Fluid chromium electroplating device for crystallizer copper pipe
By using the chromium plating device of out-of-slot fluid on the crystallizer copper tube, multiple problems of traditional immersion plating for large-sized round crystallizers are solved, and a more efficient, environmentally friendly and energy-efficient chromium plating process is achieved.
Patent Information
- Application Number
- CN202421772042.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-25
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-07-25
AI Technical Summary
Traditional immersion electroplating technology has many problems with chrome plating of large-scale circular crystallizer copper tubes, including complex corrosion protection before plating, large area of land, serious environmental pollution, difficult temperature control, low deposition efficiency and high energy consumption.
The chromium solution is continuously circulated on the inner wall of the crystallizer copper tube through the liquid storage tank and sealing cover system on the working platform, avoiding the pre-plating anti-corrosion treatment and the occupation of large-scale plating tanks.
The chrome plating effect is achieved without the need for anti-corrosion treatment before plating, small footprint, reduced environmental pollution, more stable temperature control, improved deposition efficiency and reduced energy consumption.
Smart Images
Figure CN222809575U_ABST
Abstract
Description
Technical Field
[0001] The utility model mainly relates to the technical field of crystallizer chromium plating, and in particular to a device for fluid electroplating chromium in a crystallizer copper tube. Background Art
[0002] At present, the electroplating method for circular crystallizers is to immerse the copper tube of the circular crystallizer in the plating solution for electroplating after pre-plating anti-corrosion, pre-plating treatment, and pre-plating hanging. This traditional electroplating mode has many disadvantages;
[0003] The outer surface of the copper tube needs to be strictly treated with anti-corrosion before plating to prevent the copper tube from being immersed in the plating solution and corroded during the electroplating process;
[0004] The diameter of large-sized round copper tubes is generally above 1000mm. If traditional immersion electroplating is used, the plating tank will be very large, occupying a large area, requiring a large amount of plating solution, and resulting in high process maintenance costs.
[0005] After immersion electroplating, a large amount of plating solution is carried out when the workpiece leaves the tank. As the specifications of the copper tube increase, the amount of plating solution carried out gradually increases, causing serious environmental pollution.
[0006] In large-scale traditional immersion electroplating, a large amount of heat is generated during the electroplating process, which makes it difficult and unstable to control the temperature of the plating solution.
[0007] Traditional immersion electroplating has low deposition efficiency and increased energy consumption due to the slow liquid phase mass transfer between the chromium plating solution and the workpiece interface.
[0008] It should be noted that the above content of this application does not necessarily constitute prior art. Utility Model Content
[0009] 1. Technical problems to be solved by the utility model:
[0010] The utility model provides a device for fluid electroplating chromium on a crystallizer copper tube, which is used to solve the technical problems existing in the above-mentioned background technology.
[0011] 2. Technical solution:
[0012] To achieve the above-mentioned purpose, the technical solution provided by the utility model is as follows: a device for fluid electroplating chromium of a crystallizer copper tube, comprising a working platform, a liquid storage tank is provided at the bottom of the middle surface of the working platform, the top of the working platform is connected to a support platform, a liquid inlet hole is opened in the middle of the top surface of the support platform, the bottom of the liquid inlet hole is connected to a liquid inlet pipe, the top of the liquid inlet hole is connected to a lower sealing plate, the middle of the top surface of the lower sealing plate is connected to a sealing cover, a crystallizer is placed in the sealing cover, the top of the sealing cover is buckled with an upper sealing plate, the top of the upper sealing plate is connected to a sealing cover plate, the sealing cover plate is detachably connected to the top of the working platform, a liquid outlet channel is provided at the top of the sealing cover plate, a power supply anode is provided in the liquid outlet channel, and a power supply cathode is provided on the side of the support platform. When the device is working, the sealing cover is placed on the top of the lower sealing plate, and then the crystallizer to be chrome-plated is placed in the sealing cover, the top is connected to the top of the sealing cover through the upper sealing plate, the inner wall of the crystallizer is sealed, and then the top of the upper sealing plate is connected to the sealing cover plate, the chromium solution is transported upward from the liquid inlet pipe at the bottom, and the chromium solution will fill the inner wall of the crystallizer copper tube. To facilitate the subsequent chrome plating operation, after the chromium solution fills the crystallizer, it falls back into the liquid storage tank from the liquid outlet channel at the top, and then the power anode and the power cathode are connected to the crystallizer. It should be noted that the device can perform chrome plating outside the tank on large circular crystallizers, and can also perform chrome plating on the inner wall of crystallizers of other shapes. The device adopts the method of chrome plating outside the tank, and the outer side of the crystallizer will not be in direct contact with the chromium solution, so there is no need to perform anti-corrosion treatment on the outer surface of the crystallizer. When operating on large-sized crystallizer copper tubes, there is no need to set up a large aqueduct, and because the chromium solution is continuously circulated, it only needs to fill the inner wall of the crystallizer, and there is no excessive requirement for the stock of the plating solution. Since there is no need to put the entire crystallizer into the plating solution, a large amount of plating solution will not be brought out after the chrome plating is completed. Compared with the traditional chrome plating method, the chromium solution of the present application is continuously circulated, and heat will be dissipated during the flow, which can better control the temperature of the plating solution. Since the chromium solution of the device is always circulated, the liquid phase mass transfer rate is fast and the deposition efficiency is high, thereby reducing energy consumption.
