LED headlamp module with improved protection grade for electric vehicle

By designing and centrally arranging electronic components in the LED headlight module for electric vehicles and using glue-filled brackets for protection, the problem that electronic components cannot be moisture-proof in the prior art is solved, and the protection level and sealing of the LED headlight module are significantly improved.

CN222798757UActive Publication Date: 2025-04-25ZHEJIANG HAODIAN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421804059.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-29
Publication Date
2025-04-25
Estimated Expiration
2034-07-29

AI Technical Summary

Technical Problem

The existing LED headlight modules for two-wheeled electric vehicles are not glued during the production process, resulting in the electronic components on the PCB board being unable to prevent moisture and be easily damaged. The three-proof paint used by some car companies is not well protected on dispersed electronic components.

Method used

An LED headlight module including a PCB board and a glue filling bracket is designed. By filling the glue into the glue filling bracket, the concentratedly arranged electronic components are surrounded and protected to ensure sealing and improve the protection level.

Benefits of technology

By centrally arranging electronic components and using glue filling brackets for protection, the IP level of the LED headlight module is improved, reducing the possibility of glue filling brackets falling off, and significantly improving the protection effect of electronic components.

✦ Generated by Eureka AI based on patent content.

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Abstract

A light-emitting diode (LED) headlamp module with an improved protection grade for an electric vehicle comprises a printed circuit board (PCB), a plurality of electronic elements and LED lamp beads are arranged on the PCB, the electronic elements are arranged in a centralized mode, a glue pouring support is further arranged on the PCB, the glue pouring support and the PCB form sealing, the electronic elements arranged in the centralized mode are surrounded by the glue pouring support, and the LED lamp beads are arranged on the PCB. A proper amount of glue is poured into the glue pouring bracket, so that the plurality of electronic elements are protected; according to the LED headlamp module, a plurality of electronic elements are arranged in a centralized mode, meanwhile, the electronic elements which are arranged in the centralized mode are surrounded under the action of the glue pouring support, effective protection of the electronic elements is achieved in the mode that glue is poured into the glue pouring support, the IP grade of the LED headlamp module is improved, a step face is further formed on the glue pouring support, and after the glue is poured, the LED headlamp module is not prone to falling off. The glue is solidified and adheres to the electronic component, so that the possibility that the glue pouring bracket falls off can be reduced.
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Description

Technical Field

[0001] The utility model relates to an LED headlight module for an electric vehicle with an improved protection level. Background Art

[0002] During the production process of existing LED headlight modules for two-wheeled electric vehicles, the electronic components on the PCB board are not glued, and the sealing of the lamp shell of the headlight module is poor, making the electronic components on the PCB board not moisture-proof and easily damaged; some car companies use three-proof paint on the surface of the electronic components to deal with the moisture-proof problem, but due to the scattered layout of the electronic components, the protection performance is still not ideal. Summary of the invention

[0003] In view of the shortcomings existing in the above problems, the utility model provides an LED headlight module for electric vehicles with improved protection level.

[0004] To achieve the above-mentioned purpose, the utility model provides an LED headlight module for an electric vehicle with an improved protection level, including a PCB board, on which a plurality of electronic components and LED lamp beads are arranged in a concentrated manner. The PCB board is also provided with a glue potting bracket, which forms a seal with the PCB board and surrounds the plurality of electronic components arranged in a concentrated manner. By pouring an appropriate amount of glue into the glue potting bracket, protection of the plurality of electronic components is achieved.

[0005] Furthermore, a positioning hole is formed on the PCB board, a positioning column is formed on the glue-filling bracket, and the positioning hole is used to receive the positioning column.

[0006] Furthermore, the glue-potting bracket is rectangular, and the number of the positioning columns and the number of the positioning holes are both two.

[0007] Furthermore, during assembly, the bottom of the glue-filling bracket is dip-coated with conformal coating to ensure the sealing between the glue-filling bracket and the PCB board after assembly.

[0008] Furthermore, a step surface is formed on the glue-pouring bracket.

[0009] Furthermore, the PCB board is also configured with a small lens and a large lens.

