Coupling device of laser and silicon optical chip and communication equipment

Abstract

The utility model provides a coupling device of a laser and a silicon optical chip and communication equipment, and relates to the technical field of optical communication. The coupling device of the laser devices and the silicon optical chip comprises a plurality of laser devices, a plurality of groups of optical transmission devices, the silicon optical chip and a fan-out device. And each group of optical transmission devices is arranged corresponding to the laser. And a plurality of optical waveguide channels are arranged in the silicon optical chip. And the fan-out device is arranged between the multiple groups of optical transmission devices and the silicon optical chip. A plurality of optical transmission channels are arranged in the fan-out device, the position of an incident port of each optical transmission channel is matched with the position of the optical transmission device, and the position of an emergent port of each optical transmission channel is matched with the position of an inlet of an optical waveguide channel of the silicon optical chip. According to the coupling device provided by the utility model, the size of the optical transmission device and the gap between the optical transmission devices are not limited by the optical waveguide channel of the silicon optical chip, the structural interference is avoided, and the requirements of integration and miniaturization of the silicon optical chip are met while the coupling requirement is met.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, in particular to a coupling device of a laser and a silicon photonic chip and communication equipment. Background Art

[0002] With the rise of AI technology, silicon photonics high-speed optical modules have quickly captured a larger share in the data center market with their advantages of low power consumption and high bandwidth. This has stimulated the optical module market to develop in a higher speed direction. However, higher-speed optical modules mean more optoelectronic components and more compact module internal space, and the difficulty of the silicon photonics chip optical path coupling process has increased exponentially.

[0003] Silicon photonic chip technology is a technology that integrates circuit chips and optical transmission functions on the same silicon-based chip. Therefore, silicon photonic chips can not only realize electrical signal processing functions (such as signal amplifiers, digital signal processors, etc.), but also transmit optical paths to realize optical signal filtering, splitting, modulation and other functions. In addition, the high degree of integration of silicon photonic chips can effectively reduce the volume of optical modules, which can greatly reduce the overall power consumption of optical modules and reduce costs. However, compared with conventional III-V semiconductor optoelectronic materials, silicon photonic chips are not suitable for direct use as light sources. The size of silicon waveguides is submicron, and the light field mode spot is less than 1μm, which is quite different from the 8-10μm mode spot in optical fibers. The mode spot mismatch between the two will cause a large loss in the direct coupling of optical fibers and silicon waveguides.

[0004] There are three main solutions used in the existing technology: the first is to epitaxially grow III-V semiconductor optoelectronic materials on the silicon photonic chip, and then perform laser processing on the III-V semiconductor optoelectronic materials to make a light source. The second is to make a light source component with the III-V DFB chip, lens, and isolator, and then bond this component to the silicon photonic chip with glue. The third is to flip the laser chip waveguide on the silicon waveguide, perform evanescent wave coupling, and couple the light of the laser chip into the silicon photonic chip. Due to the extremely high cost and process requirements of the above three silicon photonic coupling solutions, the subsequent silicon photonic coupling solutions are optimized into the following two based on the above solutions. One is to use the chip-lens-optical fiber-silicon light coupling method to align the silicon photonic chip with the optical fiber mode spot to achieve the final coupling. Another is to shape and converge the light path through a double lens, and then align it with the silicon photonic waveguide.

[0005] The above two optimization solutions have certain shortcomings when facing the demand for higher-speed optical modules. In order to meet the compact space requirements of high-speed optical modules, the channel spacing of silicon photonic chips is gradually reduced, which will cause structural interference during lens coupling and make it difficult to meet the coupling requirements. In addition, due to the mismatch between the optical fiber and the silicon photonic waveguide mode, the chip-lens-optical-silicon photonic coupling method has low coupling efficiency and is difficult to meet the power requirements of high-speed silicon photonic chips. Utility Model Content

[0006] An object of the first aspect of the present utility model is to provide a coupling device for a laser and a silicon photonic chip, so as to solve the problem of structural interference caused by the reduction of the channel spacing of the silicon photonic chip in the prior art.

