Light window tube cap and light emitting device

By setting up ball planting grooves on the outer edge of the light window tube cap and using ball planting welding technology, the pores and cracks caused by the welding method in the existing technology are solved, and a more regular and beautiful weld distribution and higher packaging airtightness are achieved.

CN222814794UActive Publication Date: 2025-04-29SHENZHEN JUFEI OPTOELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421604698.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-08
Publication Date
2025-04-29
Estimated Expiration
2034-07-08

AI Technical Summary

Technical Problem

When existing light emitting devices use light window tube caps to encapsulate chips, the melt welding method is prone to pores and cracks, which affects the airtightness of the packaging, and the welds are not beautiful and affects the appearance of the product.

Method used

A light window tube cap is designed, with a ball planting groove on its outer edge to be used for ball welding with the substrate to form a more regular and beautiful weld distribution, avoid pores and cracks, and ensure the airtightness of the packaging.

Benefits of technology

Through ball welding technology, the regular and beautiful distribution of the welds is achieved, the pores and cracks are avoided, and the airtightness and reliability of the packaging are improved.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222814794U_ABST
    Figure CN222814794U_ABST
Patent Text Reader

Abstract

The utility model provides a light window tube cap and a light emitting device, the light window tube cap comprises a tube shell, the tube shell comprises a side wall and an outer edge, the side wall encloses a cavity with two through ends, one end of the side wall is provided with the outer edge extending towards the circumferential side, the outer edge is provided with a ball mounting groove, the ball mounting groove penetrates through the outer edge along the wall thickness direction of the outer edge, and the wall thickness direction of the outer edge is larger than the wall thickness direction of the outer edge; the ball mounting groove is used for performing ball mounting welding on the outer edge and the substrate; and the light window blocks one end, far away from the outer edge, of the side wall. According to the light window pipe cap provided by the invention, the ball mounting groove is formed in the outer edge, so that ball mounting welding of the outer edge and the substrate can be facilitated, weld joints are more regular and attractive in distribution, meanwhile, undesirable phenomena such as air holes and cracks can be avoided, and the air tightness of packaging can be better ensured.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the field of semiconductor light sources, in particular to a light window tube cap and a light emitting device. Background Art

[0002] Some light-emitting devices currently on the market use light window caps to package chips. For example, a laser is directly used to weld the bottom edge of the light window cap to a substrate by fusion welding. In the process of implementing the present application, the inventors found that the fusion welding method is prone to pores and cracks, which affects the airtightness of the package. In addition, the welds are unsightly and irregular, which seriously affects the appearance of the product. Utility Model Content

[0003] One purpose of the utility model is to provide a light window tube cap, whose outer edge is provided with a ball planting groove, which can facilitate the ball planting welding of the outer edge and the substrate, making the weld distribution more regular and beautiful, while avoiding undesirable phenomena such as pores and cracks, and better ensuring the airtightness of the package.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] The technical solution of one aspect of the utility model proposes a light window tube cap, comprising: a light window tube cap, characterized in that it comprises: a tube shell, the tube shell comprises a side wall and an outer edge, the side wall encloses a cavity penetrated at both ends, one end of the side wall is provided with the outer edge extending toward the circumferential side, the outer edge is provided with a ball planting groove, the ball planting groove penetrates the outer edge along the wall thickness direction of the outer edge, the ball planting groove is used for ball planting welding between the outer edge and the substrate; a light window, sealed at one end of the side wall away from the outer edge.

[0006] According to some technical solutions of the present application, the ball planting groove is constructed around the outer circumference of the side wall into a circumferentially closed or circumferentially unclosed ring.

[0007] According to some technical solutions of the present application, the outer edge includes a transition portion, an outer edge portion and at least one connecting rib, one end of the transition portion is connected to one end of the side wall and forms a transition chamfer with the side wall, the outer edge portion is located at the end of the transition portion away from the side wall, and is arranged at a distance from the end of the transition portion away from the side wall, the interval between the outer edge portion and the transition portion serves as the ball planting groove, and the connecting rib is connected between the outer edge portion and the transition portion.

[0008] According to some technical solutions of the present application, there are multiple connecting ribs, and the multiple connecting ribs are arranged at intervals along the circumferential direction, and the ball planting grooves are formed between the connecting ribs adjacent to each other in the circumferential direction.

[0009] According to some technical solutions of the present application, the side wall is inclined relative to the outer edge, so that the width of the chamber surrounded by the side wall gradually increases from one end close to the outer edge to the end away from the outer edge; or the side wall is vertically arranged relative to the outer edge.

[0010] According to some technical solutions of the present application, the side wall is a straight tube or a conical tube that protrudes toward one side relative to the outer edge, at least a portion of the light window is nested in an end of the side wall away from the outer edge, and a connecting portion is provided between the side surface of the light window and the inner surface of the side wall to connect the light window and the side wall.

[0011] According to some technical solutions of the present application, an end surface is formed at one end of the side wall away from the outer edge, one end of the light window protrudes relative to the end surface to extend out of the cavity, and a portion of the connecting portion extends to the end surface and connects the side surface of the light window and the end surface.

[0012] According to some technical solutions of the present application, the connecting portion is a welding layer formed by welding.

[0013] The technical solution of another aspect of the present application proposes a light-emitting device, comprising: a substrate; a chip, arranged on the substrate; the light window cap described in any of the above technical solutions, the outer edge of the light window cap is abutted against the substrate, so that the light window cap and the substrate together form a packaging cavity for accommodating the chip, wherein a welding area is provided on the surface of the substrate, and the ball planting groove is opposite to the welding area; a ball planting welding part, at least a part of which is fixed in the ball planting groove and connected to the welding area.

