Heat pipe radiator

Abstract

The utility model discloses a heat pipe radiator which is provided with a base 1 used for transferring heat of an electronic component to a heat pipe set 2, the heat pipe set 2 used for transferring the heat to radiating fins 4, the radiating fins 4 used for radiating and a soaking piece 3 used for balancing heat loads borne by at least part of heat pipes in the heat pipe set 2. Wherein the heat pipes bearing different heat loads are connected through the soaking piece 3, so that the heat loads borne by at least part of the heat pipes in the heat pipe set 2 are balanced, the working efficiency of at least part of the heat pipes in the heat pipe set 2 is guaranteed, and then the heat dissipation efficiency of the radiator is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a heat pipe radiator. Background Art

[0002] At present, with the development of electronic information technology, the computing power of desktop personal computers has been gradually enhanced, and along with it, the heat generated by electronic components such as the central processing unit (CPU) and the graphics processing unit (GPU) has increased. Therefore, how to dissipate the heat of the above electronic components has become one of the problems that need to be solved.

[0003] A common heat sink in the prior art is a heat pipe heat sink, which generally includes a base, a heat pipe and heat sink fins. Figure 1 As shown, the base is used to contact the electronic components and transfer the heat generated by the electronic components to the heat pipe. The heat pipe is used to transfer the heat to the heat dissipation fins. There is a heat dissipation channel between the heat dissipation fins, and then the fan can be used to blow cold air into the heat dissipation channel to take away the heat to dissipate the heat.

[0004] However, when heat pipe radiators are used for heat dissipation, the working efficiency of the heat pipes is low. Based on this, the present specification provides a heat pipe radiator. Utility Model Content

[0005] This specification provides a heat pipe radiator to partially solve the above problems existing in the prior art.

[0006] This manual adopts the following technical solutions:

[0007] This specification provides a heat pipe radiator, which comprises: a base 1, a heat pipe group 2, a heat spreader 3 and a heat dissipation fin 4; wherein:

[0008] The heat pipe group 2 includes a plurality of heat pipes. For each heat pipe, the bottom of the heat pipe is arranged in the heat pipe groove 11 of the base 1, and the upper part of the heat pipe is connected to the heat dissipation fin 4.

[0009] The material of the heat equalizing member 3 is a high thermal conductivity material; the heat equalizing member 3 is connected to the first heat pipe and the second heat pipe in the heat pipe group 2; the first heat pipe and the second heat pipe carry different heat loads, and the heat equalizing member 3 is connected to the first heat pipe and the second heat pipe by surface connection.

[0010] Optionally, for each heat pipe in the heat pipe group 2, if the heat pipe is a first heat pipe or a second heat pipe, the outer surface of the heat pipe at least includes a first butt joint surface 21;

[0011] The outer surface of the heat equalizing member 3 at least includes a second butt joint surface 31 , and the second butt joint surface 31 is attached to and connected to the first butt joint surface 21 .

[0012] Optionally, the heat spreader 3 is connected to the heat pipe via the first docking surface 21 , and the distance between the first docking surface 21 and the base 1 is less than a preset specified distance.

[0013] Optionally, the heat equalizing member 3 is connected and fixed to the first heat pipe and the second heat pipe via a welding layer 22 .

[0014] Optionally, the heat equalizing member 3 is connected to each heat pipe in the heat pipe group 2 .

[0015] Optionally, the heat pipes in the heat pipe group 2 are U-shaped heat pipes, and for each heat pipe in the heat pipe group 2, the outer surface of the heat pipe comprises at least two first docking surfaces 21, and the two first docking surfaces 21 are located on different sides of the base 1; the first docking surfaces 21 of the heat pipes in the heat pipe group 2 located on the same side of the base 1 are coplanar;

[0016] The outer surface of the heat equalizer 3 at least includes a second docking surface 31. The heat equalizer 3 is connected to each heat pipe in the heat pipe group 2 by connecting the second docking surface 31 to each coplanar first docking surface 21. The first docking surface 21 and the second docking surface 31 are planes.

[0017] Optionally, the heat equalizer 3 is U-shaped, and the outer surface of the heat equalizer 3 includes at least two second docking surfaces 31 , and the connection positions of the two second docking surfaces 31 and each heat pipe in the heat pipe group 2 are located on different sides of the base 11 .

[0018] Optionally, for each heat pipe in the heat pipe group 2, the outer surface of the heat pipe includes at least two first docking surfaces 21, and the two first docking surfaces 21 are located on the same side of the base 1; for each first docking surface 21, other heat pipes in the heat pipe group 2 except the heat pipe have a first docking surface 21 coplanar with the first docking surface 21;

[0019] The outer surface of the heat equalizer 3 at least includes a second docking surface 31. The heat equalizer 3 is connected to each heat pipe in the heat pipe group 2 by connecting the second docking surface 31 to each coplanar first docking surface 21 at the same time. The first docking surface 21 and the second docking surface 31 are planes.

[0020] Optionally, the shape of the heat equalizing member 3 is U-shaped, and the outer surface of the heat equalizing member 3 includes at least two second docking surfaces 31. For each second docking surface 31, the second docking surface 31 is connected to the coplanar first docking surfaces 21, and the connection positions of the two second docking surfaces 31 and each heat pipe in the heat pipe group 2 are located on the same side of the base 1.

[0021] Optionally, the base 1 comprises an upper base 12 and a lower base 13, the upper base 12 and the lower base 13 are buckled together to form a heat pipe groove 11, and a groove 14 is provided in the lower base 13;

[0022] The heat equalizing member 3 is fixed in the groove 14 of the lower base 13 , connected to the lower base 13 , and connected to each heat pipe in the heat pipe group 2 when the lower base 13 and the upper base 12 are buckled.

