Sealing device and display module production equipment

Abstract

The utility model relates to a sealing device and display module production equipment. The sealing device is used for sealing an LED lamp bead, and the LED lamp bead comprises a packaging structure and a light-emitting chip arranged in the packaging structure. The sealing device comprises a box body, a conveying mechanism and a material spraying mechanism, wherein a heating chamber and a first cooling chamber are arranged in the box body at an interval; the conveying mechanism penetrates through the heating chamber and the first cooling chamber and penetrates through the box body; the conveying mechanism is used for conveying the LED lamp beads; the material spraying mechanism is arranged on the box body, the material spraying mechanism is communicated with the heating chamber, and the material spraying mechanism is used for spraying a gaseous sealing material into the heating chamber. Therefore, sealing of the LED lamp beads can be achieved, the yield and reliability of the LED lamp beads are improved, and the service life of the LED lamp beads is prolonged. The sealing device can be used for the display module production equipment, so that the yield and the reliability of the display module can be improved, and the display quality of the display module can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a sealing device and display module production equipment. Background Art

[0002] The working principle of light emitting diode (LED) is as follows: the terminal voltage of PN junction forms a certain potential barrier. When the forward bias voltage is applied, the potential barrier drops, and the majority carriers in the P region and N region diffuse to each other. Since the electron mobility is much greater than the hole mobility, a large number of electrons will diffuse to the P region, forming an injection of minority carriers in the P region. These electrons recombine with holes in the valence band, and the energy obtained during the recombination is released in the form of light energy. It is widely used because of its many advantages such as high efficiency, high brightness, high reliability, energy saving and fast response speed.

[0003] The pixel elements used in LED display screens are LED lamp beads. The service life of LED lamp beads affects the display quality of LED display screens. However, the packaging reliability of LED lamp beads in related technologies is low. For example, there are gaps in the brackets and potting glue of LED lamp beads, which makes it easy for water vapor to enter the interior of LED lamp beads, making LED lamp beads prone to aging, damage and other problems, shortening the service life of LED lamp beads and affecting the display quality of the display screen. Utility Model Content

[0004] Based on this, the present application provides a sealing device and a display module production equipment to improve the packaging reliability of LED lamp beads, extend the service life of LED lamp beads, and further improve the display quality of the display module.

[0005] The embodiment of the first aspect of the present application provides a sealing device for sealing an LED lamp bead, wherein the LED lamp bead comprises a packaging structure and a light-emitting chip arranged in the packaging structure. The sealing device comprises:

[0006] A box body, wherein a heating chamber and a first cooling chamber are arranged in the box body;

[0007] A conveying mechanism, the conveying mechanism passes through the heating chamber and the first cooling chamber and penetrates the box body; the conveying mechanism is used to convey the LED lamp beads;

[0008] A spraying mechanism is arranged on the box body, the spraying mechanism is communicated with the heating chamber, and the spraying mechanism is used to spray gaseous sealing material into the heating chamber.

[0009] In one of the embodiments, the spraying mechanism includes a feeding unit and at least one gasification unit, the feeding unit is connected to all the gasification units, the feeding unit is used to provide sealing material to the gasification unit, and the gasification unit is used to gasify the sealing material.

[0010] In one of the embodiments, the gasification unit includes a gasification bin, a fan and an air duct, the gasification bin is connected to the feeding unit, and the gasification bin is used to gasify the sealing material; the fan is connected to the gasification bin, and the air duct is connected to the gasification bin and the heating chamber.

[0011] In one of the embodiments, the gasification chamber includes a chamber body and a first heater disposed in the chamber body; the fan and the air duct are both connected to the chamber body.

[0012] In one of the embodiments, one end of the air guide tube extends into the heating chamber and is located above the conveying mechanism; the other end of the air guide tube is connected to the gasification chamber.

[0013] In one embodiment, the fan is a hot air blower.

[0014] In one of the embodiments, the feeding unit includes a silo and a feed port and a discharge port arranged on the silo; the discharge port is connected to the gasification unit.

[0015] In one of the embodiments, the sealing material is configured to be in a liquid state when the LED lamp bead is in a working state, and to be in a solid state when the LED lamp bead is in a non-working state, so that the interior of the packaging structure is always isolated from the outside.

[0016] An embodiment of the second aspect of the present application provides a display module production device, comprising a sealing device according to any one of the embodiments of the first aspect.

