Binding position, display panel and electronic equipment
By providing a reflective layer on the first ITO layer where the binding position is located, the corrosion problem of the etching liquid on the metal layer is solved, and the quality and service life of the product are improved.
Patent Information
- Application Number
- CN202421506611.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-27
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-06-27
AI Technical Summary
In the prior art, the etching liquid easily passes through the first ITO layer and corrodes the metal layer below the via hole in the binding position, resulting in a decrease in product quality and a shortened service life.
A reflective layer is provided on the first ITO layer bound and positioned, covering the first ITO layer to prevent penetration of the etching liquid.
It effectively avoids corrosion of the metal layer by the etching liquid and improves the quality and service life of the product.
Smart Images
Figure CN222827580U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic equipment, in particular to a binding position, a display panel and electronic equipment. Background Art
[0002] The existing binding bit structure is as follows Figure 1 As shown, an insulating layer is provided on the metal layer 102, and the insulating layer is provided with a first insulating layer 103 and a second insulating layer 104 as required, and the first insulating layer 103 and the second insulating layer 104 are both provided with via holes 106, and the via holes 106 of the two overlap. A first ITO layer 105 is provided on the side of the second insulating layer 104 facing away from the first metal layer 102, and the first ITO layer 105 covers the via holes 106. When some products require the use of an etching solution, the etching solution will penetrate the first ITO layer 105 to corrode the metal layer 102 below the via holes 106.
[0003] How to prevent the etching solution from penetrating through the first ITO layer 105 and corroding the metal layer 102 below the via hole 106 has become a technical problem that needs to be solved urgently in the industry. Summary of the invention
[0004] In order to at least solve the above technical problems, the purpose of the utility model is to provide a binding position, by setting a reflective layer, to prevent the etching liquid from penetrating through the first ITO layer and corroding the metal layer below the via hole.
[0005] In order to achieve the above purpose, the binding bits provided by this application include:
[0006] Glass substrate;
[0007] A metal layer is disposed on the glass substrate;
[0008] A first insulating layer is disposed on the metal layer;
[0009] A second insulating layer is disposed on the first insulating layer;
[0010] The first insulating layer and the second insulating layer are both provided with via holes, and the via holes of the first insulating layer overlap with the via holes of the second insulating layer;
[0011] A first ITO layer is disposed on the second insulating layer;
[0012] The first ITO layer covers the via holes of the second insulating layer;
[0013] A reflective layer, disposed on the first ITO layer;
[0014] The reflective layer covers the first ITO layer;
[0015] The second ITO layer is disposed on the reflective layer.
[0016] Furthermore, the first ITO layer is connected to the metal layer at the via hole of the first insulating layer.
[0017] Further, the first insulating layer covers the metal layer;
[0018] The surface area of the first insulating layer is greater than the surface area of the metal layer, and a portion of the first insulating layer extending beyond the metal layer is connected to the glass substrate.
[0019] Further, the second insulating layer covers the first insulating layer;
[0020] The surface area of the second insulating layer is greater than that of the first insulating layer, and a portion of the second insulating layer that exceeds the first insulating layer is connected to the glass substrate.
[0021] Further, the first ITO layer covers the second insulating layer;
[0022] The surface area of the first ITO layer is greater than the surface area of the second insulating layer, and a portion of the first ITO layer that exceeds the second insulating layer is connected to the glass substrate.
[0023] Further, the reflective layer covers the first ITO layer;
[0024] The surface area of the reflective layer is greater than that of the first ITO layer, and a portion of the reflective layer that exceeds the first ITO layer is connected to the glass substrate.
[0025] Furthermore, the position of the reflective layer at the via hole of the second insulating layer is recessed toward the glass substrate.
[0026] Further, the second ITO layer covers the reflective layer;
[0027] The surface area of the second ITO layer is greater than that of the reflective layer, and a portion of the second ITO layer that exceeds the reflective layer is connected to the glass substrate.
