Cooling mechanism of high-temperature testing machine

Abstract

The utility model discloses a cooling mechanism for a high-temperature testing machine. The cooling mechanism comprises a base; a moving platform is arranged on one side of the upper end of the base, one end of the moving platform is connected with a condenser, the upper end of the moving platform is connected with a compressor, an expansion valve is arranged on one side of the compressor, an evaporator is arranged on one side of the expansion valve, and the condenser, the compressor, the expansion valve and the evaporator are communicated through pipelines. A cooling disc B is arranged above the evaporator, and the upper end of the cooling disc B is connected with material carrying reverse molds at equal intervals. The utility model is convenient to process, convenient and reliable.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor product testing, in particular to a cooling mechanism for a high-temperature testing machine. Background Art

[0002] Semiconductor products are the core hardware foundation of the electronic information industry, including four major categories: integrated circuits, optoelectronic devices, discrete devices, and sensors. Test machines are used to undertake the structure when testing semiconductor products, and temperature testing is one of the items for testing semiconductor products.

[0003] Existing temperature testing institutions for semiconductor products use either water cooling or wind blowing for cooling tests. However, it is difficult to directly reduce the temperature to the required test temperature in a short time, which is difficult to meet the needs of electrical testing of the product. The applicability is insufficient, which affects actual use. Utility Model Content

[0004] In view of the above problems, the utility model provides a high temperature test machine cooling mechanism which is simple in structure, convenient and reliable.

[0005] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0006] A high temperature test machine cooling mechanism, comprising:

[0007] Base; a moving platform is arranged on one side of the upper end of the base, and a condenser is connected to one end of the moving platform, a compressor is connected to the upper end of the moving platform, and an expansion valve is arranged on one side of the compressor, an evaporator is arranged on one side of the expansion valve, a cooling fan is connected to the middle of the back side of the condenser, and a ring-shaped opening is opened on one side of the cooling fan.

[0008] Furthermore, the condenser, compressor, expansion valve and evaporator are connected through pipelines.

[0009] Furthermore, a support block is symmetrically connected to one side of the upper end of the base, and a movable shaft is rotatably connected to the inner side of the support block. A transmission belt is connected between a group of movable shafts, and the upper part of the transmission belt is fixedly connected to a sleeve block symmetrically fixed at one end of the motion platform.

[0010] Furthermore, a driving motor is connected through the middle of the front side of one of the supporting blocks, and an output end of the driving motor is fixed to one end of one of the movable shafts.

[0011] Furthermore, a fixing seat is provided at the upper end of the base, sliding rods are evenly distributed on one side of the fixing seat, and sliding holes corresponding to the sliding rods are provided on the motion platform.

[0012] During operation, the utility model provides a condenser, a compressor, an evaporator and an expansion valve. The compressor compresses the refrigerant, condenses it through the condenser, and then throttles the condensed refrigerant through the expansion valve, causing its volume to suddenly increase and its pressure to drop suddenly, turning it into a low-temperature and low-pressure liquid. The refrigerant is then evaporated through the evaporator, and a large amount of heat absorption is carried out during the evaporation process, thereby completing rapid cooling in a short time, thereby meeting the testing requirements of semiconductor products. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 This is the appearance diagram of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the motion platform of the utility model;

[0016] Figure 3 It is a top view of the utility model;

[0017] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0018] 1. Base; 2. Moving platform; 3. Condenser; 4. Cooling fan; 5. Compressor; 6. Expansion valve; 7. Evaporator; 8. Rotating motor 1; 9. Ring frame; 10. Material transport plate A; 11. Material transport nozzle; 12. Rotating motor 2; 13. Fixed base; 14. Cooling plate B; 15. Material loading mold; 16. Support block; 17. Movable shaft; 18. Transmission belt; 19. Driving motor; 20. Bushing block; 21. Pipeline; 22. Fixed seat; 23. Sliding rod; 24. Sliding hole. DETAILED DESCRIPTION

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0020] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0021] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0022] See also Figure 1-3 As shown, this embodiment is a high temperature test machine cooling mechanism, comprising:

[0023] Base 1; a moving platform 2 is arranged on one side of the upper end of the base 1, and a condenser 3 is connected to one end of the moving platform 2, a compressor 5 is connected to the upper end of the moving platform 2, and an expansion valve 6 is arranged on one side of the compressor 5, and an evaporator 7 is arranged on one side of the expansion valve 6, a heat dissipation fan 4 is connected to the middle of the back of the condenser 3, and a circular opening is opened on one side of the heat dissipation fan 4;

[0024] The base 1 is the main installation carrier, the moving platform 2 is used for the installation of the cooling structure and the object-carrying structure, the compressor 5 is used for compressing the coolant, the condenser 3 condenses the refrigerant, and the heat dissipation is guided by the heat dissipation fan 4, the expansion valve 6 throttles the condensed coolant to increase its volume to achieve the purpose of reducing the pressure, the evaporator 7 evaporates the refrigerant to achieve the purpose of rapid cooling through the heat absorption in evaporation, and the annular port can be connected to the external guide pipe to act on the cooling water to achieve the purpose of heating;

[0025] The condenser 3, the compressor 5, the expansion valve 6, and the evaporator 7 are connected through a pipeline 21;

[0026] Pipe 21 is used for the circulation of coolant;

[0027] A support block 16 is symmetrically connected to one side of the upper end of the base 1, and a movable shaft 17 is rotatably connected to the inner side of the support block 16. A transmission belt 18 is connected between a group of movable shafts 17. The upper part of the transmission belt 18 is sleeved and fixed to a sleeve block 20 symmetrically fixed to one end of the motion platform 2.

