Electroplating plate thickness monitoring mechanism
By adopting a combined design of sliding components and height adjustment components in the thickness monitoring mechanism of the plated plate, the problem of difficult adjustment of the plated plate monitoring position is solved, effective monitoring of the plated plate is achieved, and the quality and efficiency of the plated plate processing are improved.
Patent Information
- Application Number
- CN202421253293.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-06-04
AI Technical Summary
The existing electroplating thickness monitoring mechanism is installed in the electroplating tank, and the monitoring position is inconvenient, resulting in the inability to monitor the electroplating plate, affecting the processing of the electroplating plate.
A thickness monitoring mechanism for the plated plate is designed, using a combination of sliding components and height adjustment components. The sliding components drive the mounting plate to move horizontally in the plating box, and the height adjustment components drive the monitor to lift and lower, and adjust the position of the monitor to monitor the plated plate.
Through the coordinated work of the sliding assembly and the height adjustment assembly, the position of the monitor can be effectively adjusted to ensure that the monitor can accurately monitor the plated plate and avoid the impact of the plated plate processing caused by inability to monitor.
Smart Images

Figure CN222795776U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of electroplating plate processing, and in particular relates to an electroplating plate thickness monitoring mechanism. Background Art
[0002] The electroplating plate thickness monitoring mechanism is a device used to monitor the thickness of the coating during the electroplating process. During the electroplating process, monitoring the coating thickness is crucial to ensuring product quality, optimizing production processes and improving production efficiency.
[0003] In the prior art, when a plate is electroplated in a plating tank, in order to control the thickness of the plating layer on the surface of the plate, it is necessary to monitor the plating layer, so as to judge the plating condition on the surface of the plate. A traditional monitoring mechanism is installed in the plating tank, and its monitoring position is not convenient to adjust. When the plate located in the plating tank is adjusted, the monitoring mechanism cannot be adjusted and cannot monitor the plate, which affects the processing of the plate. Utility Model Content
[0004] The utility model aims to provide a mechanism for monitoring the thickness of an electroplated plate, aiming to solve the problem in the prior art that the monitoring mechanism is installed in an electroplating tank, its monitoring position is inconvenient to adjust, and when the electroplated plate in the electroplating tank is adjusted, the monitoring mechanism cannot be adjusted and the electroplated plate cannot be monitored, thus affecting the processing of the electroplated plate.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A mechanism for monitoring the thickness of an electroplated plate, comprising:
[0007] Electroplating box;
[0008] A convex groove, wherein the convex groove is arranged in the electroplating box;
[0009] A mounting plate, wherein the mounting plate is mounted in the electroplating box via a sliding assembly;
[0010] a height adjustment assembly mounted within the mounting plate; and
[0011] A monitor is connected to the height adjustment component.
[0012] As a preferred solution of the utility model, the sliding assembly includes a limit rod, a first screw and a first motor, the limit rod is fixedly connected to the inner walls on both sides of the convex groove, the first screw is rotatably connected to the inner walls on both sides of the convex groove, the first screw is threadedly connected to the mounting plate, the first motor is fixedly connected to the outer surface of the electroplating box, and the output end of the first motor movably passes through the inner wall of the convex groove and is fixed to one end of the first screw.
[0013] As a preferred solution of the utility model, a lifting groove is provided in the mounting plate.
[0014] As a preferred solution of the utility model, the height adjustment assembly includes a lifting plate, a second screw and a second motor, the lifting plate is slidably connected in the lifting slot, the second screw is rotatably connected to the upper and lower inner walls of the lifting slot, the second screw is threadedly connected to the lifting plate, the second motor is fixedly connected to the mounting plate, and the output end of the second motor movably passes through the upper inner wall of the lifting slot and is fixed to the upper end of the second screw.
[0015] As a preferred solution of the utility model, the monitor is fixedly connected to the surface of the lifting plate.
[0016] As a preferred solution of the utility model, an electroplating plate is placed in the electroplating box.
