Epoxy resin packaging device for thermosensitive sheet

CN222819383UActive Publication Date: 2025-05-02HUNAN NAMI XIAOXIN SEMICON CO LTD
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Patent Information

Application Number
CN202421767266.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-24
Publication Date
2025-05-02
Estimated Expiration
2034-07-24

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Abstract

The utility model provides a thermosensitive sheet epoxy resin packaging device, and relates to the technical field of thermosensitive sheet epoxy resin packaging. The thermosensitive sheet epoxy resin packaging device comprises a first horizontal driving mechanism and a second horizontal driving mechanism, a horizontal rotating mechanism is installed on the first horizontal driving mechanism, a positioning table is installed on the horizontal rotating mechanism, and the first horizontal driving mechanism is used for driving the positioning table to move in the first horizontal direction; an epoxy resin packaging mechanism and a visual sensing mechanism are installed on the second horizontal driving mechanism, the second horizontal driving mechanism is used for driving the epoxy resin packaging mechanism and the visual sensing mechanism to move in the second horizontal direction, and the visual sensing mechanism is used for obtaining a thermosensitive piece circuit of a thermosensitive piece to be packaged which is positioned and placed on the positioning table; and the horizontal rotating mechanism can drive the positioning table to horizontally rotate according to thermosensitive sheet circuit information acquired by the visual sensing mechanism. The epoxy resin packaging device for the thermosensitive sheet can improve the packaging quality of the thermosensitive sheet.
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