Device for automatically moving, pressing and heating chip for testing
By designing an automatic moving down-pressure heating chip test device, the translation and down-pressure cylinder modules are used to achieve accurate movement of the heating cavity, which solves the problems of scalds and inaccurate testing caused by manual operations, and realizes automation and high accuracy of chip heating tests.
Patent Information
- Application Number
- CN202421527590.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-01
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-01
AI Technical Summary
During the heating test of existing chips, manual operation can easily lead to scalding, inaccurate test location and difficult to control the heating time, which may cause chip damage.
An automatic moving down-pressure heating chip test device is designed, using an X-axis translation module and a Y-axis down-pressure module to combine the translation cylinder and the down-pressure cylinder to achieve accurate movement and down-pressure of the heating chamber and complete the automatic heating test of the chip.
Complete automation of chip heating tests is achieved, improving the accuracy and safety of the tests and avoiding chip damage.
Smart Images
Figure CN222825584U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip processing, and particularly relates to a device for automatically moving, pressing and heating a chip for testing. Background Art
[0002] In the field of modern electronic technology, chips play a vital role as core components. With the continuous development of chip technology and the increasing integration, the requirements for its performance and reliability are becoming more and more stringent. Chip heating test is a key link in evaluating the performance and reliability of chips under different temperature conditions.
[0003] In actual applications, chips often face various temperature environments, from extremely high temperatures to low temperatures. Temperature changes may have a significant impact on the chip's electrical characteristics, logic functions, signal transmission, etc. Through chip heating testing, these different temperature scenarios can be simulated to gain a deeper understanding of the chip's operating status and stability within a specific temperature range.
[0004] In the existing chip testing process, the chip is continuously heated by manually holding a heating source. However, the manual heating test process can easily cause burns to workers and lead to inaccurate test positions during the test. The heating time of the chip is difficult to control during the heating process, which can easily cause damage to the chip. Utility Model Content
[0005] The embodiment of the utility model provides an automatic moving downward pressing and heating chip testing device to solve the problems in the prior art.
[0006] The embodiment of the utility model adopts the following technical scheme: an automatic moving downward pressing heating chip testing device, comprising a vertically arranged main board and a heating cavity for heating the chip for testing, a chip fixture for placing the chip for testing is provided at the upper position of the side wall of the main board, an X-axis translation module is provided at the lower position of the side wall of the main board, the X-axis translation module can drive the position of the heating cavity to move along the X-axis direction, a Y-axis pressing module is provided on the X-axis translation module, the Y-axis pressing module can drive the heating cavity to move along the Y-axis direction, and drive the heating cavity to move above the chip fixture.
[0007] The utility model can realize the accuracy of moving the heating cavity through the simultaneous operation of the translation cylinder and the downward pressure cylinder, accurately move the heating cavity to the chip fixture, and perform heating testing on the chip. During the test, full automation with high accuracy can be achieved, and the cylinder execution is highly accurate without causing damage to the chip test.
[0008] Furthermore, the X-axis translation module includes a translation cylinder, a base plate, a translation block, a translation plate and two slide rails. The base plate is horizontally arranged on the main board, the two slide rails are symmetrically arranged on the base plate, the translation plate is horizontally slidably connected to the two slide rails, the translation cylinder is arranged on the base plate, the translation block is connected to the telescopic end of the translation cylinder and the translation block is connected to the translation plate.
[0009] Furthermore, the Y-axis pressing module includes a pressing cylinder vertically arranged on a translation plate, a movable plate is provided on the telescopic end of the pressing cylinder, a horizontally arranged pressing plate is provided on the movable plate, and a horizontally arranged mounting plate is provided at the bottom of the pressing plate.
[0010] Furthermore, four heating cavities are provided at the bottom of the mounting plate.
[0011] Furthermore, the chip fixture is provided with four chip placement slots.
[0012] At least one of the above technical solutions adopted in the embodiment of the utility model can achieve the following beneficial effects:
[0013] The utility model can realize the accuracy of moving the heating cavity through the simultaneous operation of the translation cylinder and the downward pressure cylinder, accurately move the heating cavity to the chip fixture, and perform heating testing on the chip. During the test, full automation with high accuracy can be achieved, and the cylinder execution is highly accurate without causing damage to the chip test. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:
[0015] Figure 1 The three-dimensional structure of the utility model is shown in FIG. Figure 1 ;
[0016] Figure 2 The three-dimensional structure of the utility model is shown in FIG. Figure 2 ;
[0017] Figure 3 It is a sectional view of the three-dimensional structure in the utility model;
[0018] Reference numerals
[0019] Main board 1, heating chamber 2, chip fixture 3, chip placement slot 31, X-axis translation module 4, translation cylinder 41, bottom plate 42, translation block 43, translation plate 44, slide rail 45, Y-axis pressing module 5, pressing cylinder 51, moving plate 52, pressing plate 53, mounting plate 54. DETAILED DESCRIPTION
[0020] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] The technical solutions provided by various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.