[0010] The beneficial effects of the utility model compared with the prior art are:

[0011] 1. Arrange multiple electronic components in a centralized manner. At the same time, the centralized electronic components are surrounded by the glue-filling bracket. By filling glue into the glue-filling bracket, effective protection of the electronic components is achieved, thereby improving the IP level of the LED headlight module.

[0012] 2. A step surface is also formed on the glue-filling bracket. After the glue is poured in, the glue solidifies and adheres to the electronic components, which can reduce the possibility of the glue-filling bracket falling off. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A three-dimensional diagram of an LED headlight module for an electric vehicle with an improved protection level;

[0014] Figure 2 for Figure 1 Schematic diagram behind the hidden large lens;

[0015] Figure 3 This is an exploded view of an LED headlight module for electric vehicles with an improved protection level.

[0016] In the figure: 1. PCB board; 11. Positioning hole; 2. Electronic component; 3. LED lamp bead; 4. Glue filling bracket; 41. Positioning column; 42. Step surface; 5. Small lens; 6. Large lens. DETAILED DESCRIPTION

[0017] like Figure 1 , Figure 2 and Figure 3 As shown, an LED headlight module for electric vehicles with improved protection level according to an embodiment of the utility model comprises a PCB board 1, on which a plurality of electronic components 2 and three LED lamp beads 3 are arranged in a concentrated manner, and a glue potting bracket 4 is further arranged on the PCB board 1, and the glue potting bracket 4 forms a seal with the PCB board 1 while enclosing the plurality of electronic components 2 arranged in a concentrated manner, and a proper amount of glue is poured into the glue potting bracket 4 to achieve protection of the plurality of electronic components 2; a positioning hole 11 is formed on the PCB board 1, and a positioning column 41 is formed on the glue potting bracket 4, and the positioning hole 11 is used to receive the positioning column 41; the glue potting bracket 4 is rectangular, and the number of the positioning column 41 and the number of the positioning hole 11 are both two; during assembly, the bottom of the glue potting bracket 4 is dip-coated with a three-proof paint to ensure the sealing between the glue potting bracket 4 and the PCB board 1 after assembly; a step surface 42 is also formed on the glue potting bracket 4; a small lens 5 and a large lens 6 are also arranged on the PCB board 1.

[0018] Multiple electronic components are arranged centrally. At the same time, the centralized electronic components are surrounded by the glue potting bracket. By pouring glue into the glue potting bracket, effective protection of the electronic components is achieved, and the IP level of the LED headlight module is improved. A step surface is also formed on the glue potting bracket. After the glue is poured in, the glue solidifies and adheres to the electronic components, which can reduce the possibility of the glue potting bracket falling off.

[0019] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An LED headlight module for an electric vehicle with an improved protection level, comprising a PCB board (1), wherein a plurality of electronic components (2) and LED lamp beads (3) are arranged on the PCB board (1), characterized in that: The plurality of electronic components (2) are arranged in a centralized manner, and a glue potting bracket (4) is also arranged on the PCB board (1). The glue potting bracket (4) forms a seal with the PCB board (1) and simultaneously surrounds the plurality of electronic components (2) arranged in a centralized manner. By pouring a suitable amount of glue into the glue potting bracket (4), the plurality of electronic components (2) are protected.

2. The LED headlight module for electric vehicles with improved protection level according to claim 1, characterized in that: A positioning hole (11) is formed on the PCB board (1), a positioning column (41) is formed on the glue-filling bracket (4), and the positioning hole (11) is used to receive the positioning column (41).

3. The LED headlight module for electric vehicles with improved protection level according to claim 2, characterized in that: The glue-pouring bracket (4) is rectangular, and the number of the positioning columns (41) and the number of the positioning holes (11) are both two.

4. The LED headlight module for electric vehicles with improved protection level according to claim 2, characterized in that: During assembly, the bottom of the glue-filling bracket (4) is dip-coated with conformal coating to ensure sealing between the glue-filling bracket (4) and the PCB board (1) after assembly.

5. The LED headlight module for electric vehicles with improved protection level according to claim 4, characterized in that: The glue-pouring bracket (4) is also formed with a step surface (42).

6. The LED headlight module for electric vehicles with improved protection level according to claim 5, characterized in that: The PCB board (1) is also provided with a small lens (5) and a large lens (6).