Display card with passive noise reduction structure
By designing cellular structure sound silencer holes and porous sound absorbing cotton on the back plate and inner wall of the graphics card, combined with the misalignment design, the noise problem of graphics card in the miniaturized chassis is solved, passive noise reduction and optimized heat dissipation effect are achieved, and user experience is improved.
Patent Information
- Application Number
- CN202421431360.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-21
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-06-21
AI Technical Summary
There is still room for improvement in the noise problem of existing graphics cards in miniaturized chassis, and the active noise reduction method has limited effect, which affects the user experience.
A graphics card with a passive noise reduction structure is designed, and a honeycomb structure silence hole is opened on the back plate and the inner wall of the upper cover, and fixedly connected through a porous sound-absorbing cotton. Combined with the misalignment design to block the connection gap, the air duct system is optimized with the heat dissipation module.
Effectively reduce graphics card noise, improve user experience, ensure cooling efficiency, and adapt to the needs of miniaturized chassis.
Smart Images

Figure CN222801086U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of graphics cards, in particular to a graphics card with a passive noise reduction structure. Background Art
[0002] With the increasing popularity of miniaturized I TX chassis, reducing graphics card operating noise to improve user experience has become a key requirement for technological development. As smaller chassis lead to a more closed space, the internal ambient temperature increases. In order to maintain the graphics card core temperature within a safe range, the graphics card fan speed must be increased, but this brings greater noise problems.
[0003] Existing technologies reduce noise by lowering fan speed, optimizing fan blade shape and internal structure. Although these active noise reduction methods are effective to a certain extent, there is still room for improvement. Therefore, seeking more effective noise reduction technology to adapt to the trend of miniaturized chassis while ensuring heat dissipation efficiency and user experience is the focus of current technological development. Utility Model Content
[0004] The purpose of the utility model is to solve the shortcomings of the prior art that the active noise reduction method is effective to a certain extent, but still has room for improvement, and to propose a graphics card with a passive noise reduction structure.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] Design a graphics card with a passive noise reduction structure, including a back plate fixed to the outer side of a motherboard unit and an upper cover, wherein at least one fan hole is provided through the end surface of the upper cover;
[0007] Wherein, a first sound-absorbing structure is provided on the inner wall of the back plate, and a first sound-absorbing member is fixedly connected thereto;
[0008] A second sound-absorbing structure is provided on the inner wall of the upper cover and is fixedly connected to a second sound-absorbing member, and the first sound-absorbing member is in at least partial contact with the second sound-absorbing member.
[0009] Furthermore, the first sound-absorbing structure and the second sound-absorbing structure have the same structure;
[0010] The first sound-absorbing structure is sound-absorbing holes arranged in a honeycomb structure on the inner wall of the back plate.
[0011] Furthermore, the first sound-absorbing component and the second sound-absorbing component have the same structure and are both configured as porous sound-absorbing cotton;
[0012] The porous sound-absorbing cotton is bonded and fixed to the inside of the back plate and the upper cover through an adhesive layer.
[0013] Furthermore, the end of the second silencer extends to the outside of the shell edge of the upper cover, and the end of the first silencer is retracted into the shell edge of the back plate. When the upper cover is connected to the back plate, the protruding second silencer contacts the retracted first silencer.
[0014] Furthermore, it also includes a heat dissipation module arranged between the back plate and the upper cover, and the heat dissipation module covers the top of the mainboard unit.
[0015] Furthermore, the spacing between the fins of the heat dissipation module is 2.2-2.5 mm.
