Resistor laser degumming equipment

Abstract

The utility model provides resistor laser degumming equipment. The resistor laser degumming equipment comprises a base, a rotary table assembly, a storage assembly, a transfer assembly and a first laser degumming assembly. The movable seat moves relative to the base; the adsorption part is connected to the moving seat and transfers the to-be-laser resistor located on the storage part to the corresponding positioning clamps along with movement of the moving seat, and the multiple positioning clamps are arranged in the annular direction of the rotary disc at intervals and sequentially reach the position below the laser head along with rotation of the rotary disc; the first laser head carries out laser degumming on the to-be-laser resistor located on the positioning clamp, the laser degumming effect of the to-be-laser resistor is guaranteed, and storage, transfer and laser technology of the to-be-laser resistor are completed, so that repeated replacement of the to-be-laser resistor located on the positioning clamp is avoided, station transfer of the resistor is achieved, and the production efficiency is improved. Therefore, the laser degumming efficiency of the resistor laser degumming equipment on the resistor to be subjected to laser degumming is improved, and the working efficiency of the resistor laser degumming equipment is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of resistor laser glue removal equipment, in particular to a resistor laser glue removal equipment. Background Art

[0002] With the development of science and technology, resistance laser adhesive removal equipment is used in industry. Resistance laser adhesive removal equipment is used to use the high energy density of the laser beam to quickly heat and vaporize the adhesive film, thereby achieving the purpose of adhesive removal.

[0003] In the prior art, the existing resistor laser degumming equipment includes a base, a turntable, a positioning fixture and a laser degumming assembly. The turntable is rotatably connected to the base, the positioning fixture is connected to the turntable, the positioning fixture is used to position the resistor to be lasered, and the laser degumming assembly performs laser degumming on the resistor to be lasered in the positioning fixture. The resistor to be lasered on the positioning fixture is positioned and arranged. However, the resistor to be lasered needs to be replaced multiple times due to human intervention, resulting in low laser degumming efficiency of the existing resistor laser degumming equipment for the resistor to be lasered. Utility Model Content

[0004] The utility model aims to provide a resistor laser degumming device, wherein a movable seat moves relative to a base; an adsorption member is connected to the movable seat, and as the movable seat moves, the resistor to be laser-processed in the material storage member is transferred to a corresponding positioning fixture, and a plurality of positioning fixtures are arranged at intervals along the annular direction of a turntable, and as the turntable rotates, they successively reach the bottom of a laser head, and a first laser head performs laser degumming on the resistor to be laser-processed in the positioning fixture, thereby ensuring the laser degumming effect of the resistor to be laser-processed, and completing the material storage, transfer and laser process of the resistor to be laser-processed, thereby avoiding the need to replace the resistor to be laser-processed in the positioning fixture multiple times, and realizing the work station transfer of the resistor, so as to improve the laser degumming efficiency of the resistor laser degumming device for the resistor to be laser-processed, and ensure the working efficiency of the resistor laser degumming device.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A resistance laser glue removal device, comprising:

[0007] Base;

[0008] A turntable assembly is mounted on the base; the turntable assembly includes a turntable and a plurality of positioning fixtures; the turntable rotates relative to the base, and the plurality of positioning fixtures are arranged at intervals along the annular direction of the turntable; the positioning fixtures are used to position the resistor to be lasered;

[0009] A material storage assembly is arranged on one side of the turntable assembly, and the material storage assembly includes a material storage piece, and the material storage piece is used to store a plurality of resistors to be lasered;

[0010] A transfer assembly is located between the material storage assembly and the turntable assembly; the transfer assembly includes a moving seat and an adsorbent; the moving seat moves relative to the base; the adsorbent is connected to the moving seat, and as the moving seat moves, the resistor to be lasered in the material storage assembly is transferred to the corresponding positioning fixture;

[0011] The first laser glue removal component is arranged on one side of the turntable component. The first laser glue removal component includes a first lifting platform and a first laser head. The first laser head is installed on the first lifting platform and performs laser glue removal on the resistor to be lasered in the positioning fixture.

[0012] Optionally, the turntable assembly also includes an electric rotating table, the fixed end of which is mounted on the base, the rotating end of which supports the turntable and drives the turntable to rotate at equal angles along the axis of the rotating end of the electric rotating table.

