Gluing mechanism for electronic component manufacturing

Abstract

The utility model relates to the technical field of gluing of electronic components, and discloses a gluing mechanism for manufacturing of electronic components, which comprises a gluing device, a gluing working disc is arranged on the top side of the gluing device, a disc sleeve is fixedly mounted on the top side of the gluing device, a machine chamber is arranged in the gluing device, and the gluing working disc is arranged in the machine chamber. A feeding rotation driving mechanism used for the gluing working disc is arranged in the machine chamber, a disc groove is formed in the inner wall of the disc sleeve, arc-shaped slopes are arranged at the two ends of the disc groove, and a plurality of inner chambers are formed in the gluing working disc. An operator can place a next to-be-glued electronic component on the top side of the outer part of the gluing working disc, and immediately glue the next electronic component after the previous electronic component is glued, so that the continuous gluing operation on the electronic components can be quickly realized, and the working efficiency is improved. And the gluing working efficiency of the electronic component is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component gluing, in particular to a gluing mechanism for manufacturing electronic components. Background Art

[0002] Electronic components refer to various basic components used to constitute electronic circuits. These components can perform specific electronic functions in electronic devices; such as capacitors, inductors, electron tubes, etc.

[0003] There is a gluing mechanism for manufacturing power electronic components (its authorization announcement number is: CN220919802U), which places electronic components on a component placement seat and controls a motor to drive a screw to rotate. The screw drives two threaded blocks to move toward each other. The threaded blocks drive a clamping plate to move through a push plate and an extension rod, so that the two clamping plates limit and clamp the components, making it convenient for the main body of the gluing mechanism to perform gluing operations on the clamped electronic components.

[0004] However, when the glue coating device is coating the next electronic component, it is necessary to first remove the previous electronic component that has just been coated with glue, then put in the new electronic component and clamp and fix it again. The operation is relatively cumbersome, and it is not convenient to quickly coat the electronic components with glue, which reduces the efficiency of coating the electronic components with glue. Therefore, we propose the utility model to solve the above problems. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a glue coating mechanism for manufacturing electronic components, which is used to solve the above problems.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A glue coating mechanism for manufacturing electronic components comprises a glue coating device, a glue coating working disk is arranged on the top side of the glue coating device, a disk sleeve is fixedly installed on the top side of the glue coating device, a machine chamber is arranged in the glue coating device, a feeding and rotating driving mechanism for the glue coating working disk is arranged in the machine chamber, a disk groove is arranged on the inner wall of the disk sleeve, arc slopes are arranged at both ends of the disk groove, a plurality of inner chambers are respectively arranged in the glue coating working disk, arc plates are installed in the plurality of inner chambers through elastic clamping and adjusting mechanisms, the plurality of arc plates are movably fitted in the disk groove of the disk sleeve, a first clamping plate is fixedly installed on one side of the plurality of arc plates, a plurality of second clamping plates are respectively fixedly installed on the top side of the glue coating working disk, a frame is fixedly installed on the top side of the glue coating device, and a gluing mechanism main body is arranged on the frame.

[0008] Preferably, the gluing work disk is rotatably sleeved in a disk sleeve, and an opening is provided on the disk sleeve. When the gluing work disk is rotatably sleeved in the disk sleeve, three electronic components on the inner side of the gluing work disk are clamped and fixed by multiple groups of first clamping plates and second clamping plates.

[0009] Preferably, the feeding rotation drive mechanism includes a motor and a driving rod. The motor is fixedly mounted on the top inner wall of the machine room, and one end of the driving rod is fixedly mounted on the output shaft of the motor. The other end of the driving rod is rotatably extended to the outside of the gluing device and fixedly mounted on the bottom side of the gluing work disk. The feeding rotation drive mechanism can realize the rotation adjustment of the gluing work disk.

[0010] Preferably, the elastic clamping adjustment mechanism includes a movable block, a connecting rod and a spring, a movable block is movably installed in the inner chamber, one end of the connecting rod is fixedly installed on one side of the movable block, the other end of the connecting rod is movably passed through to the outside of the gluing working disk and is fixedly connected to the arc plate, a spring is fixedly installed on one side of the movable block, the other end of the spring is fixedly installed on one inner wall of the inner chamber, under the elastic force of the spring, the arc plate at the opening of the disk sleeve on the gluing working disk is separated from the gluing working disk.

[0011] Preferably, multiple arc plates are distributed in a circular array, and the side walls of the corresponding three arc plates are movably fitted in the disc grooves of the disc sleeve. When the side walls of the three arc plates are movably fitted in the disc grooves of the disc sleeve, the three electronic components on the glue coating work disc can be clamped and fixed.