[0013] Furthermore, the working platform includes a support table, a control power supply is provided on one side of the top of the support table, a storage groove is opened in the middle of the support table, the liquid storage tank is placed in the storage groove, and a plating liquid circulation pump is also provided on the top of the support table, and the plating liquid circulation pump is connected to the liquid inlet pipe.
[0014] Furthermore, a reflux frame is provided on the top of the support platform, and a liquid discharge port is opened on one side of the reflux frame.
[0015] Furthermore, the top of the sealing cover plate is symmetrically connected to a pressing plate, both ends of the pressing plate are provided with limiting grooves, the limiting grooves are connected to a combining column, the top of the combining column is provided with a thread, and the combining column is arranged on the working platform.
[0016] Furthermore, the power supply anode includes a shunt block, a chrome-plated space is formed between the shunt block and the inner wall of the crystallizer, the middle of the top surface of the shunt block is connected to an anode guide plate, the anode guide plate is arranged in the liquid outlet channel, and a circularly distributed liquid inlet holes are opened on the lower sealing plate at the bottom of the shunt block.
[0017] Furthermore, the power supply cathode includes a fixed mounting block, a top side of the fixed mounting block is connected to a telescopic cylinder, the telescopic cylinder is connected to a cathode guide plate, a conductive groove is opened on a side of the sealing cover, and the conductive groove is plugged into the cathode guide plate.
[0018] Furthermore, the liquid outlet channel includes an L-shaped liquid guide tube, the bottom of the L-shaped liquid guide tube is connected to the sealing cover plate, one side of the bottom of the L-shaped liquid guide tube is connected to a drainage pipe, and the bottom of the drainage pipe is aligned with the liquid storage tank.
[0019] 3. Beneficial effects:
[0020] Compared with the prior art, the technical solution provided by the utility model has the following beneficial effects:
[0021] Since it is an outside-tank electroplating, the copper tube does not need to be immersed in the plating solution, so no anti-corrosion treatment is required before plating;
[0022] Since it is an out-of-tank fluid electroplating, the volume of the plating tank does not need to consider the space occupied by the tooling. The plating tank simply becomes a liquid storage tank, and the physical inspection of the plating tank will be greatly reduced;
[0023] Since it is electroplated outside the tank, there is no carry-out loss out of the tank, and the environmental pollution is small;
[0024] Since it is an out-of-tank fluid electroplating, the copper tube is not immersed in the plating solution, and the heat generated by the electroplating will not be directly transferred to the liquid storage tank. The heat accumulation rate in the plating solution is greatly reduced, and the difficulty of temperature control is reduced.
[0025] Since fluid electroplating uses a pump to deliver the plating solution into the inner cavity of the copper tube, the flow rate can be changed as needed, which improves the mass transfer rate between the plating solution and the interface and improves the deposition efficiency. The traditional electroplating time is 5 to 6 hours, while the utility model can complete the electroplating in 2.5 to 3 hours.