[0013] Optionally, each of the positioning fixtures is installed on the same rotating disk, and each of the positioning fixtures is provided with a positioning groove, the positioning groove extends along the length direction of the positioning fixture, and the opening of the positioning groove extends upward; the positioning groove is used to position the resistor to be lasered;

[0014] The resistor to be laser-irradiated adsorbed by the adsorbing member enters the positioning groove along the up-down direction.

[0015] Optionally, the material storage member is provided with a material storage trough, and the material storage trough is arranged along the up-down direction;

[0016] The material storage assembly further includes a support plate, which is movably connected to the base and penetrates the material storage trough in the up-down direction;

[0017] As the support plate rises, the support plate drives the multiple resistors to be irradiated in the material storage tank to move upward, so that the multiple resistors to be irradiated are adsorbed one by one by the adsorbent at the preset positions.

[0018] Optionally, the transfer assembly further comprises an electric moving platform, a moving end of the electric moving platform being connected to the moving seat;

[0019] The electric moving platform is arranged along the horizontal direction, and drives the moving seat to move between the material storage trough and the positioning groove.

[0020] Optionally, the first lifting platform is a manual lifting platform;

[0021] The first laser head is provided with a laser end and a camera end, wherein the laser end is used to output laser to the resistor to be irradiated in the positioning fixture, and the camera end is located on the peripheral side of the laser end and is used to take pictures of the resistor to be irradiated in the positioning fixture.

[0022] Optionally, the resistor laser debonding equipment also includes a second laser debonding component, which is arranged on one side of the first laser debonding component, and the first laser debonding component is used for lasering the front side of the resistor to be lasered, and the second laser debonding component is used for lasering the back side of the resistor to be lasered.

[0023] Optionally, there are two turntable assemblies, and the two turntable assemblies are arranged at intervals along the length direction of the base;

[0024] The first laser glue removal assembly and the second laser glue removal assembly are respectively arranged relative to the two turntable assemblies.

[0025] Optionally, the resistor laser glue removal equipment further includes a flip assembly, the flip assembly is located between the two turntable assemblies, and the flip assembly is used to transfer the resistor to be lasered located in one turntable assembly to the other turntable assembly;

[0026] The two rotating disk assemblies respectively carry the back side and the front side of the resistor to be lasered.

[0027] Optionally, the flip assembly includes a support seat, a rotating seat, an air gripper and two clamping members.

[0028] The support seat is installed on the base, and the rotating seat is rotatably installed on the support seat; the air claw is movably installed on the rotating seat and moves along the left and right directions. The two clamping members are respectively installed on the clamping ends of the air claw, and clamp the resistor to be lasered under the drive of the air claw.

[0029] Compared with the prior art, the beneficial effects of the utility model are:

[0030] The utility model provides a resistor laser degumming device, wherein a movable seat moves relative to a base; an adsorption member is connected to the movable seat, and as the movable seat moves, the adsorption member transfers the resistor to be laser-processed in the material storage member to the corresponding positioning fixture, and a plurality of positioning fixtures are arranged at intervals along the annular direction of a turntable, and as the turntable rotates, they successively reach the bottom of the laser head, and the first laser head performs laser degumming on the resistor to be laser-processed in the positioning fixture, thereby ensuring the laser degumming effect of the resistor to be laser-processed, and completing the material storage, transfer and laser process of the resistor to be laser-processed, thereby avoiding the need to replace the resistor to be laser-processed in the positioning fixture multiple times, and realizing the work station transfer of the resistor, so as to improve the laser degumming efficiency of the resistor laser degumming device for the resistor to be laser-processed, and ensure the working efficiency of the resistor laser degumming device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0032] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0033] Figure 1 A schematic diagram of a resistance laser glue removal device according to an embodiment of the present application is shown.

[0034] Figure 2 A schematic diagram of a turntable assembly of a resistance laser glue removal device according to an embodiment of the present application is shown.

[0035] Figure 3 A schematic diagram of a material storage component of a resistance laser glue removal device according to an embodiment of the present application is shown.

[0036] Figure 4 A schematic diagram of a transfer component of a resistance laser adhesive removal device according to an embodiment of the present application is shown.

[0037] Figure 5 A schematic diagram of a first laser adhesive removal component of a resistance laser adhesive removal device according to an embodiment of the present application is shown.

[0038] Figure 6 A schematic diagram of a flip assembly of a resistance laser glue removal device according to an embodiment of the present application is shown.