[0012] Preferably, the plurality of second clamping plates are distributed in a circular array, and the plurality of second clamping plates are respectively matched with the corresponding first clamping plates, and the electronic components can be clamped and fixed by the first clamping plates and the second clamping plates.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] The gluing mechanism for manufacturing electronic components has a gluing working disk rotatably arranged on the top side of the gluing device, and the gluing working disk is rotatably adjusted by a feeding rotation driving mechanism. When the corresponding arc plate on the gluing working disk rotates into the disk groove of the disk sleeve, the electronic component is automatically clamped and fixed by the first clamping plate and the second clamping plate. When the clamped and fixed electronic component rotates to the lower position of the gluing mechanism body, the gluing operation on the clamped and fixed electronic component is realized by the gluing mechanism body. During the gluing of the electronic component, the operator can place the next electronic component to be glued on the outer top side of the gluing working disk, wait for the previous electronic component to be glued, and then immediately glue the next electronic component, thereby realizing rapid and continuous gluing of the electronic components, thereby improving the gluing efficiency of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model from a three-dimensional perspective;

[0016] Figure 2 It is a schematic structural diagram of the side section view of the engine room of the utility model;

[0017] Figure 3 For this utility model Figure 2 Schematic diagram of the structure of part A;

[0018] Figure 4 It is a structural schematic diagram of the utility model from the perspective of a partial explosion section.

[0019] In the figure: 1. Gluing device; 2. Gluing working disk; 3. Disk sleeve; 4. Machine room; 5. Motor; 6. Driving rod; 7. Disk groove; 8. Arc slope; 9. Inner room; 10. Movable block; 11. Connecting rod; 12. Spring; 13. Arc plate; 14. First clamping plate; 15. Second clamping plate; 16. Frame; 17. Gluing mechanism body. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Reference Figure 1-4, a glue coating mechanism for manufacturing electronic components, comprising a glue coating device 1, a glue coating working disk 2 is arranged on the top side of the glue coating device 1, a disk sleeve 3 is fixedly installed on the top side of the glue coating device 1, a machine room 4 is provided in the glue coating device 1, a feeding rotation driving mechanism for the glue coating working disk 2 is provided in the machine room 4, the feeding rotation driving mechanism comprises a motor 5 and a driving rod 6, a motor 5 is fixedly installed on the inner wall of the top side of the machine room 4, one end of the driving rod 6 is fixedly installed on the output shaft of the motor 5, and the other end of the driving rod 6 is rotatably extended to the outside of the glue coating device 1 and fixedly installed on the bottom side of the glue coating working disk 2, and the glue coating working disk 2 can be rotated and adjusted by the feeding rotation driving mechanism; a disk groove 7 is provided on the inner wall of the disk sleeve 3, and arc slopes 8 are provided at both ends of the disk groove 7, and a plurality of inner chambers 9 are respectively provided in the glue coating working disk 2, and arc plates 1 are installed in the plurality of inner chambers 9 through elastic clamping adjustment mechanisms. 3. The elastic clamping adjustment mechanism includes a movable block 10, a connecting rod 11 and a spring 12. The movable block 10 is movably installed in the inner chamber 9. One end of the connecting rod 11 is fixedly installed on one side of the movable block 10. The other end of the connecting rod 11 is movably penetrated to the outside of the gluing working disk 2 and is fixedly connected with the arc plate 13. A spring 12 is fixedly installed on one side of the movable block 10. The other end of the spring 12 is fixedly installed on the inner wall of one side of the inner chamber 9. Under the elastic force of the spring 12, the arc plate 13 at the opening of the disk sleeve 3 on the glue working disk 2 is separated from the glue working disk 2; multiple arc plates 13 are movably fitted in the disk groove 7 of the disk sleeve 3, and one side of the multiple arc plates 13 is fixedly installed with a first clamping plate 14, and the top side of the glue working disk 2 is respectively fixedly installed with multiple second clamping plates 15. The top side of the glue coating device 1 is fixedly installed with a frame 16, and the frame 16 is provided with a glue coating mechanism body 17.

[0022] Furthermore, the gluing work disk 2 is rotatably sleeved in the disk sleeve 3, and an opening is provided on the disk sleeve 3. When the gluing work disk 2 is rotatably sleeved in the disk sleeve 3, the three electronic components on the inner side of the gluing work disk 2 are clamped and fixed by multiple groups of first clamping plates 14 and second clamping plates 15.

[0023] Furthermore, multiple arc plates 13 are distributed in a circular array, and the side walls of the corresponding three arc plates 13 are movably fitted in the disk groove 7 of the disk sleeve 3. When the side walls of the three arc plates 13 are movably fitted in the disk groove 7 of the disk sleeve 3, the three electronic components on the glue coating work disk 2 can be clamped and fixed.

