Epoxy resin packaging device for thermosensitive sheet
CN222819383UActive Publication Date: 2025-05-02HUNAN NAMI XIAOXIN SEMICON CO LTD
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Patent Information
- Application Number
- CN202421767266.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-24
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Figure CN222819383U_ABST
Abstract
The utility model provides a thermosensitive sheet epoxy resin packaging device, and relates to the technical field of thermosensitive sheet epoxy resin packaging. The thermosensitive sheet epoxy resin packaging device comprises a first horizontal driving mechanism and a second horizontal driving mechanism, a horizontal rotating mechanism is installed on the first horizontal driving mechanism, a positioning table is installed on the horizontal rotating mechanism, and the first horizontal driving mechanism is used for driving the positioning table to move in the first horizontal direction; an epoxy resin packaging mechanism and a visual sensing mechanism are installed on the second horizontal driving mechanism, the second horizontal driving mechanism is used for driving the epoxy resin packaging mechanism and the visual sensing mechanism to move in the second horizontal direction, and the visual sensing mechanism is used for obtaining a thermosensitive piece circuit of a thermosensitive piece to be packaged which is positioned and placed on the positioning table; and the horizontal rotating mechanism can drive the positioning table to horizontally rotate according to thermosensitive sheet circuit information acquired by the visual sensing mechanism. The epoxy resin packaging device for the thermosensitive sheet can improve the packaging quality of the thermosensitive sheet.
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