[0007] Another object of the first aspect of the utility model is to solve the problem of low coupling efficiency caused by mode spot mismatch in the prior art.

[0008] In particular, the utility model provides a coupling device for a laser and a silicon photonic chip, comprising:

[0009] Multiple lasers;

[0010] A plurality of groups of optical transmission devices, each group of the optical transmission devices being arranged corresponding to the laser to transmit the corresponding light beam of the laser;

[0011] A silicon photonic chip having a plurality of optical waveguide channels disposed therein; and

[0012] A fan-out device is arranged between the multiple groups of the optical transmission devices and the silicon photonic chip to fan out the light beams emitted from the multiple groups of the optical transmission devices to the optical waveguide channel of the silicon photonic chip; multiple optical transmission channels are arranged in the fan-out device, each of the optical transmission channels corresponds to the transmission of light emitted from one group of the optical transmission devices, the position of the incident port of each of the optical transmission channels matches the position of the corresponding optical transmission device, and the position of the exit port of the optical transmission channel matches the position of the entrance of the corresponding optical waveguide channel of the silicon photonic chip.

[0013] Optionally, each group of the optical transmission devices includes a first lens, an isolator, and a second lens arranged in sequence, and the laser light emitted from one of the lasers passes through the first lens, the isolator, and the second lens of the corresponding optical transmission device in sequence before entering the fan-out device;

[0014] The incident port of each of the light transmission channels is located behind a corresponding group of the second lenses of the light transmission devices.

[0015] Optionally, the incident port position of each of the optical transmission channels corresponds to the position of a light beam emitted from the second lens of the corresponding optical transmission device to the fan-out device.

[0016] Optionally, the light transmission channel is an arc-shaped channel.

[0017] Optionally, the size of the incident port of each optical transmission channel matches the size of the corresponding light beam incident to the fan-out device, and the size of the exit port of the optical transmission channel matches the size of the entrance of the corresponding optical waveguide channel of the silicon photonic chip.

[0018] Optionally, the size is a mold spot size.

[0019] Optionally, the pattern spot size of each of the light transmission channels changes gradually from the incident port to the exit port.

[0020] Optionally, the pattern spot size of the incident port of each of the light transmission channels is larger than the pattern spot size of the exit port, and the pattern spot size of the light transmission channel gradually decreases from the incident port to the exit port.

[0021] Optionally, the fan-out device is made of glass or silicon.

[0022] In particular, the utility model also provides a communication device, comprising the coupling device of the laser and the silicon photonic chip as described above.

[0023] In this solution, a fan-out device is arranged between the optical transmission device and the silicon photonic chip. A plurality of optical transmission channels are arranged in the fan-out device. The incident port of each optical transmission channel matches the position of the optical transmission device, and the exit port of each optical transmission device matches the entrance position of the optical waveguide channel of the silicon photonic chip. Thus, the size of the optical transmission device and the gap between each optical transmission device are not restricted by the optical waveguide channel of the silicon photonic chip, and structural interference will not occur, nor will the gap between the optical waveguide channels of the silicon photonic chip be further narrowed. The coupling requirements are met while the integration and miniaturization of the silicon photonic chip are met.

[0024] In addition, in this solution, since the incident port of the optical transmission channel of the fan-out device can match the position of the optical transmission device, the distance and size between the optical transmission devices are not affected by miniaturization, and public mold parts can be used without additional customized structures, thereby reducing costs.

[0025] In this solution, the size of the incident port of each optical transmission channel matches the size of the corresponding light beam incident on the fan-out device, and the size of the exit port of the optical transmission channel matches the size of the entrance of the corresponding optical waveguide channel of the silicon photonic chip. This can effectively solve the problem of light spot mismatch caused by the difference in mode spot size when the light beam enters from the optical transmission device to the fan-out device, and from the fan-out device to the silicon photonic chip, thereby improving the overall coupling efficiency and coupling tolerance and compensating for the loss.

