Wing impact measuring and collecting device
By integrating flexible printed circuit boards and sensor arrays on the wings, real-time monitoring and early warning of wing impact loads is achieved, and the problems of low efficiency, high misjudgment rate and complex installation in the existing technology are solved, the measurement accuracy and efficiency are improved, and the safety of the aircraft is enhanced.
Patent Information
- Application Number
- CN202421500162.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-06-28
AI Technical Summary
The existing wing impact measurement methods are inefficient, have high misjudgment rates, and are complex in installation, making it difficult to achieve high-precision and real-time detection.
A wing impact measurement and acquisition device is designed, and a flexible printed circuit board is used to integrate a flexible sensor array, signal conversion module, multiple signal acquisition module, signal processing module, asynchronous transceiver module and wireless communication module to realize real-time monitoring and early warning of wing impact load.
The integration of large-scale and multi-function sensors is achieved, the load on the measurement system is reduced, the measurement accuracy and efficiency are improved, the structural performance and safety of the wing can be more accurately evaluated, and potential safety hazards can be discovered in a timely manner, and accidents can be avoided.
Smart Images

Figure CN222800308U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wing impact detection, in particular to a wing impact measurement and collection device. Background Art
[0002] The measurement of wing impact position and impact strength is critical to the safety and maintenance of aircraft. Aircraft may be hit by bird strikes, hail, flying debris or other objects during flight, posing a threat to flight safety.
[0003] At present, the traditional way of measuring wing impact mainly relies on manual visual inspection, or by installing special instruments and equipment around the wing to be tested, using optical, laser or radar technologies for non-contact inspection. Although these two methods can meet most of the inspection needs, they also have some shortcomings. Manual visual inspection is inefficient and has a high misjudgment rate. The installation process of installing instruments for inspection is often complicated, with high requirements for the installation position. Sometimes drilling is required for installation, and targets need to be laid out on the wing to be tested, which makes the inspection complicated.
[0004] With the development of aviation technology and the advancement of modern intelligent detection technology, the requirements for aircraft wing detection are becoming higher and higher, requiring a technology that can detect wing impact with high precision and in real time. Intelligent skin technology has become an indispensable research direction in impact measurement by integrating sensors into the aircraft skin. Utility Model Content
[0005] The utility model provides a wing impact measurement and collection device.
[0006] The technical solution of this utility model is as follows:
[0007] A wing impact measurement and collection device comprises a flexible printed circuit board arranged on the wing, characterized in that it also comprises a flexible sensor array arranged on the flexible printed circuit board, wherein the flexible sensor array comprises a plurality of pressure sensors,
[0008] The flexible sensor array is electrically connected to a signal conversion module, which includes a voltage divider circuit and an amplifier circuit which are electrically connected in sequence, the voltage divider circuit is electrically connected to a plurality of pressure sensors, the amplifier circuit is electrically connected to a multi-channel signal acquisition module, and the multi-channel signal acquisition module is electrically connected to a signal processing module.
[0009] The signal processing module is electrically connected to the asynchronous transceiver module and the wireless communication module, the asynchronous transceiver module is electrically connected to the host computer, and the wireless communication module is communicatively connected to the host computer.
[0010] It also includes a power supply module, which is electrically connected to the flexible sensor array, the signal conversion module, the multi-channel signal acquisition module, the signal processing module and the asynchronous transceiver module, and the asynchronous transceiver module is electrically connected to the wireless communication module.
[0011] The signal conversion module, the multi-channel signal acquisition module, the signal processing module, the asynchronous transceiver module and the wireless communication module are all arranged on a flexible printed circuit board.
[0012] Specifically, the flexible sensor array includes a plurality of block-shaped areas, each of which is provided with a pressure sensor, and each of the block-shaped areas is electrically connected to a signal conversion module.
[0013] Specifically, a plurality of voltage divider circuits are provided, and a plurality of amplifier circuits electrically connected to the voltage divider circuits are provided accordingly. The number of voltage divider circuits is consistent with the number of pressure sensors, and each pressure sensor is connected in series with each voltage divider circuit.
[0014] Preferably, the multi-channel signal acquisition module is a CD74HC4067 multi-channel multiplexing chip.
[0015] Preferably, the signal processing module is a STM32F407ZGT6 main control chip.
[0016] Preferably, the wireless communication module is an ESP8266 chip with a built-in Wi-Fi module.
[0017] Preferably, the asynchronous transceiver module is a CP2102 chip.
[0018] Specifically, the flexible printed circuit board is attached to the surface of the wing.
[0019] Preferably, the pressure sensor is a piezoresistive pressure sensor.
[0020] Furthermore, the host computer is also electrically connected to an alarm module.
[0021] The beneficial effects of the utility model are:
[0022] (1) The utility model is a wing impact measurement and acquisition device, in which a flexible printed circuit board with a flexible sensor array is attached to the surface of a structure, which can realize the integration of large-scale and multifunctional sensors, avoids the shortcomings of traditional measurement methods such as the need for drilling, destruction of the integrity of the structure, and complex leads and pipelines, and significantly reduces the load of the measurement system.