[0014] According to some technical solutions of the present application, the ball implant welding part includes a plurality of solder joints, the solder joints are arranged in the ball implant groove, and adjacent solder joints are connected to each other; and / or the welding area is a metal plating layer formed on the surface of the substrate.

[0015] Some technical solutions of the present application provide a light window tube cap, in which one end of the side wall of the tube shell is sealed with a light window, and the other end of the side wall of the tube shell is provided with an outer edge extending toward the circumferential side, and the outer edge is provided with a ball planting groove which penetrates the outer edge along the wall thickness direction. In this way, the end of the tube shell provided with the outer edge can be abutted against the substrate, and a ball planting welding process is adopted to form a ball planting welding portion fixed in the ball planting groove, so as to weld the outer edge and the substrate ball together, thereby encapsulating the chip on the substrate. Compared with traditional fusion welding, the weld distribution is more regular and beautiful, and at the same time, it can avoid undesirable phenomena such as pores and cracks, thereby better ensuring the airtightness of the package.

[0016] The light-emitting devices provided by some technical solutions of the present application have all the above beneficial effects by being provided with the light window cap described in any of the above technical solutions, which will not be described in detail here.

[0017] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.

[0019] Figure 1 It is a schematic diagram of the cross-sectional structure of the light window tube cap in the first embodiment of the present application.

[0020] Figure 2 It is a schematic diagram of the main structure of the light window tube cap in Example 1 of the present application.

[0021] Figure 3 It is a schematic diagram of the main structure of the light window tube cap in some embodiments of the present application.

[0022] Figure 4 It is a schematic diagram of the cross-sectional structure of the light-emitting device in the second embodiment of the present application.

[0023] Figure 5 It is a schematic diagram of the cross-sectional structure of the light-emitting device in the second embodiment of the present application during the ball implantation and welding process.

[0024] Figure 6 It is a schematic diagram of the cross-sectional structure of the light-emitting device in some embodiments of the present application.

[0025] Figure 7 It is a schematic diagram of the cross-sectional structure of the light-emitting device in some embodiments of the present application.

[0026] Figure 8 It is a schematic diagram of the cross-sectional structure of the light-emitting device in some embodiments of the present application.

[0027] Fig. 9 It is a schematic diagram of the cross-sectional structure of the light-emitting device in some embodiments of the present application.

[0028] The reference numerals are as follows:

[0029] 10. tube shell; 11. side wall; 111. end face; 12. outer edge; 121. transition part; 122. outer edge; 123. connecting rib; 124. ball planting groove; 125. transition chamfer;

[0030] 20. Light window; 21. Packaging cavity;

[0031] 30. Connecting part;

[0032] 40. substrate; 41. circuit portion; 42. welding area; 43. conductive hole;

[0033] 50. Chip;

[0034] 60. Ball welding department;

[0035] 70. Solder pad;

[0036] 80. Ball planting nozzle;

[0037] 90. Planting spheres;

[0038] 100. Welding line. DETAILED DESCRIPTION

[0039] Although the present invention can be easily embodied in different forms of embodiments, only some of the specific embodiments are shown in the drawings and described in detail in this specification. It should be understood that this description should be regarded as an exemplary description of the principles of the present invention and is not intended to limit the present invention to that described herein.

[0040] Thus, a feature indicated in this specification will be used to illustrate one of the features of an embodiment of the utility model, rather than implying that each embodiment of the utility model must have the described feature. In addition, it should be noted that this specification describes many features. Although certain features can be combined together to illustrate possible system designs, these features can also be used in other combinations that are not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting. The multiple referred to in this specification can be understood as two or more.

[0041] In the embodiments shown in the drawings, the indications of directions (such as up, down, left, right, front, back, etc.) used to explain the structure and movement of various elements of the utility model are not absolute but relative. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions also change accordingly.

[0042] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that the description of the utility model will be more comprehensive and complete, and the concepts of the example embodiments will be fully conveyed to those skilled in the art. The accompanying drawings are only schematic illustrations of the utility model and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0043] Embodiment 1

[0044] This embodiment provides a light window cap, which is used to be connected to a substrate 40 to package a chip 50 on the substrate 40 .

[0045] like Figure 1 As shown, the light window tube cap includes a tube shell 10 and a light window 20 .

[0046] The tube shell 10 includes a side wall 11 and an outer edge 12. The side wall 11 forms a chamber with two ends passing through. The light window 20 is blocked at one end of the side wall 11. The end of the side wall 11 away from the light window 20 is provided with an outer edge 12 extending toward the circumferential side. The outer edge 12 is used to abut against the substrate 40 and be connected and fixed to the substrate 40 so as to encapsulate the chip 50 on the substrate 40 between the substrate 40 and the light window tube cap, and the light emitted by the chip 50 can be emitted through the light window 20. In addition, the structure in which the light window 20 is arranged at the end of the side wall 11 away from the outer edge 12 ensures that more sufficient space can be reserved between the light window 20 and the substrate 40 to accommodate the chip 50.

[0047] A ball planting groove 124 is provided on the outer edge 12, and the ball planting groove 124 penetrates the outer edge 12 along the wall thickness direction of the outer edge 12. The ball planting groove 124 is used for ball planting welding of the outer edge 12 and the substrate 40. For example, a ball planting welding method is adopted to construct a ball planting welding part 60 fixed in the ball planting groove 124, and the ball planting welding part 60 is used to realize the connection and fixation between the outer edge 12 and the substrate 40.