[0028] To achieve the above objectives, the present application also provides a display panel, including the above binding position.
[0029] To achieve the above objectives, the present application also provides an electronic device, including the above binding position, or the above display panel.
[0030] The binding position of the embodiment of the present application includes: a glass substrate; a metal layer, arranged on the glass substrate; a first insulating layer, arranged on the metal layer; a second insulating layer, arranged on the first insulating layer; the first insulating layer and the second insulating layer are both provided with vias, and the vias of the first insulating layer overlap with the vias of the second insulating layer; a first ITO layer, arranged on the second insulating layer; the first ITO layer covers the vias of the second insulating layer; a reflective layer, arranged on the first ITO layer; the reflective layer covers the first ITO layer; and the second ITO layer is arranged on the reflective layer. By providing the reflective layer, the etching solution is prevented from penetrating through the first ITO layer and corroding the metal layer below the vias, thereby improving the quality and service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] The accompanying drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings:
[0032] Figure 1 It is a schematic diagram of the existing binding bit structure;
[0033] Figure 2 It is a schematic diagram of the binding bit structure of an embodiment of the present application.
[0034] Description of reference numerals:
[0035] 101 - glass substrate; 102 - metal layer; 103 - first insulating layer; 104 - second insulating layer; 105 - first ITO layer; 106 - via hole; 107 - reflective layer; 108 - second ITO layer. DETAILED DESCRIPTION
[0036] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.
[0037] It should be understood that the various steps described in the method implementation of the present application can be performed in different orders and / or performed in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.
[0038] The term "including" and its variations used herein are open inclusions, i.e., "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.
[0039] It should be noted that the modifications of "one" and "plurality" mentioned in this application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more". "Plurality" should be understood as two or more.
[0040] The binding bits of the embodiment of the present application include:
[0041] Glass substrate;
[0042] A metal layer is disposed on the glass substrate;
[0043] A first insulating layer is disposed on the metal layer;
[0044] A second insulating layer is disposed on the first insulating layer;
[0045] The first insulating layer and the second insulating layer are both provided with via holes, and the via holes of the first insulating layer overlap with the via holes of the second insulating layer;
[0046] A first ITO layer is disposed on the second insulating layer;
[0047] The first ITO layer covers the via holes of the second insulating layer;
[0048] A reflective layer, disposed on the first ITO layer;
[0049] The reflective layer covers the first ITO layer;
[0050] The second ITO layer is disposed on the reflective layer.
[0051] Example 1
[0052] Figure 2 This is a schematic diagram of the binding bit structure of the embodiment of the present application. Figure 2 , the binding bits of the embodiments of the present application are described in detail.
[0053] The binding site of the embodiment of the present application includes: a glass substrate 101 .
[0054] In some exemplary embodiments, the glass substrate 101 is colorless transparent glass.
[0055] In some exemplary embodiments, as required, the glass substrate 101 includes a viewing area, and the viewing area is located in the middle area of the glass substrate 101 .
[0056] In some exemplary implementations, the binding site of the embodiment of the present application further includes: a metal layer 102 .
[0057] In some exemplary embodiments, the metal layer 102 is disposed on the glass substrate 101 .
[0058] In some exemplary embodiments, the metal layer 102 is attached to the upper surface of the glass substrate 101 .
[0059] In some exemplary embodiments, the surface area of the metal layer 102 is smaller than the surface area of the glass substrate 101 .
[0060] In some exemplary implementations, the binding site of the embodiment of the present application further includes: a first insulating layer 103 .
[0061] In some exemplary embodiments, the first insulating layer 103 is disposed on the metal layer 102 .
[0062] In some exemplary embodiments, the first insulating layer 103 is attached to the upper surface of the metal layer 102 .
[0063] In some exemplary embodiments, the first insulating layer 103 covers the metal layer 102 .
[0064] In some exemplary embodiments, the surface area of the first insulating layer 103 is greater than the surface area of the metal layer 102 .
