Wafer electroplating pretreatment device

Abstract

The utility model relates to a wafer electroplating pretreatment device which comprises a working table, a treatment tank is arranged in the middle of the working table, two annular pipes are arranged in the treatment tank and communicated through a connecting pipe, a plurality of nozzles are arranged on the inner sides of the annular pipes, a first water pump is arranged at the end, adjacent to the treatment tank, of the working table, and a second water pump is arranged at the end, adjacent to the treatment tank, of the working table. The output end of the first water pump communicates with the connecting pipe, a water inlet pipe is arranged at the input end of the first water pump, the end, away from the first water pump, of the water inlet pipe communicates with the treatment tank, a supporting frame is arranged at the top of the workbench, an air cylinder is arranged at the top of the supporting frame, and a motor is arranged at the output end of the air cylinder. Three wafer placing racks are arranged on an output shaft of the motor; according to the utility model, the treatment liquid in the treatment tank is pumped out through the first water pump, conveyed into the annular pipe and then sprayed out from the nozzle, so that the flowability of the treatment liquid is enhanced, and impurities and bubbles on the surface of a wafer can be better cleaned.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer manufacturing, in particular to a wafer electroplating pre-processing device. Background Art

[0002] Wafer electroplating is an important part of the semiconductor manufacturing process. However, during the electroplating process, bubbles may be generated in the grooves and blind holes on the surface of the wafer. These bubbles may have an adverse effect on the quality of the electroplated layer, such as reducing the uniformity of the coating and causing voids in the coating. Therefore, it is necessary to properly treat the wafer before electroplating to remove the bubbles on its surface, which is crucial to improving the quality of electroplating.

[0003] After searching, a Chinese patent with publication number CN204550745U discloses a wafer electroplating pre-treatment device, which is characterized by comprising: a processing tank; the processing tank is provided with a cavity; the cavity is used to store electroplating pre-treatment liquid; a wafer carrying device; the wafer carrying device is used to carry wafers; the wafer carrying device can perform lifting and lowering movements relative to the processing tank to carry wafers into or out of the cavity; the wafer electroplating pre-treatment device provided by the novel invention is used to process the wafer before the wafer is electroplated to remove bubbles in the grooves and blind holes on the wafer surface, to avoid the bubbles in the grooves and blind holes on the wafer surface from affecting the coating, and to improve the quality of wafer electroplating;

[0004] In the above technology, although the bubbles in the grooves and blind holes on the surface of the wafer are removed by setting a vacuum device, there is no mechanism to drive the flow of the processing liquid in the processing tank. At the same time, the wafer is placed on the wafer carrier and is also stationary. In this way, when the wafer is immersed in the processing liquid, the impurities on its surface are difficult to be washed away, and these impurities affect the subsequent electroplating effect. Utility Model Content

[0005] Therefore, the technical problem to be solved by the utility model is to overcome the poor cleaning effect of the wafer in the processing tank in the prior art.

[0006] In order to solve the above technical problems, the utility model provides a wafer electroplating pre-processing device, including a workbench, a processing tank is arranged in the middle of the workbench, two annular tubes are arranged in the processing tank, the two annular tubes are connected by a connecting pipe, and a plurality of nozzles are arranged on the inner side of the annular tubes. A first water pump is arranged at one end of the workbench adjacent to the processing tank, the output end of the first water pump is connected to the connecting pipe, the input end of the first water pump is provided with a water inlet pipe, and the end of the water inlet pipe away from the first water pump is connected to the processing tank, a support frame is arranged on the top of the workbench, a cylinder is arranged on the top of the support frame, a motor is arranged on the output end of the cylinder, and three wafer placement racks are arranged on the output shaft of the motor.

[0007] In one embodiment of the utility model, connecting arms are fixedly connected to both ends of the motor side wall, and the two connecting arms are commonly fixedly connected to a sealing cover. The motor output shaft passes through the sealing cover and is rotatably connected to the sealing cover.

[0008] In one embodiment of the utility model, a connecting frame is fixedly connected to the bottom of the motor output shaft, and the connecting frame is fixedly connected to the placement frame. The placement frame is semicircular and has a placement groove on its inner wall.

[0009] In one embodiment of the utility model, a vacuum pump is fixedly connected to one end of the bottom of the workbench, and a vacuum pipe is provided at the input end of the vacuum pump, and the vacuum pipe is connected to the processing tank.

[0010] In one embodiment of the utility model, the exhaust pipe is located at one end of the processing tank and is fixedly connected to the inner wall with four fixing blocks, the four fixing blocks are commonly fixedly connected to an electric push rod, and the top of the electric push rod is fixedly connected to a sealing plug.