[0026] The light transmission channel of this solution is designed to have a gradual pattern size from the incident port to the exit port, so as to minimize the loss of light during transmission in the light transmission channel.

[0027] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0029] Figure 1 is a schematic structural diagram of a coupling device of a laser and a silicon photonic chip according to a specific embodiment of the utility model;

[0030] Figure 2 is a schematic side structural diagram of a coupling device of a laser and a silicon photonic chip according to a specific embodiment of the utility model;

[0031] Figure 3 It is a schematic structural diagram of a fan-out device according to a specific embodiment of the utility model.

[0032] Description of reference numerals:

[0033] Coupling device of laser and silicon photonic chip-100; laser-110; optical transmission device-120; first lens-121; isolator-122; second lens-123; silicon photonic chip-130; fan-out device-140; optical transmission channel-141; incident port-142; and exit port-143. DETAILED DESCRIPTION

[0034] In the description of this embodiment, it should be understood that the terms "length", "width", "height", "up", "down", "left", "right", "vertical", "horizontal", "bottom", "inside" and "outside" etc. indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0035] As a specific embodiment of the present invention, Figure 1As shown, this embodiment provides a coupling device 100 for a laser and a silicon photonic chip. The coupling device 100 for a laser and a silicon photonic chip may include multiple lasers 110, multiple groups of optical transmission devices 120, a silicon photonic chip 130, and a fan-out device 140. Each group of optical transmission devices 120 is arranged corresponding to the laser 110 to transmit the light beam of the corresponding laser 110. A plurality of optical waveguide channels (not shown in the figure) are arranged in the silicon photonic chip 130. The fan-out device 140 is arranged between the multiple groups of optical transmission devices 120 and the silicon photonic chip 130 to fan out the light beams emitted from the multiple groups of optical transmission devices 120 to the optical waveguide channels of the silicon photonic chip 130. A plurality of optical transmission channels 141 are arranged in the fan-out device 140. Each optical transmission channel 141 transmits light emitted from one of the optical transmission devices 120. The position of an incident port 142 of each optical transmission channel 141 matches the position of the corresponding optical transmission device 120. The position of an exit port 143 of the optical transmission channel 141 matches the position of the entrance of the corresponding optical waveguide channel of the silicon photonic chip 130.

[0036] Specifically, in this embodiment, a fan-out device 140 is arranged between the optical transmission device 120 and the silicon photonic chip 130, and a plurality of optical transmission channels 141 are arranged in the fan-out device 140. The incident port 142 of each optical transmission channel 141 matches the position of the optical transmission device 120, and the exit port 143 of each optical transmission device 120 matches the entrance position of the optical waveguide channel of the silicon photonic chip 130. In this way, the size of the optical transmission device 120 and the gap between each optical transmission device 120 are not restricted by the optical waveguide channel of the silicon photonic chip 130, and structural interference will not occur, nor will the gap between the optical waveguide channels of the silicon photonic chip 130 be restricted from further narrowing. The coupling requirements are met while the integration and miniaturization of the silicon photonic chip 130 are met.

[0037] In addition, in this embodiment, since the incident port 142 of the optical transmission channel 141 of the fan-out device 140 can match the position of the optical transmission device 120, the distance and size between the optical transmission devices 120 are not affected by miniaturization, and public mold parts can be used without additional customized structures, thereby reducing costs.

[0038] As a specific embodiment of the utility model, each group of optical transmission devices 120 in this embodiment may include a first lens 121, an isolator 122, and a second lens 123 arranged in sequence. The laser emitted from one of the lasers 110 passes through the first lens 121, the isolator 122, and the second lens 123 of the corresponding optical transmission device 120 in sequence and then enters the fan-out device 140.

[0039] Specifically, the first lens 121, the second lens 123 and the isolator 122 of this embodiment can all adopt products of current conventional sizes, without the need to customize additional small-sized products, and without structural interference, thereby satisfying coupling while reducing costs.

[0040] Specifically, the incident port 142 of each light transmission channel 141 is located behind the second lens 123 of a corresponding group of light transmission devices 120 .

