Optical coupler
By setting specific ridge position and curve equation on the reflector of the optocoupler, the problem of low efficiency caused by dispersion of radiation energy of the optocoupler is solved, and more efficient optical signal transmission is achieved.
Patent Information
- Application Number
- CN202421790189.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-26
AI Technical Summary
The radiation energy of existing optocouplers is relatively dispersed, resulting in lower efficiency.
An optical coupler is designed to provide a specific ridge position and curve equation on the reflector, so that the light emitted by the light emitting chip can be reflected more concentratedly on the light receiving chip, thereby improving the efficiency of the optical coupler.
Through this design, the efficiency of the optocoupler is increased to 23.44%, and the incident power is also increased to 0.012892W, which significantly improves the optical signal transmission performance.
Smart Images

Figure CN222825707U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical couplers, in particular to an optical coupler. Background Art
[0002] In a planar optocoupler, the light emitted by the light-emitting chip is reflected to the light-receiving chip through the reflective surface to realize the transmission of the optical signal. During the transmission of the optical signal, the propagation efficiency of the light determines the light energy received by the light-receiving chip, that is, the total light energy received by the light-receiving chip divided by the total light energy emitted by the light-emitting chip. Therefore, the structure of the reflective surface directly affects the light energy received by the light-receiving chip and the data transmission performance of the optocoupler.
[0003] In the Chinese patent application number CN201621236869.7, the patent name is optical coupler, after simulating the technology, it is found that its efficiency is 12.019%, the incident power is 0.0066106W, and it can be observed from the radiant illumination pseudo-color diagram of the light receiving chip, such as Figure 1 As shown, its radiation energy is dispersed and has no center, so its efficiency is relatively low and there is still much room for improvement. Utility Model Content
[0004] In view of the deficiencies of the prior art, the utility model provides an optical coupler, which solves the problem of relatively dispersed radiation energy of the optical coupler in the prior art leading to low efficiency.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] An optical coupler includes a light emitting chip and a light receiving chip for receiving light, and a plurality of pins for mounting the light emitting chip and the light receiving chip for connecting positive and negative electrodes, an external package body is provided on the plurality of pins, and a reflective component is provided on the plurality of pins for reflecting light emitted by the light emitting chip to the light receiving chip, the reflective component including:
[0007] A transparent inner package body, which is an optical reflective surface, is used to cover the light-emitting chip and the light-receiving chip, and reflect the light emitted by the light-emitting chip back into the inner package body;
[0008] A reflector, wherein the reflector is arranged on the inner package body at a position corresponding to the light-emitting chip and the light-receiving chip, the second connecting line between the light-emitting chip and the light-receiving chip is located on the plane where the ridge line on the reflector is located, and the reflector is provided with a first reflecting surface close to the light-emitting chip, the first reflecting surface is used to reflect the first light emitted by the light-emitting chip to the light-receiving chip, and the reflector is also provided with a second reflecting surface for reflecting the second light emitted by the light-emitting chip to the light-receiving chip.
[0009] Preferably, a first line between the two ends of the second reflecting surface is perpendicular to a second line between the light-emitting chip and the light-receiving chip, and the first line is located between the midpoints of the light-emitting chip and the second line, and endpoints of the first line are arranged on the bottom edge of the reflector, and the upper and lower heights of the second reflecting surface gradually decrease from the ridge line position of the reflector to both ends.
[0010] Preferably, the maximum height between the ridge line of the reflector and the bottom surface of the reflector is between 0.62 and 0.64 mm, the maximum length of the left and right sides of the bottom surface of the reflector is 1.94 to 1.96 mm, the maximum width of the front and rear sides of the bottom surface of the reflector is 1.49 to 1.51 mm, and the height between the bottom surface of the reflector and the bottom surface of the chip is between 0.34 and 0.36 mm.
[0011] Preferably, a spherical lens is provided on the light emitting chip.
[0012] Preferably, the lens body is also arranged on the light collecting chip.
[0013] Preferably, the normal line of the reflection point of the first light ray on the upper curved surface of the reflector passes through the midpoint of the second connecting line.
[0014] Preferably, the curve equation of the ridge line is:
[0015] Z=-0.4702x 6 -2.0621x 5 -3.5238x 4 -2.9914x 3 -1.7852x 2 -0.9713x
[0016] +7.0919
[0017] In the above formula, Z and x represent the z-axis coordinate and x-axis coordinate of any point on the ridge line, respectively.
