in the liquid cooling cabinet 1 can be guaranteed.

[0036] Of course, in order to achieve a better heat dissipation effect, during the design, the emission direction of the ultrasonic waves of the multiple heat dissipation components 3 can be set to face the same direction, and the flow direction of the coolant 16 in the liquid cooling cabinet 1 is in the same direction as the propagation direction of the ultrasonic waves. This helps the propagation of ultrasonic waves in the coolant 16, avoiding excessive energy attenuation of ultrasonic waves during propagation caused by mutual interference during propagation in opposite directions, and setting the emission directions of multiple ultrasonic waves in the same direction as the flow of the coolant 16 helps the diffusion and propagation of ultrasonic waves, further improving the heat dissipation effect.

[0037] The heat dissipation component 3 of one embodiment of the utility model includes a box body 31, the box body 31 is arranged in parallel with the electronic device 2, the ultrasonic generator 311 and the transducer 312 are both arranged on the box body 31, and the ultrasonic generator 311 and the transducer 312 are electrically connected, and the heat dissipation component 3 is detachably installed in the liquid cooling cabinet 1 through the box body 31. The heat dissipation component 3 in this embodiment is set as an integrated module. When in use, a space for installing the heat dissipation component 3 can be reserved in the liquid cooling cabinet 1. In the reserved space, a mounting groove, a support frame or other mounting structure that can stably install the heat dissipation component 3 in the liquid cooling cabinet 1 can be set. Through the integrated modular setting, the installation and subsequent maintenance efficiency of the liquid cooling equipment can be improved. After long-term use, the heat dissipation component 3 that has been in operation for a long time can be disassembled and repaired by replacing the heat dissipation component 3, and another new heat dissipation component 3 can be put into the corresponding position without affecting the heat dissipation effect. It should be noted that since the ultrasonic generator 311 and the transducer 312 also generate a certain amount of heat during operation, by immersing them in the coolant 16, the heat generated by the heat dissipation component 3 during operation can be dissipated in time to ensure its good working condition (it should be noted that the overall power of the heat dissipation component 3 is much smaller than the power of the electronic device 2, and the impact on the heat in the liquid cooling cabinet 1 can be ignored).

[0038] Of course, in order to facilitate the installation and disassembly of the heat dissipation component 3, one end of the liquid cooling cabinet 1 of the utility model is set as an open structure, and a support plate 313 and a handle 314 are respectively provided on both sides of the box body 31. The handle 314 is set on the support plate 313, and the support plate 313 is supported at the edge of the opening of the liquid cooling cabinet 1. A gap is reserved between the bottom plate of the box body 31 and the bottom wall of the liquid cooling cabinet 1. A top plate 317 is provided on the top of the box body 31, and a power socket 315 and a switch 316 are provided on the top plate 317. The heat dissipation component 3 in this embodiment is supported at the opening of the liquid cooling cabinet 1 by the support plate 313. A quick-release fixing component for positioning or fixing the support plate 313 can be provided at the edge of the liquid cooling cabinet 1, so that the heat dissipation component 3 is stably fixed in the liquid cooling cabinet 1. During installation, a gap is reserved between the heat dissipation component 3 and the bottom of the liquid cooling cabinet 1, so that the coolant 16 can flow through the bottom of the heat dissipation component 3, so that the coolant 16 can surround the heat dissipation component 3 in all directions, thereby achieving a better heat dissipation effect on the heat dissipation component 3 and the electronic equipment 2.

[0039] Since the electronic device 2 has a certain volume, and during operation, its heating part is not limited to one point, but is an area or multiple areas with a certain area. In order to achieve a better heat dissipation effect, each heat dissipation component 3 of the utility model includes multiple transducers 312, and the multiple transducers 312 are arranged in an array distribution. On the one hand, the arrangement of multiple transducers 312 can improve the transmission power of the ultrasonic wave. On the other hand, the array distribution of multiple transducers 312 can increase the coverage area of ​​the ultrasonic wave emission, so that the ultrasonic wave can act evenly on the electronic device 2. By reasonably arranging the heating position relationship between the transducer 312 and the electronic device 2, the heat dissipation treatment of the electronic device 2 can be more targeted.

[0040] The multiple transducers 312 in the present invention can be fixed on the box body 31 by one or more connection methods such as pasting, thread connection, and welding. A mounting plate for mounting the transducers 312 can be provided on the box body 31, and the transducers 312 are fixed on the mounting plate in an array arrangement. The mounting plate and the electronic device 2 are arranged in parallel to ensure the consistency of the distance between the multiple transducers 312 and the electronic device 2, so that the heat dissipation effect is easy to uniformly control.

