Automobile stamping die with damping function

By setting buffer components and installation components in the automotive stamping mold, the damage caused by the fast contact between the stamping block and the parts is solved, and the rapid removal of the parts is achieved, improving work efficiency.

CN222790306UActive Publication Date: 2025-04-25WUXI BADER PRECISION MASCH CO LTD
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Patent Information

Application Number
CN202421314285.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-11
Publication Date
2025-04-25
Estimated Expiration
2034-06-11

AI Technical Summary

Technical Problem

Existing automotive stamping molds do not have a buffer mechanism, which causes the stamping blocks to come into contact with parts too fast, causing damage to the mold and parts. At the same time, the parts are inconvenient to be taken after stamping, which affects working efficiency.

Method used

An automobile stamping mold with shock absorption function is designed. By providing a buffer assembly and an installation assembly in the mold, the buffer assembly includes a spring and a slider, and the installation assembly includes a slide groove and a tie rod, the impact force buffering and quick removal of components are achieved.

Benefits of technology

It effectively avoids excessive impact force when the stamping block comes into contact with the parts and damages the mold, and can quickly eject the parts after the stamping is finished, improving working efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an automobile stamping die with a shock absorption function, and particularly relates to the technical field of automobile part machining, the automobile stamping die comprises a lower die holder, an upper die holder is arranged above the lower die holder, a stamping groove is formed in the center of the top of the lower die holder, and a placing frame is fixedly connected to the periphery of the top of the stamping groove; buffering assemblies are arranged on the two sides of the containing frame correspondingly, and mounting assemblies are arranged at the joints of the buffering assemblies and the lower die base. According to the stamping die, impact force generated when the stamping block makes contact with a part can be buffered, damage to the die caused by too fast contact and too large impact force is effectively avoided, meanwhile, the part can be ejected out of the stamping groove after stamping is finished, a worker can take out the part more quickly, and the stamping efficiency is improved. And moreover, the buffer assembly is relatively simple and quick to mount and dismount, so that the working efficiency is effectively improved.
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Description

Technical Field

[0001] The utility model relates to the field of automobile parts processing, in particular to an automobile stamping die with a shock absorbing function. Background Art

[0002] Auto parts are the units that make up the whole of auto parts processing and the products that serve auto parts processing. Traditional auto parts can be roughly divided into seven categories, namely engines, transmission systems, steering systems, braking systems, driving systems, body accessories, and electronic appliances. There are tens of thousands of types of auto parts, involving many fields such as smelting, chemical industry, and electronics, forming an industry with a long processing chain from raw materials to finished products and distinctive features. It is an important industry that is indispensable to supporting the development of automotive products and technological progress. Without a strong auto parts industry as a foundation, there will be no independent, complete, and internationally competitive auto industry.

[0003] In the process of processing automobile parts, they need to be stamped, but the current stamping dies do not have a buffer mechanism. During the stamping process, the stamping block contacts the parts too quickly, which will increase the impact force and cause damage to the mold and parts. In addition, it is inconvenient to take the parts after stamping, which affects work efficiency. Utility Model Content

[0004] Technical problems to be solved: If the stamping block contacts the parts too quickly, it will cause damage to the mold and parts, and it will be inconvenient to take the parts after stamping.

[0005] In view of the deficiencies of the prior art, the utility model provides an automobile stamping die with a shock-absorbing function, which solves the problems mentioned in the background technology.

[0006] Technical solution:

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A car stamping die with a shock-absorbing function comprises a lower die base, an upper die base is arranged above the lower die base, a stamping groove is opened at the center of the top of the lower die base, a placement frame is fixedly connected to the outer periphery of the top of the stamping groove, buffer components are arranged on both sides of the placement frame, and a mounting component is arranged at the connection between the buffer component and the lower die base.

[0009] In a possible implementation, the buffer assembly includes a mounting groove, a mounting seat, a cross plate, a first slide groove, a through hole and a connecting rod, the mounting grooves are opened on both sides of the top of the lower mold seat, the mounting seat is movably connected to the mounting groove, the cross plate is movably connected to the top of the mounting seat, the first slide groove is opened inside the mounting seat, the through hole passes through the inner wall at the top of the first slide groove and has a smaller diameter than the first slide groove, the top end of the connecting rod is fixedly connected to the cross plate and the bottom end passes through the through hole and extends to the inside of the first slide groove.