[0018] Preferably, the curve equation of the first curve on the reflector surface that passes through the highest point of the ridge line and is perpendicular to the plane where the ridge line is located is:
[0019] Z=-2.6292y 6 +0.5244y 5 +1.1185y 4 -0.289y 3 -0.8854y 2 +0.0638y
[0020] +7.3663
[0021] In the above formula, y and z represent the y-axis coordinate and z-axis coordinate of any point on the first curve, respectively.
[0022] Compared with the prior art, the utility model provides an optical coupler with the following beneficial effects:
[0023] 1. By setting the ridge position of the reflector and the two curve equations of the reflector construction, the light emitted by the light-emitting chip can be reflected more concentratedly to the vicinity of the center position of the surface of the light-receiving chip, thereby making the light energy more concentrated, improving the efficiency and incident power of the optocoupler, and improving the optical signal transmission performance of the optocoupler.
[0024] 2. By setting up two lenses, on the one hand, the light-receiving chip and the light-emitting chip are fixed to prevent position displacement in subsequent processing. On the other hand, the first light is refracted when it is emitted and refracted again before being received by the light-receiving chip. The two refractions increase the concentration of the normal of the reflection point on the reflector on the bottom surface of the reflector and make it more concentrated at one point, thereby facilitating the control of the curvature radius and center of each position on the reflector and facilitating subsequent detection.
[0025] 3. By setting two curve equations, the construction of the reflector surface is concretized so that it can obtain the maximum efficiency and incident power as much as possible on the basis of meeting the existing optocoupler package size, thereby improving the optical signal transmission performance of the optocoupler. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0027] Figure 1 It is a false color image of the radiance of the light receiving chip in the prior art;
[0028] Figure 2 It is a three-dimensional structural diagram of the utility model;
[0029] Figure 3 It is a schematic diagram of the internal structure of the utility model;
[0030] Figure 4 A schematic diagram of the ridge line and the second connecting line of the utility model;
[0031] Figure 5 It is a schematic diagram of simulation results of the utility model;
[0032] Figure 6 It is a pseudo-color image of the radiance of the light-receiving chip of the utility model;
[0033] Figure 7 It is a schematic diagram of the first reflecting surface and the second reflecting surface of the utility model;
[0034] Figure 8 It is a side view of the reflector of the utility model;
[0035] Fig. 9 The figure is a schematic diagram of the optical path of a light beam of the present invention.
[0036] In the figure: 1. light-emitting chip; 2. light-receiving chip; 3. pins; 4. external package; 5. reflective component; 51. internal package; 52. reflector; 6. lens. DETAILED DESCRIPTION
[0037] The following will describe the implementation methods of the present application in detail with the help of accompanying drawings and examples, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.
[0038] In order to solve the problem of relatively dispersed radiation energy of optical couplers in the prior art resulting in low efficiency, the utility model provides an optical coupler, based on the irradiance pseudo-color map, to further concentrate the radiation energy of the optical coupler and improve the efficiency of the optical coupler, such as Figure 2 and Figure 3 As shown, it includes a light-emitting chip 1 and a light-receiving chip 2 for receiving light, and several pins 3 for connecting positive and negative electrodes for installing the light-emitting chip 1 and the light-receiving chip 2, and an external package 4 is provided on several pins 3. A reflective component 5 for reflecting the light emitted by the light-emitting chip 1 to the light-receiving chip 2 is provided on several pins 3. The external package 4 is an external sealing glue, which generally contains titanium dioxide and epoxy resin and has reflection and plastic sealing functions. The reflective component 5 is generally made of light-transmitting epoxy resin, and its main function is to transmit light and form a reflective structure. When doing optical simulation, for the convenience of setting, the reflective surface on the reflective component 5 is set as a reflector 52, and a good simulation effect and actual effect are achieved. The structure of the reflective component 5 is further described below:
[0039] The reflective assembly 5 is composed of an inner package 51 and a reflector 52, wherein the transparent inner package 51 is used as an optical reflective surface to cover the light-emitting chip 1 and the light-receiving chip 2 and reflect the light emitted by the light-emitting chip 1 back into the inner package 51; the reflector 52 is arranged on the inner package 51 at a position corresponding to the light-emitting chip 1 and the light-receiving chip 2, and the second connecting line between the light-emitting chip 1 and the light-receiving chip 2 is located on the plane where the ridge line on the reflector 52 is located, such as Figure 4As shown, in the cross section in the same vertical direction, the ridge line and the second connecting line are located in the same vertical plane, and the reflector 52 is provided with a first reflecting surface close to the light emitting chip 1, and the first reflecting surface is used to reflect the first light emitted by the light emitting chip 1 to the light receiving chip 2. The reflector 52 is also provided with a second reflecting surface for reflecting the second light emitted by the light emitting chip 1 to the light receiving chip 2. By further limiting the ridge line position of the reflecting surface, the light received by the light receiving chip 2 is concentrated at one point. At this time, the radiant illumination pseudo-color diagram of the light receiving chip 2 is as shown in FIG. Figure 5 and Figure 6 As shown, it can be clearly seen that the light energy received by the light-collecting chip 2 is significantly more concentrated, which effectively improves the light-collecting efficiency of the light-collecting chip 2 .