[0016] The utility model proposes a graphics card with a passive noise reduction structure, and its beneficial effects are as follows: in the utility model, the back plate and the upper cover of the traditional graphics card are optimized. First, a sound-absorbing hole design with a honeycomb structure is opened on the inner walls of the two, and the porous sound-absorbing cotton is connected to achieve the passive noise reduction effect of the graphics card, thereby optimizing noise and improving user experience. In addition, in the utility model, at the connection between the upper cover and the back plate, two porous sound-absorbing cotton staggered structural designs are adopted, which can realize the shielding of the connection gap between the two, so as to further enhance the passive noise reduction effect. Through the combination of multiple structural designs, the noise is optimized and reduced synchronously, so as to achieve the purpose of improving user experience. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a three-dimensional diagram of the utility model;
[0018] Figure 2 This is a schematic diagram of the upper cover structure of the utility model;
[0019] Figure 3 This is a schematic diagram of the back plate structure of the utility model;
[0020] Figure 4 This is a schematic diagram of the heat dissipation module structure of the utility model;
[0021] Figure 5 It is a schematic diagram of the structure of the connection between the back plate and the upper cover of the utility model.
[0022] In the figure: 1. main board unit; 2. back plate; 21. first silencer structure; 22. first silencer component; 3. upper cover; 31. second silencer structure; 32. second silencer component; 33. fan hole; 4. heat dissipation module. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0024] Reference Figure 1-5 An embodiment of the utility model discloses a graphics card with a passive noise reduction structure. Specifically, the graphics card includes a back plate 2 fixed to the outer side of a motherboard unit 1 and an upper cover 3. At least one fan hole 33 is formed through the end surface of the upper cover 3.
[0025] Wherein, a first sound-absorbing structure 21 is provided on the inner wall of the back plate 2, and a first sound-absorbing member 22 is fixedly connected thereto;
[0026] A second sound-absorbing structure 31 is provided on the inner wall of the upper cover 3 , and a second sound-absorbing member 32 is fixedly connected thereto. The first sound-absorbing member 22 is in contact with at least a portion of the second sound-absorbing member 32 .
[0027] In some embodiments of the present invention, the first sound-absorbing structure 21 and the second sound-absorbing structure 31 have the same structure;
[0028] The first sound-absorbing structure 21 is sound-absorbing holes arranged in a honeycomb structure on the inner wall of the back panel 2. Specifically, the back panel 2 in this embodiment includes a first bottom surface and a first bent surface vertically connected to the first bottom surface, and the sound-absorbing holes are distributed on the first bottom surface. In addition, the upper cover 3 includes a second bottom surface and a second bent surface vertically connected to the second bottom surface, and the sound-absorbing holes are distributed on the second bottom surface and the second bent surface. Furthermore, the above-mentioned fan hole 33 is opened on the second bottom surface.
[0029] The upper cover 3 is configured as a plastic outer cover, and the honeycomb structure design on the inner side thereof can effectively absorb the noise from the front fan hitting the heat dissipation module. Similarly, when the back panel in this embodiment is made of metal aluminum plate or plastic plate, a honeycomb structure + porous sound-absorbing cotton can be designed simultaneously to effectively absorb the noise from the back panel direction.
[0030] Furthermore, in this embodiment, the first sound-absorbing member 22 and the second sound-absorbing member 32 have the same structure and are both configured as porous sound-absorbing cotton;
[0031] The porous sound-absorbing cotton is bonded and fixed to the inside of the back panel 2 and the upper cover 3 by an adhesive layer. Of course, those skilled in the art know that the structures of the two multiple sound-absorbing surfaces in this embodiment are respectively the same as those of the back panel 2 and the upper cover 3, that is, the porous sound-absorbing cotton also includes a bottom surface and a bending surface, and the porous sound-absorbing cotton can be bonded and fixed by 3M glue during assembly.
[0032] On the basis of the above embodiments, in the utility model, the end of the second silencer 32 extends to the outside of the shell edge of the upper cover 3, and the end of the first silencer 22 is retracted into the shell edge of the back plate 2. When the upper cover 3 is connected to the back plate 2, the protruding second silencer 32 contacts the retracted first silencer 22.