[0039] Reference numerals

[0040] 100. Resistor laser glue removal equipment;

[0041] 10. Base;

[0042] 20. turntable assembly; 21. turntable; 22. positioning fixture; 22a. positioning groove; 23. electric rotating table;

[0043] 30. Material storage assembly; 31. Material storage member; 31a. Material storage trough; 32. Support plate; 33. Lifting member;

[0044] 40. Transfer assembly; 41. Moving seat; 42. Adsorption member; 43. Electric moving platform;

[0045] 50. first laser glue removal component; 51. first lifting platform; 52. first laser head; 521. laser end; 522. camera end;

[0046] 60. Second laser glue removal component;

[0047] 70. Flip assembly; 71. Support seat; 72. Rotating seat; 73. Air claw; 74. Clamping piece; 75. Motor. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0049] Please refer to the attached Figures 1 to 6 The embodiment of the present application provides a resistor laser degumming device 100, which is used for laser degumming of resistors to be treated by laser. The resistor laser degumming device 100 includes a base 10, a turntable assembly 20, a material storage assembly 30, a transfer assembly 40 and a first laser degumming assembly 50. The turntable assembly 20, the material storage assembly 30, the transfer assembly 40 and the first laser degumming assembly 50 are all arranged on the upper side of the base 10.

[0050] In the embodiment of the present application, the base 10 serves as a supporting component of the resistance laser glue removal equipment 100 , and the base 10 is used to support the turntable assembly 20 , the material storage assembly 30 , the transfer assembly 40 and the first laser glue removal assembly 50 .

[0051] In the embodiment of the present application, the turntable assembly 20 is arranged on the upper side of the base 10, and the turntable assembly 20 is installed on the base 10; the turntable assembly 20 includes a turntable 21 and a plurality of positioning fixtures 22; the turntable 21 rotates relative to the base 10 to facilitate the adjustment of the rotation of the turntable 21 relative to the base 10, and the plurality of positioning fixtures 22 are respectively arranged at intervals along the annular direction of the turntable 21, and the plurality of positioning fixtures 22 rotate with the rotation of the turntable 21 to facilitate the adjustment of the rotation of the plurality of positioning fixtures 22 relative to the base 10; the positioning fixture 22 is used to position the resistor to be lased, so that the resistor to be lased is fixed to the positioning fixture 22, so that the resistor to be lased can rotate with the rotation of the turntable 21, and then the position of the resistor to be lased can be adjusted, thereby avoiding the need to replace the resistor to be lased in the positioning fixture multiple times, and realizing the work station transfer of the resistor.

[0052] At this time, the turntable assembly 20 also includes an electric rotating table 23, a fixed end of the electric rotating table 23 is installed on the base 10, the rotating end of the electric rotating table 23 carries the turntable 21, and drives the turntable 21 to rotate at equal angles along the axis of the rotating end of the electric rotating table 23, so that the turntable 21 can be rotated relative to the base 10 through the electric rotating table 23, so that the turntable 21 can drive multiple positioning fixtures 22 and the resistor to be lasered to rotate. Optionally, the rotation angle of the turntable 21 is 0°~360°.

[0053] Among them, each positioning fixture 22 is installed on the same turntable 21, and each positioning fixture 22 is provided with a positioning groove 22a, which extends along the length direction of the positioning fixture 22, and the opening of the positioning groove 22a extends upward; the positioning groove 22a is used to position the resistor to be laser irradiated, so that the resistor to be laser irradiated can be positioned and connected with the positioning fixture 22 through the positioning groove 22a, thereby ensuring the position accuracy of the resistor to be laser irradiated and the positioning fixture 22.

[0054] Optionally, the turntable 21 is also provided with a mounting seat and a pressing seat. The mounting seat is arranged on one side of the turntable 21. The pressing seat can be installed on the mounting seat in a liftable manner and is lifted and lowered under the drive of the cylinder so that the pressing seat can descend toward the positioning fixture 22 and press the resistor to be lasered in the positioning groove 22a.

[0055] In an embodiment of the present application, the material storage component 30 is arranged on the outside of the turntable component 20, and the material storage component 30 includes a material storage piece 31, and the material storage piece 31 is used to store multiple resistors to be lasered, so that the multiple resistors to be lasered can be accommodated in the material storage piece 31, thereby ensuring the positions of the multiple resistors to be lasered.

