Light emitting device

Abstract

The utility model provides a light-emitting device which comprises a light-transmitting part, a first surface and a second surface are correspondingly formed at the two ends of the light-transmitting part in the wall thickness direction, a through groove connected end to end is formed in the edge of the light-transmitting part, and the through groove penetrates through the light-transmitting part to form a first port in the first surface and a second port in the second surface; the first surface of the light-transmitting part is opposite to the base body part, the edge of the light-transmitting part is in contact with the base body part, the first port is shielded by the base body part, and the light-transmitting part and the base body part define a packaging cavity; the light-emitting element is located in the packaging cavity and connected with the base body part; and the bonding part is accommodated in the through groove and is connected to the base body part at the first port. According to the light-emitting device, the penetrating through groove is formed in the light-transmitting piece, the through groove is used for containing the bonding part, bonding of the light-transmitting piece and the base body part is achieved, the problems of light-transmitting piece springback and glue overflowing in an existing conventional semi-inorganic packaging mode are solved, the glue amount is easy to control, the process manufacturing difficulty is lowered, and the consistency of the product appearance and air tightness is good.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor light sources, in particular to a light-emitting device. Background Art

[0002] Existing light-emitting devices such as LEDs (light-emitting diodes) are combined with a light-transmitting member and a base by bonding. Specifically, during packaging, a layer of glue is applied to the bottom surface of the light-transmitting member, and the light-transmitting member is placed on the base so that the bottom surface of the light-transmitting member and the base are bonded together in the hope of achieving airtight packaging. In the process of realizing the present utility model, the inventors found that this packaging structure has at least the following disadvantages:

[0003] 1. Water marks and air holes are easily formed at the bonding point, affecting the air tightness of the product. In this packaging structure, when the light-transmitting component is covered on the base, since there is air in the packaging cavity between the light-transmitting component and the base, the air in the packaging cavity will be compressed when the light-transmitting component is gradually covered. In this way, the light-transmitting component after the cover is installed will rebound and float due to the rebound of the glue itself and the compressed air. During the floating of the light-transmitting component, the glue will not be evenly distributed, and water marks and air holes will be formed, which will not only affect the appearance of the product, but also affect the air tightness of the product.

[0004] 2. Glue overflows easily. In the process of covering the light-transmitting parts, glue easily overflows into the packaging cavity, affecting product performance.

[0005] 3. The amount of glue cannot be accurately quantified and detected. In this packaging structure, the packaging quality is heavily dependent on the amount of glue applied. If the glue is applied too thickly, the light-transmitting part will rebound and the glue will overflow; if the glue is applied too thinly, the light-transmitting part and the base part cannot be effectively bonded, affecting the airtightness of the product. Unfortunately, in this packaging structure, the thickness of the glue cannot be detected during production, which leads to uneven appearance and airtightness of the product and poor consistency. Utility Model Content

[0006] One purpose of the utility model is to provide a light-emitting device, wherein a through groove is provided on the edge of the light-transmitting member, which is connected end to end and passes through the light-transmitting member. The through groove is utilized to accommodate a bonding portion, thereby achieving bonding and sealing between the light-transmitting member and a base portion. This not only solves the problems of springback and glue overflow of the light-transmitting member in the existing conventional semi-inorganic packaging method, but also simplifies the control of the glue amount, reduces the difficulty of the process, and achieves good consistency in product appearance and air tightness.

[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0008] The technical solution of one aspect of the utility model proposes a light-emitting device, including: a light-transmitting member, wherein the two ends of the light-transmitting member along the wall thickness direction respectively form a first surface and a second surface, and the edge of the light-transmitting member is provided with a through groove connected end to end, and the through groove penetrates the light-transmitting member to form a first port on the first surface and a second port on the second surface; a base part, the first surface of the light-transmitting member is opposite to the base part, the edge of the light-transmitting member is in contact with the base part, and the first port is shielded by the base part, and the light-transmitting member and the base part are surrounded by a packaging cavity; a light-emitting element is located in the packaging cavity and is electrically connected to the base part; and an adhesive part is accommodated in the through groove and connected to the base part at the first port.

[0009] According to some technical solutions of the present application, the through groove penetrates the light transparent member along the wall thickness direction of the light transparent member, and the second port is opposite to the first port along the wall thickness direction of the light transparent member; or the through groove penetrates the light transparent member at an angle relative to the wall thickness direction of the light transparent member, and the second port is at least partially misaligned with the first port along the wall thickness direction of the light transparent member.

[0010] According to some technical solutions of the present application, the projection shape of the through groove on the second surface is a broken line or an arc.

