Anti-falling mobile phone mainboard upper cover

Abstract

The utility model provides an anti-drop mobile phone mainboard upper cover, which comprises a cover body and a middle frame, the cover body is provided with a camera hole and a plurality of threaded holes, the top and the bottom of the cover body are both provided with a placing groove and a sliding groove, the placing groove is communicated with the sliding groove, a limiting plate is arranged in the sliding groove in a sliding manner, and the middle frame is provided with a plurality of through holes. Limiting grooves are formed in the top and the bottom of the middle frame correspondingly, one side of each limiting plate extends into the corresponding limiting groove, arc-shaped elastic pieces are arranged in the containing grooves, the bottoms of the arc-shaped elastic pieces are fixed to the walls of the sliding grooves, the tops of the arc-shaped elastic pieces make contact with the limiting plates, and shifting plates are fixed to one sides of the limiting plates. The main board upper cover solves the problem that when an existing main board upper cover is maintained and installed, a worker needs to spend more time to screw out all screws through tools, and the operation is very troublesome.

Description

Technical Field

[0001] The utility model relates to the field of mobile phone mainboards, in particular to a drop-resistant upper cover of a mobile phone mainboard. Background Art

[0002] The mobile phone motherboard is the core component of the mobile phone, and due to its too many delicate structures, it is very easy to be damaged. The mobile phone motherboard cover is the key component to protect the mobile phone motherboard. In the existing technology, the cover and the middle frame used to protect the motherboard are connected together by multiple small screws. Therefore, during maintenance and installation, the staff needs to spend a lot of time to use tools to unscrew them, which is very troublesome.

[0003] Therefore, it is necessary to provide a new anti-fall mobile phone mainboard cover to solve the above-mentioned technical problems. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a drop-resistant mobile phone motherboard cover, which solves the problem that the existing motherboard cover requires workers to spend a lot of time using tools to unscrew all the screws during maintenance and installation, which is very troublesome.

[0005] The anti-fall mobile phone motherboard upper cover provided by the utility model comprises a cover body and a middle frame, the cover body is provided with a camera hole and a plurality of threaded holes, the top and bottom of the cover body are provided with a placement groove and a slide groove, the placement groove is connected with the slide groove, and a limit plate is slidably arranged inside the slide groove;

[0006] The top and the bottom of the middle frame are both provided with limiting grooves, and one side of the limiting plate extends into the limiting groove.

[0007] In a preferred embodiment, an arc-shaped spring piece is arranged inside the placement groove, the bottom of the arc-shaped spring piece is fixed to the wall of the sliding groove, and the top of the arc-shaped spring piece is in contact with the limiting plate.

[0008] In a preferred embodiment, a shift plate is fixed to one side of the limiting plate, and the shift plate is 1-2 mm higher than the edge of the cover body.

[0009] In a preferred embodiment, a silicone pad is provided at the edge of the cover body.

[0010] In a preferred embodiment, shock-absorbing feet are provided at the four corners of the cover body.

[0011] In a preferred embodiment, a triangular reinforcing rod is fixed on the cover body.

[0012] In a preferred embodiment, a plurality of heat-conducting blocks are provided through the cover body, and a heat-conducting sheet is fixed to a portion of the heat-conducting block located inside the cover body.

[0013] The working principle of this utility model:

[0014] The cover does not need to be disassembled by screwing multiple screws. The staff only needs to use tools such as fingernails to move two plates. Under the action of the plates, the limit plates and the limit grooves are separated. At this time, the entire cover can be removed from the middle frame. The installation is similar. The operation is simple and convenient. In daily use, due to the action of the arc-shaped spring sheet, the limit plate will always be located inside the limit groove to ensure that the cover and the middle frame will not separate.

[0015] By setting a silicone pad at the edge of the cover, when the motherboard is subjected to external force, the silicone pad can play a certain buffering role. At the same time, the silicone pad at the edge can also play a dust-proof role. By setting shock-absorbing pads at the four corners of the cover, the motherboard can be further protected.

[0016] The cover body can improve the overall strength of the cover body by arranging a plurality of triangular reinforcing rods, and can transfer the heat of the mainboard to the edge by arranging heat conducting sheets and heat conducting blocks, thereby increasing the heat dissipation area and avoiding excessive local temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A three-dimensional view of the main structure of the anti-fall mobile phone motherboard upper cover provided by the utility model;

[0018] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of shown;

[0019] Figure 3 A plan view of the main structure of the anti-fall mobile phone mainboard upper cover provided by the utility model;

[0020] Figure 4 for Figure 3 Schematic diagram of the enlarged structure of B shown.

[0021] Numbers in the figure: 1. Cover body; 2. Middle frame; 3. Placement slot; 4. Slide slot; 5. Limit plate; 6. Limit slot; 7. Arc spring; 8. Paddle plate; 9. Silicone pad; 10. Shock-absorbing foot; 11. Triangular reinforcement rod; 12. Heat-conducting block; 13. Heat-conducting sheet; 14. Camera hole; 15. Threaded hole. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0023] Please refer to Figure 1 , Figure 2 , Figure 3 as well as Figure 4 ,in Figure 1A three-dimensional view of the main structure of the anti-fall mobile phone motherboard upper cover provided by the utility model; Figure 2 for Figure 1 A schematic diagram of the enlarged structure of shown; Figure 3 A plan view of the main structure of the anti-fall mobile phone mainboard upper cover provided by the utility model; Figure 4 for Figure 3 Schematic diagram of the enlarged structure of B shown.