[0023] At least one of the above technical solutions adopted in this specification can achieve the following beneficial effects:

[0024] The heat pipe radiator provided in the present specification includes a base 1 for transferring heat from electronic components to a heat pipe group 2, a heat pipe group 2 for transferring heat to a heat dissipation fin 4, a heat dissipation fin 4 for dissipating heat, and a heat equalizer 3 for balancing the heat load borne by at least part of the heat pipes in the heat pipe group 2. The heat equalizer 3 connects heat pipes with different heat loads to balance the heat load borne by at least part of the heat pipes in the heat pipe group 2, thereby ensuring the working efficiency of at least part of the heat pipes in the heat pipe group 2, and further ensuring the heat dissipation efficiency of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide a further understanding of this specification and constitute a part of this specification. The illustrative embodiments and descriptions of this specification are used to explain this specification and do not constitute an improper limitation on this specification. In the drawings:

[0026] Figure 1 It is a structural schematic diagram of a heat pipe radiator;

[0027] Figure 2A A schematic diagram of a heat pipe radiator provided for this specification;

[0028] Figure 2B A schematic diagram of a heat pipe radiator provided for this specification;

[0029] Figure 3A A schematic diagram of the structure of the heat pipe radiator provided in this manual;

[0030] Figure 3B A schematic diagram of the structure of the heat pipe radiator provided in this manual;

[0031] Figure 4AA schematic cross-sectional view of the heat pipe and the heat spreader at the connection position provided in this specification;

[0032] Figure 4B A schematic cross-sectional view of the heat pipe and the heat spreader at the connection position provided in this specification;

[0033] Figure 5 A schematic diagram of the structure of the heat pipe radiator provided in this manual;

[0034] Figure 6 A schematic cross-sectional view of the heat spreader and the heat pipe at the connection position provided in this specification;

[0035] Figure 7 A schematic diagram of the structure of the heat pipe radiator provided in this manual;

[0036] Figure 8 A schematic diagram of the structure of the heat pipe radiator provided in this manual;

[0037] Fig. 9 A schematic diagram of the structure of the heat pipe radiator provided in this manual;

[0038] Fig.10 A schematic diagram of the structure of the heat pipe radiator provided in this manual;

[0039] Fig.11 A schematic diagram of the structure of the heat pipe radiator provided in this manual;

[0040] Fig. 12A A schematic diagram of the structure of the radiator base provided for this manual;

[0041] Fig. 12B A schematic diagram of the structure of the heat pipe radiator provided in this manual;

[0042] Fig. 12C This is a schematic diagram of the structure of the heat pipe radiator provided in this manual.

[0043] Description of main reference numerals:

[0044] 1-base, 2-heat pipe group, 3-heat equalizing member, 4-heat sink fin, 11-heat pipe slot, 12-upper base, 13-lower base, 14-groove, 21-first docking surface, 22-welding layer, 31-second docking surface, 32-arc-shaped groove. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of this specification more clear, the technical solutions of this specification will be clearly and completely described below in combination with the specific embodiments of this specification and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of this specification, not all of them. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0046] At present, since different parts of electronic components such as CPU and GPU generate different amounts of heat during operation, when the heat is transferred to the upper surface of the electronic component, the temperature of each area on the upper surface of the electronic component is also different. When the heat is transferred to the base using a radiator for heat dissipation, the heat of each area in the base is not exactly the same, which results in different heat loads required to be borne by each heat pipe in the heat pipe groove of the base.

[0047] As a result, some heat pipes in the heat pipe group have higher working efficiency but other heat pipes have lower working efficiency, resulting in lower overall heat dissipation efficiency of the radiator. Among them, the heat load that the heat pipe needs to bear is the heat that the heat pipe needs to transfer from the base per unit time. One of the manifestations of the different heat loads carried by each heat pipe is the different temperatures on the outer surfaces of each heat pipe, especially the different temperatures on the outer surfaces of the heat pipes at the same distance from the base.

[0048] Based on this, the present specification provides a heat pipe radiator, in which a heat equalizing element is deployed for balancing the heat load borne by each heat pipe in the heat pipe group, so that before each heat pipe in the heat pipe group transfers heat to the cooling fins, the heat load of at least part of the heat pipes in the heat pipe group is balanced, thereby ensuring the working efficiency of at least part of the heat pipes in the heat pipe group, and further ensuring the heat dissipation efficiency of the radiator.

[0049] The technical solutions provided by the embodiments of this specification are described in detail below in conjunction with the accompanying drawings.

[0050] This specification provides a heat pipe radiator, which can be used to dissipate heat for electronic components, such as CPU, GPU, memory bar, motherboard chipset, power supply unit, etc. The radiator can also be used to dissipate heat for any one or more electronic devices such as servers, medical imaging equipment, broadcasting and communication equipment. In the embodiments of this specification, for ease of understanding, only the heat pipe radiator is used to dissipate heat for the CPU as an example to illustrate the specific technical solution. Figure 2A and Figure 2B shown.

[0051] Figure 2AA schematic diagram of a heat pipe radiator provided in this specification. In the figure, the heat pipe radiator includes a base 1, a heat pipe group 2, a heat equalizer 3 and heat dissipation fins 4. Among them, the base 1 is provided with a heat pipe groove 11 (not shown in the figure). The base 1 is used to be fixed on the CPU to transfer the heat of the CPU to the heat pipe fixed in the base 1 through the heat pipe groove 11. The heat pipe radiator includes a plurality of heat pipes, and for each heat pipe, the bottom of the heat pipe is arranged in the heat pipe groove 11 of the base 1, and the upper part of the heat pipe is connected to the heat dissipation fins 4. In other words, for each heat pipe, the heat pipe is used to transfer the heat carried to the heat dissipation fins 4. The multiple heat pipes in the heat pipe radiator constitute a heat pipe group 2.

[0052] The biggest difference between this solution and the prior art is that the heat pipe radiator in this specification includes a heat equalizer 3 for equalizing the heat load borne by at least part of the heat pipes in the heat pipe group 2. In order to achieve the above purpose, the heat equalizer 3 needs to have two major elements:

[0053] 1. The heat spreader 3 can conduct heat.

[0054] 2. The heat loads borne by the heat pipes connected to the heat equalizing element 3 are different.

[0055] Therefore, in order to meet the above two elements, the heat spreader 3 in this specification is made of a high thermal conductivity material, and the heat spreader 3 is connected to the first heat pipe and the second heat pipe in the heat pipe group 2. The first heat pipe and the second heat pipe carry different heat loads.