[0056] At this time, the material storage piece 31 is provided with a material storage trough 31a, which is arranged along the up-down direction so that multiple resistors to be laser irradiated are stacked from top to bottom; the material storage assembly 30 also includes a support plate 32, which is connected to the base 10 in a liftable manner and penetrates the material storage trough 31a along the up-down direction so as to adjust the position of the support plate 32 relative to the base 10; as the support plate 32 rises, the support plate 32 drives the multiple resistors to be laser irradiated in the material storage trough 31a to move upward, so as to adjust the upward movement position of the multiple resistors to be laser irradiated.

[0057] Among them, a lifting member 33 is provided between the support plate 32 and the base 10, the fixed end of the lifting member 33 is connected to the base 10, and the lifting end of the lifting member 33 is connected to the support plate 32, and drives the support plate 32 to rise and fall, so that the support plate 32 can be lifted and lowered by the lifting member 33. Optionally, the lifting member 33 is a cylinder.

[0058] In the embodiment of the present application, the transfer component 40 is located between the storage component 30 and the turntable component 20; the transfer component 40 includes a moving seat 41 and an adsorbent 42; the moving seat 41 moves relative to the base 10 to adjust the position of the moving seat 41 relative to the base 10; the adsorbent 42 is connected to the moving seat 41, and as the moving seat 41 moves, the resistor to be lasered in the storage component 31 is transferred to the corresponding positioning fixture 22, so that the resistor to be lasered can be transferred through the moving seat 41 and the adsorbent 42, thereby facilitating the transfer of the resistor to be lasered from the storage component 31 to the corresponding positioning fixture 22, and the resistor to be lasered adsorbed by the adsorbent 42 enters the positioning groove 22a along the up and down direction, so that the resistor to be lasered is transferred, so that multiple resistors to be lasered are adsorbed one by one by the adsorbent 42 at the preset position, so that each resistor to be lasered is successively adsorbed upward by the adsorbent 42.

[0059] At this time, the transfer assembly 40 also includes an electric moving table 43, the moving end of the electric moving table 43 is connected to the moving seat 41, so that the moving seat 41 can be moved relative to the base 10 through the electric moving table 43; the electric moving table 43 is arranged along the horizontal direction, and drives the moving seat 41 to move between the storage slot 31a and the positioning slot 22a, so that the electric moving table 43 drives the moving seat 41 and the adsorption member 42 to move back and forth between the storage slot 31a and the positioning slot 22a, thereby facilitating the transfer of the resistor to be lasered from the storage slot 31a to the positioning slot 22a.

[0060] In the embodiment of the present application, the first laser glue removal component 50 is arranged on the rear side of the turntable assembly 20. The first laser glue removal component 50 is arranged on the rear side of the turntable assembly 20. The first laser glue removal component 50 includes a first lifting platform 51 and a first laser head 52. The first laser head 52 is installed on the first lifting platform 51 so that the first laser head 52 can be lifted and lowered under the action of the first lifting platform 51. The first laser head 52 performs laser glue removal on the resistor to be lasered in the positioning fixture 22.

[0061] At this time, the movable seat 41 moves relative to the base 10; the adsorption member 42 is connected to the movable seat 41, and as the movable seat 41 moves, the resistor to be laser etched in the material storage member 31 is transferred to the corresponding positioning fixture 22. A plurality of positioning fixtures 22 are arranged at intervals along the annular direction of the turntable 21, and as the turntable 21 rotates, they reach the bottom of the laser head in sequence. The first laser head 52 performs laser degumming on the resistor to be laser etched in the positioning fixture 22, thereby ensuring the laser degumming effect of the resistor to be laser etched, and completing the storage, transfer and laser process of the resistor to be laser etched, thereby avoiding the need to replace the resistor to be laser etched in the positioning fixture multiple times, and realizing the work station transfer of the resistor, so as to improve the laser degumming efficiency of the resistor to be laser etched by the resistor laser degumming equipment 100, and ensure the working efficiency of the resistor laser degumming equipment 100.

[0062] Among them, the first lifting platform 51 is a manual lifting platform; the first laser head 52 is provided with a laser end 521 and a camera end 522, the laser end 521 is used to output laser to the resistor to be lasered in the positioning fixture 22, the camera end 522 is located on the peripheral side of the laser end 521, and is used to shoot the resistor to be lasered in the positioning fixture 22, so that the laser end 521 can be aligned with the glue of the resistor to be lasered through the camera end 522, so as to facilitate the laser end 521 to remove the glue from the resistor to be lasered from top to bottom.