[0023] (2) It can monitor and warn of wing impact loads in real time and achieve accurate measurement of wing impact position and impact strength. Compared with traditional methods, this technology has higher measurement accuracy and efficiency, and can more accurately evaluate the structural performance and safety of the wing, timely discover potential safety hazards, take timely measures to avoid accidents, and improve the safety and reliability of the aircraft. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] By reading the detailed description of the preferred embodiment below, the scheme and advantages of the present application will become clear to those skilled in the art. The accompanying drawings are only used to illustrate the preferred embodiment and are not considered to be limiting of the present invention.
[0025] In the attached picture:
[0026] Figure 1 This is a schematic diagram of the module structure of a wing impact measurement and collection device in the embodiment;
[0027] Figure 2 It is a structural diagram of a sensor array of a wing impact measurement and collection device in an embodiment. DETAILED DESCRIPTION
[0028] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings.
[0029] Example
[0030] This embodiment provides a wing impact measurement and collection device, see Figure 1 , comprising a flexible printed circuit board arranged on the wing, characterized in that it also comprises a flexible sensor array arranged on the flexible printed circuit board, wherein the flexible sensor array comprises a plurality of pressure sensors,
[0031] The flexible sensor array is electrically connected to a signal conversion module, which includes a voltage divider circuit and an amplifier circuit which are electrically connected in sequence, the voltage divider circuit is electrically connected to a plurality of pressure sensors, the amplifier circuit is electrically connected to a multi-channel signal acquisition module, and the multi-channel signal acquisition module is electrically connected to a signal processing module.
[0032] The signal processing module is electrically connected to the asynchronous transceiver module and the wireless communication module, the asynchronous transceiver module is electrically connected to the host computer, and the wireless communication module is communicatively connected to the host computer.
[0033] It also includes a power supply module, which is electrically connected to the flexible sensor array, the signal conversion module, the multi-channel signal acquisition module, the signal processing module and the asynchronous transceiver module, and the asynchronous transceiver module is electrically connected to the wireless communication module.
[0034] The signal conversion module, the multi-channel signal acquisition module, the signal processing module, the asynchronous transceiver module and the wireless communication module are all arranged on a flexible printed circuit board.
[0035] In the present invention, a flexible sensor array is arranged on a flexible printed circuit board, and the flexible sensor array includes a plurality of block-shaped areas, each of which is provided with a pressure sensor, and each block-shaped area is electrically connected to a signal conversion module, so as to simultaneously monitor multiple position areas of the wing. Figure 2 As shown, there are 16 block areas of 4×4, corresponding to which are 16 pressure sensors, which are piezoresistive pressure sensors.
[0036] The flexible sensor array is electrically connected to the signal conversion module, which includes a voltage divider circuit and an amplifying circuit electrically connected in sequence. The voltage divider circuit is electrically connected to several pressure sensors, the amplifying circuit is electrically connected to a multi-channel signal acquisition module, and the multi-channel signal acquisition module is electrically connected to the signal processing module.
[0037] When one voltage divider circuit is provided, a plurality of pressure sensors are electrically connected to one voltage divider circuit, the voltage divider circuit is electrically connected to the amplifier circuit, and the amplifier circuit is electrically connected to the multi-channel signal acquisition module. The multi-channel signal acquisition module is a CD74HC4067 multi-channel multiplexing chip, which is used to control the signals of multiple pressure sensors to be transmitted to the signal processing module after passing through one voltage divider circuit and an amplifier circuit in time sequence.
[0038] When a plurality of voltage divider circuits are provided, a plurality of amplifier circuits electrically connected to the voltage divider circuits are provided accordingly. The number of the voltage divider circuits is consistent with the number of the pressure sensors. Each pressure sensor is connected in series with a fixed resistance resistor in each voltage divider circuit.
[0039] The function of the voltage divider circuit is to convert the resistance change of the pressure sensor output into a voltage change. The number of voltage divider circuits is consistent with the number of pressure sensors. Each pressure sensor is connected in series with a fixed resistance resistor in the voltage divider circuit. The fixed resistance resistor provides a reference voltage so that the change in the resistance value of the pressure sensor can be converted into a change in the output voltage signal.
[0040] The amplifier circuit is used to enhance the voltage signal output by the pressure sensor. The number of amplifier circuits is the same as the number of voltage divider circuits, which is 16.
[0041] When the wing position where the pressure sensor is located is not impacted, its resistance value is in the initial state, and the output voltage after voltage division with the fixed resistance resistor connected in series with it in the voltage divider circuit remains stable. When the pressure sensor is impacted with different intensities, its resistance value changes, causing the output voltage of the voltage divider circuit to change as well. The output voltage signal is amplified by the amplifier circuit and collected by the multi-channel signal acquisition module.