[0048] It can be understood that ball welding can also be called ball spray welding. Figure 5 It can be understood that during ball planting welding, the ball planting sphere 90 is transferred to the ball planting nozzle 80 of the ball planting welding equipment, and the ball planting sphere 90 placed on the ball planting nozzle 80 is instantly melted by the high pulse energy of the laser, and then the melted ball planting sphere 90 is sprayed into the ball planting groove 124 by the pressure of the inert gas, so that the ball planting groove 124 solidifies to form the ball planting welding part 60. Among them, since the ball planting sphere 90 does not contain flux, the laser heating and melting of the ball planting sphere 90 will not cause splashing, and it is not easy to have undesirable phenomena such as pores and cracks, which can better ensure the air tightness of the package, and at the same time, the solidified ball planting welding part 60 is full and smooth, and the weld distribution is more regular and beautiful, and no additional processes such as subsequent cleaning or surface treatment are required, so the processing is more efficient.

[0049] Optionally, the material of the ball 90 can be a metal or alloy such as a tin ball, a gold-tin alloy ball, etc. The ball diameter is not limited and can be selected according to the size of the ball groove 124. For example, the ball diameter of the ball is approximately equal to the width of the ball groove 124, or slightly smaller or slightly larger than the width of the ball groove 124.

[0050] The tube shell 10 may be a metal part made of metal material, for example, the tube shell 10 may be made of Kovar alloy.

[0051] Further optionally, the tube shell 10 can be integrally formed by stamping using a metal material, so that the tube shell 10 has higher processing efficiency and higher structural strength, and can better balance the cost and quality of the product.

[0052] like Figure 2 As shown, along the centerline direction of the tube shell 10, the side wall 11 can be surrounded by a rectangular cavity, the outer edge 12 can be arranged along the circumference of the side wall 11 to be roughly adapted to the outer shape of the side wall 11. The ball planting groove 124 can be constructed around the outer circumference of the side wall 11 as a circumferentially closed or circumferentially unclosed rectangular annular groove. In this way, for the rectangular light window cap, the ball planting groove 124 can be roughly rectangular. The ring is connected to the substrate 40, making the connection between the light window cap and the substrate 40 more stable and reliable. At the same time, the circumference of the outer edge 12 of the light window cap can also be sealed, thereby better ensuring the airtightness of the package. Correspondingly, the light window 20 can be arranged as a rectangular window adapted to the rectangular cavity.

[0053] Of course, the shape of the cavity formed by the side walls 11 of the tube shell 10 and the shape of the light window 20 are not limited to the following. Figure 2 In other embodiments, the shape of the cavity formed by the side walls 11 of the tube shell 10 and the shape of the light window 20 may also be set as follows: Figure 3 Alternatively, in other embodiments not shown in the drawings, the shape of the cavity formed by the sidewalls 11 of the tube housing 10 and the shape of the light window 20 can also be set to be an ellipse, a triangle, a rhombus, a trapezoid, a pentagon, a hexagon, or even other shapes not exhaustively listed here.

[0054] The shape of the outer edge 12 is not limited to the Figure 2 In other embodiments, the shape of the outer edge 12 may also be set as follows: Figure 3 The circular ring shown, correspondingly, the ball planting groove 124 can be a circular ring-shaped groove that is circumferentially closed or circumferentially open around the outer circumference of the side wall 11. Alternatively, in other embodiments not shown in the drawings, the shape of the outer edge 12 can also be set to an elliptical ring, a triangular ring, a diamond ring, a trapezoidal ring, a pentagonal ring, a hexagonal ring, or even other shapes that are not exhaustively listed here, and correspondingly, the shape formed by the ball planting groove 124 along the circumference is roughly adapted to the shape of the outer edge 12.

[0055] The outer edge 12 is not limited to Figure 2 and Figure 3 The shape shown is configured to match the cavity enclosed by the side wall 11. In other embodiments, the shape of the outer edge 12 and the shape of the cavity enclosed by the side wall 11 can form different combinations. For example, a rectangular ring-shaped outer edge 12 is provided on the outer periphery of one end of the circular side wall 11 to form a structure similar to a round earth and a square sky.

[0056] For example, in more detail, Figure 1 and Figure 2 It can be understood that the outer edge 12 includes a transition portion 121, an outer edge portion 122 and at least one connecting rib 123. One end of the transition portion 121 is connected to one end of the side wall 11 and forms a transition chamfer 125 with the side wall 11. The outer edge portion 122 is located at the end of the transition portion 121 away from the side wall 11 and is arranged at a distance from the end of the transition portion 121 away from the side wall 11. The interval between the outer edge portion 122 and the transition portion 121 serves as a ball planting groove 124. In this way, the ball planting groove 124 has a larger circumferential extension length and can form a larger connection area on the circumference of the outer edge 12, thereby better ensuring the connection reliability and airtightness of the package. The connecting rib 123 is connected between the outer edge portion 122 and the transition portion 121, and the connecting rib 123 is used to increase the connectivity between the outer edge portion 122 and the transition portion 121.

[0057] Optionally, there are multiple connecting ribs 123, and multiple connecting ribs 123 are arranged at intervals along the circumferential direction, and the ball planting groove 124 is formed between the circumferentially adjacent connecting ribs 123. By forming a circumferentially unclosed annular ball planting groove 124, and using multiple connecting ribs 123 to connect the outer edge portion 122 and the transition portion 121 respectively, the shape of the ball planting groove 124 can be better maintained, so that the outer edge portion 122 is not easy to shift, and the ball planting groove 124 is not easy to deform, so as to better ensure the connection reliability of the ball planting welding part to the outer edge 12 and the substrate 40, and ensure the aesthetics of the weld. Of course, in other embodiments, the outer edge portion 122 and the transition portion 121 can be connected in an overlapping manner by connecting ribs, for example, the lower surface of one end of the connecting rib overlaps and connects to a part of the upper surface of the outer edge portion 122, and the lower surface of the other end of the connecting rib overlaps and connects to a part of the upper surface of the transition portion 121, and the ball planting groove 124 is not separated by the connecting rib, thereby forming a circumferentially closed annular ball planting groove 124.