[0026] The staged electroplating intensity of the electroplating power supply can be changed by computer control according to practical conditions to improve the coating performance and enhance the performance of the product.
[0027] It should be noted that the structures not introduced in the present invention are not related to the design points and improvement directions of the present invention, and are the same as the prior art or can be implemented by using the prior art, and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1It is a schematic diagram of the structure of the utility model;
[0029] Figure 2 It is a structural schematic diagram of the liquid storage tank of the utility model;
[0030] Figure 3 It is a schematic diagram of the bottom of the local structure of the utility model.
[0031] Figure 4 This is a schematic structural diagram of the utility model from another angle;
[0032] Figure 5 It is a schematic diagram of the structure of the pressed plate of the utility model;
[0033] Figure 6 This is a schematic diagram of the anode structure of the power supply of the utility model;
[0034] Figure 7 For this utility model Figure 4 A is an enlarged structural diagram of FIG.
[0035] Reference numerals:
[0036] 1. Working platform; 2. Liquid storage tank; 3. Support table; 31. Reflux frame; 32. Liquid discharge port; 4. Liquid inlet hole; 5. Liquid inlet pipe; 6. Lower sealing plate; 7. Sealing cover; 8. Upper sealing plate; 9. Sealing cover plate; 91. Pressing plate; 92. Limiting groove; 93. Combining column; 10. Liquid outlet channel; 101. L-shaped liquid guide pipe; 102. Liquid discharge pipe; 11. Power supply anode; 111. Diverter block; 112. Chrome plating space; 113. Anode guide plate; 114. Liquid inlet hole; 12. Power supply cathode; 121. Fixed mounting block; 122. Telescopic cylinder; 123. Cathode guide plate; 124. Conductive groove; 13. Support table; 14. Control power supply; 15. Storage tank; 16. Plating solution circulation pump; 5. Liquid inlet pipe. DETAILED DESCRIPTION
[0037] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "page", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0040] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "provided with", "provided on" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Example
[0041] Refer to the attached Figure 1-7A device for electroplating chromium by fluid in a crystallizer copper tube comprises a working platform 1, a liquid storage tank 2 is provided at the bottom of the middle surface of the working platform 1, the top of the working platform 1 is connected to a support platform 3, a liquid inlet hole 4 is provided in the middle of the top surface of the support platform 3, the bottom of the liquid inlet hole 4 is connected to a liquid inlet pipe 5, the top of the liquid inlet hole 4 is connected to a lower sealing plate 6, the middle of the top surface of the lower sealing plate 6 is connected to a sealing cover 7, a crystallizer is placed in the sealing cover 7, the top of the sealing cover 7 is buckled with an upper sealing plate 8, the top of the upper sealing plate 8 is connected to a sealing cover plate 9, and the sealing cover plate 9 is detachably connected to the top of the working platform 1 The top of the sealing cover plate 9 is provided with a liquid outlet channel 10, and a power supply anode 11 is provided in the liquid outlet channel 10. A power supply cathode 12 is provided on the side of the support platform 3. When the device is working, the sealing cover 7 is placed on the top of the lower sealing plate 6, and then the crystallizer to be chrome-plated is placed in the sealing cover 7. The top is connected to the top of the sealing cover 7 through the upper sealing plate 8 to form a seal on the inner wall of the crystallizer. Then, the top of the upper sealing plate 8 is connected to the sealing cover plate 9, and the chromium solution is transported upward from the liquid inlet pipe 5 at the bottom. The chromium solution will fill the inner wall of the crystallizer copper tube, which is convenient for subsequent chrome plating operations. The chromium solution is filled After the crystallizer, the liquid falls back into the liquid storage tank 2 from the liquid outlet channel 10 at the top, and the power anode 11 and the power cathode 12 are connected to the crystallizer. It should be noted that the device can perform chrome plating outside the tank on large circular crystallizers, and can also perform chrome plating operations on the inner walls of crystallizers of other shapes. The device adopts the method of chrome plating outside the tank, and the outer side of the crystallizer will not directly contact the chromium solution, so there is no need to perform anti-corrosion treatment on the outer surface of the crystallizer. When operating on large-sized crystallizer copper tubes, there is no need to set up a large aqueduct, and because the chromium solution is continuously circulated, only It is sufficient to fill the inner wall of the crystallizer, and there is no excessive requirement for the inventory of the plating solution. Since there is no need to put the entire crystallizer into the plating solution, a large amount of plating solution will not be brought out after the chrome plating is completed. In addition, compared with the traditional chrome plating method, the chromium solution of the present application is in continuous circulation, and heat will be dissipated during the flow, so the temperature of the plating solution can be better controlled. Since the chromium solution of the device is constantly circulating, the liquid phase mass transfer rate is fast and the deposition efficiency is high, thereby reducing energy consumption. Since it is an outside-tank electroplating, the copper tube is supplied with liquid through a pump and a closed piping system, and the liquid storage tank can also be closed according to the situation.