[0040] When optical modeling is performed using modeling software such as SolidWorks, the reflector 52 is close to the light receiving chip 2, that is, the light at the second reflecting surface is difficult to share a model with the first reflecting surface to complete the overall modeling. Therefore, it is necessary to model it separately. On the one hand, it can facilitate subsequent mold processing, and on the other hand, it can make the light receiving chip 2 receive part of the light that is difficult to simulate again, thereby improving efficiency. Figure 7 As shown, the first connecting line between the two ends of the second reflective surface is perpendicular to the second connecting line between the light emitting chip 1 and the light receiving chip 2. Because the ridge line is coplanar with the second connecting line, Figure 7 Although the second line is not drawn, it can be obtained that the first line is perpendicular to the second line, and the first line is located between the light-emitting chip 1 and the midpoint of the second line. The endpoints of the first line are set on the bottom edge of the reflector 52, and the upper and lower heights L2 of the second reflective surface gradually decrease from the ridge position of the reflector 52 to both ends, so as to achieve the complement and improvement of the reflector 52 in cooperation with the first reflective surface, thereby improving the light collection efficiency.
[0041] The size of the optocoupler package is limited by market factors. During the TracePRO simulation, it was found that when the efficiency was the highest, the reflector 52 exceeded the corresponding size limit. Therefore, while satisfying the optocoupler package size, further simulation was performed to obtain the size of the reflector 52 corresponding to the maximum efficiency, as shown in Figure 1. Figure 7 and Figure 8 As shown, the maximum height H1 between the ridge line of the reflector 52 and the bottom surface of the reflector 52 is between 0.62 and 0.64 mm, the maximum length L on the left and right sides of the bottom surface of the reflector 52 is between 1.94 and 1.96 mm, the maximum width W on the front and rear sides of the bottom surface of the reflector 52 is between 1.49 and 1.51 mm, and the height H2 between the bottom surface of the reflector 52 and the bottom surface of the chip is between 0.34 and 0.36 mm.
[0042] The light receiving chip 2 and the light emitting chip 1 may be misaligned during the processing, so it is necessary to improve their positioning accuracy to prevent offset during the processing. Since the light emitting chip 1 will gradually age during use, light attenuation will occur during the aging process, resulting in a weakening of the emitted light energy. In order to reduce the aging speed of the light emitting chip 1, a spherical lens body 6 is provided on the light emitting chip 1. Furthermore, in order to prevent the light receiving chip 2 and the light emitting chip 1 from being squeezed by the epoxy resin of the one-time plastic packaging, the same lens body 6 is also provided on the light receiving chip 2. In the case of the presence of two lens bodies 6, the light will be refracted by the lens body 6 when it is emitted and received, so that the normal of the reflection point of the first light on the curved surface of the reflector 52 can always pass through a point with a high probability. At this time, the reflector 52 is symmetrical front-to-back about the plane where the ridge line is located, and is symmetrical left-right about the plane passing through the highest point of the ridge line and perpendicular to the plane where the ridge line is located, thereby making it easier to model and process the reflector 52 and to detect the size in the subsequent processing process. Fig. 9 shown.
[0043] In order to make the first light be reflected more accurately onto the light-receiving chip 2, the normal of the reflection point of the first light on the curved surface of the reflector 52 passes through the midpoint of the second connecting line, which is the connecting line between the center positions of the upper surfaces of the light-receiving chip 2 and the light-emitting chip 1, thereby further ensuring that the position of the light after irradiating the light-receiving chip 2 does not deviate. Fig. 9 shown.