[0017] In one embodiment, it includes a reflow soldering device, which includes a reflow furnace and the heating chamber, the insulation chamber, the welding chamber and the second cooling chamber sequentially arranged in the reflow furnace, the box body is arranged in the reflow furnace, the heating chamber of the box body is connected with the welding chamber; the first cooling chamber of the box body is connected with the second cooling chamber; the conveying mechanism passes through the heating chamber, the insulation chamber, the welding chamber, the heating chamber, the first cooling chamber and the second cooling chamber, and the conveying mechanism runs through the reflow furnace.

[0018] When sealing the LED lamp beads, the above sealing device can convey the LED lamp beads into the box through the conveying mechanism. When the LED lamp beads pass through the heating chamber, due to the high temperature of the heating chamber, the packaging structure of the LED lamp beads expands due to the heat, so that the original gap of the packaging structure of the LED lamp beads is enlarged, and the spraying mechanism sprays the sealing material into the heating chamber, and the gaseous sealing material can enter the interior of the LED lamp beads through the gap on the packaging structure. When the LED lamp beads pass through the first cooling chamber, the sealing material in the LED lamp beads solidifies, thereby filling the gap on the packaging structure of the LED lamp beads and achieving the sealing of the LED lamp beads. The sealing device can be used for display module production equipment, thereby improving the yield and reliability of the display module, and further improving the display quality of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the structure of the sealing device in some embodiments of the present application.

[0020] Figure 2 It is a schematic diagram of the partial structure of the sealing device in some embodiments of the present application.

[0021] Figure 3 for Figure 2 A front view structural schematic diagram of the sealing structure shown.

[0022] Figure 4 This is a schematic diagram of the structure of the spraying mechanism of the sealing device in some embodiments of the present application.

[0023] Figure 5 It is a schematic diagram of the structure of the display module production equipment in some embodiments of the present application.

[0024] Figure 6 This is a schematic diagram of the structure of LED lamp beads in some embodiments of the present application.

[0025] Description of reference numerals:

[0026] 10. Sealing device; 20. Reflow soldering device; 30. Display module;

[0027] 110, box body; 111, heating chamber; 1111, first cavity; 112, first cooling chamber; 1121, second cavity; 120, conveying mechanism; 130, spraying mechanism; 131, feeding unit; 1311, silo; 1312, feed port; 1313, discharge port; 132, gasification unit; 1321, gasification silo; 1321a, silo body; 1322, fan; 1323, air guide pipe;

[0028] 210, reflow oven; 211, heating chamber; 212, insulation chamber; 213, welding chamber; 214, second cooling chamber;

[0029] 310, LED lamp bead; 311, packaging structure; 3111, bracket; 3112, potting glue; 312, light-emitting chip; 320, substrate. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0034] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0036] The working principle of light emitting diode (LED) is as follows: the terminal voltage of PN junction forms a certain potential barrier. When the forward bias voltage is applied, the potential barrier drops, and the majority carriers in the P region and N region diffuse to each other. Since the electron mobility is much greater than the hole mobility, a large number of electrons will diffuse to the P region, forming an injection of minority carriers in the P region. These electrons recombine with holes in the valence band, and the energy obtained during the recombination is released in the form of light energy. It is widely used because of its many advantages such as high efficiency, high brightness, high reliability, energy saving and fast response speed.

[0037] The pixel elements used in LED display screens are LED lamp beads. The service life of LED lamp beads affects the display quality of LED display screens. However, the packaging reliability of LED lamp beads in related technologies is low. For example, there are gaps in the brackets and potting glue of LED lamp beads, which makes it easy for water vapor to enter the interior of LED lamp beads, making LED lamp beads prone to aging, damage and other problems, shortening the service life of LED lamp beads and affecting the display quality of the display screen.

[0038] Based on the above technical problems, the present application provides a sealing device and a display module production equipment to improve the packaging reliability of LEDs, extend the service life of LED lamp beads, and further improve the display quality of the display module.

[0039] First, see Figure 1 and Figure 6The embodiment of the present application provides a sealing device 10 for sealing an LED lamp bead 310, wherein the LED lamp bead 310 includes a packaging structure 311 and a light-emitting chip 312 disposed in the packaging structure 311. The sealing device 10 includes a box body 110, a conveying mechanism 120 and a spraying mechanism 130. A heating chamber 111 and a first cooling chamber 112 are arranged in the box body 110; the conveying mechanism 120 passes through the heating chamber 111 and the first cooling chamber 112 and penetrates the box body 110; the conveying mechanism 120 is used to convey the LED lamp bead 310; the spraying mechanism 130 is disposed on the box body 110, the spraying mechanism 130 is connected to the heating chamber 111, and the spraying mechanism 130 is used to spray a gaseous sealing material into the heating chamber 111.