[0022] Reference Figures 1 to 3 As shown, an embodiment of the utility model provides an automatic moving downward pressing heating chip testing device, comprising a vertically arranged main board 1 and a heating cavity 2 for heating the chip, a chip fixture 3 for placing the chip for testing is provided at the upper position of the side wall of the main board 1, an X-axis translation module 4 is provided at the lower position of the side wall of the main board 1, the X-axis translation module 4 can drive the position of the heating cavity 2 to move along the X-axis direction, a Y-axis pressing module 5 is provided on the X-axis translation module 4, the Y-axis pressing module 5 can drive the heating cavity 2 to move along the Y-axis direction, and drive the heating cavity 2 to move above the chip fixture 3.
[0023] Through the compact and simple cylinder combination, the chip function test of the test fixture can be realized continuously, and the sealed high temperature test can be carried out. It has a compact structure and high cost performance, and is suitable for equipment with multiple test stations.
[0024] Preferably, the X-axis translation module 4 comprises a translation cylinder 41, a bottom plate 42, a translation block 43, a translation plate 44 and two slide rails 45, wherein the bottom plate 42 is horizontally arranged on the main board 1, the two slide rails 45 are symmetrically arranged on the bottom plate 42, the translation plate 44 is horizontally slidably connected to the two slide rails 45, the translation cylinder 41 is arranged on the bottom plate 42, the translation block 43 is connected to the telescopic end of the translation cylinder 41 and the translation block 43 is connected to the translation plate 44; the Y-axis pressing module 5 comprises a pressing cylinder 51 vertically arranged on the translation plate 44, a moving plate 52 is arranged on the telescopic end of the pressing cylinder 51, a horizontally arranged lower pressing plate 53 is arranged on the moving plate 52, and a horizontally arranged mounting plate 54 is arranged at the bottom of the lower pressing plate 53. The mounting plate 54 is used for installing and placing the heating cavity 2.
[0025] During use, the translation cylinder 41 works to move the translation block 43, thereby driving the translation plate 44 to move on the two slide rails 45 along the X-axis direction, thereby driving the position of the heating chamber 2 to move along the X-axis direction, and moving the heating chamber 2 to the top of the chip fixture 3; then the pressing cylinder 51 works to drive the position of the moving plate 52 to move up and down, thereby driving the position of the pressing plate 53 to move, and moving the four heating chambers 2 at the bottom of the mounting plate 54 to the four IC chips on the chip fixture 3, and performing heating test operations on the IC chips. The simultaneous operation of the translation cylinder 41 and the pressing cylinder 51 can achieve the accuracy of the movement of the heating chamber 2, and the heating chamber 2 can be accurately moved to the chip fixture 3, and the chip can be heated and tested. During the test process, full automation can be achieved with high accuracy, and the cylinder execution is highly accurate, and no damage to the chip test will be caused.
[0026] Preferably, four heating cavities 2 are provided at the bottom of the mounting plate 54; four chip placement slots 31 are provided on the chip fixture 3; the chip placement slots 31 can be used to place IC chips so as to perform subsequent heating test operations on the IC chips, and the four heating cavities 2 can heat the chips in the four chip placement slots 31 respectively. During the use of the four chip placement slots 31, four chips can be tested at one time, which speeds up the work efficiency.
[0027] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.
Claims
1. An automatic moving downward heating chip testing device, characterized in that: It comprises a main board (1) arranged vertically and a heating chamber (2) for performing heating tests on chips, wherein a chip fixture (3) for placing chips for testing is provided on the upper part of the side wall of the main board (1); An X-axis translation module (4) is provided at the lower part of the side wall of the main board (1), and the X-axis translation module (4) can drive the position of the heating cavity (2) to move along the X-axis direction; The X-axis translation module (4) is provided with a Y-axis pressing module (5), and the Y-axis pressing module (5) can drive the heating cavity (2) to move along the Y-axis direction.
2. The device for automatically moving down-pressing and heating a chip for testing according to claim 1, characterized in that: The X-axis translation module (4) comprises a translation cylinder (41), a base plate (42), a translation block (43), a translation plate (44) and two slide rails (45); The bottom plate (42) is horizontally arranged on the main plate (1), the two slide rails (45) are symmetrically arranged on the bottom plate (42), and the translation plate (44) is horizontally slidably connected to the two slide rails (45); The translation cylinder (41) is arranged on a bottom plate (42), the translation block (43) is connected to the telescopic end of the translation cylinder (41), and the translation block (43) is connected to the translation plate (44).
3. The device for automatically moving down-pressing and heating a chip for testing according to claim 2, characterized in that: The Y-axis pressing module (5) comprises a pressing cylinder (51) vertically arranged on a translation plate (44), and a moving plate (52) is arranged on the telescopic end of the pressing cylinder (51); A horizontally arranged lower pressing plate (53) is provided on the movable plate (52), and a horizontally arranged mounting plate (54) is provided at the bottom of the lower pressing plate (53).
4. The device for automatically moving down-pressing and heating a chip for testing according to claim 3 is characterized in that: Four heating cavities (2) are provided at the bottom of the mounting plate (54).
5. The device for automatically moving down-pressing and heating a chip for testing according to claim 1, characterized in that: The chip fixture (3) is provided with four chip placement slots (31).