[0042] The function of the multi-channel signal acquisition module is to collect the amplified signal and transmit it to the signal processing module. The multi-channel signal acquisition module is a CD74HC4067 multi-channel multiplexing chip. The CD74HC4067 multi-channel multiplexing chip is provided with 16 signal acquisition channels, which are connected to the outputs of 16 amplification circuits. By controlling the address selection line of CD74HC4067, the signal of one channel can be selected from the 16 channels for acquisition. Each signal acquisition channel corresponds to a pressure sensor to ensure that the signal of each pressure sensor can be independently collected and processed. The number of signal acquisition channels should match the number of pressure sensors to achieve one-to-one signal acquisition.
[0043] By using the output voltage change signals of different pressure sensor acquisition channels, it is possible to determine which areas of sensors are impacted. The utility model provides a simple and effective way to detect and quantify the impact of each area in the sensor array.
[0044] The signal processing module is used to convert the analog signal into a digital voltage signal and filter the converted digital voltage signal. The signal processing module is an STM32F407ZGT6 main control chip, which performs analog-to-digital conversion, FIR low-pass filtering and median filtering on the input analog voltage signal.
[0045] The signal processing module is electrically connected to both the asynchronous transceiver module and the wireless communication module, the asynchronous transceiver module is electrically connected to the host computer, and the wireless communication module is communicatively connected to the host computer. The signal processing module transmits the collected voltage signal of the flexible sensor array to the host computer through the asynchronous transceiver module or the wireless communication module, wherein the asynchronous transceiver module is a CP2102 chip, which is used to convert the voltage signal into serial data and transmit it to the host computer through the interface of the CP2102 chip; the wireless communication module is an ESP8266 chip with a built-in Wi-Fi module, which is used to transmit the collected signal data to the host computer through a wireless network and perform remote wireless communication with the host computer.
[0046] The power module is used to provide power for the entire wing impact measurement device. The power module is electrically connected to the flexible sensor array, signal conversion module, multi-channel signal acquisition module, signal processing module and asynchronous transceiver module. The power module type can be a battery.
[0047] The host computer is also electrically connected to an alarm module. When the collected voltage signal exceeds a set threshold, the alarm module sends out an alarm to remind the management personnel. The alarm module includes an indicator light and a speaker, both of which are electrically connected to the host computer.
Claims
1. A wing impact measurement and collection device, comprising a flexible printed circuit board arranged on the wing, characterized in that: Also included is a flexible sensor array disposed on a flexible printed circuit board, wherein the flexible sensor array includes a plurality of pressure sensors, The flexible sensor array is electrically connected to a signal conversion module, which includes a voltage divider circuit and an amplifier circuit which are electrically connected in sequence, the voltage divider circuit is electrically connected to a plurality of pressure sensors, the amplifier circuit is electrically connected to a multi-channel signal acquisition module, and the multi-channel signal acquisition module is electrically connected to a signal processing module. The signal processing module is electrically connected to the asynchronous transceiver module and the wireless communication module, the asynchronous transceiver module is electrically connected to the host computer, and the wireless communication module is communicatively connected to the host computer. It also includes a power supply module, which is electrically connected to the flexible sensor array, the signal conversion module, the multi-channel signal acquisition module, the signal processing module and the asynchronous transceiver module, and the asynchronous transceiver module is electrically connected to the wireless communication module. The signal conversion module, the multi-channel signal acquisition module, the signal processing module, the asynchronous transceiver module and the wireless communication module are all arranged on a flexible printed circuit board.
2. A wing impact measurement and collection device according to claim 1, characterized in that: The flexible sensor array includes a plurality of block-shaped areas, each of which is provided with a pressure sensor, and each of the block-shaped areas is electrically connected to a signal conversion module.
3. A wing impact measurement and collection device according to claim 1, characterized in that: There are several voltage divider circuits, and there are several amplifier circuits electrically connected to the voltage divider circuits. The number of voltage divider circuits is consistent with the number of pressure sensors, and each pressure sensor is connected in series with each voltage divider circuit.
4. A wing impact measurement and collection device according to claim 1, characterized in that: The multi-channel signal acquisition module is a CD74HC4067 multi-channel multiplexing chip.
5. The wing impact measurement and collection device according to claim 1, characterized in that: The signal processing module is a STM32F407ZGT6 main control chip.
6. A wing impact measurement and collection device according to claim 1, characterized in that: The wireless communication module is an ESP8266 chip with a built-in Wi-Fi module.
7. A wing impact measurement and collection device according to claim 1, characterized in that: The asynchronous transceiver module is a CP2102 chip.
8. The wing impact measurement and collection device according to claim 1, characterized in that: The flexible printed circuit board is attached to the surface of the wing.
9. The wing impact measurement and collection device according to claim 1, characterized in that: The pressure sensor is a piezoresistive pressure sensor.
10. The wing impact measurement and collection device according to claim 1, characterized in that: The host computer is also electrically connected to an alarm module.