[0010] In a possible implementation, the buffer assembly also includes a first slider and a first spring, the first slider is fixedly connected to the bottom end of the connecting rod and is slidably connected to the first slide groove, the first spring is fixedly installed inside the first slide groove and its two ends are respectively fixedly connected to the bottom of the first slider and the inner wall of the bottom of the first slide groove.

[0011] In a possible implementation, the buffer assembly further includes an empty slot and a top block, wherein the empty slot is opened on both sides of the placement frame, and the top block is fixedly connected to the inner side of the cross bar and is adapted to the size of the empty slot.

[0012] In one possible implementation, the mounting assembly includes a mounting hole, a connecting groove and a mounting rod. The mounting hole passes through the bottom of the mounting base and is below the first slide groove. The connecting groove is opened inside the lower mold base and is connected to the mounting groove. The mounting rod is movably connected to the connecting groove and is adapted to the size of the mounting hole.

[0013] In a possible implementation, the mounting assembly further includes a second slide groove, a second slider, a second spring and a pull rod, the second slide groove is opened at the top of the lower mold base and is connected to the connecting groove, the second slider is fixedly connected to one end of the mounting rod and is slidably connected to the second slide groove, the second spring is fixedly installed inside the second slide groove and its two ends are respectively fixedly connected to one side of the second slider and the inner wall of one side of the second slide groove, and the pull rod is fixedly connected to the top of the second slider.

[0014] Beneficial effects:

[0015] First, by providing a buffer assembly, when the punch block contacts the component, the component is subjected to pressure and drives the top block to move downward along the empty slot, and the top block drives the first slider to slide downward along the first slide slot through the cross bar and the connecting rod and squeezes the first spring. At this time, the rebound force generated by the first spring will buffer the impact force generated when the punch block contacts the component, and then the punch block continues to move downward to punch the component. After the punching is completed, the upper die seat drives the punch block to move upward. At this time, the first spring rebounds and drives the cross bar to move upward through the first slider and the connecting rod, and the cross bar drives the top block to move upward along the empty slot, thereby ejecting the punched component upward. This design can buffer the impact force generated when the punch block contacts the component, effectively avoiding damage to the mold caused by excessive impact force due to too fast contact, and at the same time, the component can be ejected from the punching slot after the punching is completed, so that the staff can take out the component more quickly.

[0016] Secondly, by providing an installation assembly, the pull rod is pulled outward so that it drives the installation rod to move outward through the second slider and squeezes the second spring. When the installation rod is moved out of the installation groove, the mounting seat is placed in the installation groove and the mounting hole and the installation rod are on the same axis. Then the pull rod is released, the second spring rebounds and drives the installation rod to move inward through the second slider. When the installation rod is inserted into the mounting hole, the mounting seat can be fixed in the mounting groove, thereby completing the installation of the buffer assembly. This design can make the installation and disassembly of the buffer assembly simpler and faster, effectively improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a cross-sectional view of the buffer assembly and the mounting assembly structure of the utility model;

[0020] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0021] Figure 4 for Figure 2 Enlarged view of point B in the middle.

[0022] Description of reference numerals:

[0023] 1. Lower die base; 2. Upper die base; 3. Punching groove; 4. Placement frame; 5. Buffer assembly; 51. Mounting groove; 52. Mounting seat; 53. Cross plate; 54. First slide groove; 55. Through hole; 56. Connecting rod; 57. First slider; 58. First spring; 59. Empty groove; 510. Top block; 6. Mounting assembly; 61. Mounting hole; 62. Connecting groove; 63. Mounting rod; 64. Second slide groove; 65. Second slider; 66. Second spring; 67. Pull rod. DETAILED DESCRIPTION

[0024] The embodiments of the present application solve the problems in the prior art by providing an automobile stamping die with a shock absorbing function.

[0025] The technical solution in the embodiment of the present application is to solve the above problems, and the overall idea is as follows:

[0026] The specific structure of this embodiment is as follows: Figures 1 to 4 As shown, an automobile stamping die with a shock-absorbing function comprises a lower die base 1, an upper die base 2 is arranged above the lower die base 1, a stamping groove 3 is opened at the center of the top of the lower die base 1, a placement frame 4 is fixedly connected to the outer periphery of the top of the stamping groove 3, buffer components 5 are arranged on both sides of the placement frame 4, and an installation component 6 is arranged at the connection between the buffer component 5 and the lower die base 1.