[0040] Specifically, Figure 6 As shown, the packaging structure 311 includes a bracket 3111 and a potting compound 3112. The bracket 3111 can be made of plastic; from a microscopic perspective, there are a large number of small gaps on the bracket 3111. The potting compound 3112 can be formed of a transparent polymer, such as epoxy resin; from a microscopic perspective, there are a large number of small gaps on the potting compound 3112. During the use of the LED lamp bead 310, external water vapor can enter the packaging structure 311 through the gaps, causing the LED lamp bead 310 to be prone to aging, damage and other problems. In the present application, the LED lamp bead 310 can be transported by the conveying mechanism 120. When the LED lamp bead 310 passes through the heating chamber 111 of the box body 110, the temperature of the heating chamber 111 is relatively high, and the bracket 3111 and the potting glue 3112 of the packaging structure 311 will expand. Due to the difference in thermal expansion coefficients between the bracket 3111 and the potting glue 3112, the bracket 3111 and the potting glue 3112 will be squeezed and deformed, and the gap on the bracket 3111 and / or the potting glue 3112 will become larger. The spraying mechanism 130 sprays the LED lamp bead 310 into the heating chamber 111. The gaseous sealing material is introduced into the packaging structure 311 through the gaps in the bracket 3111 and / or the potting glue 3112. When the LED lamp bead 310 passes through the first cooling chamber 112 of the box body 110, the sealing material in the LED lamp bead 310 is solidified, thereby filling the gaps in the bracket 3111 and the potting glue 3112 of the LED lamp bead 310, thereby achieving the sealing of the LED lamp bead 310; thereby improving the packaging reliability and yield of the LED lamp bead 310 and extending the service life of the LED lamp bead 310.

[0041] In summary, the sealing device 10 provided in the embodiment of the present application can convey the LED lamp bead 310 to the box body 110 through the conveying mechanism 120 when sealing the LED lamp bead 310. When the LED lamp bead 310 passes through the heating chamber 111, due to the high temperature of the heating chamber 111, the packaging structure 311 of the LED lamp bead 310 expands due to the heat, so that the original gap of the packaging structure 311 of the LED lamp bead 310 is enlarged, and the spraying mechanism 130 sprays the sealing material into the heating chamber 111, and the gaseous sealing material can enter the interior of the LED lamp bead 310 through the gap on the packaging structure 311. When the LED lamp bead 310 passes through the first cooling chamber 112, the sealing material in the LED lamp bead 310 is solidified, thereby filling the gap on the packaging structure 311 of the LED lamp bead 310 to achieve the sealing of the LED lamp bead 310; thereby, the packaging reliability and yield of the LED lamp bead 310 can be improved, and the service life of the LED lamp bead 310 can be extended.

[0042] It should be noted that if Figure 1 As shown, the heating chamber 111 includes a first cavity 1111 defined in the box body 110, and a second heater (not shown) disposed in the first cavity 1111; the first cooling chamber 112 includes a second cavity 1121 defined in the box body 110, and a cooler (not shown) is disposed in the second cavity 1121. The conveying mechanism 120 may be a transmission belt mechanism, or other conveying mechanisms may be used, and there is no particular limitation on this.

[0043] In one embodiment, if Figure 2 As shown, the spraying mechanism 130 includes a feeding unit 131 and at least one gasification unit 132. The feeding unit 131 is connected to all the gasification units 132. The feeding unit 131 is used to provide sealing materials to the gasification units 132, and the gasification units 132 are used to gasify the sealing materials.

[0044] Thus, the feeding unit 131 feeds the gasification unit 132 , and the gasification unit 132 gasifies the package, so that the spraying mechanism 130 can conveniently spray the gaseous sealing material into the heating chamber 111 to achieve the sealing of the LED lamp bead 310 .

[0045] In one embodiment, if Figure 3 As shown, the gasification unit 132 includes a gasification bin 1321, a fan 1322 and an air duct 1323. The gasification bin 1321 is connected to the feeding unit 131, and the gasification bin 1321 is used to gasify the sealing material; the fan 1322 is connected to the gasification bin 1321, and the air duct 1323 is connected to the gasification bin 1321 and the heating chamber 111.

[0046] Thus, the sealing material provided by the feeding unit 131 can be gasified through the gasification bin 1321, and the fan 1322 drives the gaseous sealing material to move toward the air guide pipe 1323, and is introduced into the heating chamber 111 through the air guide pipe 1323, thereby realizing rapid gasification and introduction of the sealing material.