[0058] The specific number of connecting ribs 123 is not limited. Figure 2 As shown in the figure, the number of connecting ribs 123 is 4, so that the four connecting ribs 123 are used to connect the four sides of the rectangular annular outer edge portion 122 and the rectangular annular transition portion 121, so that the outer edge portion 122 and the transition portion 121 have good connectivity in four directions; or as shown in Figure 3 The number of connecting ribs 123 is shown as 3, so that the three connecting ribs 123 are used to connect the annular outer edge portion 122 and the annular transition portion 121. Preferably, the three connecting ribs 123 are arranged rotationally symmetrically, so that the outer edge portion 122 and the transition portion 121 have good connectivity in three directions. Of course, in other embodiments, the number of connecting ribs 123 can be set to 2, 5, 6, etc. according to needs, and will not be exhaustively listed here.

[0059] The light window 20 can be specifically a glass lens, and its material can be selected from quartz or sapphire. Figure 1 Of course, the present application is not limited thereto. In other embodiments, Figure 7 As shown, the light window 20 may also be configured as a hemispherical lens.

[0060] like Figure 1 As shown, the side wall 11 is a straight tube or a tapered tube that bulges toward one side relative to the outer edge 12, that is, the side wall 11 is a straight tube shape surrounded by straight walls, or a tapered tube shape surrounded by inclined walls. In this way, compared with the traditional TO-type metal tube shell light window, the side wall 11 is a straight tube or a tapered tube structure design, and no inner edge is formed at the end of the side wall 11 away from the outer edge 12. Accordingly, there is no problem of the inner edge blocking the light, which reduces the light loss of the light-emitting device and enables the light-emitting device to obtain a greater light output rate.

[0061] Alternatively, if Figure 1 As shown, the side wall 11 is vertically arranged relative to the outer edge 12, that is, the transition chamfer is arranged at a right angle, so that the light around the chip 50 can be vertically emitted along the inner surface of the side wall 11, thereby reducing the light loss of the chip 50 and improving the light extraction rate. Of course, the present application is not limited to this. In other embodiments, such as Figure 6 As shown, the side wall 11 is inclined relative to the outer edge 12. In other words, the side wall 11 and the outer edge 12 are roughly assembled to form an acute angle less than 90°, that is, the transition chamfer is set to an acute angle, so that the width of the cavity enclosed by the side wall 11 gradually increases from the end close to the outer edge 12 to the end away from the outer edge 12. In this way, the light emitted from the side of the chip 50 can be more effectively reflected to the position of the light window 20, and the light extraction efficiency is better than the case where the side wall 11 is vertically arranged relative to the outer edge 12, further reducing the light loss of the chip 50 and improving the light extraction rate.

[0062] Alternatively, if Figure 1 As shown, the width of the light window 20 can be slightly narrower than the width of the end of the chamber away from the outer edge 12, and the light window 20 is nested in the end of the side wall 11 away from the outer edge 12, and a connecting portion 30 is provided between the side surface of the light window 20 and the inner side surface of the side wall 11 to connect the light window 20 and the side wall 11. In this way, while ensuring a reliable connection between the light window 20 and the straight or conical side wall 11, the side wall 11 can also play a role in protecting and limiting the light window 20, reducing the risk of displacement and damage of the light window 20.

[0063] Optionally, the connection portion 30 is a welding layer formed by welding. That is, the side surface of the light window 20 is welded to the inner side surface of the side wall 11. Compared with the structure of bonding with organic glue, the welding layer is more firmly connected to the light window 20 and the side wall 11, and there will be no problem of the light window 20 falling off, and the problem of aging and failure of the organic glue due to long-term exposure to light can also be avoided, thereby ensuring the reliability of long-term fixation of the light window 20.

[0064] In more detail, the side surface of the window and the inner side surface of the side wall 11 may be welded by glass solder to form a welding layer.

[0065] Alternatively, if Figure 4 As shown, an end face 111 is formed at one end of the side wall 11 away from the outer edge 12, and one end of the light window 20 protrudes relative to the end face 111 to extend out of the cavity, that is, the height of the side wall 11 of the tube shell 10 will not be higher than the surface of the light window 20, so that the side light output of the chip 50 can be avoided to the greatest extent by the side wall 11, wherein a portion of the connecting portion 30 extends to the end face 111 and connects the side surface of the light window 20 with the end face 111, so that the connecting portion 30 extending to the end face 111 forms a circle of fillet welds around the protruding end of the light window 20, so as to firmly weld the side surface of the protruding end of the light window 20 to the end face 111, thereby further improving the reliability of the connection between the light window 20 and the side wall 11.

[0066] The light window cap provided in this embodiment has at least one of the following beneficial effects:

[0067] 1. The side wall 11 of the tube shell 10 is set to be in a straight tube or a conical tube shape. Compared with the light window 20 of the traditional TO-type tube shell 10, the inner edge of the tube shell 10 close to the light window 20 is cancelled, and the side surface of the light window 20 is welded to the inner side surface of the side wall 11, which ensures the reliability of the connection between the light window 20 and the tube shell 10, increases the light output area, and ensures the light output rate of the light window cap.

[0068] 2. A ball planting groove 124 is provided on the outer edge 12 of the tube shell 10 to position the ball planting welding portion formed by the ball planting ball 90 and improve the aesthetics of the product.

[0069] 3. By using the ball planting groove 124, the ball planting ball 90 can be dissolved and implanted in the ball planting groove 124, so as to realize convenient ball planting welding between the outer edge 12 and the substrate 40, which greatly avoids the problems of pores and cracks generated during the welding process of the existing laser melting welding method, and further improves the air tightness and reliability of the product.