[0017] Compared with the prior art, the beneficial effects of the utility model are:
[0018] 1. In this scheme, by using this device, during the electroplating process of the electroplating plate, the sliding component and the height adjustment component operate simultaneously to adjust the position of the monitor in the electroplating box, so that the monitor can monitor the electroplating plate conveniently, and the monitor can be adjusted according to the position of the electroplating plate to avoid the inability to monitor the electroplating plate and affect the electroplating plate processing.
[0019] 2. In this solution, a convex groove is provided in the electroplating box, and a sliding component is provided in the convex groove. When the sliding component is in operation, it drives the mounting plate to move horizontally in the convex groove. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0021] Figure 1 It is the first stereogram of the utility model;
[0022] Figure 2 It is a second stereoscopic view of the utility model;
[0023] Figure 3 It is a top view of the utility model.
[0024] In the figure: 1. electroplating box; 2. convex groove; 3. limit rod; 4. first screw rod; 5. mounting plate; 6. first motor; 7. lifting groove; 8. lifting plate; 9. monitor; 10. second motor. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] Example
[0027] See also Figure 1-Figure 3 , the utility model provides the following technical solutions:
[0028] A mechanism for monitoring the thickness of an electroplated plate, comprising:
[0029] Electroplating box 1;
[0030] A convex groove 2, wherein the convex groove 2 is arranged in the electroplating box 1;
[0031] A mounting plate 5, wherein the mounting plate 5 is mounted in the electroplating box 1 through a sliding assembly;
[0032] A height adjustment assembly, the height adjustment assembly is installed in the mounting plate 5; and
[0033] Monitor 9, monitor 9 is connected with the height adjustment component.
[0034] In a specific embodiment of the utility model, a convex groove 2 is provided in the electroplating box 1, and a sliding component is provided in the convex groove 2. When the sliding component is in operation, it drives the mounting plate 5 to move horizontally in the convex groove 2. A height adjustment component is provided in the mounting plate 5. When the height adjustment component is in operation, it drives the monitor 9 to rise and fall in the electroplating box 1. Through the operation of the sliding component and the height adjustment component, the position of the monitor 9 in the electroplating box 1 is controlled to be adjusted, so that the monitor 9 can monitor the surface coating of the electroplating plate.
[0035] For details, please refer to Figure 1-Figure 3 The sliding assembly includes a limit rod 3, a first screw rod 4 and a first motor 6. The limit rod 3 is fixedly connected to the inner walls of both sides of the convex groove 2. The first screw rod 4 is rotatably connected to the inner walls of both sides of the convex groove 2. The first screw rod 4 is threadedly connected to the mounting plate 5. The first motor 6 is fixedly connected to the outer surface of the electroplating box 1. The output end of the first motor 6 movably passes through the inner wall of the convex groove 2 and is fixed to one end of the first screw rod 4.
[0036] In this embodiment: the first motor 6 in the sliding assembly drives the first screw 4 connected to its output end to rotate when running, the first screw 4 is threadedly matched with the mounting plate 5, the mounting plate 5 slides on the circumferential surface of the limiting rod 3, and the output end of the first motor 6 drives the first screw 4 to rotate. When the first screw 4 rotates, it drives the mounting plate 5 to move on the circumferential surface of the limiting rod 3, thereby horizontally adjusting the position of the mounting plate 5, and indirectly driving the monitor 9 to horizontally adjust its position.
[0037] For details, please refer to Figure 1-Figure 3 A lifting slot 7 is provided in the mounting plate 5 .
[0038] In this embodiment, the lifting groove 7 is used to connect the lifting plate 8.
[0039] For details, please refer to Figure 1-Figure 3 The height adjustment component includes a lifting plate 8, a second screw and a second motor 10. The lifting plate 8 is slidably connected to the lifting slot 7. The second screw is rotatably connected to the upper and lower inner walls of the lifting slot 7. The second screw is threadedly connected to the lifting plate 8. The second motor 10 is fixedly connected to the mounting plate 5. The output end of the second motor 10 movably passes through the upper inner wall of the lifting slot 7 and is fixed to the upper end of the second screw.