[0011] In one embodiment of the utility model, it also includes a liquid storage tank, the top of the liquid storage tank is connected to a second water pump, the output end of the second water pump is connected to a water injection pipe, the water injection pipe is connected to the treatment tank, and the output end of the water injection pipe is located at the top of the side wall of the treatment tank.

[0012] In one embodiment of the utility model, a reflux pipe is connected to the bottom of the liquid storage tank, and one end of the reflux pipe away from the liquid storage tank is connected to the processing tank. A valve is installed at one end of the reflux pipe located at the processing tank.

[0013] In one embodiment of the present invention, the input end of the second water pump is connected to a water pipe, and one end of the water pipe extends to the bottom end of the liquid storage tank.

[0014] The above technical solution of the utility model has the following advantages compared with the prior art:

[0015] The wafer electroplating pre-treatment device described in the utility model is provided with a first water pump to extract the treatment liquid at the bottom of the treatment tank and transport it to two annular tubes, and then spray it out from the nozzles on the annular tubes, so that the treatment liquid inside the treatment tank flows. In addition, the placement rack is driven to rotate by a motor to further increase the fluidity of the treatment liquid on the wafer surface, so as to flush away impurities on the wafer surface, and the treatment liquid can also remove part of the bubbles on the wafer surface during the flow process;

[0016] The utility model discloses a wafer electroplating pre-treatment device, which extracts the air in the treatment tank by arranging an exhaust pump, thereby generating a low-pressure environment inside the treatment tank. The bubbles on the wafer surface or in the grooves are subjected to inward pressure due to the effect of the external atmospheric pressure, forcing them to shrink in volume and gradually move to the low-pressure area. As the pressure further decreases, the gas molecules in the bubbles will escape faster, thereby ensuring the subsequent electroplating quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below based on specific embodiments of the utility model in combination with the accompanying drawings.

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0019] Figure 2 yes Figure 1 Another perspective structural diagram;

[0020] Figure 3 It is a schematic diagram of the internal structure of the processing tank in the utility model;

[0021] Figure 4 This is a schematic diagram of the connection structure between the air extraction pipe and the electric push rod in the utility model;

[0022] Figure 5 It is a schematic diagram of the structure of the placement rack in the utility model.

[0023] Explanation of the reference numerals in the drawings in the specification: 1. workbench; 2. treatment tank; 3. annular pipe; 4. connecting pipe; 5. nozzle; 6. first water pump; 7. water inlet pipe; 8. support frame; 9. cylinder; 10. motor; 11. placement frame; 12. connecting arm; 13. sealing cover; 14. connecting frame; 15. placement tank; 16. vacuum pump; 17. vacuum pipe; 18. fixing block; 19. electric push rod; 20. sealing plug; 21. liquid storage tank; 22. second water pump; 23. water injection pipe; 24. reflux pipe; 25. valve; 26. water guide pipe. DETAILED DESCRIPTION

[0024] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0025] Reference Figures 1 to 5As shown, a wafer electroplating pre-treatment device of the utility model comprises a workbench 1, a treatment tank 2 is arranged in the middle of the workbench 1, two annular tubes 3 are arranged in the treatment tank 2, the two annular tubes 3 are connected through a connecting tube 4, a plurality of nozzles 5 are arranged inside the annular tube 3, a first water pump 6 is arranged at one end of the workbench 1 adjacent to the treatment tank 2, the output end of the first water pump 6 is connected with the connecting tube 4, a water inlet pipe 7 is arranged at the input end of the first water pump 6, and the end of the water inlet pipe 7 away from the first water pump 6 is connected with the treatment tank 2, a support frame 8 is arranged on the top of the workbench 1, a cylinder 9 is arranged on the top of the support frame 8, a motor 10 is arranged at the output end of the cylinder 9, and three wafer placement racks 11 are arranged on the output shaft of the motor 10;

[0026] In this embodiment, the processing tank 2 is pre-filled with processing liquid, and then the cylinder 9 is opened. Under the drive of the cylinder 9, the placement rack 11 will move downward, thereby driving the wafer to move downward until the wafer is completely immersed in the processing liquid in the processing tank 2, wherein the processing liquid is a cleaning agent. The wafer immersed in the processing liquid can remove impurities and bubbles, improve surface properties, and improve the stability and reliability of the wafer. After the wafer is immersed in the processing liquid, the first water pump 6 is turned on. Under the action of the first water pump 6, the processing liquid at the bottom of the processing tank 2 can be extracted and transported to the two annular tubes 3, and then sprayed out from the nozzles 5 on the annular tubes 3, so that the processing liquid inside the processing tank 2 flows. In addition, the placement rack 11 is driven to rotate by the motor 10, thereby driving the wafer to rotate, further increasing the fluidity of the processing liquid on the wafer surface, thereby cleaning up the impurities and bubbles on the wafer surface.