[0065] In some exemplary embodiments, a portion of the first insulation layer extending beyond the metal layer 102 is connected to the glass substrate 101 , and the extending portion is still in contact with the upper surface of the glass substrate 101 .
[0066] In some exemplary embodiments, the first insulating layer 103 is provided with a via hole 106 .
[0067] In some exemplary implementations, the binding site of the embodiment of the present application further includes: a second insulating layer 104 .
[0068] In some exemplary embodiments, the second insulating layer 104 is disposed on the first insulating layer 103 .
[0069] In some exemplary embodiments, the second insulating layer 104 is attached to the upper surface of the first insulating layer 103 .
[0070] In some exemplary embodiments, the second insulating layer 104 covers the first insulating layer 103 .
[0071] In some exemplary embodiments, the surface area of the second insulating layer 104 is greater than the surface area of the first insulating layer 103 .
[0072] In some exemplary embodiments, a portion of the second insulation layer that extends beyond the first insulation layer 103 is connected to the glass substrate 101 , and the portion that extends beyond the first insulation layer 103 is still in contact with the upper surface of the glass substrate 101 .
[0073] In some exemplary embodiments, the second insulating layer 104 is provided with a via hole 106 , and the via hole 106 of the second insulating layer 104 overlaps with the via hole 106 of the first insulating layer 103 .
[0074] In some exemplary embodiments, the via hole 106 of the second insulating layer 104 is not smaller than the via hole 106 of the first insulating layer 103 .
[0075] In some exemplary embodiments, the via hole 106 of the second insulating layer 104 is larger than the via hole 106 of the first insulating layer 103 .
[0076] In some exemplary implementations, the binding site of the embodiment of the present application further includes: a first ITO layer 105 .
[0077] In some exemplary embodiments, ITO (Indium tin oxide).
[0078] In some exemplary embodiments, the first ITO layer 105 is disposed on the second insulating layer 104 .
[0079] In some exemplary embodiments, the first ITO layer 105 is attached to the upper surface of the second insulating layer 104 .
[0080] In some exemplary embodiments, the first ITO layer 105 covers the second insulating layer 104 .
[0081] In some exemplary embodiments, the surface area of the first ITO layer 105 is greater than the surface area of the second insulating layer 104 .
[0082] In some exemplary embodiments, a portion of the first ITO layer 105 extending beyond the second insulating layer 104 is connected to the glass substrate 101 , and the extending portion is still in contact with the upper surface of the glass substrate 101 .
[0083] In some exemplary embodiments, the first ITO layer 105 covers the via hole 106 of the second insulating layer 104 .
[0084] In some exemplary embodiments, the first ITO layer 105 is connected to the metal layer 102 at the via 106 of the first insulating layer 103, that is, the first ITO layer 105 is recessed toward the glass substrate 101 at the via 106 of the second insulating layer 104, and the recessed portion of the first ITO layer 105 is directly connected to the metal layer 102 through the via 106 of the second insulating layer 104 and the via 106 of the first insulating layer 103.
[0085] In some exemplary implementations, the binding site of the embodiment of the present application further includes: a reflective layer 107 .
[0086] In some exemplary embodiments, the reflective layer 107 is disposed on the first ITO layer 105 .
[0087] In some exemplary embodiments, the reflective layer 107 is attached to the upper surface of the first ITO layer 105 .
[0088] In some exemplary embodiments, the reflective layer 107 covers the first ITO layer 105 .
[0089] In some exemplary embodiments, the surface area of the reflective layer 107 is greater than the surface area of the first ITO layer 105 .
[0090] In some exemplary embodiments, the portion of the reflective layer 107 that extends beyond the first ITO layer 105 is connected to the glass substrate 101 , and the portion that extends beyond the first ITO layer 105 is still in contact with the upper surface of the glass substrate 101 .
[0091] In some exemplary embodiments, the reflective layer 107 at the via hole 106 of the second insulating layer 104 is recessed toward the glass substrate 101 .