[0047] In one embodiment, if Figure 4 As shown, the gasification chamber 1321 includes a chamber body 1321a and a first heater (not shown) disposed in the chamber body 1321a; the fan 1322 and the air guide pipe 1323 are both connected to the chamber body 1321a.

[0048] Thus, the sealing material entering the chamber body 1321 a can be heated by the first heater, so that the sealing material is vaporized and introduced into the heating chamber 111 through the air duct 1323 under the drive of the fan 1322 .

[0049] In one embodiment, if Figure 1 , Figure 3 and Figure 4 As shown, one end of the air guide pipe 1323 extends into the heating chamber 111 and is located above the conveying mechanism 120 ; the other end of the air guide pipe 1323 is connected to the gasification bin 1321 .

[0050] Therefore, by extending one end of the air guide tube 1323 into the heating chamber 111 and being located above the conveying mechanism 120; the other end of the air guide tube 1323 is connected to the gasification bin 1321, so that the gaseous sealing material introduced into the heating chamber 111 through the air guide tube 1323 can be directly sprayed onto the surface of the LED lamp bead 310, so that the gaseous sealing material can effectively fill the interior and gaps of the packaging structure 311, thereby achieving the sealing of the LED lamp bead 310.

[0051] In one embodiment, the fan 1322 is a hot air fan 1322 .

[0052] Therefore, the hot air blower 1322 can not only drive the gaseous sealing material to move toward the air guide pipe 1323, but also promote the gasification of the sealing material, increase the gasification rate of the sealing material, and at the same time, allow the gasified sealing material to be introduced into the heating chamber 111 in time.

[0053] In one embodiment, if Figure 3 As shown, the feeding unit 131 includes a silo 1311 and a feed port 1312 and a discharge port 1313 disposed on the silo 1311 , and the discharge port 1313 is communicated with the gasification unit 132 .

[0054] Therefore, the sealing material can be conveniently added into the silo 1311 through the feed port 1312 , and the feeding unit 131 can conveniently provide the sealing material to the gasification unit 132 through the discharge port 1313 .

[0055] In one embodiment, the sealing material is configured to be in liquid state when the LED lamp bead 310 is in a working state, and in solid state when the LED lamp bead 310 is in a non-working state, so that the interior of the packaging structure 311 is always isolated from the outside.

[0056] Therefore, when the LED lamp bead 310 is in a working state, the sealing material is in liquid state, and the sealing material can fill the gaps on the packaging structure 311; when the LED lamp bead 310 is in a non-working state, the sealing material in the packaging structure 311 and in the gaps filled in the packaging structure 311 gradually solidifies. In this way, no matter whether the LED lamp bead 310 is in a working state or a non-working state, the sealing material can always isolate the interior of the packaging structure 311 from the outside world, thereby reducing the probability of aging and damage of the light-emitting chip 312 due to erosion by external water vapor, improving the packaging reliability of the LED lamp bead 310, and extending the service life of the LED lamp bead 310.

[0057] In a specific example, the melting point of the sealing material is lower than the minimum temperature generated when the light emitting chip 312 emits light.

[0058] Therefore, when the LED lamp bead 310 is working and the light-emitting chip 312 is emitting light, the sealing material will quickly convert from solid to liquid and fill the gaps on the packaging structure 311 to ensure the isolation of the interior of the packaging structure 311 from the outside world; when the LED lamp bead 310 stops working and the light-emitting chip 312 does not emit light, the sealing material gradually converts from liquid to solid, thereby effectively isolating the interior of the packaging structure 311 from the outside world, effectively improving the packaging reliability of the LED lamp bead 310, and thus extending the service life of the LED lamp bead 310.

[0059] In one embodiment, the sealing material includes wax. The melting point of wax is between 57°C and 63°C, and the minimum temperature of the light-emitting chip 312 when emitting light is 80°C. In this way, by filling wax in the packaging structure 311, the packaging structure 311 can be effectively isolated from the outside world, effectively improving the packaging reliability of the LED lamp bead 310, thereby extending the service life of the LED lamp bead 310. In addition, wax is a transparent material and does not affect the light output of the LED lamp bead 310.

[0060] Second, see Figure 5 The embodiment of the present application provides a display module production device, comprising a sealing device 10 according to any one of the embodiments of the first aspect. In this way, the yield and reliability of the display module can be improved, and thus the display quality of the display module can be improved.