[0024] Furthermore, the plurality of second clamping plates 15 are distributed in a circular array, and the plurality of second clamping plates 15 are respectively matched with the corresponding first clamping plates 14 , and the electronic components can be clamped and fixed by the first clamping plates 14 and the second clamping plates 15 .

[0025] During use: When gluing electronic components, the operator places the electronic components to be glued on the outer top side of the gluing work disk 2, and turns on the motor 5 to drive the driving rod 6 to drive the gluing work disk 2 to rotate in the disk sleeve 3. During the rotation, when the outer wall of the arc plate 13 fits on the arc slope 8, the arc plate 13 moves toward the gluing work disk 2, and the connecting rod 11 drives the movable block 10 to move in the inner chamber 9 toward the axial direction of the gluing work disk 2. At this time, the spring 12 is deformed and stretched by force. When the arc plate 13 is completely rotated into the disk groove 7 of the disk sleeve 3, the first clamping plate 14 and The second clamping plate 15 automatically clamps and fixes the electronic components. When the clamped and fixed electronic components rotate to the lower position of the gluing mechanism body 17, the gluing operation on the clamped and fixed electronic components is realized through the gluing mechanism body 17. During the gluing of the electronic components, the operator can place the next electronic component to be glued on the outer top side of the gluing work tray 2, wait for the previous electronic component to be glued, and then immediately glue the next electronic component, thereby realizing rapid and continuous gluing operations on the electronic components, thereby improving the efficiency of gluing the electronic components.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A glue coating mechanism for manufacturing electronic components, comprising a glue coating device (1), characterized in that: A glue coating working disk (2) is arranged on the top side of the glue coating device (1), a disk sleeve (3) is fixedly installed on the top side of the glue coating device (1), a machine room (4) is arranged in the glue coating device (1), a feeding rotation driving mechanism for the glue coating working disk (2) is arranged in the machine room (4), a disk groove (7) is arranged on the inner wall of the disk sleeve (3), arc-shaped slopes (8) are arranged at both ends of the disk groove (7), and a plurality of inner chambers (9) are respectively arranged in the glue coating working disk (2), and the plurality of inner chambers (9) are arranged in the plurality of inner chambers (9) Each inner chamber (9) is provided with an arc plate (13) through an elastic clamping adjustment mechanism, and the plurality of arc plates (13) are movably fitted in the disc groove (7) of the disc sleeve (3), and a first clamping plate (14) is fixedly installed on one side of the plurality of arc plates (13), and a plurality of second clamping plates (15) are fixedly installed on the top side of the gluing working disc (2), and a frame (16) is fixedly installed on the top side of the gluing device (1), and a gluing mechanism main body (17) is arranged on the frame (16).

2. The gluing mechanism for manufacturing electronic components according to claim 1, characterized in that: The glue coating working disc (2) is rotatably sleeved in a disc sleeve (3), and an opening is provided on the disc sleeve (3).

3. The gluing mechanism for manufacturing electronic components according to claim 1, characterized in that: The feeding rotation drive mechanism comprises a motor (5) and a drive rod (6); the motor (5) is fixedly mounted on the top inner wall of the machine chamber (4); one end of the drive rod (6) is fixedly mounted on the output shaft of the motor (5); the other end of the drive rod (6) is rotatably extended to the outside of the gluing device (1) and is fixedly mounted on the bottom side of the gluing working disk (2).

4. The gluing mechanism for manufacturing electronic components according to claim 1, characterized in that: The elastic clamping adjustment mechanism comprises a movable block (10), a connecting rod (11) and a spring (12); the movable block (10) is movably installed in the inner chamber (9); one end of the connecting rod (11) is fixedly installed on one side of the movable block (10); the other end of the connecting rod (11) movably penetrates to the outside of the gluing working disk (2) and is fixedly connected to the arc plate (13); the spring (12) is fixedly installed on one side of the movable block (10); the other end of the spring (12) is fixedly installed on one inner wall of the inner chamber (9).

5. The glue coating mechanism for manufacturing electronic components according to claim 4, characterized in that: The plurality of arc-shaped plates (13) are distributed in a circular array, and the side walls of the corresponding three arc-shaped plates (13) are movably fitted in the disc grooves (7) of the disc sleeve (3).

6. The gluing mechanism for manufacturing electronic components according to claim 1, characterized in that: The plurality of second clamping plates (15) are distributed in a circumferential array, and the plurality of second clamping plates (15) are respectively matched with the corresponding first clamping plates (14).

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