[0028] A driving motor 19 is connected through the middle of the front side of a support block 16, and the output end of the driving motor 19 is fixed to one end of a movable shaft 17;

[0029] The support block 16 is used to install the drive motor 19 and the movable shaft 17. The drive belt 18 can be installed by using the movable shaft 17. After the controlled drive motor 19 applies a rotational force to a movable shaft 17, the movement of the drive belt 18 can be satisfied under the transmission of force. The sleeve block 20 can be used to adjust the left and right position of the motion platform 2.

[0030] A fixing seat 22 is disposed at the upper end of the base 1 , and sliding rods 23 are evenly distributed on one side of the fixing seat 22 . The motion platform 2 is provided with sliding holes 24 corresponding to the sliding rods 23 one by one.

[0031] In this way, the stability of the motion platform is ensured.

[0032] In a specific application, a rotating motor 12 is connected to one side of the upper end of the motion platform 2, and a fixed base 13 is provided on the outer side of the rotating motor 12. The output end of the rotating motor 12 passes through the evaporator, and a cooling plate B 14 is fixed on the upper part, and a loading mold 15 is equidistantly connected to the upper end of the cooling plate B 14.

[0033] The evaporator 7 is located between the fixed base 13 and the cooling B disk 14;

[0034] A suction hole is provided in the middle of the loading mold 15, penetrating through the cooling plate B 14;

[0035] The second rotating motor 12 is structurally mounted on the cooling plate B 14 and can meet its rotation requirements; the fixed base 13 is arranged on the moving platform through a column, the fixed base 13 isolates and protects the upper part of the second rotating motor 12, and structurally mounts the evaporator 7, and the loading mold 15 cooperates with the adsorption holes to adsorb and position the loading material to meet the test requirements;

[0036] A rotating motor 8 is fixed in the middle of the other side of the upper end of the base 1, and a ring frame 9 is fixed on the upper part of the output end of the rotating motor 8, a material transport plate A 10 is fixed in the middle of the outer surface of the ring frame 9, and a material transport nozzle 11 is fixed on one side of the upper end of the material transport plate A 10;

[0037] The rotating motor 8 is installed on the ring frame 9 and can rotate the ring frame 9 at an angle. The material transport plate A 10 is used in conjunction with the material transport nozzle 11 to absorb the semiconductor product to be tested and move it to the material loading mold 15;

[0038] Working principle: When the controlled rotating motor 8 applies a rotating force to the ring frame 9, so that the material transport suction nozzle 11 moves to the top of the semiconductor product to be tested, the semiconductor product to be tested is adsorbed by the material transport suction nozzle 11;

[0039] At this time, the rotating motor 8 applies a rotating force to the ring frame 9 again, and the driving motor 19 drives the movable shaft 17 to rotate, and the transmission belt 18 is linked to rotate, and the sleeve block 20 is used to move the motion platform 2 inward, so that the material transport suction nozzle 11 is above the material loading mold 15, and the material transport suction nozzle 11 stops adsorbing so that the semiconductor product to be tested is on the material loading mold 15, and the adsorption holes on the material loading mold 15 cooperate with the external adsorption equipment to adsorb and fix it;

[0040] Next, the refrigerant is compressed by the compressor 5, condensed by the condenser 3, and throttled by the expansion valve 6, causing its volume to increase suddenly and its pressure to drop suddenly, turning into a low-temperature and low-pressure liquid. It is then evaporated by the evaporator 7, and a large amount of heat absorption is carried out during the evaporation process, so that the temperature is quickly reduced in a short time, and the test of semiconductor products is completed;

[0041] This solution can meet the testing requirements of semiconductor products, and is provided with a cooling fan 4 to conduct the heat generated during condensation. After an external guide pipe is sleeved on the annular opening on one side of the cooling fan 4, it can act on external cold water to recycle the waste heat, save resources, reduce costs, and improve the structural applicability and functionality.

[0042] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be connected, detachably connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Claims

1. A high temperature test machine cooling mechanism, characterized in that: include: A base (1); a moving platform (2) is arranged on one side of the upper end of the base (1), and one end of the moving platform (2) is connected to a condenser (3); a compressor (5) is connected to the upper end of the moving platform (2), and an expansion valve (6) is arranged on one side of the compressor (5), and an evaporator (7) is arranged on one side of the expansion valve (6); the condenser (3), the compressor (5), the expansion valve (6), and the evaporator (7) are connected via a pipeline (21); A cooling plate B (14) is provided above the evaporator (7), and a material loading mold (15) is equidistantly connected to the upper end of the cooling plate B (14).

2. A high temperature test machine cooling mechanism according to claim 1, characterized in that: A heat dissipation fan (4) is connected to the middle of the back side of the condenser (3), and an annular opening is provided on one side of the heat dissipation fan (4).

3. The high temperature test machine cooling mechanism according to claim 1, characterized in that: A support block (16) is symmetrically connected to one side of the upper end of the base (1), and a movable shaft (17) is rotatably connected to the inner side of the support block (16). A transmission belt (18) is connected between a group of movable shafts (17), and the upper part of the transmission belt (18) is sleeved and fixed to a sleeve block (20) symmetrically fixed to one end of the motion platform (2).

4. A high temperature test machine cooling mechanism according to claim 3, characterized in that: A driving motor (19) is connected through the middle of the front side of one of the supporting blocks (16), and an output end of the driving motor (19) is fixed to one end of one of the movable shafts (17).

5. A high temperature test machine cooling mechanism according to claim 4, characterized in that: A fixing seat (22) is provided at the upper end of the base (1), sliding rods (23) are evenly distributed on one side of the fixing seat (22), and sliding holes (24) corresponding one to one with the sliding rods (23) are provided on the motion platform (2).

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