[0011] According to some technical solutions of the present application, the light-transmitting member includes a main body portion, an outer edge portion and at least one connecting portion, the outer edge portion is located on the peripheral side of the main body portion and is arranged at intervals from the main body portion, the through groove is formed between the outer edge portion and the main body portion, and the connecting portion is connected between the main body portion and the outer edge portion.

[0012] According to some technical solutions of the present application, there is a gap between the relative surfaces of the connecting portion and the base portion, the gap is connected to the through groove, and a portion of the adhesive portion is located in the gap to connect the connecting portion and the base portion.

[0013] According to some technical solutions of the present application, the thickness of the connecting part is smaller than the thickness of the outer edge part; one end of the connecting part in the thickness direction is flush with one end of the outer edge part in the thickness direction, and the other end of the connecting part in the thickness direction is recessed relative to the other end of the outer edge part in the thickness direction, so that when the other end of the outer edge part in the thickness direction contacts the base part, the gap can be formed between the connecting part and the base part.

[0014] According to some technical solutions of the present application, there are multiple connecting parts, wherein the connecting parts are distributed at intervals along the circumference of the main body, and the through groove is between two circumferentially adjacent connecting parts.

[0015] According to some technical solutions of the present application, the base portion includes a substrate and a dam, the dam is arranged on the surface of one side of the substrate, the dam and the substrate form a groove, the edge of the light-transmitting member rests on the end of the dam away from the substrate and the first port is shielded by the dam, the adhesive portion is connected to the dam at the first port, and the light-transmitting member and the groove together form the packaging cavity; the light-emitting element is located in the groove and connected to the substrate.

[0016] According to some technical solutions of the present application, a step is recessed at one end of the dam away from the substrate, and an edge of the light-transmitting member rests on the step.

[0017] According to some technical solutions of the present application, the bonding part is a light-transmitting glue.

[0018] Some technical solutions of the present application provide light-emitting devices, in which a through groove connected end to end is provided at the edge of the light-transmitting member, and the through groove penetrates the light-transmitting member to form a first port on the first surface of the light-transmitting member and a second port on the second surface of the light-transmitting member. When the light-transmitting member and the base part are covered to form a packaging cavity, the first surface of the light-transmitting member is opposite to the base part, the edge of the light-transmitting member is in contact with the base part and the first port is shielded by the base part. At this time, a medium (such as glue, etc.) for forming a bonding part can be injected into the through groove from the second port, so as to utilize the formed bonding part to achieve bonding and sealing between the light-transmitting member and the base part. This structure realizes the bonding of the light-transmitting member and the base portion. Since the bonding portion is filled in the through groove, there is no need to apply glue between the bottom surface of the light-transmitting member and the base portion, so that there will be no problem of glue overflowing into the packaging cavity. The through groove can be used to more conveniently and accurately quantify the bonding portion, thereby avoiding problems such as excessive or insufficient glue, better taking into account the appearance and air tightness of the product, and making the product more consistent. This structure can realize the process sequence of first covering the light-transmitting member and then filling the bonding portion. The process difficulty is lower, and there is no problem of glue rebound or compressed air rebound causing the light-transmitting member to float, thereby effectively avoiding defects such as water marks and air holes, and obtaining better air tightness and product appearance.

[0019] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other objects, features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.

[0021] Figure 1 It is a schematic diagram of the cross-sectional structure of the light-emitting device in Example 1 of the present application.

[0022] Figure 2 It is a schematic diagram of the main structure of the light-transmitting component in the first embodiment of the present application.

[0023] Figure 3 yes Figure 2 Schematic diagram of the structure of the AA section shown in .

[0024] Figure 4 yes Figure 1 Schematic diagram of the structure of the light-emitting device after removing the light-transmitting part and the light-emitting element.

[0025] Figure 5 It is a schematic diagram of the main structure of the light-transmitting member in another embodiment of the present application.

[0026] Figure 6 It is a schematic diagram of the main structure of the light-transmitting member in another embodiment of the present application.

[0027] Figure 7 It is a schematic diagram of the cross-sectional structure of the light-emitting device in the second embodiment of the present application.

[0028] Figure 8 It is a schematic diagram of the cross-sectional structure of the light-emitting device in Example 3 of the present application.

[0029] Fig. 9 It is a schematic diagram of the cross-sectional structure of a light-emitting device in another embodiment of the present application.

[0030] The reference numerals are as follows:

[0031] 10. light-transmitting member; 11. through groove; 111. first port; 112. second port; 12. main body; 13. outer edge; 14. connecting portion; 15. gap;

[0032] 20. base body; 21. base plate; 22. dam; 221. step;

[0033] 30. Packaging cavity;

[0034] 40. Light-emitting element;

[0035] 50. bonding part;

[0036] 61. Circuit portion; 62. Conductive hole; 63. Solder pad;

[0037] 71. Welding line. DETAILED DESCRIPTION

[0038] Although the present invention can be easily embodied in different forms of embodiments, only some of the specific embodiments are shown in the drawings and described in detail in this specification. It should be understood that this description should be regarded as an exemplary description of the principles of the present invention and is not intended to limit the present invention to that described herein.