[0024] In the specific implementation process, Figure 1-Figure 4 As shown, it includes a cover body 1 and a middle frame 2, the cover body 1 is provided with a camera hole 14 and a plurality of threaded holes 15, the top and bottom of the cover body 1 are provided with a placement groove 3 and a slide groove 4, the placement groove 3 is connected with the slide groove 4, a limit plate 5 is slidably arranged inside the slide groove 4, the top and bottom of the middle frame 2 are provided with a limit groove 6, and one side of the limit plate 5 extends into the limit groove 6, the placement groove 3 is provided with an arc spring piece 7, the bottom of the arc spring piece 7 is fixed to the groove wall of the slide groove 4, the top of the arc spring piece 7 is in contact with the limit plate 5, and the limit A shift plate 8 is fixed on one side of the positioning plate 5, and the shift plate 8 is 1-2mm higher than the edge of the cover body 1. The cover body 1 does not need to be disassembled by screwing multiple screws. The staff only needs to use tools such as fingernails to shift the two shift plates 8. Under the action of the shift plate 8, the limit plate 5 is separated from the limit groove 6. At this time, the entire cover body 1 can be removed. The installation is similar. The operation is simple and convenient. In daily use, due to the action of the arc-shaped spring piece 7, the limit plate 5 will always be located inside the limit groove 6 to ensure that the cover body 1 and the middle frame 2 will not be separated.

[0025] A silicone pad 9 is provided at the edge of the cover body 1, shock-absorbing feet 10 are provided at the four corners of the cover body 1, a triangular reinforcing rod 11 is fixed on the cover body 1, and a plurality of heat-conducting blocks 12 are penetrated through the cover body 1. A heat-conducting sheet 13 is fixed to the part of the heat-conducting block 12 located inside the cover body 1, and thermal grease is applied between the heat-conducting sheet 13 and the heat concentration area (CPU) of the motherboard. The cover body 1 can improve the overall strength of the cover body 1 by arranging a plurality of triangular reinforcing rods 10, and the heat of the motherboard can be transferred to the edge by arranging the heat-conducting sheet 13 and the heat-conducting block 12, thereby increasing the heat dissipation area and avoiding excessive local temperature.

[0026] Working principle of the utility model: the cover body 1 does not need to be disassembled by screwing multiple screws. The staff only needs to use tools such as fingernails to move the two dial plates 8. Under the action of the dial plates 8, the limit plates 5 are separated from the limit grooves 6. At this time, the entire cover body 1 can be removed from the middle frame 2. The installation is similar. The operation is simple and convenient. In daily use, due to the action of the arc-shaped spring sheet 7, the limit plates 5 will always be located inside the limit grooves 6 to ensure that the cover body 1 and the middle frame 2 will not separate.

[0027] By arranging the silicone pad 9 at the edge of the cover body 1, when the mainboard is subjected to external force, the silicone pad 9 can play a certain buffering role, and the silicone pad 9 at the edge can also play a dustproof role. By arranging shock-absorbing pads 10 at the four corners of the cover body 1, the mainboard can be further protected;

[0028] The cover body 1 can improve the overall strength of the cover body 1 by arranging a plurality of triangular reinforcing rods 10, and can transfer the heat of the mainboard to the edge by arranging the heat conducting sheet 13 and the heat conducting block 12, thereby increasing the heat dissipation area and avoiding excessive local temperature.

[0029] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0030] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A drop-resistant mobile phone motherboard upper cover, comprising a cover body (1) and a middle frame (2), wherein the cover body (1) is provided with a camera hole (14) and a plurality of threaded holes (15), characterized in that: The top and bottom of the cover body (1) are both provided with a placement groove (3) and a slide groove (4), the placement groove (3) is connected to the slide groove (4), and a limit plate (5) is slidably arranged inside the slide groove (4); The top and bottom of the middle frame (2) are both provided with limiting grooves (6), and one side of the limiting plate (5) extends into the limiting groove (6).

2. The drop-resistant mobile phone motherboard upper cover according to claim 1, characterized in that: An arc-shaped spring piece (7) is arranged inside the placement groove (3), the bottom of the arc-shaped spring piece (7) is fixed to the groove wall of the sliding groove (4), and the top of the arc-shaped spring piece (7) is in contact with the limiting plate (5).

3. The drop-resistant mobile phone motherboard upper cover according to claim 2, characterized in that: A shift plate (8) is fixed to one side of the limit plate (5), and the shift plate (8) is 1-2 mm higher than the edge of the cover body (1).

4. The drop-resistant mobile phone motherboard upper cover according to claim 3, characterized in that: A silicone pad (9) is provided at the edge of the cover body (1).

5. The drop-resistant mobile phone motherboard upper cover according to claim 4, characterized in that: Shock-absorbing pads (10) are provided at the four corners of the cover body (1).

6. The drop-resistant mobile phone motherboard upper cover according to claim 5, characterized in that: A triangular reinforcing rod (11) is fixed on the cover body (1).

7. The drop-resistant mobile phone motherboard upper cover according to claim 6, characterized in that: A plurality of heat-conducting blocks (12) are provided through the cover body (1), and a heat-conducting sheet (13) is fixed to the portion of the heat-conducting block (12) located inside the cover body (1).

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