[0040] In this embodiment, the second motor 10 in the height adjustment assembly drives the second screw connected to its output end to rotate during operation, and the second screw drives the lifting plate 8 to move up and down in the lifting slot 7, and the lifting plate 8 drives the monitor 9 to move up and down.
[0041] For details, please refer to Figure 1-Figure 3 , the monitor 9 is fixedly connected to the surface of the lifting plate 8.
[0042] In this embodiment, the lifting plate 8 drives the monitor 9 to move when it moves.
[0043] For details, please refer to Figure 1-Figure 3 , the electroplating plate is placed in the electroplating box 1.
[0044] In this embodiment: the electroplating plate placed in the electroplating box 1 is subjected to electroplating processing.
[0045] It should be noted that the specific types of the first motor 6, the second motor and the monitor 9 to be used are selected by the relevant technical personnel familiar with the field, and the above-mentioned first motor 6, the second motor and the monitor 9 are all existing technologies and will not be elaborated in this solution.
[0046] The working principle and use process of the utility model: when the device is in use, the electroplating plate is placed in the electroplating box 1 for electroplating processing. When the surface of the electroplating plate needs to be monitored, the sliding component and the height adjustment component are controlled to operate, and the sliding component indirectly drives the monitor 9 to move horizontally in the electroplating box 1, and the height adjustment component indirectly drives the monitor 9 to move up and down, and adjusts the longitudinal height of the monitor 9; by using the device, during the electroplating process of the electroplating plate, the sliding component and the height adjustment component are operated at the same time to adjust the position of the monitor 9 in the electroplating box 1, so that the monitor 9 can monitor the electroplating plate conveniently, and the monitor 9 can be adjusted according to the position of the electroplating plate, so as to avoid the inability to monitor the electroplating plate and affect the electroplating plate processing.
[0047] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A mechanism for monitoring the thickness of an electroplated plate, characterized in that: include: Plating box (1); A convex groove (2), wherein the convex groove (2) is arranged in the electroplating box (1); A mounting plate (5), wherein the mounting plate (5) is mounted in the electroplating box (1) via a sliding assembly; a height adjustment assembly, the height adjustment assembly being mounted in the mounting plate (5); and A monitor (9), wherein the monitor (9) is connected to the height adjustment component.
2. The electroplating plate thickness monitoring mechanism according to claim 1, characterized in that: The sliding assembly comprises a limit rod (3), a first screw rod (4) and a first motor (6); the limit rod (3) is fixedly connected to the inner walls on both sides of the convex groove (2); the first screw rod (4) is rotatably connected to the inner walls on both sides of the convex groove (2); the first screw rod (4) is threadedly connected to the mounting plate (5); the first motor (6) is fixedly connected to the outer surface of the electroplating box (1); and the output end of the first motor (6) movably passes through the inner wall of the convex groove (2) and is fixed to one end of the first screw rod (4).
3. The electroplating plate thickness monitoring mechanism according to claim 2, characterized in that: A lifting slot (7) is provided in the mounting plate (5).
4. The electroplating plate thickness monitoring mechanism according to claim 3 is characterized in that: The height adjustment assembly comprises a lifting plate (8), a second screw and a second motor (10); the lifting plate (8) is slidably connected in the lifting slot (7); the second screw is rotatably connected to the upper and lower inner walls of the lifting slot (7); the second screw is threadedly connected to the lifting plate (8); the second motor (10) is fixedly connected to the mounting plate (5); and the output end of the second motor (10) movably passes through the upper inner wall of the lifting slot (7) and is fixed to the upper end of the second screw.
5. The electroplating plate thickness monitoring mechanism according to claim 4, characterized in that: The monitor (9) is fixedly connected to the surface of the lifting plate (8).
6. The electroplating plate thickness monitoring mechanism according to claim 5, characterized in that: The electroplating plate is placed in the electroplating box (1).