[0039] Thus, a feature indicated in this specification will be used to illustrate one of the features of an embodiment of the utility model, rather than implying that each embodiment of the utility model must have the described feature. In addition, it should be noted that this specification describes many features. Although certain features can be combined together to illustrate possible system designs, these features can also be used in other combinations that are not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting. The multiple referred to in this specification can be understood as two or more.

[0040] In the embodiments shown in the drawings, the indications of directions (such as up, down, left, right, front, back, etc.) used to explain the structure and movement of various elements of the utility model are not absolute but relative. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions also change accordingly.

[0041] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that the description of the utility model will be more comprehensive and complete, and the concepts of the example embodiments will be fully conveyed to those skilled in the art. The accompanying drawings are only schematic illustrations of the utility model and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0042] Embodiment 1

[0043] like Figures 1 to 4 As shown, this embodiment provides a light emitting device.

[0044] Light-emitting devices can be used to convert electrical energy into light for output. For example, light-emitting devices can be devices such as LEDs (light-emitting diodes), and more specifically, UV-LEDs (Ultraviolet-light-emitting diodes) that can be used to output ultraviolet light.

[0045] The light-emitting device includes a light-transmitting member 10, a base portion 20, a light-emitting element 40, an adhesive portion 50, etc. The base portion 20 and the light-transmitting member 10 are connected together by the adhesive portion 50 and enclose a packaging cavity 30. The light-emitting element 40 is located in the packaging cavity 30 and is connected to the base portion 20. The light-emitting element 40 can be a chip or other element. When the light-emitting element 40 is powered on, it can convert electrical energy into light energy to emit light. The light of the light-emitting element 40 can pass through the light-transmitting member 10 and emit, thereby realizing the light output of the light-emitting device.

[0046] With detailed examples, combined Figure 2 and Figure 3 It can be understood that the two ends of the light-transmitting member 10 along the wall thickness direction form a first surface and a second surface respectively, and the edge of the light-transmitting member 10 is provided with a through groove connected end to end, that is, the through groove is a circumferential structure connected end to end. Among them, the through groove 11 penetrates the light-transmitting member 10 to form a first port 111 on the first surface and a second port 112 on the second surface.

[0047] like Figure 1 As shown, the first surface of the light-transmitting member 10 is opposite to the base portion 20, the edge of the light-transmitting member 10 is in contact with the base portion 20 and the first port 111 is shielded by the base portion 20, and the light-transmitting member 10 and the base portion 20 are enclosed to form a packaging cavity 30; the adhesive portion 50 is accommodated in the through groove 11 and connected to the base portion 20 at the first port 111, so that the light-transmitting member 10 and the base portion 20 are connected together through the adhesive portion 50.

[0048] The through groove 11 connected end to end is provided on the edge of the light-transmitting member 10, and the through groove 11 is provided to penetrate the light-transmitting member 10. The light-transmitting member 10 and the base 20 are bonded by using the through groove 11 on the light-transmitting member 10 to accommodate the medium for forming the bonding portion 50, thereby achieving the connection and sealing between the light-transmitting member 10 and the base 20. Compared with the conventional solution of coating glue between the bottom surface of the light-transmitting member 10 and the base 20 for bonding, there is no problem of glue overflowing into the packaging cavity 30, and the through groove 11 is used to accommodate the medium for forming the bonding portion 50. The medium can be more conveniently and accurately quantified, thereby avoiding problems such as excessive glue or insufficient glue, better taking into account the appearance and air tightness of the product, and making the product more consistent. The light-transmitting member 10 is provided with a through groove 11 to accommodate the structure of the adhesive portion 50, which can realize the process sequence of first covering the light-transmitting member 10 and then filling the adhesive portion 50. The process difficulty is lower, and there is no problem of the light-transmitting member 10 floating due to the rebound of glue or compressed air, thereby effectively avoiding defects such as water marks and pores, and obtaining better air tightness and product appearance.

[0049] For example, in more detail, Figure 1 and Figure 4 It can be understood that the base portion 20 can be configured to include a base plate 21 and a dam 22 .

[0050] The material of the substrate 21 can be selected as a ceramic substrate 21 material, such as aluminum nitride ceramic (ALN), gallium nitride ceramic (GaN), aluminum oxide ceramic (AL2O3), silicon carbide ceramic (SiC), etc.