[0044] In order to further clarify the construction method of the first reflection surface on the reflector 52, and ensure the coordinates, curvature radius and normal direction of each point on the curved surface of the reflector 52, when modeling, the construction of the first reflection surface is obtained by sweeping the curve where the ridge line equation is located along the first curve, and the curve equation of the ridge line is:
[0045] Z=-0.4702x 6 -2.0621x 5 -3.5238x 4 -2.9914x 3 -1.7852x 2 -0.9713x
[0046] +7.0919
[0047] In the above formula, Z and x represent the z-axis coordinate and x-axis coordinate of any point on the ridge line, respectively.
[0048] The curve equation of the first curve on the curved surface of the reflector 52, which passes through the highest point of the ridge line and is perpendicular to the plane where the ridge line is located, is:
[0049] Z=-2.6292y 6 +0.5244y 5 +1.1185y4 -0.289y 3 -0.8854y 2 +0.0638y
[0050] +7.3663
[0051] In the above formula, y and z represent the y-axis coordinate and z-axis coordinate of any point on the first curve, respectively.
[0052] After simulation, the optocoupler efficiency of this scheme reached 23.44%, and the incident power reached 0.012892W, which are greatly improved compared with the existing technology.
[0053] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0054] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An optical coupler, comprising a light emitting chip (1) and a light receiving chip (2) for receiving light, and a plurality of pins (3) for mounting the light emitting chip (1) and the light receiving chip (2) for connecting positive and negative electrodes, wherein an external package (4) is arranged on the plurality of pins (3), characterized in that: A plurality of the pins (3) are provided with a reflective component (5) for reflecting light emitted by the light-emitting chip (1) onto the light-receiving chip (2), and the reflective component (5) comprises: A transparent inner packaging body (51), the inner packaging body (51) being an optical reflection surface, used for covering the light-emitting chip (1) and the light-receiving chip (2), and reflecting the light emitted by the light-emitting chip (1) back into the inner packaging body; A reflector (52), wherein the reflector (52) is arranged on the inner packaging body (51) at a position corresponding to the light-emitting chip (1) and the light-receiving chip (2); a second connecting line between the light-emitting chip (1) and the light-receiving chip (2) is located on the plane where the ridge line on the reflector (52) is located; a first reflecting surface close to the light-emitting chip (1) is provided on the reflector (52); the first reflecting surface is used to reflect a first light emitted by the light-emitting chip (1) to the light-receiving chip (2); and a second reflecting surface is also provided on the reflector (52) for reflecting a second light emitted by the light-emitting chip (1) to the light-receiving chip (2).
2. An optical coupler according to claim 1, characterized in that: A first connecting line between the two ends of the second reflecting surface is perpendicular to a second connecting line between the light-emitting chip (1) and the light-receiving chip (2), and the first connecting line is located between the midpoints of the light-emitting chip (1) and the second connecting line. The endpoints of the first connecting line are arranged on the bottom edge of the reflector (52), and the upper and lower heights of the second reflecting surface gradually decrease from the ridgeline position of the reflector (52) to the two ends.
3. An optical coupler according to claim 1, characterized in that: The maximum height between the ridge line of the reflector (52) and the bottom surface of the reflector (52) is between 0.62 and 0.64 mm, the maximum length of the left and right sides of the bottom surface of the reflector (52) is between 1.94 and 1.96 mm, the maximum width of the front and rear sides of the bottom surface of the reflector (52) is between 1.49 and 1.51 mm, and the height between the bottom surface of the reflector (52) and the bottom surface of the chip is between 0.34 and 0.36 mm.
4. An optical coupler according to claim 2, characterized in that: A spherical lens (6) is arranged on the light-emitting chip (1).
5. An optical coupler according to claim 4, characterized in that: The lens body (6) is also arranged on the light-collecting chip (2).
6. An optical coupler according to claim 2, characterized in that: The normal line of the reflection point of the first light ray on the upper curved surface of the reflector (52) passes through the midpoint of the second connecting line.
7. An optical coupler according to claim 1, characterized in that: The curve equation of the ridge line is: Z=-0.4702x 6 -2.0621x 5 -3.5238x 4 -2.9914x 3 -1.7852x 2 -0.9713x+7.0919 In the above formula, Z and x represent the z-axis coordinate and x-axis coordinate of any point on the ridge line, respectively.
8. An optical coupler according to claim 1, characterized in that: The curve equation of the first curve on the curved surface of the reflector (52) that passes through the highest point of the ridge line and is perpendicular to the plane where the ridge line is located is: Z=-2.6292y 6 +0.5244y 5 +1.1185y 4 -0.289y 3 -0.8854y 2 +0.0638y +7.3663 In the above formula, y and z represent the y-axis coordinate and z-axis coordinate of any point on the first curve, respectively.