[0027] In some examples, the buffer assembly 5 includes a mounting groove 51, a mounting seat 52, a cross plate 53, a first slide groove 54, a through hole 55 and a connecting rod 56. The mounting groove 51 is opened on both sides of the top of the lower mold base 1, the mounting seat 52 is movably connected to the mounting groove 51, the cross plate 53 is movably connected to the top of the mounting seat 52, the first slide groove 54 is opened inside the mounting seat 52, the through hole 55 passes through the top inner wall of the first slide groove 54 and has a diameter smaller than the first slide groove 54, and the top end of the connecting rod 56 is fixedly connected to the cross plate 53 and the bottom end passes through the through hole 55 and extends to the inside of the first slide groove 54.

[0028] In some examples, the buffer assembly 5 also includes a first slider 57 and a first spring 58. The first slider 57 is fixedly connected to the bottom end of the connecting rod 56 and is slidably connected to the first slide groove 54. The first spring 58 is fixedly installed inside the first slide groove 54 and its two ends are respectively fixedly connected to the bottom of the first slider 57 and the inner wall of the bottom of the first slide groove 54. When the upper mold base 2 moves downward, the cross bar will press downward. At this time, the cross bar will drive the first slider 57 to move downward along the first slide groove 54 through the connecting rod 56 and squeeze the first spring 58. The rebound force generated by the first spring 58 will buffer the upper mold base 2 and reduce the impact force generated when the stamping block contacts the auto parts, effectively avoiding damage caused by rapid contact between the stamping block and the auto parts.

[0029] In some examples, the buffer assembly 5 also includes an empty slot 59 and a top block 510. The empty slot 59 is opened on both sides of the placement frame 4. The top block 510 is fixedly connected to the inner side of the cross bar and is adapted to the size of the empty slot 59. When the cross bar moves downward, it will drive the top block 510 to move downward along the empty slot 59 until it is immersed in the empty slot 59. When the stamping is completed, the upper mold moves upward. At this time, the first spring 58 rebounds and drives the cross bar to move upward through the first slider 57 and the connecting rod 56. The cross bar drives the top block 510 to move upward, thereby ejecting the stamped automobile parts upward.

[0030] In some examples, the mounting assembly 6 includes a mounting hole 61, a connecting groove 62 and a mounting rod 63. The mounting hole 61 passes through the bottom of the mounting seat 52 and is below the first slide groove 54. The connecting groove 62 is opened inside the lower mold base 1 and is connected to the mounting groove 51. The mounting rod 63 is movably connected to the connecting groove 62 and is adapted to the size of the mounting hole 61. The mounting seat 52 is placed in the mounting groove 51, and then the mounting rod 63 is inserted into the mounting hole 61 to fix the mounting seat 52 in the mounting groove 51, thereby completing the installation of the buffer assembly 5.

[0031] In some examples, the mounting assembly 6 also includes a second slide groove 64, a second slider 65, a second spring 66 and a pull rod 67. The second slide groove 64 is opened at the top of the lower mold base 1 and is connected to the connecting groove 62. The second slider 65 is fixedly connected to one end of the mounting rod 63 and is slidably connected to the second slide groove 64. The second spring 66 is fixedly installed inside the second slide groove 64 and its two ends are respectively fixedly connected to one side of the second slider 65 and the inner wall of one side of the second slide groove 64. The pull rod 67 is fixedly connected to the top of the second slider 65. Pulling the pull rod 67 outward can drive the mounting rod 63 to move outward through the second slider 65 and squeeze the second spring 66. Release the pull rod 67, the second spring 66 rebounds and can drive the mounting rod 63 to move inward through the second slider 65.