[0051] The substrate 21 can be configured to be a plate with a certain wall thickness. The surface of the substrate 21 at one end along the wall thickness direction is defined as a first plate surface, and the surface of the substrate 21 at the other end along the wall thickness direction is defined as a second plate surface.

[0052] Optionally, the dam 22 may be a copper dam.

[0053] The dam 22 is convexly disposed on the first plate surface of the substrate 21, and the shape of the dam 22 can be set to be a rectangle when viewed from a direction perpendicular to the substrate 21. Of course, it can be understood that the shape design of the dam 22 can have many implementation schemes, such as being set to be circular, elliptical, triangular, pentagonal, etc., and is not limited to the exemplified rectangle.

[0054] The dam 22 and the substrate 21 form a groove. The edge of the light-transmitting member 10 rests on the end of the dam 22 away from the substrate 21. The first end 111 of the through slot 11 of the light-transmitting member 10 is opposite to the dam 22 so as to be shielded by the dam 22. The light-transmitting member 10 and the groove together form a packaging cavity 30. The adhesive portion 50 is connected to the dam 22 at the first end 111. The light-emitting element 40 is located in the groove and connected to the substrate 21.

[0055] Of course, the present application is not limited to this. In other embodiments, the dam 22 may be eliminated, and the edge of the light-transmitting member 10 and the substrate 21 may be connected together through the adhesive portion 50 so that the light-emitting element 40 is encapsulated between the light-transmitting member 10 and the substrate 21 .

[0056] like Figure 1 As shown, a circuit portion 61 may be provided on the first surface of the substrate 21, a soldering pad 63 may be provided on the second surface of the substrate 21, and a conductive hole 62 penetrating along the wall thickness direction of the substrate 21 is provided on the substrate 21, one end of the conductive hole 62 in the extension direction is connected to the circuit portion 61, and the other end of the conductive hole 62 in the extension direction is connected to the soldering pad 63, so that the circuit portion 61 and the soldering pad 63 are electrically connected through the conductive hole 62.

[0057] like Figure 1 As shown, the light-emitting element 40 is specifically a flip chip, and the light-emitting element 40 is connected to the circuit part 61 of the substrate 21 by using a eutectic process. For example, a soldering flux is applied to the circuit part 61 of the substrate 21, wherein, in the case where the light-emitting element 40 is a flip chip, the soldering flux may be a gold-tin alloy, and a nickel-gold layer may be plated on the circuit part 61 accordingly, and the thickness of the nickel-gold layer is nickel>3μm, and gold>0.05μm. The light-emitting element 40 is fixed at the position with the soldering flux, and the substrate 21 with the light-emitting element 40 fixed is passed through a eutectic furnace, so that the light-emitting element 40 is firmly combined with the substrate 21. Among them, the temperature of the eutectic furnace has at least one temperature zone between 280℃-340℃. Since the melting point of the gold-tin alloy is 280℃, the temperature setting of this temperature zone can achieve a better eutectic welding effect. The eutectic process adopts vacuum or nitrogen protection, so that the soldering void rate of the light-emitting element 40 is reduced, and the high-temperature oxidation of the electrode of the light-emitting element 40 is prevented. The flux is used as a medium for eutectic bonding, so that the light emitting element 40 and the substrate 21 can be better bonded during eutectic bonding.

[0058] Of course, the present application is not limited to this. In other embodiments, the light emitting element 40 and the substrate 21 may be directly eutectic welded without using flux. The light emitting element 40 is also not limited to the flip chip in the example. In other embodiments, the light emitting element 40 may also be a face-up chip (such as Figure 8 as shown) or vertical chips (as Figure 7 shown) etc.

[0059] Optionally, the substrate 21 may be made by a DPC (direct plating-copper) process, and the circuit portion 61 , the pad 63 , and the dam 22 on the substrate 21 may all be integrally manufactured on the substrate 21 by the DPC process.

[0060] Optionally, combined Figure 1 and Figure 4 It can be understood that a step 221 is recessed at one end of the dam 22 away from the substrate 21, and the edge of the light-transmitting member 10 rests on the step 221. Accordingly, the first port 111 of the through slot 11 of the light-transmitting member 10 is opposite to the surface of the step 221, so that it is shielded by the surface of the step 221, and the bonding portion 50 in the through slot 11 is connected to the surface of the step 221 at the first port 111. By using the step 221, the light-transmitting member 10 can be embedded and rest on the end of the dam 22 away from the substrate 21, which has a better positioning effect on the light-transmitting member 10. At the same time, the step 221 can limit the light-transmitting member 10 from moving relative to the dam 22 in a direction parallel to the substrate 21. In this way, the shear force on the connection between the bonding portion 50 and the dam 22 is smaller, which can better ensure the long-term connection reliability of the bonding portion 50 to the light-transmitting member 10 and the dam 22. Of course, the present application is not limited to this. In other embodiments, the end of the dam 22 away from the substrate 21 can also be set to a plane.