[0056] Therefore, due to the temperature-averaging characteristic of the heat pipe, the first heat pipe and the second heat pipe carry different heat loads, resulting in different temperatures of the outer surfaces of the first heat pipe and the second heat pipe. The heat-averaging component 3 can transfer heat from the heat pipe with a higher temperature to the heat pipe with a lower temperature, thereby balancing the heat loads carried by different heat pipes in the heat pipe group 2, improving the working efficiency of at least some of the heat pipes, and thereby improving the overall heat dissipation efficiency of the heat pipe group 2.

[0057] In order to ensure the heat conduction efficiency of the heat spreader 3, the heat spreader 3 is connected to the first heat pipe and the second heat pipe in the heat pipe group 2 by means of surface connection. Surface connection generally refers to a connection method formed by the interaction of the surfaces of two or more components through various mechanical, chemical or physical means. The surface connection methods generally include welding, gluing, interference fit, concave-convex surface fit, etc.

[0058] For each of the first heat pipe and the second heat pipe, the connection position of the heat equalizer 3 and the heat pipe can be any position on the outer surface of the heat pipe between the bottom end of the heat pipe and the upper part of the heat pipe. The bottom end of the heat pipe is the part disposed in the heat pipe groove 11, and the upper part of the heat pipe is the part starting from the connection position of the heat pipe and the heat dissipation fin 4 and extending in the direction away from the base 1.

[0059] Based on this, in the heat pipe radiator provided in the present specification, a base 1 for transferring heat from electronic components to the heat pipe group 2, a heat pipe group 2 for transferring heat to the heat dissipation fins 4, heat dissipation fins 4 for heat dissipation, and a heat equalizer 3 for balancing the heat loads borne by multiple heat pipes in the heat pipe group 2 are deployed. The heat equalizer 3 transfers heat between heat pipes with different heat loads in the heat pipe group 2, balances the heat loads borne by different heat pipes in the heat pipe group 2, improves the working efficiency of at least some heat pipes, and thus improves the overall heat dissipation efficiency of the heat pipe group 2.

[0060] The heat sink fins may be a plurality of evenly arranged metal sheets provided with heat pipe jacks. Since the specific structure of the heat sink fins 4 and how to connect the heat sink fins 4 to the heat pipes for heat dissipation are relatively mature technologies in the field of air-cooled heat sinks and heat pipe heat sinks, the specific structure of the heat sink fins 4 and how to connect the heat sink fins 4 to the heat pipes are not described in detail in this specification.

[0061] In addition, in order to more intuitively demonstrate the structure of the heat pipe radiator, this manual also provides Figure 2B View shown.

[0062] Figure 2B A schematic diagram of the structure of a heat pipe radiator provided for this specification. It can be seen that the heat pipe radiator comprises a base 1, a heat pipe group 2, a heat equalizer 3 and a heat dissipation fin 4. A heat pipe groove 11 (not shown in the figure) is provided in the base 1. The heat pipe group 2 comprises a plurality of heat pipes, and for each heat pipe, the bottom of the heat pipe is provided in the heat pipe groove 11, and the upper part of the heat pipe is connected to the heat dissipation fin 4. The heat equalizer 3 is connected to the first heat pipe and the second heat pipe, and the heat loads carried by the first heat pipe and the second heat pipe are different.

[0063] Furthermore, if the number of the first heat pipe and the second heat pipe is one, when the heat pipe group 2 includes multiple heat pipes, the overall working efficiency of the heat pipe radiator may be low due to the uneven working efficiency of the other heat pipes except the first heat pipe and the second heat pipe. Therefore, the number of the first heat pipe and / or the second heat pipe in this specification may not be one. Figure 3A and Figure 3B shown.

[0064] Figure 3AThe schematic diagram of the structure of the heat pipe radiator provided in this specification. The heat pipe radiator includes a base 1, a heat pipe group 2, a heat equalizer 3 and a heat sink fin 4. It can be seen that the heat pipe group 2 includes 6 heat pipes. The first heat pipe is the heat pipe shown as the left 2 in the heat pipe group 2, and the second heat pipe is the heat pipe shown as the left 3 and the right 3 in the heat pipe group 2. The left 2 refers to the second heat pipe from the left to the right, and the left 3 and the right 3 are analogous.

[0065] The heat equalizing member 3 connects the three heat pipes in the heat pipe group 2, so that the heat equalizing member 3 can transfer the heat of the three heat pipes, so that the heat flows from the heat pipe with a larger heat load to the heat pipe with a smaller heat load, thereby balancing the temperature of each heat pipe, and then adjusting the heat load carried by each heat pipe, thereby ensuring the working efficiency of the three heat pipes. Among them, ensuring the working efficiency of the three heat pipes can be to avoid overheating of the heat pipe with a larger heat load, or to improve the working efficiency of the heat pipe with a smaller heat load.

[0066] However, Figure 3A For the heat pipe radiator shown in the example, the working efficiency of the heat pipe shown in the left 1 is still low. Based on this, this specification also provides a heat pipe radiator, such as Figure 3B shown.

[0067] Figure 3B The heat pipe radiator provided in this specification is a schematic diagram of the structure. The heat pipe radiator includes a base 1, a heat pipe group 2, a heat spreader 3 and a heat dissipation fin 4. Figure 2A Similarly, the heat pipe group 2 includes 6 heat pipes. The difference is that the heat equalizer 3 is simultaneously connected to all the heat pipes in the heat pipe group 2. Therefore, heat can flow from the heat pipe carrying more heat load to the heat pipe carrying less heat load through the heat equalizer 3, so that the temperature of each heat pipe is balanced, and then the heat load carried by each heat pipe is adjusted.

[0068] It should be noted that the above Figure 3A and Figure 3B In the description, only the example of the heat pipe group 2 including 6 heat pipes is used for explanation, but the number of heat pipes actually included in the heat pipe group 2 can be set as needed, and this specification does not limit this.

[0069] In addition, when the number of heat pipes included in the first heat pipe and the second heat pipe is one, the temperature on the outer surface of the first heat pipe and the second heat pipe can be directly used to measure whether the heat loads they carry are the same. When the first heat pipe and the second heat pipe both contain multiple heat pipes, the average value of the temperature of the outer surface of each heat pipe included in the first heat pipe can be used as a representation of the heat load carried by the first heat pipe. The same is true for the second heat pipe.