[0033] That is to say, in the present embodiment, a part of the porous sound-absorbing cotton on the upper cover 3 extends to the outside of its shell edge. Since the porous sound-absorbing cotton of the back plate 2 adopts a retracted design, when the entire graphics card is assembled, the upper cover 3 and the back plate 2 are connected to each other. The connection between the two is formed by the extended part of the porous sound-absorbing cotton of the upper cover 3 being connected to the retracted opening of the porous sound-absorbing cotton of the back plate 2. While completing the contact and soundproofing of the two, the connection gap between the upper cover 3 and the back plate 2 can be covered as much as possible to further enhance the soundproofing effect. It should be noted that the above structure is mainly for the connection between the upper cover 3 and the back plate 2.
[0034] In some embodiments, the present invention further includes a heat dissipation module 4 disposed between the back plate 2 and the upper cover 3 , and the heat dissipation module 4 covers the top of the mainboard unit 1 .
[0035] Specifically, the spacing between the fins of the heat dissipation module 4 described in this embodiment is 2.2-2.5mm, that is, the module fins in this embodiment adopt a 2.2-2.5mm large spacing design. By appropriately increasing the spacing of the heat dissipation fins, the system impedance of the entire air duct system is reduced, and the noise generation is effectively reduced, so as to further optimize the passive noise reduction effect.
[0036] In summary, the utility model optimizes the back plate 2 and the upper cover 3 of the traditional graphics card. First, a sound-absorbing hole design with a honeycomb structure is adopted on the inner walls of the two, and the porous sound-absorbing cotton is connected to achieve the passive noise reduction effect of the graphics card, thereby optimizing the noise and improving the user experience. In addition, in the utility model, at the connection between the upper cover 3 and the back plate 2, a staggered structure design of two porous sound-absorbing cottons is adopted, which can block the connection gap between the two to further enhance the passive noise reduction effect. Through the combination of various structural designs, the noise is optimized and reduced simultaneously, so as to achieve the purpose of improving the user experience.
[0037] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A graphics card with a passive noise reduction structure, comprising a back plate (2) and an upper cover (3) fixed to the outer side of a motherboard unit (1), characterized in that: At least one fan hole (33) is formed through the end surface of the upper cover (3); Wherein, a first sound-absorbing structure (21) is provided on the inner wall of the back plate (2), and a first sound-absorbing member (22) is fixedly connected thereto; A second sound-absorbing structure (31) is provided on the inner wall of the upper cover (3), and is fixedly connected to a second sound-absorbing member (32), and the first sound-absorbing member (22) is in at least partial contact with the second sound-absorbing member (32).
2. A graphics card with a passive noise reduction structure according to claim 1, characterized in that: The first sound-absorbing structure (21) and the second sound-absorbing structure (31) have the same structure; The first sound-absorbing structure (21) is sound-absorbing holes arranged in a honeycomb structure and opened on the inner wall of the back plate (2).
3. The graphics card with a passive noise reduction structure according to claim 1, characterized in that: The first sound-absorbing component (22) and the second sound-absorbing component (32) have the same structure and are both configured as porous sound-absorbing cotton; The porous sound-absorbing cotton is fixed to the inside of the back plate (2) and the upper cover (3) by means of an adhesive layer.
4. The graphics card with a passive noise reduction structure according to claim 1, characterized in that: The end of the second silencer (32) extends to the outside of the shell edge of the upper cover (3), and the end of the first silencer (22) is retracted into the shell edge of the back plate (2); when the upper cover (3) is connected to the back plate (2), the protruding second silencer (32) contacts the retracted first silencer (22).
5. The graphics card with a passive noise reduction structure according to claim 1, characterized in that: It also includes a heat dissipation module (4) arranged between the back plate (2) and the upper cover (3), and the heat dissipation module (4) covers the top of the mainboard unit (1).
6. The graphics card with a passive noise reduction structure according to claim 5, characterized in that: The spacing between the fins of the heat dissipation module (4) is 2.2-2.5 mm.