[0063] Optionally, the camera end 522 captures the visual positioning hole or the product frame at a speed of up to 200ms / time. The laser end 521 generates a high-energy laser beam, which is focused onto the adhesive film on the resistor through a focusing lens. The high energy density of the laser beam is used to quickly heat and vaporize the adhesive film, thereby achieving the purpose of adhesive removal.

[0064] In an embodiment of the present application, the resistor laser glue removal equipment 100 also includes a second laser glue removal component 60, which is arranged on the right side of the first laser glue removal component 50. The first laser glue removal component 50 is used to laser the front side of the resistor to be lasered, and the second laser glue removal component 60 is used to laser the back side of the resistor to be lasered, so that the glue on both the front and back sides of the resistor to be lasered can be removed by the first laser glue removal component 50 and the second laser glue removal component 60.

[0065] In the embodiment of the present application, there are two turntable assemblies 20, and the two turntable assemblies 20 are arranged at intervals along the length direction of the base 10; the first laser glue removal assembly 50 and the second laser glue removal assembly 60 are arranged relative to the two turntable assemblies 20, respectively. By arranging the two turntable assemblies 20, two resistors to be laser-treated are simultaneously positioned, thereby facilitating the glue removal of the two resistors to be laser-treated at the same time, thereby facilitating further improving the laser glue removal efficiency of the resistor laser glue removal equipment 100 for the resistors to be laser-treated.

[0066] In an embodiment of the present application, the resistor laser debonding equipment 100 also includes a flipping component 70, which is located between the two turntable components 20. The flipping component 70 is used to transfer the resistor to be lasered in one turntable component 20 to the other turntable component 20. The two turntable components 20 respectively carry the back and front sides of the resistor to be lasered, so that the resistor to be lasered in one turntable component 20 with the front side facing up is reversed to the other turntable component 20 through the flipping component 70, so that the resistor to be lasered with the back side facing up is in the other turntable component 20, and then the first laser debonding component 50 and the second laser debonding component 60 respectively debond the resistor to be lasered with the front side facing up and the resistor to be lasered with the back side facing up.

[0067] At this time, the flipping assembly 70 includes a support seat 71, a rotating seat 72, an air gripper 73 and two clamping members 74. The support seat 71 is installed on the base 10, and the rotating seat 72 can be rotatably installed on the support seat 71 to facilitate adjustment of the position of the rotating seat 72 relative to the support seat 71; the air gripper 73 is movably installed on the rotating seat 72 and moves along the left and right directions to facilitate adjustment of the position of the air gripper 73 relative to the rotating seat 72. The two clamping members 74 are respectively installed on the clamping ends of the air gripper 73, and clamp the resistor to be lased under the drive of the air gripper 73, so that the resistor to be lased is fixed to the clamping end of the air gripper 73, so that the resistor to be lased can rotate with the rotation of the rotating seat 72, thereby realizing the flipping of the resistor to be lased.

[0068] A motor 75 is provided between the rotating seat 72 and the supporting seat 71. The fixed end of the motor 75 is connected to the supporting seat 71, and the rotating end of the motor 75 is connected to the rotating seat 72, and drives the rotating seat 72 to rotate, so that the rotating seat 72 can be flipped through the motor 75. Optionally, the rotation angle of the rotating seat 72 is 0°~360°.

[0069] Compared with the prior art, the beneficial effects of the utility model are:

[0070] The utility model provides a resistor laser degumming device 100, wherein a movable seat 41 moves relative to a base 10; an adsorbent 42 is connected to the movable seat 41, and as the movable seat 41 moves, the adsorbent 42 transfers the resistor to be laser-processed in the material storage member 31 to the corresponding positioning fixture 22, and a plurality of positioning fixtures 22 are arranged at intervals along the annular direction of a turntable 21, and as the turntable 21 rotates, they successively reach the bottom of the laser head, and a first laser head 52 performs laser degumming on the resistor to be laser-processed in the positioning fixture 22, thereby ensuring the laser degumming effect of the resistor to be laser-processed, and completing the material storage, transfer and laser process of the resistor to be laser-processed, thereby avoiding the need to replace the resistor to be laser-processed in the positioning fixture multiple times, and realizing the work station transfer of the resistor, so as to improve the laser degumming efficiency of the resistor laser degumming device 100 for the resistor to be laser-processed, and ensure the working efficiency of the resistor laser degumming device 100.