[0070] In addition, taking the CPU as an example, usually, since the core area of ​​the CPU is a unit for data processing and logical operations, the middle area often generates the most heat during the operation of the CPU. Therefore, in the scenario of using a heat pipe radiator to dissipate heat for the CPU, it is often the case that the central heat pipe located in the middle of the heat pipe group 2 carries too much heat, while the edge heat pipe located at the edge of the heat pipe group 2 carries too little heat.

[0071] When the central heat pipe carries too much heat, in order to avoid local overheating that affects the service life of electronic components, the radiator usually dispatches the fan to work at a higher power to remove the heat carried by the central heat pipe in time. However, when the fan works at a higher power, it will produce higher decibel noise and require more energy supply, which will not only reduce the user experience, but also cause energy waste.

[0072] The radiator in the utility model can balance the heat load borne by each heat pipe in the heat pipe group 2. While ensuring the overall working efficiency of the radiator, it can also avoid the situation where the central heat pipe overheats and causes the fan to work at a higher power. While reducing energy consumption, it also avoids the generation of noise and improves user experience.

[0073] Furthermore, as mentioned above, the heat spreader 3 and each heat pipe in the heat pipe group 2 are connected by surface connection. Among them, a common surface connection method is welding, such as Figure 4A shown.

[0074] Figure 4A A schematic cross-sectional view of the heat pipe and the heat spreader at the connection position provided for this specification. Among them, the circle is the cross section of the first heat pipe and / or the second heat pipe in the heat pipe group 2, the rectangle is the cross section of the heat spreader 3, and the shaded area is the cross section of the welding layer 22. It can be seen that the welding layer 22 fixes the heat pipe and the heat spreader 3 while also being used for auxiliary heat transfer. In other words, there is a welding layer 22 between the heat spreader 3 and the first heat pipe and the second heat pipe, through which the heat spreader 3 can be connected and fixed to the first heat pipe and the second heat pipe.

[0075] Heat can flow from the heat pipe to the welding layer 22, and then flow from the welding layer 22 to the heat spreader 3, or heat can flow from the heat spreader 3 to the welding layer 22, and then flow from the welding layer 22 to the heat pipe, thereby ensuring the thermal conductivity of the heat spreader 3, and thus ensuring the working efficiency of the radiator. The welding layer can be formed by welding the heat spreader and the heat pipe in the heat pipe group using a variety of solders such as tin solder, silver solder, copper solder, and lead solder.

[0076] It should be noted that the above description is only based on the example of the heat equalizer 3 being connected to the first heat pipe and the second heat pipe, but in actual operation, the heat equalizer 3 can be connected to each heat pipe in the heat pipe group 2 at the same time. In other words, the shape of each heat pipe in the heat pipe group 2 and the connection relationship between the heat equalizer 3 and the heat equalizer 3 can refer to the above description of the first heat pipe and the second heat pipe. Of course, the heat equalizer 3 can be connected and fixed to each heat pipe in the heat pipe group 2 through a welding layer.

[0077] However, heat will encounter various forms of thermal resistance during the transfer process, including the thermal resistance of the material itself, the thermal resistance of the interface, etc. As a high thermal conductivity material, the thermal resistance of the heat spreader 3 is obviously smaller than the various solders that make up the solder layer. Compared with connecting the heat spreader 3 with the first heat pipe and the second heat pipe through the solder layer 22, the first docking surface 21 is set on the heat pipe, and the second docking surface 31 is set on the heat spreader 3. The thermal resistance is obviously smaller by attaching and connecting the first docking surface 21 and the second docking surface 31. Figure 4B shown.

[0078] Figure 4B A schematic cross-sectional view of the heat pipe and the heat spreader 3 at the connection position provided in this specification. The multiple circles located above the image are cross-sections of the first heat pipe and / or the second heat pipe, and the rectangle located below the image is the cross-section of the heat spreader 3. It can be seen that for each of the first heat pipe and the second heat pipe, the outer surface of the heat pipe includes at least a first docking surface 21. Specifically, the figure may be a straight line portion at the bottom surface of the circle.

[0079] As for the heat equalizing member 3, the outer surface of the heat equalizing member 3 includes at least a second docking surface 31. The figure shows the second docking surface 31 as an example of a rectangular upper surface. The second docking surface 31 can be simultaneously connected to the first docking surfaces 21 corresponding to the first heat pipe and the second heat pipe respectively. It can be seen that the connection method between the heat equalizing member 3 and the first heat pipe and the second heat pipe is a surface connection, and its connection area is a docking surface and does not require a welding layer 22 as a medium to transfer heat. The thermal resistance in the heat transfer process will be greatly reduced, which ensures the thermal conductivity of the heat equalizing member 3 and improves the efficiency of heat transfer between the heat pipes in the heat pipe group 2.

[0080] Among them, the docking surface usually refers to a plane or surface designed to fit tightly, connect or join between two independent components or structures. Similarly, the first docking surface in this specification refers to a plane or surface on the heat pipe designed to be tightly connected to the heat spreader, and the second docking surface refers to a plane or surface on the heat spreader designed to be tightly connected to the heat pipe. The above-mentioned method of fitting and connecting the first docking surface and the second docking surface can be a method of connecting the heat spreader by any surface such as snap-fit, welding, gluing, interference fit, concave-convex fit, etc. Since the first docking surface and the second docking surface can fit together, even if the first docking surface and the second docking surface are connected by welding, there will be less solder between the first docking surface and the second docking surface, and the corresponding thermal resistance will be much smaller than the above-mentioned Figure 4A Thermal resistance in.

[0081] It should be noted that the above description is only based on the example that the heat equalizer 3 is connected to the first heat pipe and the second heat pipe, but in actual operation, the heat equalizer 3 can be simultaneously connected to each heat pipe in the heat pipe group 2. In other words, the shape of each heat pipe in the heat pipe group 2 and the connection relationship between the heat equalizer 3 can refer to the above description of the first heat pipe and the second heat pipe.