[0042] The working platform 1 comprises a supporting table 13, a control power supply 14 is arranged on one side of the top of the supporting table 13, a storage groove 15 is opened in the middle of the supporting table 13, the storage groove 15 is used to place the liquid storage tank 2, a plating solution circulation pump 16 is arranged on the top of the supporting table, the plating solution circulation pump 16 is connected to the liquid inlet pipe 5, the control power supply 14 can control the stage-by-stage change of the electroplating intensity of the electroplating power supply, improve the plating performance, and enhance the performance of the product, a power connection block is arranged on the side thereof, which is respectively connected to the power supply anode 11 and the power supply cathode 12, and is not drawn in the wire diagram, the plating solution circulation pump 16 can circulate the chromium solution, and can change the flow rate as needed, thereby improving the mass transfer rate between the plating solution and the interface, and thus improving the deposition efficiency.
[0043] A backflow frame 31 is provided on the top of the support platform 3, and a drain port 32 is opened on one side of the backflow frame 31. During the nickel plating process of the device, if the upper sealing plate 8 and the lower sealing plate 6 are not sealed tightly, chromium liquid will flow out from the bottom of the sealing cover 7. The backflow frame can collect this part of the chromium liquid and discharge it through the drain port 32.
[0044] The top of the sealing cover plate 9 is symmetrically connected to the pressing plate 91, and limiting grooves 92 are provided at both ends of the pressing plate 91. The limiting grooves 92 are connected to the combining column 93. The top of the combining column 93 is provided with a thread. The combining column 93 is arranged on the working platform 1. In order to improve the sealing effect of the upper sealing plate 8 and the lower sealing plate 6 on the crystallizer, a sealing cover plate 9 is arranged on the top of the upper sealing plate 8. The sealing cover plate 9 applies downward pressure through the pressing plate 91. The top of the pressing plate 91 can be connected with a nut and locked with the combining column 93 to improve the sealing effect.
[0045] The power anode 11 includes a shunt block 111, and a chrome plating space 112 is formed between the shunt block 111 and the inner wall of the crystallizer. The middle of the top surface of the shunt block 111 is connected to an anode guide plate 113, and the anode guide plate 113 is arranged in the liquid outlet channel 10. The lower sealing plate 6 at the bottom of the shunt block 111 is provided with circularly distributed liquid inlet holes 114. In order to further save chromium solution, the shunt block 111 is provided, and the chrome plating space 112 formed by the shunt block 111 and the crystallizer can pass through the chromium solution. When chrome plating, the liquid inlet pipe 5 at the bottom will transport the chromium liquid to the inside, and the chromium liquid will enter the chrome plating space 112 through the annular liquid inlet hole 114, and the top anode guide plate 113 will be connected to the control power supply 14.
[0046] The power cathode 12 includes a fixed mounting block 121, and a telescopic cylinder 122 is connected to one side of the top of the fixed mounting block 121. The telescopic cylinder 122 is connected to a cathode guide plate 123. A conductive groove 124 is opened on the side of the sealing cover 7, and the conductive groove 124 is plugged into the cathode guide plate 123. When the crystallizer is installed and the chromium solution fills the chrome plating space 112, the telescopic cylinder 122 on the side drives the cathode guide plate 123 to move toward the conductive groove 124, and then contacts the crystallizer inside the sealing cover 7, which is convenient for subsequent electroplating operations.