[0061] Optionally, the light-transmitting member 10 is a lens, for example, the light-transmitting member 10 may be a glass lens, and its material may be quartz or sapphire, etc. Of course, the present application is not limited thereto, and in other embodiments, the light-transmitting member 10 may also be a fluorescent sheet, or other light-transmitting elements other than a lens and a fluorescent sheet.

[0062] like Figure 2 As shown, viewed from a direction perpendicular to the surface of the light-transmitting member 10, the light-transmitting member 10 can be divided into a main body portion 12, an outer edge portion 13 and at least one connecting portion 14 according to different positions. The outer edge portion 13 is located on the peripheral side of the main body portion 12 and is arranged at a distance from the main body portion 12. A through groove 11 is formed between the outer edge portion 13 and the main body portion 12, and the connecting portion 14 is connected between the main body portion 12 and the outer edge portion 13.

[0063] For example, when viewed from a direction perpendicular to the surface of the light-transmitting member 10, the main body 12 may be configured as follows: Figure 2The outer edge portion 13 may be configured as follows: Figure 2 In the rectangular ring shown, the outer edge portion 13 is generally distributed on the outer circumference of the main body 12 in a nested manner, and is distributed radially spaced from the main body 12, so that a through groove 11 is formed between the outer edge portion 13 and the main body 12. The connecting portion 14 can be a rib with a certain width, one end of the connecting portion 14 is connected to the main body 12, and the other end is connected to the outer edge portion 13, so as to connect the main body 12 and the outer edge portion 13 together. In this way, by connecting the main body 12 and the annular outer edge portion 13 through the connecting portion 14, while realizing a reliable connection between the outer edge portion 13 and the main body 12, a larger through groove 11 area can be obtained, so as to correspondingly realize a larger capacity of the bonding portion 50 and a connection area of ​​the bonding portion 50 to the light-transmitting member 10 and the dam 22, so as to better ensure the connection reliability of the light-transmitting member 10 and the dam 22.

[0064] Optionally, the number of connecting parts 14 can be set as follows Figure 2 The four lines shown in the figure correspond to the four sides connecting the rectangular main body 12 and the outer edge 13 of the rectangular ring, which can more reliably realize the connectivity between the main body 12 and the outer edge 13 and the overall structural strength of the light-transmitting member 10.

[0065] Alternatively, if Figure 2 As shown, four connecting portions 14 are distributed at intervals along the circumference of the main body 12, and a through groove 11 is distributed between two circumferentially adjacent connecting portions 14. Optionally, the connecting portions 14 at each side of the main body 12 are correspondingly connected to the middle position of the side of the main body 12, and four through grooves 11 roughly in the shape of an L-fold line are formed between the main body 12 and the outer edge 13 through the four connecting portions 14, that is, the projection of the through groove 11 on the second surface is in the shape of an L-fold line, and the connecting portions 14 and the bonding portions 50 in the through grooves 11 are distributed alternately in the circumference, so that the connection uniformity between the main body 12 and the outer edge 13 at various locations in the circumference is better, the connection reliability between the main body 12 and the outer edge 13 is higher, and the bonding area of ​​the bonding portion 50 in the through groove 11 is larger. At the same time, the bonding portion 50 in the through groove 11 can achieve better shear resistance, thereby more reliably maintaining the bonding strength between the light-transmitting member 10 and the dam 22.

[0066] Of course, the present application is not limited thereto. In other embodiments, Figure 5 As shown, the main body 12 can be set to a circular shape, and the outer edge 13 can be set to an irregular ring shape with an inner circle and an outer square. Three connecting parts 14 can be arranged at intervals between the main body 12 and the outer edge 13, so that three roughly arc-shaped through grooves 11 are formed between the main body 12 and the outer edge 13, that is, the projection shape of the through grooves 11 on the second surface is an arc shape. In other embodiments, such as Figure 6As shown, the main body portion 12 can be set to a circular shape, the outer edge portion 13 can be set to a circular ring shape, and three connecting portions 14 can be arranged at intervals between the main body portion 12 and the outer edge portion 13, so that three roughly arc-shaped through grooves 11 are formed between the main body portion 12 and the outer edge portion 13, that is, the shape of the projection of the through grooves 11 on the second surface is an arc shape.