[0041] As a specific embodiment of the present invention, the position of the incident port 142 of each optical transmission channel 141 of the present embodiment corresponds to the position of the light beam emitted from the second lens 123 of the corresponding optical transmission device 120 to the fan-out device 140 .

[0042] Specifically, since the light beam is emitted from the laser 110, the position of the light beam emitted after passing through the first lens 121, the isolator 122 and the second lens 123 is determined by the position of the laser 110 and the optical transmission device 120. Of course, when the size of the light beam changes, the position where it irradiates the fan-out device 140 will also change. In this embodiment, the position of the incident port 142 corresponds to the position of the light beam emitted from the second lens 123, ensuring that the light beam emitted from the second lens 123 will inevitably irradiate the incident port 142 of the optical transmission channel 141, avoiding coupling failure.

[0043] Specifically, the optical transmission channel 141 of this embodiment is an arc-shaped channel. Since the incident port 142 and the exit port 143 of the optical transmission channel 141 are not on the same straight line, in order to ensure that the light beam reaches the exit port 143 smoothly from the incident port 142, the position inside the optical transmission channel 141 needs to be changed, and the broken line will cause light loss. Therefore, this embodiment is formed into an arc-shaped channel to minimize the light loss caused by the structure of the channel.

[0044] As a specific embodiment of the present invention, Figure 2 and Figure 3 As shown, the size of the incident port 142 of each optical transmission channel 141 of the present embodiment matches the size of the corresponding light beam incident to the fan-out device 140 , and the size of the exit port 143 of the optical transmission channel 141 matches the size of the entrance of the corresponding optical waveguide channel of the silicon photonic chip 130 .

[0045] Specifically, the size in this embodiment is the size of the mold spot. The size in this embodiment is not a size in the physical sense, but a function. The physical sizes of the incident port 142 and the exit port 143 of the light transmission channel 141 correspond to the size of the mold spot.

[0046] Generally speaking, in the process of light being emitted from the second lens 123 and then entering the optical transmission channel 141 of the fan-out device 140, or in the process of light being emitted from the fan-out device 140 and then entering the silicon photonic chip 130, if the mode spot size of the incident port 142 of the optical transmission channel 141 is significantly different from the mode spot size of the light, and the mode spot size of the light beam emitted from the fan-out device 140 is significantly different from the mode spot size of the optical waveguide channel incident to the silicon photonic chip 130, it will cause size mismatch, thereby resulting in low light coupling efficiency. In this embodiment, the size of the incident port 142 of each optical transmission channel 141 matches the size of the corresponding light beam incident on the fan-out device 140, and the size of the exit port 143 of the optical transmission channel 141 matches the size of the entrance of the corresponding optical waveguide channel of the silicon photonic chip 130. This can effectively solve the problem of light spot mismatch caused by the difference in mode spot size of the light when the light beam enters from the optical transmission device 120 to the fan-out device 140, and when the light beam enters from the fan-out device 140 to the silicon photonic chip 130, thereby improving the overall coupling efficiency and coupling tolerance and compensating for the loss.

[0047] As a specific embodiment of the present invention, the size of the pattern spot of each light transmission channel 141 in this embodiment changes gradually from the incident port 142 to the exit port 143 .

[0048] Specifically, the size of the pattern spots of the incident port 142 and the exit port 143 of the optical transmission channel 141 of this embodiment is different, so the size inside the channel will inevitably change. A sudden change in the size inside the channel will lead to light loss. The pattern spot size of the optical transmission channel 141 of this embodiment changes gradually, minimizing the loss of light when it is transmitted in the optical transmission channel 141 as much as possible.

[0049] As a specific embodiment of the present invention, the pattern spot size of the incident port 142 of each optical transmission channel 141 of this embodiment is larger than the pattern spot size of the exit port 143 , and the pattern spot size of the optical transmission channel 141 gradually decreases from the incident port 142 to the exit port 143 .