[0032] In a specific application scenario, first pull the pull rod 67 outward so that it drives the mounting rod 63 to move outward through the second slider 65 and squeezes the second spring 66. When the mounting rod 63 moves out of the mounting slot 51, the mounting seat 52 is placed in the mounting slot 51 and the mounting hole 61 and the mounting rod 63 are on the same axis. Then release the pull rod 67, the second spring 66 rebounds and drives the mounting rod 63 to move inward through the second slider 65. When the mounting rod 63 is inserted into the mounting hole 61, the mounting seat 52 can be fixed in the mounting slot 51, thereby completing the installation of the buffer assembly 5. Then, place the parts to be stamped on the top of the top block 510 above the placement frame 4. At this time, start the mold so that it drives the stamping block to move downward through the upper mold base 2. When the stamping block When in contact with the parts, the parts are subjected to pressure and drive the top block 510 to move downward along the empty slot 59. The top block 510 drives the first slider 57 to slide downward along the first slide slot 54 through the cross bar and the connecting rod 56 and squeezes the first spring 58. At this time, the rebound force generated by the first spring 58 will buffer the impact force generated when the stamping block contacts the parts. Then the stamping block continues to move downward to stamp the parts. After the stamping is completed, the upper die seat 2 drives the stamping block to move upward. At this time, the first spring 58 rebounds and drives the cross bar to move upward through the first slider 57 and the connecting rod 56. The cross bar drives the top block 510 to move upward along the empty slot 59, thereby ejecting the stamped parts upward. At this time, the staff can take it out of the stamping slot 3.

[0033] By adopting the above technical solution: not only can the impact force generated when the punching block contacts the parts be buffered, effectively avoiding damage to the mold caused by excessive impact force due to too fast contact, but also the parts can be ejected from the punching groove after the punching is completed, so that the staff can take out the parts more quickly, and the installation and disassembly of the buffer assembly is also relatively simple and quick, effectively improving work efficiency.

[0034] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from them are still within the scope of protection of the present invention.

Claims

1. An automobile stamping die with a shock absorbing function, comprising a lower die base (1), characterized in that: An upper die seat (2) is arranged above the lower die seat (1); a punching groove (3) is provided at the center of the top of the lower die seat (1); a placement frame (4) is fixedly connected to the outer periphery of the top of the punching groove (3); buffer components (5) are arranged on both sides of the placement frame (4); a mounting component (6) is arranged at the connection between the buffer component (5) and the lower die seat (1); the buffer component (5) comprises a mounting groove (51), a mounting seat (52), a transverse plate (53), a first slide groove (54), a through hole (55) and a connecting rod (56); The mounting groove (51) is provided on both sides of the top of the lower mold base (1); the mounting base (52) is movably connected to the mounting groove (51); the transverse plate (53) is movably connected to the top of the mounting base (52); the first slide groove (54) is provided inside the mounting base (52); the through hole (55) passes through the inner wall of the top of the first slide groove (54) and has a diameter smaller than that of the first slide groove (54); the top end of the connecting rod (56) is fixedly connected to the transverse plate (53) and the bottom end passes through the through hole (55) and extends to the inside of the first slide groove (54).

2. The automobile stamping die with shock absorbing function according to claim 1, characterized in that: The buffer assembly (5) further comprises a first slider (57) and a first spring (58), wherein the first slider (57) is fixedly connected to the bottom end of the connecting rod (56) and is slidably connected to the first slide groove (54), and the first spring (58) is fixedly installed inside the first slide groove (54) and has two ends fixedly connected to the bottom of the first slider (57) and the inner wall of the bottom of the first slide groove (54), respectively.

3. The automobile stamping die with shock-absorbing function according to claim 1, characterized in that: The buffer assembly (5) further comprises an empty slot (59) and a top block (510), wherein the empty slot (59) is provided on both sides of the placement frame (4), and the top block (510) is fixedly connected to the inner side of the cross bar and is adapted to the size of the empty slot (59).

4. The automobile stamping die with shock-absorbing function according to claim 1, characterized in that: The mounting assembly (6) comprises a mounting hole (61), a connecting groove (62) and a mounting rod (63); the mounting hole (61) passes through the bottom of the mounting seat (52) and is located below the first slide groove (54); the connecting groove (62) is opened inside the lower mold seat (1) and is connected to the mounting groove (51); the mounting rod (63) is movably connected to the connecting groove (62) and is adapted to the size of the mounting hole (61).

5. The automobile stamping die with shock absorbing function according to claim 4, characterized in that: The mounting assembly (6) also includes a second slide groove (64), a second slider (65), a second spring (66) and a pull rod (67), wherein the second slide groove (64) is opened at the top of the lower mold base (1) and is connected to the connecting groove (62), the second slider (65) is fixedly connected to one end of the mounting rod (63) and is slidably connected to the second slide groove (64), the second spring (66) is fixedly installed inside the second slide groove (64) and its two ends are respectively fixedly connected to one side of the second slider (65) and the inner wall of one side of the second slide groove (64), and the pull rod (67) is fixedly connected to the top of the second slider (65).