[0067] It is understood that the shape of the main body 12 is not limited to Figure 2 The rectangles in the example, Figure 5 and Figure 6 In practice, the shape of the main body 12 can be adjusted and selected accordingly according to the specific appearance of the light-emitting device and the shape design requirements of the dam 22. For example, the main body 12 can be set to an ellipse, a triangle, a rhombus, a pentagon, etc. according to the needs, and the examples are not enumerated here; the shape of the outer edge 13 is not limited to the following. Figure 2 The rectangular rings exemplified in Figure 5 The irregular ring with inner circle and outer square as exemplified in Figure 6 In practice, the shape of the outer edge portion 13 can be adjusted and selected accordingly according to the specific appearance of the light-emitting device and the shape design requirements of the dam 22. For example, the outer edge portion 13 can also be set to an elliptical ring, a triangular ring, a diamond ring, a pentagonal ring, etc. according to needs, and the number of shapes of the connecting portion 14 is not limited to the following. Figure 2 The four examples given in Figure 5 and Figure 6 As shown in the three examples, in practice, the number of the connecting parts 14 can be reasonably configured depending on the size of the light-emitting device and the structural strength requirements of the light-transmitting member 10. For example, the number of the connecting parts 14 can be set to two, five, six, etc. according to the needs.

[0068] Optionally, the light-transmitting member 10 may be configured as follows: Figure 3 and Figure 1 For the plane lens, when viewed from a direction perpendicular to the thickness of the light-transmitting element 10, the body portion 12 and the outer edge portion 13 are structures with substantially equal wall thicknesses, so as to construct a substantially flush second surface.

[0069] Of course, the present application is not limited thereto. In other embodiments, the light-transmitting member 10 may be configured as follows: Fig. 9 For the hemispherical lens, the main body 12 is roughly hemispherical with a thick middle and thin edges, and the thickness of the outer edge 13 is roughly uniform and roughly equal to the thickness of the edge of the main body 12, so as to construct a second surface with a flat surface at the edge and a convex arch surface in the middle.

[0070] Alternatively, if Figure 1 and Figure 3As shown, the through groove 11 penetrates the light-transmitting member 10 along the wall thickness direction of the light-transmitting member 10, and the second port 112 and the first port 111 are opposite to each other along the wall thickness direction of the light-transmitting member 10, that is, the through groove 11 is extended and arranged substantially parallel to the wall thickness direction of the light-transmitting member 10, which has better processability and can reduce the cost of the product. Of course, the present application is not limited to this. In other embodiments, the through groove 11 can also be arranged to penetrate the light-transmitting member 10 obliquely relative to the wall thickness direction of the light-transmitting member 10, so that the second port 112 and the first port 111 are at least partially misaligned along the wall thickness direction of the light-transmitting member 10, so that the bonding portion 50 and the inner surface of the through groove 11 have a larger bonding area, and at the same time, the bonding portion 50 after solidification is not easy to separate from the through groove 11, which can better ensure the bonding strength between the light-transmitting member 10 and the dam 22. Alternatively, in other embodiments, the through groove 11 can also be arranged as a stepped through groove 11, which also has the advantages of a large bonding area and the bonding portion 50 is not easy to separate from the through groove 11.

[0071] Optionally, there is a gap 15 between the connecting portion 14 and the opposing surface of the base portion 20, for example, there is a gap 15 between the bottom surface of the connecting portion 14 and the surface of the step 221 of the dam 22, wherein the through grooves 11 on both sides of the connecting portion 14 are connected through the gap 15, so that the plurality of through grooves 11 arranged circumferentially form a head-to-tail connected structure. A portion of the adhesive portion 50 is located in the gap 15 to connect the connecting portion 14 and the base portion 20 (i.e., the surface of the step 221 of the dam 22). In this way, after the light-transmitting member 10 is covered on the dam 22, the medium (such as glue) used to form the bonding portion 50 is filled into the through groove 11 through the second port 112. Since the through grooves 11 are connected along the gaps 15, multiple through grooves 11 can be filled at one time without filling the multiple through grooves 11 separately, and the bonding portion 50 in the gaps 15 is used to achieve bonding between the connecting portion 14 and the dam 22 of the base portion 20, thereby further enhancing the connection reliability between the light-transmitting member 10 and the dam 22 of the base portion 20.

[0072] For example, Figure 3As shown, the thickness of the connecting portion 14 is less than the thickness of the outer edge portion 13; one end of the connecting portion 14 in the thickness direction is flush with one end of the outer edge portion 13 in the thickness direction, and the other end of the connecting portion 14 in the thickness direction is recessed relative to the other end of the outer edge portion 13 in the thickness direction, so that when the other end of the outer edge portion 13 in the thickness direction contacts the base portion 20, a gap 15 can be formed between the connecting portion 14 and the base portion 20. In this way, the flatness of the second surface of the light-transmitting member 10 is ensured, and when the light-transmitting member 10 is covered on the dam 22 of the base portion 20, the gap 15 is formed by naturally avoiding air by utilizing the structure that the other end of the connecting portion 14 in the thickness direction is recessed relative to the other end of the outer edge portion 13 in the thickness direction, thereby ensuring the connectivity between the through grooves 11, and providing a larger bonding area for the connection between the light-transmitting member 10 and the dam 22 of the base portion 20, thereby enhancing the connection reliability.