[0050] Specifically, since the pattern spot size of the incident port of the optical waveguide channel of the silicon photonic chip 130 of this embodiment is smaller than the pattern spot size of the light emitted from the second lens 123, the pattern spot size of the incident port 142 of each optical transmission channel 141 of this embodiment is larger than the pattern spot size of the exit port 143, and the pattern spot size of the optical transmission channel 141 gradually decreases from the incident port 142 to the exit port 143, so that the pattern spot size of the light beam when passing through the fan-out device 140 matches the pattern spot size of the devices before and after as much as possible, and the light energy loss is reduced.

[0051] As a specific embodiment of the present invention, the material of the fan-out device 140 of this embodiment is selected from glass or silicon.

[0052] Specifically, when the material of the fan-out device 140 is selected from glass, a light transmission channel 141 with a corresponding pattern spot size, number, position and orientation can be punched in the glass by a femtosecond laser. When the material of the fan-out device 140 is selected from silicon, a light transmission channel 141 with a corresponding pattern spot size, number, position and orientation can be gradually formed during the silicon deposition process.

[0053] As a specific embodiment of the present invention, this embodiment may also disclose a communication device, which may include the coupling device 100 of the laser and the silicon photonic chip described above.

[0054] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A coupling device for a laser and a silicon photonic chip, characterized in that: include: Multiple lasers; A plurality of groups of optical transmission devices, each group of the optical transmission devices being arranged corresponding to the laser to transmit the corresponding light beam of the laser; A silicon photonic chip having multiple optical waveguide channels disposed therein; and A fan-out device is arranged between the multiple groups of optical transmission devices and the silicon photonic chip to fan out the light beams emitted from the multiple groups of optical transmission devices to the optical waveguide channel of the silicon photonic chip; multiple optical transmission channels are arranged in the fan-out device, each of the optical transmission channels corresponds to the transmission of light emitted from one group of the optical transmission devices, the position of the incident port of each optical transmission channel matches the position of the corresponding optical transmission device, and the position of the exit port of the optical transmission channel matches the position of the entrance of the corresponding optical waveguide channel of the silicon photonic chip.

2. The coupling device of a laser and a silicon photonic chip according to claim 1, characterized in that: Each group of the optical transmission devices comprises a first lens, an isolator, and a second lens which are arranged in sequence, and the laser light emitted from one of the lasers passes through the first lens, the isolator, and the second lens of the corresponding optical transmission device in sequence before entering the fan-out device; The incident port of each of the light transmission channels is located behind a corresponding group of the second lenses of the light transmission devices.

3. The coupling device of a laser and a silicon photonic chip according to claim 2, characterized in that: The incident port position of each of the light transmission channels corresponds to the position of the light beam emitted from the second lens of the corresponding light transmission device to the fan-out device.

4. The coupling device of a laser and a silicon photonic chip according to claim 1, characterized in that: The light transmission channel is an arc-shaped channel.

5. The coupling device of a laser and a silicon photonic chip according to any one of claims 1 to 4, characterized in that: The size of the incident port of each optical transmission channel matches the size of the corresponding light beam incident to the fan-out device, and the size of the exit port of the optical transmission channel matches the size of the entrance of the corresponding optical waveguide channel of the silicon photonic chip.

6. The coupling device of a laser and a silicon photonic chip according to claim 5, characterized in that: The dimensions mentioned are mold spot dimensions.

7. The coupling device of a laser and a silicon photonic chip according to claim 6, characterized in that: The size of the pattern spot of each of the light transmission channels changes gradually from the incident port to the exit port.

8. The coupling device of a laser and a silicon photonic chip according to claim 6, characterized in that: The pattern spot size of the incident port of each of the light transmission channels is larger than the pattern spot size of the exit port, and the pattern spot size of the light transmission channel gradually decreases from the incident port to the exit port.

9. The coupling device of a laser and a silicon photonic chip according to any one of claims 1 to 4, characterized in that: The fan-out device is made of glass or silicon.

10. A communication device, characterized in that: A coupling device comprising the laser and silicon photonic chip as described in any one of claims 1 to 9.

Images