[0071] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0072] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features.

[0073] Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A resistor laser glue removal device, characterized in that: include: Base; A turntable assembly is mounted on the base; the turntable assembly includes a turntable and a plurality of positioning fixtures; the turntable rotates relative to the base, and the plurality of positioning fixtures are arranged at intervals along the annular direction of the turntable; the positioning fixtures are used to position the resistor to be lasered; A material storage assembly is arranged on one side of the turntable assembly, and the material storage assembly includes a material storage piece, and the material storage piece is used to store a plurality of resistors to be lasered; A transfer assembly is located between the material storage assembly and the turntable assembly; the transfer assembly includes a moving seat and an adsorption member; the moving seat moves relative to the base; The adsorption member is connected to the moving seat, and as the moving seat moves, the resistor to be lasered in the storage member is transferred to the corresponding positioning fixture; The first laser glue removal component is arranged on one side of the turntable component. The first laser glue removal component includes a first lifting platform and a first laser head. The first laser head is installed on the first lifting platform and performs laser glue removal on the resistor to be lasered in the positioning fixture.

2. The resistor laser glue removal equipment according to claim 1, characterized in that: The turntable assembly also includes an electric rotating table, the fixed end of which is mounted on the base, the rotating end of which carries the turntable and drives the turntable to rotate at equal angles along the axis of the rotating end of the electric rotating table.

3. The resistor laser glue removal equipment according to claim 1, characterized in that: Each of the positioning fixtures is installed on the same rotating disk, and each of the positioning fixtures is provided with a positioning groove, the positioning groove extends along the length direction of the positioning fixture, and the opening of the positioning groove extends upward; the positioning groove is used to position the resistor to be lasered; The resistor to be laser-irradiated adsorbed by the adsorbing member enters the positioning groove along the up-down direction.

4. The resistor laser glue removal equipment according to claim 3, characterized in that: The material storage member is provided with a material storage trough, and the material storage trough is arranged along the up and down direction; The material storage assembly further includes a support plate, which is movably connected to the base and penetrates the material storage trough in the up-down direction; As the support plate rises, the support plate drives the multiple resistors to be irradiated in the material storage tank to move upward, so that the multiple resistors to be irradiated are adsorbed one by one by the adsorbent at the preset positions.

5. The resistor laser glue removal equipment according to claim 4, characterized in that: The transfer assembly further comprises an electric moving platform, a moving end of which is connected to the moving seat; The electric moving platform is arranged along the horizontal direction, and drives the moving seat to move between the material storage trough and the positioning groove.

6. The resistor laser glue removal equipment according to claim 1, characterized in that: The first lifting platform is a manual lifting platform; The first laser head is provided with a laser end and a camera end, wherein the laser end is used to output laser to the resistor to be irradiated in the positioning fixture, and the camera end is located on the peripheral side of the laser end and is used to take pictures of the resistor to be irradiated in the positioning fixture.

7. The resistor laser glue removal equipment according to claim 1, characterized in that: The resistor laser degumming equipment also includes a second laser degumming component, which is arranged on one side of the first laser degumming component. The first laser degumming component is used for lasering the front side of the resistor to be lasered, and the second laser degumming component is used for lasering the back side of the resistor to be lasered.

8. The resistor laser glue removal equipment according to claim 7, characterized in that: There are two turntable assemblies, and the two turntable assemblies are arranged at intervals along the length direction of the base; The first laser glue removal assembly and the second laser glue removal assembly are respectively arranged relative to the two turntable assemblies.

9. The resistor laser glue removal equipment according to claim 8, characterized in that: The resistor laser glue removal equipment also includes a flip assembly, which is located between the two turntable assemblies, and is used to transfer the resistor to be lasered located in one turntable assembly to the other turntable assembly; The two rotating disk assemblies respectively carry the back side and the front side of the resistor to be lasered.

10. The resistor laser glue removal equipment according to claim 9, characterized in that: The flip assembly includes a support seat, a rotating seat, an air claw and two clamping parts. The support seat is installed on the base, and the rotating seat is rotatably installed on the support seat; the air claw is movably installed on the rotating seat and moves along the left and right directions. The two clamping members are respectively installed on the clamping ends of the air claw, and clamp the resistor to be lasered under the drive of the air claw.

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