[0082] In addition, in one or more embodiments provided in this specification, even if the material itself is a high thermal conductivity material, as the transfer distance increases, the thermal resistance will also increase. In the case of a large thermal resistance, the heat spreader 3 obviously cannot effectively transfer heat, and thus cannot effectively improve the problem of uneven working efficiency of each heat pipe in the heat pipe group 2. Based on this, in order to improve the above problems, this specification also provides a heat pipe radiator, such as Figure 5 shown.

[0083] Figure 5 A schematic diagram of the structure of a heat pipe radiator provided in this specification. The radiator includes a base 1, a heat pipe group 2, a heat spreader 3 and heat dissipation fins 4. The outer surfaces of the first heat pipe and the second heat pipe in the heat pipe group 2 include a first docking surface 21, and the position of the first docking surface 21 is the connection position between the heat spreader 3 and the first heat pipe and the second heat pipe. The connection position is located near the bottom of the heat pipe. In other words, the distance between the connection position and the base 1 is less than a preset specified distance. The specified distance can be 1mm, 2mm, 5mm, etc. The specific value of the specified distance can be set as needed, and this specification does not limit this.

[0084] Therefore, when the connection position is located at the bottom of the heat pipe, the length of the heat spreader 3 will be much smaller than the length of the heat spreader 3 when the connection position is located at the upper part of the heat pipe, and accordingly, its thermal resistance will also be smaller. Therefore, the heat spreader 3 can effectively transfer heat between the first heat pipe and the second heat pipe, ensuring the thermal conductivity of the heat spreader 3, and further ensuring the heat dissipation efficiency of the radiator.

[0085] At the same time, for the heat pipe, its corresponding first docking surface 21 can be obtained when manufacturing the heat pipe, or after the heat pipe body is manufactured, a certain area on the outer surface of the heat pipe is flattened by a flattening machine or other equipment to obtain a heat pipe with a first docking surface 21 on the outer surface. Compared with flattening the heat pipe at the top, using a flattening machine at the bottom of the heat pipe to flatten each heat pipe at the same time to form the first docking surface 21 corresponding to each heat pipe has lower requirements on the manufacturing process. Therefore, Figure 5 The heat pipe radiator shown is easier to manufacture, further ensuring production efficiency.

[0086] Furthermore, the above description is based on the example that the first butt joint surface 21 and the second butt joint surface 31 are planes, but in fact, the first butt joint surface 21 and the second butt joint surface 31 can also be curved surfaces. Figure 6 shown.

[0087] Figure 6 The cross-sectional schematic diagram of the heat spreader 3 and the heat pipe at the connection position provided in this specification. The circle shown in the figure is the cross section of the first heat pipe or the second heat pipe, the thick solid line on the surface of the heat pipe is the first docking surface 21, and the rectangle with an arc-shaped groove on the lower surface is the cross section of the heat spreader 3. The lower surface of the heat spreader is the second docking surface 31. For each first docking surface 21, the second docking surface 31 has an arc-shaped groove 32 that can fit with the first docking surface 21.

[0088] Therefore, by fitting the arc groove 32 and the first butt surface 21, the heat pipes in the heat pipe group 2 can be embedded in the heat equalizer 3. The heat equalizer 3 can fit and connect the first heat pipe and the second heat pipe in the heat pipe group 2.

[0089] Figure 6 In the example, the cross section of the first docking surface 21 at the connection position is arc-shaped. In actual use, the shape of the heat spreader can be a cylinder, so the second docking surface 31 can also be set as an arc surface. Then, the first heat pipe and the second heat pipe in the heat pipe group 2 can be flattened according to the shape of the second docking surface 31 to obtain each first docking surface 21 that matches the second docking surface 31. Then, the heat spreader 3 and the heat pipes in the heat pipe group 2 can be fixed by attaching and connecting the second docking surface 31 to each first docking surface 21.

[0090] It should be noted that the shapes of the first docking surfaces of different heat pipes may not be exactly the same. For example, the first docking surfaces of some heat pipes in the heat pipe group are flat, while the first docking surfaces of other heat pipes are curved. The shapes of the specific first docking surfaces and the second docking surfaces can be set as needed, and this specification does not impose any restrictions on this.

[0091] Furthermore, the specific material of the heat spreader 3 can be a high thermal conductivity material such as metal material, carbon fiber material, graphite material, silicon nitride material and high thermal conductivity plastic. Compared with a single material, the heat pipe is currently a more commonly used heat spreader 3. Its ultra-high thermal conductivity, isothermal property, and easy material acquisition characteristics make the heat pipe used as the heat spreader 3 in the heat pipe radiator described in this specification easy to manufacture and have good overall heat dissipation effect. Therefore, the heat spreader 3 in the heat pipe radiator can be made in advance by flattening the heat pipe.

[0092] Of course, the specific width and thickness of the heat-spreading member 3 formed by the heat pipe can be set as required, and this specification does not limit this.

[0093] Furthermore, the shape of each heat pipe in the heat pipe group 2 can be L-shaped, such as Figure 7 shown.

[0094] Figure 7 The heat pipe radiator provided in this specification is a schematic diagram of the structure. The heat pipes in the heat pipe group 2 are L-shaped, and the bottom of each heat pipe is arranged in the heat pipe groove 11 in the base 1, and the upper part is connected to the heat dissipation fins 4.

[0095] In addition, in order to ensure the heat dissipation efficiency, each heat pipe in the radiator can also be a U-shaped heat pipe. For each U-shaped heat pipe, the bottom of the U-shaped heat pipe passes through and is arranged in the heat pipe groove 11 of the base 1, that is, the U-shaped heat pipe is penetrated in the heat pipe groove 11. The heat pipe groove 11 is used to allow the heat pipe to pass through and fix the heat pipe and the base 1. At the same time, the upper part of the U-shaped heat pipe passes through and is arranged in the heat pipe perforation in the heat dissipation fin 4, that is, it is penetrated in the heat pipe perforation in the heat dissipation fin 4. Among them, the heat pipe perforation is used to allow the heat pipe to pass through and fix the heat pipe and the heat dissipation fin 4.