[0061] In one embodiment, if Figure 5As shown, the reflow soldering device 20 includes a reflow soldering furnace 210 and a heating chamber 211, a heat preservation chamber 212, a welding chamber 213 and a second cooling chamber 214 which are sequentially arranged in the reflow furnace 210. The box body 110 is arranged in the reflow furnace 210. The heating chamber 111 of the box body 110 is connected with the welding chamber 213; the first cooling chamber 112 of the box body 110 is connected with the second cooling chamber 214; the conveying mechanism 120 passes through the heating chamber 211, the heat preservation chamber 212, the welding chamber 213, the heating chamber 111, the first cooling chamber 112 and the second cooling chamber 214, and the conveying mechanism 120 runs through the reflow furnace 210.

[0062] The display module 30 includes a substrate 320 and an LED lamp bead 310, and the substrate 320 can be a circuit board. The LED lamp bead 310 can be fixed on the substrate 320 by the reflow soldering device 20. In this embodiment, by setting the box body in the reflow furnace 210, the heating chamber 111 of the box body 110 is connected with the welding chamber 213; the first cooling chamber 112 of the box body 110 is connected with the second cooling chamber 214; the conveying mechanism 120 passes through the heating chamber 211, the insulation chamber 212, the welding chamber 213, the heating chamber 111 of the box body 110, the first cooling chamber 112 and the second cooling chamber 214, and the conveying mechanism 120 passes through the reflow furnace 210, so that the LED lamp bead 310 can be fixed on the substrate 320 while achieving the sealing of the LED lamp bead 310, thereby improving the manufacturing yield and efficiency of the display module 30, improving the reliability of the display module 30, and then improving the display quality of the display module 30.

[0063] It should be noted that the box 110 and the reflow furnace 210 may be an integrated structure or a separate structure. Figure 5 As shown, if the box body 110 and the reflow oven 210 are an integrated structure, the welding chamber 213 of the reflow oven 210 can be used as the heating chamber 111 , and the second cooling chamber 214 in the reflow oven 210 can be used as the first cooling chamber 112 .

[0064] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A sealing device for sealing an LED lamp bead, wherein the LED lamp bead comprises a packaging structure and a light-emitting chip arranged in the packaging structure, characterized in that: The sealing device comprises: A box body, wherein a heating chamber and a first cooling chamber are arranged in the box body; A conveying mechanism, the conveying mechanism passes through the heating chamber and the first cooling chamber and penetrates the box body; the conveying mechanism is used to convey the LED lamp beads; A spraying mechanism is arranged on the box body, the spraying mechanism is communicated with the heating chamber, and the spraying mechanism is used to spray gaseous sealing material into the heating chamber.

2. The sealing device according to claim 1, characterized in that: The spraying mechanism comprises a feeding unit and at least one gasification unit, wherein the feeding unit is connected to all the gasification units, the feeding unit is used to provide sealing material to the gasification unit, and the gasification unit is used to gasify the sealing material.

3. The sealing device according to claim 2, characterized in that: The gasification unit includes a gasification bin, a fan and an air duct. The gasification bin is connected to the feeding unit and is used to gasify the sealing material. The fan is connected to the gasification bin, and the air duct is connected to the gasification bin and the heating chamber.

4. The sealing device according to claim 3, characterized in that: The gasification chamber includes a chamber body and a first heater disposed in the chamber body; the fan and the air guide pipe are both connected to the chamber body.

5. The sealing device according to claim 3, characterized in that: One end of the air guide pipe extends into the heating chamber and is located above the conveying mechanism; the other end of the air guide pipe is communicated with the gasification bin.

6. The sealing device according to claim 3, characterized in that: The fan is a hot air fan.

7. The sealing device according to claim 2, characterized in that: The feeding unit comprises a silo and a feed port and a discharge port arranged on the silo; the discharge port is communicated with the gasification unit.

8. The sealing device according to any one of claims 1 to 7, characterized in that: The sealing material is configured to be in a liquid state when the LED lamp bead is in a working state, and to be in a solid state when the LED lamp bead is in a non-working state, so that the interior of the packaging structure is always isolated from the outside.

9. A display module production device, characterized in that: Comprising a sealing device according to any one of claims 1 to 8.

10. The display module production equipment according to claim 9, characterized in that: The invention comprises a reflow soldering device, which comprises a reflow furnace and a heating chamber, a heat preservation chamber, a welding chamber and a second cooling chamber which are sequentially arranged in the reflow furnace. The box body is arranged in the reflow furnace, and the heating chamber of the box body is connected with the welding chamber; the first cooling chamber of the box body is connected with the second cooling chamber; the conveying mechanism passes through the heating chamber, the heat preservation chamber, the welding chamber, the heating chamber, the first cooling chamber and the second cooling chamber, and the conveying mechanism runs through the reflow furnace.

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