[0027] Further, such as Figure 1 and Figure 2 As shown, two ends of the side wall of the motor 10 are respectively fixedly connected with connecting arms 12, and the two connecting arms 12 are commonly fixedly connected with a sealing cover 13. The output shaft of the motor 10 passes through the sealing cover 13 and is rotatably connected with the sealing cover 13;

[0028] In this embodiment, the sealing cover 13 is designed so that when the wafer is processed in the processing tank 2 , the processing liquid in the processing tank 2 will not splash to the outside of the processing tank 2 , thereby affecting subsequent cleaning.

[0029] Further, such as Figure 1 and Figure 5 As shown, a connecting frame 14 is fixedly connected to the bottom of the output shaft of the motor 10, and the connecting frame 14 is fixedly connected to the placement frame 11. The placement frame 11 is semicircular, and a placement groove 15 is provided on the inner wall of the placement frame 11;

[0030] In this embodiment, the design of the connecting frame 14 allows the three placement racks 11 to be stably fixedly connected to the output shaft of the motor 10 , and the design of the placement slot 15 allows the wafer to be smoothly placed on the placement rack 11 .

[0031] Further, such as Figure 1 and Figure 2 As shown, a vacuum pump 16 is fixedly connected to one end of the bottom of the workbench 1, and a vacuum pipe 17 is provided at the input end of the vacuum pump 16, and the vacuum pipe 17 is connected to the processing tank 2;

[0032] In this embodiment, the air in the processing tank 2 is evacuated by the vacuum pump 16, so that a low-pressure environment is generated inside the processing tank 2. The bubbles on the surface of the wafer or in the grooves are subjected to inward pressure due to the external atmospheric pressure, forcing them to shrink in volume and gradually move to the low-pressure area. As the pressure further decreases, the gas molecules in the bubbles will escape faster, thereby ensuring the subsequent electroplating quality of the wafer. When the vacuum pump 16 is turned on, the processing liquid cannot be injected into the processing tank 2, and the sealing cover 13 needs to cover the processing tank 2 to keep the processing tank 2 in a sealed environment.

[0033] Further, such as Figure 4 As shown, the exhaust pipe 17 is located at one end of the processing tank 2 and is fixedly connected to the inner wall with four fixing blocks 18, the four fixing blocks 18 are commonly fixedly connected to an electric push rod 19, and a sealing plug 20 is fixedly connected to the top of the electric push rod 19;

[0034] In this embodiment, the sealing plug 20 is driven up and down by the electric push rod 19 to realize the opening and closing of the connecting port between the vacuum pump 16 and the processing tank 2. When the vacuum pump 16 is turned on, the electric push rod 19 drives the sealing plug 20 to move upward to open the connecting port. When the processing liquid needs to be injected into the processing tank 2, the electric push rod 19 drives the sealing plug 20 to move downward to block the connecting port to prevent the processing liquid from flowing into the vacuum pump 16.

[0035] Further, such as Figure 2 As shown, it also includes a liquid storage tank 21, the top of the liquid storage tank 21 is connected to a second water pump 22, the output end of the second water pump 22 is connected to a water injection pipe 23, the water injection pipe 23 is connected to the treatment tank 2, and the output end of the water injection pipe 23 is located at the top of the side wall of the treatment tank 2;

[0036] In this embodiment, the treatment liquid is stored in the liquid storage tank 21 , the treatment liquid in the liquid storage tank 21 is pumped out by the second water pump 22 , and is input into the treatment tank 2 through the water injection pipe 23 .

[0037] Further, such as Figure 2 As shown, the bottom of the liquid storage tank 21 is connected with a reflux pipe 24, and one end of the reflux pipe 24 away from the liquid storage tank 21 is connected with the processing tank 2. The reflux pipe 24 is located at one end of the processing tank 2 and is installed with a valve 25;

[0038] In this embodiment, the design of the reflux pipe 24 allows the processing liquid in the processing tank 2 to flow back into the liquid storage tank 21, thereby realizing the recycling of the processing liquid. In actual use, a filter net can be installed on the reflux pipe 24 to ensure that the recycled processing liquid does not contain too many impurities. During the wafer processing process, the valve 25 needs to be closed to prevent the processing liquid in the processing tank 2 from flowing back into the liquid storage tank 21 before the wafer is completed.

[0039] Further, such as Figure 2 As shown, the input end of the second water pump 22 is connected to a water pipe 26, and one end of the water pipe 26 extends to the bottom end of the liquid storage tank 21;

[0040] In this embodiment, since the second water pump 22 is disposed on the top of the liquid storage tank 21 , the design of the water conduit 26 allows the second water pump 22 to smoothly pump out the treatment liquid in the liquid storage tank 21 .