[0047] The liquid outlet channel 10 includes an L-shaped liquid guide tube 101, the bottom of the L-shaped liquid guide tube 101 is connected to the sealing cover plate 9, one side of the bottom of the L-shaped liquid guide tube 101 is connected to a drain pipe 102, and the bottom of the drain pipe 102 is aligned with the liquid storage tank 2. After passing through the inner wall of the crystallizer, the chromium solution will continue to overflow upward and then enter the L-shaped liquid guide tube 101. The L-shaped liquid guide tube 101 will transport the chromium solution back to the liquid storage tank 2 again, and the flowing chromium solution will also dissipate heat in this process.
[0048] The above-described embodiments only express a certain implementation method of the utility model, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the patent of the utility model shall be based on the attached claims.
Claims
1. A device for electroplating chromium in a crystallizer copper tube fluid, characterized in that: The invention comprises a working platform (1), wherein a liquid storage tank (2) is provided at the bottom of the middle surface of the working platform (1), the top of the working platform (1) is connected to a supporting platform (3), a liquid inlet hole (4) is provided in the middle of the top surface of the supporting platform (3), the bottom of the liquid inlet hole (4) is connected to a liquid inlet pipe (5), the top of the liquid inlet hole (4) is connected to a lower sealing plate (6), the middle of the top surface of the lower sealing plate (6) is connected to a sealing cover (7), a crystallizer is placed in the sealing cover (7), the top of the sealing cover (7) is buckled with an upper sealing plate (8), the top of the upper sealing plate (8) is connected to a sealing cover plate (9), the sealing cover plate (9) is detachably connected to the top of the working platform (1), a liquid outlet channel (10) is provided at the top of the sealing cover plate (9), a power supply anode (11) is provided in the liquid outlet channel (10), and a power supply cathode (12) is provided on the side of the supporting platform (3).
2. The device for fluid electroplating chromium in a crystallizer copper tube according to claim 1, characterized in that: The working platform (1) comprises a support table (13), a control power supply (14) is provided on one side of the top of the support table (13), a storage groove (15) is provided in the middle of the support table (13), the liquid storage tank (2) is placed in the storage groove (15), and a plating liquid circulation pump (16) is also provided on the top of the support table, and the plating liquid circulation pump (16) is connected to the liquid inlet pipe (5).
3. The device for fluid electroplating chromium in a crystallizer copper tube according to claim 1, characterized in that: A backflow frame (31) is provided on the top of the support platform (3), and a liquid discharge port (32) is provided on one side of the backflow frame (31).
4. The device for electroplating chromium in a crystallizer copper tube according to claim 1, characterized in that: The top of the sealing cover plate (9) is symmetrically connected to a pressing plate (91), both ends of the pressing plate (91) are provided with limiting grooves (92), the limiting grooves (92) are connected to a combining column (93), the top of the combining column (93) is provided with a thread, and the combining column (93) is arranged on the working platform (1).
5. The device for fluid electroplating chromium in a crystallizer copper tube according to claim 1, characterized in that: The power supply anode (11) comprises a shunt block (111), a chrome-plated space (112) is formed between the shunt block (111) and the inner wall of the crystallizer, the middle of the top surface of the shunt block (111) is connected to an anode guide plate (113), the anode guide plate (113) is arranged in the liquid outlet channel (10), and a lower sealing plate (6) at the bottom of the shunt block (111) is provided with circularly distributed liquid inlet holes (114).
6. The device for fluid electroplating chromium in a crystallizer copper tube according to claim 1, characterized in that: The power supply cathode (12) comprises a fixed mounting block (121), one side of the top of the fixed mounting block (121) is connected to a telescopic cylinder (122), the telescopic cylinder (122) is connected to a cathode guide plate (123), and a conductive groove (124) is formed on a side of the sealing cover (7), the conductive groove (124) being plugged into the cathode guide plate (123).
7. The device for fluid electroplating chromium in a crystallizer copper tube according to claim 1, characterized in that: The liquid outlet channel (10) comprises an L-shaped liquid guide tube (101), the bottom of the L-shaped liquid guide tube (101) is connected to the sealing cover plate (9), one side of the bottom of the L-shaped liquid guide tube (101) is connected to a liquid discharge tube (102), and the bottom of the liquid discharge tube (102) is aligned with the liquid storage tank (2).