[0070] Embodiment 2

[0071] This embodiment provides a light emitting device.

[0072] Light-emitting devices can be used to convert electrical energy into light for output. For example, light-emitting devices can be devices such as LEDs (light-emitting diodes), and more specifically, UV-LEDs (Ultraviolet-light-emitting diodes) that can be used to output ultraviolet light.

[0073] like Figure 4 As shown, the light emitting device includes a substrate 40, a chip 50, a light window cap, and a ball-planting welding part.

[0074] The chip 50 is a component that can convert electrical energy into light energy to emit light when powered on.

[0075] The material of the substrate 40 can be selected as a ceramic substrate material, such as aluminum nitride ceramic (ALN), gallium nitride ceramic (GaN), aluminum oxide ceramic (Al2O3), silicon carbide ceramic (SiC), etc.

[0076] The substrate 40 may be configured to be a plate with a certain wall thickness. The surface of the substrate 40 at one end along the wall thickness direction is defined as a first plate surface, and the surface of the substrate 40 at the other end along the wall thickness direction is defined as a second plate surface.

[0077] A circuit portion 41 and a welding area 42 are arranged on the first surface of the substrate 40, a soldering pad 70 is arranged on the second surface of the substrate 40, and a conductive hole 43 is also arranged on the substrate 40 that penetrates the substrate 40 along the wall thickness direction of the substrate 40. The circuit portion 41 is electrically connected to the soldering pad 70 through the conductive hole 43.

[0078] Optionally, the circuit portion 41 and the welding area 42 are both metal plating layers formed on the first board surface of the substrate 40. The circuit portion 41 and the welding area 42 can be integrally formed on the substrate 40 by DPC (direct copper plating technology). The circuit portion 41 is connected to the pad 70 through the conductive hole 43, which will play a conductive role, and the welding area 42 does not need to be used for conductive purposes, but is only used for welding.

[0079] like Figure 4 As shown, the light window tube cap includes a tube shell 10 and a light window 20 .

[0080] The tube shell 10 includes a side wall 11 and an outer edge 12. The side wall 11 forms a chamber with two ends passing through. The light window 20 is blocked at one end of the side wall 11. The end of the side wall 11 away from the light window 20 is provided with an outer edge 12 extending toward the circumferential side. The outer edge 12 is used to abut against the substrate 40 and be connected and fixed to the substrate 40 so as to encapsulate the chip 50 on the substrate 40 between the substrate 40 and the light window tube cap, and the light emitted by the chip 50 can be emitted through the light window 20. In addition, the structure in which the light window 20 is arranged at the end of the side wall 11 away from the outer edge 12 ensures that more sufficient space can be reserved between the light window 20 and the substrate 40 to accommodate the chip 50.

[0081] The outer edge 12 is provided with a ball planting groove 124, and the ball planting groove 124 penetrates the outer edge 12 along the wall thickness direction of the outer edge 12. The outer edge 12 of the light window cap is close to the substrate 40, so that the light window cap and the substrate 40 are surrounded to form a packaging cavity 21 for accommodating the chip 50, wherein the combination Figure 4 and Figure 5 It can be understood that the ball planting groove 124 is opposite to the welding area 42, and the ball planting welding part is a structure fixed in the ball planting groove 124 constructed by ball planting welding. At least a part of the ball planting welding part 60 is fixed in the ball planting groove 124 and connected to the welding area 42, thereby realizing the connection and fixation between the outer edge 12 and the substrate 40.

[0082] Optionally, the outer edge 12 may be directly placed against the welding area 42 of the substrate 40 to better ensure that the ball planting groove 124 is opposite to the welding area 42 .

[0083] It can be understood that ball welding can also be called ball spray welding. Figure 5 It can be understood that during ball planting welding, the ball planting sphere 90 is transferred to the ball planting nozzle 80 of the laser ball planting machine, and the ball planting sphere 90 placed on the ball planting nozzle 80 is instantly melted by the high pulse energy of the laser, and then the melted ball planting sphere 90 is sprayed into the ball planting groove 124 by the pressure of the inert gas, so that the ball planting groove 124 solidifies to form the ball planting welding part 60. Among them, since the ball planting sphere 90 does not contain flux, the laser heating and melting of the ball planting sphere 90 will not cause splashing, and it is not easy to have undesirable phenomena such as pores and cracks, which can better ensure the air tightness of the package, and at the same time, the solidified ball planting welding part 60 is full and smooth, and the weld distribution is more regular and beautiful, and no additional processes such as subsequent cleaning or surface treatment are required, so the processing is more efficient.

[0084] Optionally, the material of the ball 90 can be a metal or alloy such as a tin ball, a gold-tin alloy ball, etc. The ball diameter is not limited and can be selected according to the size of the ball groove 124. For example, the ball diameter is approximately equal to the width of the ball groove 124, or slightly smaller or slightly larger than the width of the ball groove 124.

[0085] Optionally, the ball implant welding part 60 includes a plurality of welding points, which are arranged in the ball implant groove 124 and connected to each other. The ball implant welding part 60 is full and smooth, and the weld distribution is more regular and beautiful, and it is not easy to have undesirable phenomena such as pores and cracks.

[0086] The tube shell 10 may be a metal part made of metal material, for example, the tube shell 10 may be made of Kovar alloy.

[0087] Further optionally, the tube shell 10 can be integrally formed by stamping using a metal material, so that the tube shell 10 has higher processing efficiency and higher structural strength, and can better balance the cost and quality of the product.