[0041] Working principle: first, place the wafer on the placement rack 11, then open the cylinder 9, and let the cylinder 9 drive the placement rack 11 and the sealing cover 13 to move downward. When the sealing cover 13 covers the processing tank 2, turn on the vacuum pump 16. Under the action of the vacuum pump 16, the air in the processing tank 2 can be pumped out, so that a low-pressure environment is generated inside the processing tank 2. The bubbles on the surface of the wafer or in the groove will be subjected to inward pressure due to the external atmospheric pressure, forcing their volume to shrink and gradually move to the low-pressure area. As the pressure further decreases, the gas molecules in the bubbles will escape faster, and then the electric push rod 19 will be opened. Driven by the electric push rod 19, the sealing plug 20 will move downward, thereby connecting the vacuum pipe 17 to the processing tank. 2, and then the second water pump 22 is turned on. Under the action of the second water pump 22, the treatment liquid in the liquid storage tank 21 can be transported to the treatment tank 2. When the treatment tank 2 is full of the treatment liquid, the first water pump 6 is turned on. Under the action of the first water pump 6, the treatment liquid at the bottom of the treatment tank 2 will be pumped out and transported to the two annular tubes 3, and then sprayed out from the nozzles 5 on the annular tubes 3, so that the treatment liquid inside the treatment tank 2 can flow. At the same time, the motor 10 is turned on. Under the drive of the motor 10, the connecting frame 14 will rotate, thereby driving the placement frame 11 to rotate, so as to further increase the fluidity between the treatment liquid and the wafer, and it is easier to flush away impurities on the uniform surface during the flow of the treatment liquid.

[0042] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.

Claims

1. A wafer electroplating pre-treatment device, comprising a workbench (1), characterized in that: A processing tank (2) is arranged in the middle of the workbench (1), two annular tubes (3) are arranged in the processing tank (2), the two annular tubes (3) are connected through a connecting tube (4), a plurality of nozzles (5) are arranged on the inner side of the annular tube (3), a first water pump (6) is arranged at one end of the workbench (1) adjacent to the processing tank (2), the output end of the first water pump (6) is connected to the connecting tube (4), the input end of the first water pump (6) is arranged with a water inlet pipe (7), the end of the water inlet pipe (7) away from the first water pump (6) is connected to the processing tank (2), a support frame (8) is arranged on the top of the support frame (8), a cylinder (9) is arranged on the top of the cylinder (9), a motor (10) is arranged on the output end of the cylinder (9), and three wafer placement racks (11) are arranged on the output shaft of the motor (10).

2. The wafer electroplating pre-treatment device according to claim 1, characterized in that: The two ends of the side wall of the motor (10) are respectively fixedly connected with connecting arms (12), the two connecting arms (12) are commonly fixedly connected with a sealing cover (13), and the output shaft of the motor (10) passes through the sealing cover (13) and is rotatably connected to the sealing cover (13).

3. A wafer electroplating pre-treatment device according to claim 2, characterized in that: A connecting frame (14) is fixedly connected to the bottom of the output shaft of the motor (10), and the connecting frame (14) is fixedly connected to the placement frame (11). The placement frame (11) is semicircular in shape, and a placement groove (15) is provided on the inner wall of the placement frame (11).

4. The wafer electroplating pre-treatment device according to claim 1, characterized in that: An exhaust pump (16) is fixedly connected to one end of the bottom of the workbench (1), an exhaust pipe (17) is provided at the input end of the exhaust pump (16), and the exhaust pipe (17) is connected to the processing tank (2).

5. The wafer electroplating pre-treatment device according to claim 4, characterized in that: The exhaust pipe (17) is located at one end of the processing tank (2) and is fixedly connected to the inner wall with four fixing blocks (18); the four fixing blocks (18) are commonly fixedly connected to an electric push rod (19); and a sealing plug (20) is fixedly connected to the top of the electric push rod (19).

6. The wafer electroplating pre-treatment device according to claim 1, characterized in that: It also comprises a liquid storage tank (21), the top of the liquid storage tank (21) is connected to a second water pump (22), the output end of the second water pump (22) is connected to a water injection pipe (23), the water injection pipe (23) is connected to the treatment tank (2), and the output end of the water injection pipe (23) is located at the top of the side wall of the treatment tank (2).

7. The wafer electroplating pre-treatment device according to claim 6, characterized in that: The bottom of the liquid storage tank (21) is connected to a reflux pipe (24), one end of the reflux pipe (24) away from the liquid storage tank (21) is connected to the processing tank (2), and a valve (25) is installed at one end of the reflux pipe (24) located at the processing tank (2).

8. The wafer electroplating pre-treatment device according to claim 6, characterized in that: The input end of the second water pump (22) is connected to a water pipe (26), and one end of the water pipe (26) extends to the bottom end of the liquid storage tank (21).

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