[0096] Furthermore, in the case where the heat pipe is a U-shaped pipe, the heat pipes in the heat pipe group 2 are evenly distributed on both sides of the base 1. Based on the aforementioned influence of the distance on the thermal resistance, it is obvious that the thermal resistance of the heat spreader 3 will be smaller when connecting the heat pipes on the same side than when connecting the heat pipes on the opposite sides. Therefore, the heat pipe radiator in this specification can connect the heat pipes on the same side of the base 1.

[0097] Specifically, for each heat pipe in the heat pipe group 2, the outer surface of the heat pipe includes at least two first butt joint surfaces 21, and the two first butt joint surfaces 21 are respectively located on both sides of the base 1. At the same time, for the same side of the base 1, the first butt joint surfaces 21 of each heat pipe in the heat pipe group 2 on this side are coplanar.

[0098] The outer surface of the heat-scaling member 3 includes at least a second butt joint surface 31. Thus, by simultaneously attaching and connecting the second butt joint surface 31 to the coplanar first butt joint surfaces 21, the purpose of surface-connecting the heat-scaling member 3 and the heat pipes of the heat pipe group 2 can be achieved. Figure 8 shown.

[0099] Figure 8 A schematic diagram of the structure of the heat pipe radiator provided in this specification. In the figure, the number of the heat equalizers 3 is 2. It can be seen that the figure takes the case where each heat pipe in the heat pipe group is flattened in advance to obtain the first docking surface 21 corresponding to each heat pipe, and the first docking surface 21 and the second docking surface 31 are both planes as an example for explanation. The upper part of the figure is the structure in which the heat equalizer 3 and the heat pipe group 2 are connected to each other, and the lower part of the figure is the structure corresponding to each heat pipe at the connection position of the heat equalizer 3 and the heat pipe in the heat pipe group 2. Only the first docking surface 21 corresponding to the right 1 heat pipe in the heat pipe group 2 is marked in the figure. The first docking surfaces 21 corresponding to the heat pipes located on the same side of the base 1 are coplanar, and the plane in which they are located is 23.

[0100] The right side of the figure is the heat spreader 3. It can be seen that the outer surface of the heat spreader 3 includes at least a second docking surface 31. Therefore, the heat spreader 3 and each heat pipe in the heat pipe group 2 can be connected together by connecting the second docking surface 31 with each coplanar first docking surface 21. The first docking surface 21 and the second docking surface 31 are both planes.

[0101] In addition, each heat pipe in the heat pipe group 2 can be flattened in advance before assembling the radiator, and then when assembling the radiator, each heat pipe is fixed to the base 1 to obtain a plurality of coplanar first butt joint surfaces 21. Alternatively, after each heat pipe in the heat pipe group 2 is fixed to the base 1 in advance, the heat pipes on the same side of the base 1 are flattened by a flattening machine to obtain the coplanar first butt joint surfaces 21 corresponding to each heat pipe. When the heat pipe is flattened and the manufacturing process of the radiator can be set as needed, and this specification does not limit this.

[0102] It should be noted that Figure 8 In the description, only the area formed by pre-flattening the heat pipe at the connection position is directly used as the first docking surface 21 as an example, but in fact, the first docking surface 21 can also be a part of the area formed by pre-flattening the heat pipe, and its corresponding shape can also be a variety of shapes such as rectangle and circle. Correspondingly, the corresponding shape and area size of the second docking surface 31 and the docking surfaces where the coplanar first docking surfaces 21 are located can also be set as needed, and this specification does not limit this.

[0103] Although the heat pipe is isothermal, there is still a temperature difference between different positions of the heat pipe. Therefore, when the heat equalizer 3 is connected to each heat pipe in the heat pipe group 2, the heat equalizer 3 can be connected to each heat pipe in the heat pipe group 2 on both sides of the base 1 at the same time.

[0104] Specifically, the heat spreader 3 may be in a U-shape, and the outer surface of the heat spreader 3 includes at least two second docking surfaces 31. For each second docking surface 31, the second docking surface 31 is connected to each coplanar first docking surface 21, and the first docking surfaces 21 connected to the two second docking surfaces 31 on the heat spreader 3 are located on both sides of the base 1. Fig. 9 shown.

[0105] Fig. 9 The structural schematic diagram of the heat pipe radiator provided in this specification shows that the heat pipe radiator includes a base 1, a heat pipe group 2, a heat equalizer 3 and heat dissipation fins 4. The heat equalizer 3 is U-shaped, and the heat equalizer 3 is simultaneously connected to the parts of each heat pipe in the heat pipe group 2 located on both sides of the base 1. That is, for each side of the base 1, the first docking surfaces 21 of each heat pipe in the heat pipe group 2 on that side are coplanar in the same plane. The heat equalizer 3 can be connected to each of the first docking surfaces 21 coplanar in the same plane. The heat equalizer 3 has two second docking surfaces 31, and the connection positions of the two second docking surfaces 31 and each heat pipe in the heat pipe group 2 are respectively located on both sides of the base 1.

[0106] The heat spreader 3 can be made by flattening a U-shaped heat pipe in advance, or by making other high thermal conductivity materials into a U shape.

[0107] Of course, the heat spreader 3 may also be annular, and the specific shape of the heat spreader 3 may be set as required, and this specification does not limit this.

[0108] It should be noted that for each heat pipe, the number of the first docking surfaces 21 on the surface of the heat pipe can be one or more. Similarly, when the number of the first docking surfaces 21 is more than one, the first docking surfaces 21 can be distributed in the part of the heat pipe on the same side as the base 1, or in the part of the heat pipe on the opposite side of the base 1. The specific number of the first docking surfaces 21 and the position of the first docking surfaces 21 on the radiator can be set as needed, and this specification does not limit this.

[0109] In addition, for each heat pipe in the heat pipe group 2, in the process of pre-flattening the heat pipe to obtain its corresponding first docking surface 21, due to the process problems of the flattening machine, the outer surface of the flattened heat pipe usually has two first docking surfaces 21, and the two first docking surfaces 21 are usually located on the same side of the base 1.