[0073] Optionally, the bonding portion 50 is glue, such as silicone, epoxy resin, fluororesin, etc.

[0074] Optionally, the bonding portion 50 is a light-transmitting adhesive, such as light-transmitting silicone, epoxy resin, fluororesin, etc. In this way, the bonding portion 50 will not block light at the through groove 11 of the light-transmitting member 10, thereby better ensuring the light extraction efficiency of the product.

[0075] The method for manufacturing the light emitting device of the first embodiment generally comprises the following steps:

[0076] 1. Chip bonding. Apply flux to the circuit part 61 of the substrate 21, and fix the chip (i.e., the light emitting element 40) to the position of the circuit part 61 with the flux; wherein, the pad 63 of the flip chip is a gold-tin alloy, and the circuit part 61 of the substrate 21 is plated with a nickel-gold layer, and the thickness of the nickel-gold layer satisfies: nickel>3um, gold>0.05um.

[0077] 2. Eutectic welding. The substrate 21 with the chip fixed is passed through a eutectic furnace to firmly bond the chip to the substrate 21; wherein the temperature of the eutectic furnace has at least one temperature zone between 280°C and 340°C, and the eutectic process is protected by vacuum or nitrogen.

[0078] 3. Cover the light-transmitting member 10 . Cover the light-transmitting member 10 made of glass on the step 221 of the dam 22 of the substrate 21 .

[0079] 4. Apply glue. Apply glue to the through groove 11 of the light-transmitting member 10 , so that the through groove 11 is completely filled with glue.

[0080] 5. Glue curing. The glue is cured by baking or UV light curing. It is understood that the curing method is determined by the characteristics of the selected glue. If the glue needs to be cured by baking, the baking curing method is adopted. If the glue can be cured by UV light, the UV light curing method is adopted.

[0081] The light-emitting device provided in the first embodiment not only solves the problems of springback and glue overflow of the light-transmitting member 10 in the existing conventional semi-inorganic packaging method, but also simplifies the glue quantity control, reduces the difficulty of process manufacturing, and has good consistency in product appearance and air tightness.

[0082] Embodiment 2

[0083] like Figure 7 As shown, this embodiment provides a light emitting device.

[0084] The differences from the above-mentioned embodiment 1 include: the light emitting element 40 in the embodiment 2 adopts a vertical chip.

[0085] When the light-emitting element 40 is a vertical chip, one electrode of the light-emitting element 40 is bonded to the circuit portion 61 of the substrate 21 by a bonding adhesive, and the bonding adhesive is a conductive adhesive, which can be, for example, silver adhesive, thereby achieving the fixing and electrical connection between the light-emitting element 40 and the pad 63 of the substrate 21. In addition, the other electrode of the light-emitting element 40 is connected to the circuit portion 61 of the substrate 21 by a welding wire 71, thereby achieving the electrical connection between the light-emitting element 40 and the pad 63 of the substrate 21.

[0086] Embodiment 3

[0087] like Figure 8 As shown, this embodiment provides a light emitting device.

[0088] The differences from the above-mentioned second embodiment include: the light emitting element 40 in the third embodiment adopts a front mounted chip.

[0089] When the light-emitting element 40 is a face-up chip, the light-emitting element 40 is bonded to the circuit portion 61 of the substrate 21 by a bonding adhesive, and the bonding adhesive is a conductive adhesive (such as silver adhesive) or an insulating adhesive, thereby achieving the fixing between the light-emitting element 40 and the substrate 21. The two electrodes of the light-emitting element 40 are respectively connected to the circuit portion 61 of the substrate 21 through welding wires 71, thereby achieving electrical connection between the light-emitting element 40 and the pads 63 of the substrate 21.

[0090] The method for manufacturing the light emitting device of the second or third embodiment generally comprises the following steps:

[0091] 1. Chip bonding. Apply bonding glue to the circuit part 61 of the substrate 21, fix the chip (i.e., the light-emitting element 40) to the position of the circuit part 61 with the bonding glue, and perform high-temperature baking to solidify the bonding glue, so that the chip is combined with the substrate 21; wherein, the role of bonding is: to act as solder to bond the chip to the substrate 21; wherein, the bonding glue used for the vertical chip can be silver glue; the bonding glue used for the upright chip can be insulating glue or silver glue. A nickel-palladium-gold layer is plated on the circuit part 61 of the substrate 21 to facilitate the connection of the welding wire 71 by welding. The thickness of the nickel-palladium-gold layer satisfies: nickel>3um, palladium>0.05um, and gold>0.05um.