[0088] Combination Figure 2 It can be understood that, viewed along the centerline direction of the tube shell 10, the side wall 11 can be surrounded by a rectangular cavity, the outer edge 12 can be arranged along the circumference of the side wall 11 to be roughly adapted to the outer shape of the side wall 11. The ball planting groove 124 can be constructed around the outer circumference of the side wall 11 as a circumferentially closed or circumferentially unclosed rectangular annular groove. In this way, for the rectangular light window cap, the ball planting groove 124 can be roughly rectangular. The ring is connected to the substrate 40, making the connection between the light window cap and the substrate 40 more stable and reliable. At the same time, the circumference of the outer edge 12 of the light window cap can also be sealed, thereby better ensuring the airtightness of the package. Accordingly, the light window 20 can be arranged as a rectangular window adapted to the rectangular cavity.

[0089] Of course, the shape of the cavity formed by the side walls 11 of the tube shell 10 and the shape of the light window 20 are not limited to the following. Figure 2 In other embodiments, the shape of the cavity formed by the side walls 11 of the tube shell 10 and the shape of the light window 20 may also be set as follows: Figure 3 Alternatively, in other embodiments not shown in the drawings, the shape of the cavity formed by the sidewalls 11 of the tube housing 10 and the shape of the light window 20 can also be set to be an ellipse, a triangle, a rhombus, a trapezoid, a pentagon, a hexagon, or even other shapes not exhaustively listed here.

[0090] The shape of the outer edge 12 is not limited to the Figure 2 In other embodiments, the shape of the outer edge 12 may also be set as follows: Figure 3 The circular ring shown, correspondingly, the ball planting groove 124 can be a circular ring-shaped groove that is circumferentially closed or circumferentially open around the outer circumference of the side wall 11. Alternatively, in other embodiments not shown in the drawings, the shape of the outer edge 12 can also be set to an elliptical ring, a triangular ring, a diamond ring, a trapezoidal ring, a pentagonal ring, a hexagonal ring, or even other shapes that are not exhaustively listed here, and correspondingly, the shape formed by the ball planting groove 124 along the circumference is roughly adapted to the shape of the outer edge 12.

[0091] The outer edge 12 is not limited to Figure 2 and Figure 3 The shape shown is configured to match the cavity enclosed by the side wall 11. In other embodiments, the shape of the outer edge 12 and the shape of the cavity enclosed by the side wall 11 can form different combinations. For example, a rectangular ring-shaped outer edge 12 is provided on the outer periphery of one end of the circular side wall 11 to form a structure similar to a round earth and a square sky.

[0092] In more detail, the outer edge 12 includes a transition portion 121, an outer edge portion 122 and at least one connecting rib 123. One end of the transition portion 121 is connected to one end of the side wall 11 and forms a transition chamfer 125 with the side wall 11. The outer edge portion 122 is located at the end of the transition portion 121 away from the side wall 11 and is arranged at a distance from the end of the transition portion 121 away from the side wall 11. The distance between the outer edge portion 122 and the transition portion 121 serves as a ball planting groove 124. In this way, the ball planting groove 124 has a larger circumferential extension length and can form a larger connection area on the circumference of the outer edge 12, thereby better ensuring the connection reliability and airtightness of the package. The connecting rib 123 is connected between the outer edge portion 122 and the transition portion 121, and the connecting rib 123 is used to increase the connectivity between the outer edge portion 122 and the transition portion 121.

[0093] Optionally, there are multiple connecting ribs 123, which are arranged at intervals along the circumferential direction, and the ball planting grooves 124 are formed between the circumferentially adjacent connecting ribs 123. By using multiple connecting ribs 123 to connect the outer edge portion 122 and the transition portion 121 respectively, the shape of the ball planting groove 124 can be better maintained, so that the outer edge portion 122 is not easily displaced, and the ball planting groove 124 is not easily deformed, so that the connection reliability of the ball planting welding portion to the outer edge 12 and the substrate 40 can be better guaranteed, and the aesthetics of the weld can be guaranteed.

[0094] The specific number of connecting ribs 123 is not limited. Figure 2 As shown in the figure, the number of connecting ribs 123 is 4, so that the four connecting ribs 123 are used to connect the four sides of the rectangular annular outer edge portion 122 and the rectangular annular transition portion 121, so that the outer edge portion 122 and the transition portion 121 have good connectivity in four directions; or as shown in Figure 3 The number of connecting ribs 123 is shown as 3, so that the three connecting ribs 123 are used to connect the annular outer edge portion 122 and the annular transition portion 121. Preferably, the three connecting ribs 123 are arranged rotationally symmetrically, so that the outer edge portion 122 and the transition portion 121 have good connectivity in three directions. Of course, in other embodiments, the number of connecting ribs 123 can be set to 2, 5, 6, etc. according to needs, and will not be exhaustively listed here.

[0095] The light window 20 can be specifically a glass lens, and its material can be selected from quartz or sapphire. Figure 1 Of course, the present application is not limited thereto. In other embodiments, Figure 7 As shown, the light window 20 may also be configured as a hemispherical lens.

[0096] like Figure 4 As shown, the side wall 11 is a straight tube or a tapered tube that bulges toward one side relative to the outer edge 12, that is, the side wall 11 is a straight tube shape surrounded by straight walls, or a tapered tube shape surrounded by inclined walls. In this way, compared with the traditional TO-type metal tube shell light window, the side wall 11 is a straight tube or a tapered tube structure design, and no inner edge is formed at the end of the side wall 11 away from the outer edge 12. Accordingly, there is no problem of the inner edge blocking the light, which reduces the light loss of the light-emitting device and enables the light-emitting device to obtain a greater light output rate.