[0092] In some exemplary implementations, the binding site of the embodiment of the present application further includes: a second ITO layer 108 .
[0093] In some exemplary embodiments, the second ITO layer 108 is disposed on the reflective layer 107 .
[0094] In some exemplary embodiments, the second ITO layer 108 is attached to the upper surface of the reflective layer 107 .
[0095] In some exemplary embodiments, the second ITO layer 108 covers the reflective layer 107 .
[0096] In some exemplary embodiments, the surface area of the second ITO layer 108 is greater than the surface area of the reflective layer 107 .
[0097] In some exemplary embodiments, a portion of the second ITO layer 108 extending beyond the reflective layer 107 is connected to the glass substrate 101 , and the extending portion is still in contact with the upper surface of the glass substrate 101 .
[0098] Example 2
[0099] Embodiment 2 is a display panel, comprising the binding bits of the above embodiment.
[0100] In some exemplary embodiments, the display panel is, for example, a liquid crystal display panel.
[0101] Example 3
[0102] Embodiment 3 is an electronic device, comprising the binding bit of the above embodiment.
[0103] In some exemplary implementations, the electronic device according to the embodiments of the present application includes the display panel according to the above embodiments.
[0104] In some exemplary embodiments, the electronic device is, for example, a display.
[0105] Although the implementation methods disclosed in the utility model are as above, the content is only an implementation method adopted to facilitate the understanding of the utility model, and is not used to limit the utility model. Any technician in the field to which the utility model belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the utility model, but the scope of patent protection of the utility model shall still be based on the scope defined in the attached claims.
Claims
1. A binding bit, characterized in that: include: Glass substrate; A metal layer is disposed on the glass substrate; A first insulating layer, disposed on the metal layer; A second insulating layer, disposed on the first insulating layer; The first insulating layer and the second insulating layer are both provided with via holes, and the via holes of the first insulating layer overlap with the via holes of the second insulating layer; A first ITO layer is disposed on the second insulating layer; The first ITO layer covers the via holes of the second insulating layer; A reflective layer, disposed on the first ITO layer; The reflective layer covers the first ITO layer; The second ITO layer is disposed on the reflective layer.
2. The binding bit according to claim 1, characterized in that: The first ITO layer is connected to the metal layer at a via hole in the first insulating layer.
3. The binding position according to claim 2, characterized in that: The first insulating layer covers the metal layer; The surface area of the first insulating layer is greater than the surface area of the metal layer, and a portion of the first insulating layer extending beyond the metal layer is connected to the glass substrate.
4. The binding position according to claim 3, characterized in that: The second insulating layer covers the first insulating layer; The surface area of the second insulating layer is greater than that of the first insulating layer, and a portion of the second insulating layer extending beyond the first insulating layer is connected to the glass substrate.
5. The binding position according to claim 4, characterized in that: The first ITO layer covers the second insulating layer; The surface area of the first ITO layer is greater than the surface area of the second insulating layer, and a portion of the first ITO layer that exceeds the second insulating layer is connected to the glass substrate.
6. The binding position according to claim 5, characterized in that: The reflective layer covers the first ITO layer; The surface area of the reflective layer is greater than the surface area of the first ITO layer, and a portion of the reflective layer that exceeds the first ITO layer is connected to the glass substrate.
7. The binding bit according to claim 6, characterized in that: The position of the reflective layer located at the via hole of the second insulating layer is recessed toward the glass substrate.
8. The binding bit according to claim 7, characterized in that: The second ITO layer covers the reflective layer; The surface area of the second ITO layer is greater than the surface area of the reflective layer, and a portion of the second ITO layer that exceeds the reflective layer is connected to the glass substrate.
9. A display panel, characterized in that: Comprising the binding site described in any one of claims 1-8.
10. An electronic device, characterized in that: It comprises the binding position as described in any one of claims 1 to 8, or the display panel as described in claim 9.