[0092] 2. Wire bonding: Use a wire bonding machine to connect the electrodes of the chip to the circuit portion 61 of the substrate 21 by wire bonding.

[0093] 3. Cover the light-transmitting member 10 . Cover the light-transmitting member 10 made of glass on the step 221 of the dam 22 of the substrate 21 .

[0094] 4. Apply glue. Apply glue to the through groove 11 of the light-transmitting member 10 , so that the through groove 11 is completely filled with glue.

[0095] 5. Glue curing. The glue is cured by baking or UV light curing. It is understood that the curing method is determined by the characteristics of the selected glue. If the glue needs to be cured by baking, the baking curing method is adopted. If the glue can be cured by UV light, the UV light curing method is adopted.

[0096] The light-emitting devices provided in the second and third embodiments not only solve the problems of springback and glue overflow of the light-transmitting member 10 in the existing conventional semi-inorganic packaging method, but also simplify the glue quantity control, reduce the difficulty of process manufacturing, and have good consistency in product appearance and airtightness.

[0097] Although the utility model has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the utility model can be implemented in a variety of forms without departing from the spirit or essence of the utility model, it should be understood that the above-mentioned embodiments are not limited to any of the aforementioned details, but should be widely interpreted within the spirit and scope defined by the attached claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the attached claims.

Claims

1. A light emitting device, characterized in that: include: A light-transmitting member, wherein two ends of the light-transmitting member in the wall thickness direction form a first surface and a second surface respectively, and an edge of the light-transmitting member is provided with a through groove connected end to end, and the through groove penetrates the light-transmitting member to form a first port on the first surface and a second port on the second surface; A base portion, wherein the first surface of the light-transmitting member is opposite to the base portion, an edge of the light-transmitting member is in contact with the base portion, and the first port is shielded by the base portion, and the light-transmitting member and the base portion are enclosed to form a packaging cavity; A light emitting element is located in the packaging cavity and is electrically connected to the base portion; The bonding portion is accommodated in the through groove and connected to the base portion at the first port.

2. The light emitting device according to claim 1, characterized in that: The through groove penetrates the light-transmitting member along the wall thickness direction of the light-transmitting member, and the second port is opposite to the first port along the wall thickness direction of the light-transmitting member; or The through slot penetrates the light-transmitting member obliquely relative to the wall thickness direction of the light-transmitting member, and the second port and the first port are at least partially offset along the wall thickness direction of the light-transmitting member.

3. The light emitting device according to claim 1 or 2, characterized in that: The projection shape of the through groove on the second surface is a broken line shape or an arc shape.

4. The light emitting device according to claim 1 or 2, characterized in that: The light-transmitting member includes a main body portion, an outer edge portion and at least one connecting portion, wherein the outer edge portion is located on the peripheral side of the main body portion and is arranged at a distance from the main body portion, the through groove is formed between the outer edge portion and the main body portion, and the connecting portion is connected between the main body portion and the outer edge portion.

5. The light emitting device according to claim 4, characterized in that: There is a gap between the connecting portion and the opposite surfaces of the base portion, the gap is communicated with the through groove, and a part of the bonding portion is located in the gap to connect the connecting portion and the base portion.

6. The light emitting device according to claim 5, characterized in that: The thickness of the connecting portion is smaller than the thickness of the outer edge portion; One end of the connecting portion in the thickness direction is flush with one end of the outer edge portion in the thickness direction, and the other end of the connecting portion in the thickness direction is recessed relative to the other end of the outer edge portion in the thickness direction, so that when the other end of the outer edge portion in the thickness direction contacts the base portion, the gap can be formed between the connecting portion and the base portion.

7. The light emitting device according to claim 4, characterized in that: There are multiple connecting parts, wherein the connecting parts are distributed at intervals along the circumference of the main body, and the through groove is between two circumferentially adjacent connecting parts.

8. The light emitting device according to claim 1 or 2, characterized in that: The base portion includes a substrate and a dam, wherein the dam is disposed on a surface of one side of the substrate, the dam and the substrate form a groove, the edge of the light-transmitting member rests on an end of the dam away from the substrate and the first port is shielded by the dam, the adhesive portion is connected to the dam at the first port, and the light-transmitting member and the groove together form the packaging cavity; The light emitting element is located in the groove and connected to the substrate.

9. The light emitting device according to claim 8, characterized in that: A step is recessed at one end of the dam away from the substrate, and an edge of the light-transmitting member rests on the step.

10. The light emitting device according to claim 1 or 2, characterized in that: The bonding portion is a light-transmitting adhesive.

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