[0097] Alternatively, if Figure 4 As shown, the side wall 11 is vertically arranged relative to the outer edge 12, that is, the transition chamfer is arranged at a right angle, so that the light around the chip 50 can be vertically emitted along the inner surface of the side wall 11, thereby reducing the light loss of the chip 50 and improving the light extraction rate. Of course, the present application is not limited to this. In other embodiments, such as Figure 6 As shown, the side wall 11 is inclined relative to the outer edge 12. In other words, the side wall 11 and the outer edge 12 are roughly assembled to form an acute angle less than 90°, that is, the transition chamfer is set to an acute angle, so that the width of the cavity enclosed by the side wall 11 gradually increases from the end close to the outer edge 12 to the end away from the outer edge 12. In this way, the light emitted from the side of the chip 50 can be more effectively reflected to the position of the light window 20, and the light extraction efficiency is better than the case where the side wall 11 is vertically arranged relative to the outer edge 12, further reducing the light loss of the chip 50 and improving the light extraction rate.

[0098] Alternatively, if Figure 4 As shown, the width of the light window 20 can be slightly narrower than the width of the end of the chamber away from the outer edge 12, and the light window 20 is nested in the end of the side wall 11 away from the outer edge 12, and a connecting portion 30 is provided between the side surface of the light window 20 and the inner side surface of the side wall 11 to connect the light window 20 and the side wall 11. In this way, while ensuring a reliable connection between the light window 20 and the straight or conical side wall 11, the side wall 11 can also play a role in protecting and limiting the light window 20, reducing the risk of displacement and damage of the light window 20.

[0099] Optionally, the connection portion 30 is a welding layer formed by welding. That is, the side surface of the light window 20 is welded to the inner side surface of the side wall 11. Compared with the structure of bonding with organic glue, the welding layer is more firmly connected to the light window 20 and the side wall 11, and there will be no problem of the light window 20 falling off, and the problem of aging and failure of the organic glue due to long-term exposure to light can also be avoided, thereby ensuring the reliability of long-term fixation of the light window 20.

[0100] Alternatively, if Figure 4 As shown, an end face 111 is formed at one end of the side wall 11 away from the outer edge 12, and one end of the light window 20 protrudes relative to the end face 111 to extend out of the cavity, that is, the height of the side wall 11 of the tube shell 10 will not be higher than the surface of the light window 20, so that the side light output of the chip 50 can be avoided to the greatest extent by the side wall 11, wherein a portion of the connecting portion 30 extends to the end face 111 and connects the side surface of the light window 20 with the end face 111, so that the connecting portion 30 extending to the end face 111 forms a circle of fillet welds around the protruding end of the light window 20, so as to firmly weld the side surface of the protruding end of the light window 20 to the end face 111, thereby further improving the reliability of the connection between the light window 20 and the side wall 11.

[0101] The chip 50 is disposed on the substrate 40, and the chip 50 is electrically connected to the circuit portion 41. For example, Figure 4 As shown, the chip 50 is a flip chip 50 , and the electrodes of the chip 50 are connected to the circuit portion 41 of the substrate 40 through a eutectic process, thereby achieving fixation of the chip 50 and the substrate 40 and electrical connection of the chip 50 .

[0102] For example, the packaging process steps of the light emitting device using a flip chip 50 include:

[0103] S1. Chip bonding: Apply flux to the circuit portion 41 of the substrate 40, and fix the chip 50 at the position with the flux, wherein the flux acts as a medium for eutectic, so that the chip 50 and the substrate 40 can be better bonded during eutectic welding. Of course, in other embodiments, the flux may not be used, and the chip 50 and the substrate 40 may be directly eutectic welded; optionally, the pad 70 of the flip chip 50 may be a gold-tin alloy; the surface of the circuit portion 41 of the substrate 40 is plated with nickel and gold, wherein the thickness of the nickel and gold plated on the surface of the circuit portion 41 of the substrate 40 satisfies: nickel>3um, gold>0.05um.

[0104] S2, eutectic welding: the substrate 40 with the chip 50 fixed thereon is passed through a eutectic furnace to firmly bond the chip 50 to the substrate 40. The eutectic furnace has at least one temperature zone between 280°C and 340°C. For the case where the melting point of the gold-tin alloy is 280°C, a better eutectic welding effect is achieved, and the eutectic process is preferably protected by vacuum or nitrogen to reduce the welding void rate of the chip 50 and prevent the high-temperature oxidation of the chip 50 electrodes.

[0105] S3 , covering the light window cap: Cover the light window cap on the surface of the substrate 40 , so that the outer edge 12 of the bottom of the light window cap contacts the welding area 42 on the surface of the substrate 40 .

[0106] S4, laser implantation (such as Figure 5 As shown): a laser ball planting machine is used to melt and spray the ball planting sphere 90 into the ball planting groove 124 of the light window cap, so that the light window cap and the substrate 40 are tightly welded.

[0107] Of course, the present application is not limited thereto. In other embodiments, Figure 8 As shown, the chip 50 may also be a vertical chip 50, one electrode of the chip 50 is bonded to a circuit portion 41 of the substrate 40 by a die-bonding adhesive, and the other electrode of the chip 50 is connected to another circuit portion 41 of the substrate 40 by a bonding wire 100; or, in other embodiments, as Fig. 9 As shown, the chip 50 can also be a positive chip 50, the chip 50 is bonded to the substrate 40 by a die-bonding adhesive, one electrode of the chip 50 is connected to a circuit portion 41 of the substrate 40 by a welding wire 100, and the other electrode of the chip 50 is connected to another circuit portion 41 of the substrate 40 by a welding wire 100.