[0110] Specifically, for each heat pipe in the heat pipe group 2, the outer surface of the heat pipe includes at least a first docking surface 21, and the two first docking surfaces 21 are located on the same side of the bottom surface. At the same time, for each first docking surface 21 of the heat pipe, the outer surfaces of other heat pipes in the heat pipe group 2 include a first docking surface 21 that is coplanar with the first docking surface 21. In other words, the heat pipes in the heat pipe group 2 are located on the same side of the base 1, and there are at least two places where the first docking surfaces of the outer surfaces of the heat pipes are coplanar.

[0111] Therefore, the number of heat spreaders 3 in the heat pipe radiator can be multiple, and for each first docking surface 21 coplanar with the same plane, there is a corresponding second docking surface 31 connected thereto. Fig.10 shown.

[0112] Fig.10 This is a schematic diagram of the structure of the heat pipe radiator provided in this specification. It can be seen that each heat pipe in the heat pipe group 2 of the heat pipe radiator has two first docking surfaces 21 on its outer surface on each side of the base 1, and the two first docking surfaces 21 of each heat pipe in the heat pipe radiator are coplanar with two different planes. The number of heat spreaders 3 in the heat pipe radiator is 4, and for each heat spreader 3, the heat spreader 3 is connected to each first docking surface 21 coplanar with the same plane.

[0113] For each heat spreader 3, the connection position between the heat spreader 3 and each heat pipe in the heat pipe group 2 is not the same as the connection position between other heat spreaders 3 and each heat pipe in the heat pipe group 2. The first butt joint surface 21 and the second butt joint surface 31 are both planes.

[0114] Therefore, the heat equalizing member 3 can effectively balance the heat load carried by each heat pipe in the heat pipe group 2, thereby ensuring the heat conduction efficiency and further ensuring the overall working efficiency of the heat pipe radiator based on this structure.

[0115] Furthermore, the heat spreader 3 may be a U-shaped heat pipe, and the heat spreader 3 may also simultaneously connect different first docking surfaces 21 of each heat pipe in the heat pipe group 2 located on the same side of the base 1 to achieve a better heat conduction effect.

[0116] Specifically, the heat spreader 3 may be in a U-shape, and at least two second docking surfaces 31 are provided on the outer surface of the heat spreader 3. For each second docking surface 31, the second docking surface 31 may be connected to one of the different planes coplanar with the first docking surfaces 21 of each heat pipe in the heat pipe group 2, so as to be connected to each coplanar first docking surface 21, thereby connecting the heat spreader 3 and each heat pipe in the heat pipe group 2.

[0117] Therefore, for the heat pipes located on the same side of the base 1, the same heat spreader 3 can also be connected to different surfaces of the heat pipes on this side at the same time, such as Fig.11 shown.

[0118] Fig.11 This is a schematic diagram of the structure of the heat pipe radiator provided in this specification. It can be seen that the heat pipe radiator includes two heat spreaders 3. For each heat spreader 3, the shape of the heat spreader 3 is U-shaped, and the heat spreader 3 includes at least two second docking surfaces 31. Therefore, by connecting each second docking surface 31 of the heat spreader 3 to different first docking surfaces 21 of the heat pipe located on the same side of the base 1, the heat spreader 3 can be further guaranteed. Among them, Fig.11 In the embodiment, the different surfaces of the side heat pipe simultaneously connected to the same heat equalizing member 3 may be the upper surface and the lower surface of the side heat pipe at the same distance from the heat source.

[0119] In addition, due to the process problems of the flattening machine, the first butt joint surfaces 21 on the outer surface of the flattened heat pipe located on the same side of the base 1 are often parallel to each other.

[0120] Furthermore, in order to further improve the thermal conductivity of the heat equalizing component 3, the heat equalizing component 3 can also be embedded in the base 1, and connected to each heat pipe in the heat pipe group 2 by the snap fit of the base 1. The heat load borne by each heat pipe is balanced at the first time when the base 1 transfers heat to the heat pipe, thereby further ensuring the working efficiency of each heat pipe.

[0121] Specifically, the base 1 of the radiator in this specification may be composed of an upper base 12 and a lower base 13. Fig. 12A shown.

[0122] Fig. 12A This is a schematic diagram of the structure of the radiator base 1 provided in this specification. It can be seen that the base 1 includes an upper base 12 and a lower base 13. The upper white rectangle in the figure is the upper base 12, and the lower white rectangle is the lower base 13. The circle is the heat pipe groove 11, and the shaded rectangle is the groove 14, which is used to fix the heat spreader 3. Among them, the cross-sectional shape of the heat pipe groove 11 can also be a quadrilateral with straight lines on the top and bottom but curved sides, or a rounded rectangle, etc. The specific shape of the heat pipe groove 11 can be set as needed, and this specification does not limit this.

[0123] Therefore, the heat spreader 3 can be fixed in the groove 14 and connected to the lower base 13 , and when the upper base 12 and the lower base 13 are buckled together, they are connected to the heat pipes in the heat pipe group 2 .

[0124] Of course, the groove 14 for fixing and preventing the heat spreader 3 can also be set in the upper base 12, that is, the heat spreader can also be located above each heat pipe. The specific position of the heat spreader 3 can be set as needed, and this specification does not limit this.

[0125] In order to more intuitively illustrate the connection relationship between the heat-sparing member 3 and the base 1, this specification also provides the following Fig. 12B and Fig. 12C A partial schematic diagram of the radiator is shown.

[0126] Fig. 12B The schematic diagram of the structure of the heat pipe radiator provided in this specification. It can be seen that the figure includes an upper base 12, a heat spreader 3 and a lower base 13. The heat spreader 3 and the lower base 13 are independent of each other, and a groove 14 for placing the heat spreader 3 is provided in the lower base 13. Therefore, by fixing the heat spreader 3 in the groove 14, the heat spreader 3 and the lower base 13 can be fixed.

[0127] Fig. 12C The schematic diagram of the structure of the heat pipe radiator provided in this specification. It can be seen that the figure includes an upper base 12, a heat spreader 3 and a lower base 13. Among them, the heat spreader 3 is fixed in the groove 14 of the lower base 13. Therefore, by buckling the lower base 13 and the upper base 12, the heat spreader 3 and each heat pipe in the heat pipe group 2 can be connected.