[0041] During the propagation of ultrasonic waves, if there are obstacles on the propagation path, the propagation of ultrasonic waves will be hindered, and the ultrasonic waves will not be able to directly reach the heating area of ​​the electronic device 2. In order to achieve a better heat dissipation effect, in actual use, the cover plate of the electronic device 2 of the utility model facing the transducer 312 side can be removed so that the ultrasonic waves can directly act on the electrical components inside the electronic device 2.

[0042] See attached Figure 1 In one embodiment of the utility model, the liquid cooling cabinet 1 is provided with an input pipeline 11 and an output pipeline 12. The inlet end of the input pipeline 11 is provided with a pump body 15. The input pipeline 11 and the output pipeline 12 are both provided with a temperature detection component 13 and a valve body 14. The temperature detection component 13 is connected to the pump body 15. In actual operation, the temperature in the liquid cooling cabinet 1 can be known through the temperature detection component 13. When the temperature is high, the flow rate of the liquid in the liquid cooling cabinet 1 can be adjusted through the valve body 14. The heat dissipation capacity of the coolant can be enhanced by emitting ultrasonic waves in conjunction with the heat dissipation component 3, thereby achieving a better heat dissipation effect.

[0043] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that the present invention includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification that does not deviate from the functional and structural principles of the present invention shall be included in the scope of the claims.

Claims

1. An immersion liquid cooling heat dissipation structure, comprising a liquid cooling cabinet (1) and an electronic device (2) immersed in a cooling liquid (16) of the liquid cooling cabinet (1), characterized in that: The liquid cooling cabinet (1) is provided with a heat dissipation component (3) located on one side of the electronic device (2); the heat dissipation component (3) comprises an ultrasonic generator (311) and a transducer (312) immersed in cooling liquid (16); and the heat dissipation component (3) is capable of emitting ultrasonic waves toward the electronic device (2).

2. The immersion liquid cooling heat dissipation structure according to claim 1, characterized in that: The liquid cooling cabinet (1) is provided with a plurality of electronic devices (2) and heat dissipation components (3) corresponding one to one with the electronic devices (2), and the plurality of electronic devices (2) and the heat dissipation components (3) are alternately distributed in sequence.

3. The immersion liquid cooling heat dissipation structure according to claim 2, characterized in that: The ultrasonic waves emitted by the plurality of heat dissipation components (3) are directed in the same direction, and the flow direction of the cooling liquid (16) in the liquid cooling cabinet (1) is in the same direction as the propagation direction of the ultrasonic waves.

4. The immersion liquid cooling heat dissipation structure according to any one of claims 1 to 3, characterized in that: The distance between the ultrasonic wave transmitting end of the heat dissipation component (3) and the electronic device (2) is 1 to 10 cm.

5. The immersion liquid cooling heat dissipation structure according to claim 4, characterized in that: The heat dissipation component (3) comprises a box (31), the box (31) and the electronic device (2) are arranged in parallel with each other at an interval, the ultrasonic generator (311) and the transducer (312) are both arranged on the box (31), and the ultrasonic generator (311) and the transducer (312) are electrically connected, and the heat dissipation component (3) is detachably installed in the liquid cooling cabinet (1) through the box (31).

6. The immersion liquid cooling heat dissipation structure according to claim 5, characterized in that: One end of the liquid cooling cabinet (1) is an open structure, and a support plate (313) and a handle (314) are respectively provided on both sides of the box body (31), and the handle (314) is arranged on the support plate (313), and the support plate (313) is supported at the edge of the opening of the liquid cooling cabinet (1), and a gap is reserved between the bottom plate of the box body (31) and the bottom wall of the liquid cooling cabinet (1), and a top plate (317) is provided on the top of the box body (31), and a power socket (315) and a switch (316) are provided on the top plate (317).

7. The immersion liquid cooling heat dissipation structure according to claim 1, characterized in that: Each of the heat dissipation components (3) comprises a plurality of transducers (312), and the plurality of transducers (312) are arranged in an array distribution.

8. The immersion liquid cooling heat dissipation structure according to claim 5, characterized in that: The transducer (312) is fixed on the box body (31) by one or more connection methods including gluing, thread connection, and welding.

9. The immersion liquid cooling heat dissipation structure according to claim 1, characterized in that: The cover plate on the side of the electronic device (2) facing the transducer (312) can be removed so that the ultrasonic wave can directly act on the electrical components inside the electronic device (2).

10. The immersion liquid cooling heat dissipation structure according to claim 1, characterized in that: The liquid cooling cabinet (1) is provided with an input pipeline (11) and an output pipeline (12); the input pipeline (11) and the output pipeline (12) are both provided with a temperature detection component (13) and a valve body (14); the electronic device (2) is provided with a temperature detection component (13); and the temperature detection component (13) is communicatively connected with the valve body (14).

Images