[0108] For example, the packaging process steps of the light emitting device using a vertical chip 50 or a face-up chip 50 include:

[0109] S1. Chip bonding: Apply bonding glue on the circuit portion 41 of the substrate 40, and fix the chip 50 at the position with the bonding glue, wherein the bonding glue acts as solder to bond the chip 50 to the substrate 40. The bonding glue used for the upright chip 50 can be an insulating glue or a silver glue with a conductive function, and the bonding glue used for the vertical chip 50 is a silver glue with a conductive function. Afterwards, high-temperature baking is performed to solidify the bonding glue so that the chip 50 is bonded to the substrate 40. Optionally, the surface of the circuit portion 41 of the substrate 40 is plated with nickel-palladium-gold to facilitate wire bonding between the chip 50 and the circuit portion 41 of the substrate 40, wherein the thickness of the nickel-palladium-gold plating on the surface of the circuit portion 41 of the substrate 40 satisfies: nickel>3um, palladium>0.05um, and gold>0.05um.

[0110] S2, wire bonding: Use a wire bonding machine to connect the electrodes of the chip 50 and the circuit portion 41 of the substrate 40 by means of bonding wires 100.

[0111] S3 , covering the light window cap: Cover the light window cap on the surface of the substrate 40 , so that the outer edge 12 of the bottom of the light window cap contacts the welding area 42 on the surface of the substrate 40 .

[0112] S4, laser ball planting: Use a laser ball planting machine to melt the ball planting sphere 90 and spray it into the ball planting groove 124 of the light window cap, so that the light window cap and the substrate 40 are tightly welded.

[0113] The light emitting device provided in this embodiment has at least one of the following beneficial effects:

[0114] 1. The side wall 11 of the tube shell 10 is set to be in a straight tube or a conical tube shape. Compared with the light window 20 of the traditional TO-type tube shell 10, the inner edge of the tube shell 10 close to the light window 20 is cancelled, and the side surface of the light window 20 is welded to the inner side surface of the side wall 11, which ensures the reliability of the connection between the light window 20 and the tube shell 10, increases the light output area, and ensures the light output rate of the light window cap.

[0115] 2. A ball planting groove 124 is provided on the outer edge 12 of the tube shell 10 to position the ball planting welding portion formed by the ball planting ball 90 and improve the aesthetics of the product.

[0116] 3. By using the ball planting groove 124, the ball planting ball 90 can be dissolved and implanted in the ball planting groove 124, so as to realize convenient ball planting welding between the outer edge 12 and the substrate 40, which greatly avoids the problems of pores and cracks generated during the welding process of the existing laser melting welding method, and further improves the air tightness and reliability of the product.

[0117] Although the utility model has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the utility model can be implemented in a variety of forms without departing from the spirit or essence of the utility model, it should be understood that the above-mentioned embodiments are not limited to any of the aforementioned details, but should be widely interpreted within the spirit and scope defined by the attached claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the attached claims.

Claims

1. A light window cap, characterized in that: include: A tube shell, the tube shell comprising a side wall and an outer edge, the side wall enclosing a chamber with two ends passing through, one end of the side wall being provided with the outer edge extending toward the peripheral side, the outer edge being provided with a ball planting groove, the ball planting groove passing through the outer edge along the wall thickness direction of the outer edge, the ball planting groove being used for ball planting welding between the outer edge and the substrate; A light window is blocked at an end of the side wall away from the outer edge.

2. The light window cap according to claim 1, characterized in that: The ball planting groove is configured around the outer circumference of the side wall to form a circumferentially closed or circumferentially unclosed ring.

3. The light window cap according to claim 1 or 2, characterized in that: The outer edge includes a transition portion, an outer edge portion and at least one connecting rib, one end of the transition portion is connected to one end of the side wall and forms a transition chamfer with the side wall, the outer edge portion is located at the end of the transition portion away from the side wall, and is arranged at a distance from the end of the transition portion away from the side wall, the interval between the outer edge portion and the transition portion serves as the ball planting groove, and the connecting rib is connected between the outer edge portion and the transition portion.

4. The light window cap according to claim 3, characterized in that: There are multiple connecting ribs, which are arranged at intervals along the circumferential direction, and the ball planting grooves are formed between the connecting ribs adjacent to each other in the circumferential direction.

5. The light window cap according to claim 1 or 2, characterized in that: The side wall is arranged obliquely relative to the outer edge, so that the width of the chamber surrounded by the side wall gradually increases from an end close to the outer edge to an end away from the outer edge; or The side wall is arranged perpendicularly relative to the outer edge.

6. The light window cap according to claim 1 or 2, characterized in that: The side wall is a straight tube or a conical tube that protrudes toward one side relative to the outer edge, at least a portion of the light window is embedded in an end of the side wall away from the outer edge, and a connecting portion is provided between the side surface of the light window and the inner surface of the side wall to connect the light window and the side wall.

7. The light window cap according to claim 6, characterized in that: An end surface is formed at one end of the side wall away from the outer edge, one end of the light window protrudes relative to the end surface to extend out of the cavity, and a portion of the connecting portion extends to the end surface and connects the side surface of the light window and the end surface.

8. The light window cap according to claim 6, characterized in that: The connecting portion is a welding layer formed by welding.

9. A light emitting device, characterized in that: include: substrate; A chip is arranged on the substrate; The light window cap according to any one of claims 1 to 8, wherein the outer edge of the light window cap is in contact with the substrate, so that the light window cap and the substrate together form a packaging cavity for accommodating the chip, wherein a welding area is provided on the surface of the substrate, and the ball planting groove is opposite to the welding area; The ball planting welding part, at least a part of which is fixed in the ball planting groove and connected to the welding area.

10. The light emitting device according to claim 9, characterized in that: The ball planting welding part includes a plurality of welding spots, the welding spots are arranged in an array in the ball planting groove, and adjacent welding spots are connected to each other; and / or The welding area is a metal plating layer formed on the surface of the substrate.