[0128] It should be noted that the above Fig. 12C In the description, only the shape of the groove and the shape of the heat spreader 3 are completely matched as an example, that is, after the heat spreader 3 is embedded in the groove, the upper surface of the lower base 13 is a docking surface. However, in actual operation, the height of the heat spreader 3 and the depth of the groove may not match. It is only necessary to ensure that the shape of the heat pipe and the heat spreader 3 combined matches the shape of the groove and the heat pipe groove 11. The specific shapes of the heat spreader 3 and the groove can be set as needed, and this specification does not limit this.

[0129] In addition, the above Fig. 12A , Fig. 12B and Fig. 12C In the description, only the heat equalizing member 3 is taken as an annular member as an example, but in actual operation, the shape of the heat equalizing member 3 can also be a rectangular member, a U-shaped member, etc. Correspondingly, the shape of the groove 14 can also be rectangular, U-shaped, etc. The specific shapes of the heat equalizing member 3 and the groove 14 can be set as needed, and this specification does not limit this.

[0130] It should be noted that the above description is only based on the example of the heat equalizer 3 being connected to each heat pipe in the heat pipe group 2, but in actual operation, the heat equalizer 3 can be connected only to the first heat pipe and the second heat pipe in the heat pipe group 2. In other words, any of the above embodiments in which the heat equalizer 3 is connected to each heat pipe in the heat pipe group 2 can be applied to the case in which the heat equalizer 3 is connected only to the first heat pipe and the second heat pipe in the heat pipe group 2, that is, for each heat pipe in the heat pipe group 2, if the heat pipe is the first heat pipe or the second heat pipe, the heat pipe can refer to the above description of each heat pipe in the heat pipe group 2, and this specification will not repeat it here.

[0131] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0132] The above description is only an embodiment of the present specification and is not intended to limit the present specification. For those skilled in the art, the present specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present specification shall be included in the scope of the claims of the present specification.

Claims

1. A heat pipe radiator, characterized in that: The radiator comprises: a base (1), a heat pipe group (2), a heat spreader (3) and heat dissipation fins (4); wherein: The heat pipe group (2) comprises a plurality of heat pipes, and for each heat pipe, the bottom of the heat pipe is arranged in a heat pipe groove (11) of the base (1), and the top of the heat pipe is connected to the heat dissipation fin (4); The material of the heat equalizing member (3) is a high thermal conductivity material; the heat equalizing member (3) is connected to the first heat pipe and the second heat pipe in the heat pipe group (2); the heat loads borne by the first heat pipe and the second heat pipe are different, and the heat equalizing member (3) is connected to the first heat pipe and the second heat pipe in a surface connection manner.

2. The heat sink according to claim 1, characterized in that For each heat pipe in the heat pipe group (2), if the heat pipe is a first heat pipe or a second heat pipe, the outer surface of the heat pipe at least includes a first butt joint surface (21); The outer surface of the heat-sparing member (3) comprises at least a second butt joint surface (31), and the second butt joint surface (31) is attached to and connected to the first butt joint surface (21).

3. The heat sink according to claim 2, characterized in that The heat equalizing element (3) is connected to the heat pipe via the first butt joint surface (21), and the distance between the first butt joint surface (21) and the base (1) is less than a preset specified distance.

4. The heat sink according to claim 1, characterized in that The heat equalizing element (3) is connected and fixed to the first heat pipe and the second heat pipe via a welding layer (22).

5. The heat sink according to claim 1, characterized in that The heat equalizing element (3) is connected to each heat pipe in the heat pipe group (2).

6. The heat sink according to claim 5, characterized in that The heat pipes in the heat pipe group (2) are U-shaped heat pipes, and for each heat pipe in the heat pipe group (2), the outer surface of the heat pipe comprises at least two first butt joint surfaces (21), and the two first butt joint surfaces (21) are located on different sides of the base (1); the first butt joint surfaces (21) of the heat pipes in the heat pipe group (2) located on the same side of the base (1) are coplanar; The outer surface of the heat equalizing member (3) comprises at least a second butt joint surface (31); the heat equalizing member (3) is connected to each heat pipe in the heat pipe group (2) by connecting the second butt joint surface (31) to each coplanar first butt joint surface (21); the first butt joint surface (21) and the second butt joint surface (31) are planes.

7. The heat sink according to claim 6, characterized in that The heat equalizing member (3) is U-shaped, and the outer surface of the heat equalizing member (3) comprises at least two second butt joint surfaces (31), wherein the connection positions of the two second butt joint surfaces (31) and the heat pipes in the heat pipe group (2) are located on different sides of the base (1).

8. The heat sink according to claim 1, characterized in that For each heat pipe in the heat pipe group (2), the outer surface of the heat pipe comprises at least two first butt joint surfaces (21), and the two first butt joint surfaces (21) are located on the same side of the base (1); for each first butt joint surface (21), the other heat pipes in the heat pipe group (2) except the heat pipe have a first butt joint surface (21) coplanar with the first butt joint surface (21); The outer surface of the heat equalizing member (3) comprises at least a second butt joint surface (31); the heat equalizing member (3) is connected to each heat pipe in the heat pipe group (2) by simultaneously connecting the second butt joint surface (31) to each coplanar first butt joint surface (21); the first butt joint surface (21) and the second butt joint surface (31) are planes.

9. The heat sink according to claim 1, wherein: The heat equalizing member (3) is in a U-shape, and the outer surface of the heat equalizing member (3) comprises at least two second butt joint surfaces (31), and for each second butt joint surface (31), the second butt joint surface (31) is connected to each coplanar first butt joint surface (21), and the connection positions of the two second butt joint surfaces (31) and each heat pipe in the heat pipe group (2) are located on the same side of the base (1).

10. The heat sink according to claim 5, characterized in that The base (1) comprises an upper base (12) and a lower base (13), wherein the upper base (12) and the lower base (13) are buckled together to form a heat pipe groove (11), and a groove (14) is provided in the lower base (13); The heat equalizing element (3) is fixed in the groove (14) of the lower base (13), connected to the lower base (13), and connected to each heat pipe in the heat pipe group (2) when the lower base (13) and the upper base (12) are buckled.

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