Light-emitting device and display device

Abstract

The utility model discloses a light-emitting device and a display device, the light-emitting device comprises a support, a light-emitting member and a micro-bead lens layer, the light-emitting member is arranged on the support, the micro-bead lens layer and the light-emitting member are arranged on the same side of the support, the micro-bead lens layer comprises a first glue structure and glass micro-beads arranged in the first glue structure, the first glue structure at least covers the light-emitting side of the light-emitting part, the first light-emitting surface of the first glue structure is a curved surface protruding towards the outside of the microbead lens layer, and at least part of the glass microbeads are located at the top of the first glue structure, so that the light-emitting device can perform diffuse reflection on light emitted by the light-emitting part through the glass microbeads; the uniformity of light intensity distribution of light emitted by the whole light-emitting device is improved, and the light-emitting angle of the light-emitting device is enlarged.

Description

Technical Field

[0001] The utility model relates to the technical field of light-emitting electronic components, and in particular to a light-emitting device and a display device. Background Art

[0002] In recent years, high-end display technology has been committed to improving the display quality of display devices, making the bright fields of the display brighter and the dark fields darker, achieving a higher contrast ratio between light and dark, and allowing any details in the display to be fully displayed to enhance the user's viewing experience.

[0003] At present, the total number of light-emitting devices in an ultra-thin display device based on Mini LED backlight can generally reach thousands or even tens of thousands, which seriously affects the economic efficiency of the display device. In order to reduce costs, make the price of display devices more market-friendly, and improve product competitiveness, current display devices must take into account the reduction of the number of light-emitting devices while being ultra-thin; and how to effectively control the processing and manufacturing costs of display devices so that the display devices have good economic and market competitiveness, while ensuring that the display screen of the display devices has excellent color saturation and display brightness uniformity to meet the user's viewing experience has become an urgent problem to be solved in the industry.

[0004] However, existing light emitting components often have a light distribution curve that is cosine-distributed and a small light-emitting angle, which results in poor display brightness uniformity of a display device that uses the light emitting component as a backlight source. Utility Model Content

[0005] One purpose of the utility model is to provide a light emitting device that can have a larger light emitting angle.

[0006] Another object of the present invention is to provide a display device that can improve display brightness uniformity by using the aforementioned light-emitting device.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] In a first aspect, a light emitting device is provided, comprising:

[0009] Bracket;

[0010] a light emitting member, the light emitting member being arranged on the bracket; and

[0011] A microbead lens layer, wherein the microbead lens layer and the light-emitting component are arranged on the same side of the bracket, the microbead lens layer includes a first glue structure and glass microbeads arranged in the first glue structure, the first glue structure is at least covered on the light-emitting side of the light-emitting component, the first light-emitting surface of the first glue structure is a curved surface convex toward the outside of the microbead lens layer, and at least part of the glass microbeads are located on the top of the first glue structure.

[0012] As a preferred technical solution of the light-emitting device, the first glue structure has a volume V1, the sum of the volumes of all the glass microbeads is a total volume V2, and 0.1%≤V2 / V1≤10%.

[0013] As a preferred technical solution of the light-emitting device, the density of the glass microbeads is less than the density of the colloid before the first glue structure is cured.

[0014] As a preferred technical solution of the light-emitting device, at least part of the glass microbeads are gathered in the middle of the top of the first glue structure.

[0015] As a preferred technical solution of the light-emitting device, the particle size of the glass microbeads ranges from 15 μm to 135 μm.

[0016] As a preferred technical solution of the light-emitting device, the bracket has a cup cavity, the light-emitting element is arranged in the cup cavity, and the microbead lens layer is at least partially located in the cup cavity and connected to the side wall of the cup cavity.

[0017] As a preferred technical solution of the light emitting device, the bracket includes a substrate and a frame, the frame is arranged on the substrate, and the frame surrounds the cup cavity, and the light transmittance of the frame is greater than or equal to 50%.

[0018] As a preferred technical solution of the light-emitting device, the light-emitting component is a CSP light-emitting component, which includes an LED chip and a fluorescent film layer, wherein the fluorescent film layer covers the light-emitting surface of the LED chip, and the microbead lens layer is covered on the fluorescent film layer.

[0019] As a preferred technical solution of the light-emitting device, the light-emitting component includes an LED chip and a phosphor glue layer, the phosphor glue layer is at least covered on the light-emitting side of the LED chip, and the microbead lens layer is covered on the phosphor glue layer.

[0020] As a preferred technical solution of the light-emitting device, the second light-emitting surface of the phosphor glue layer is a curved surface convex toward the micro-bead lens layer.

[0021] As a preferred technical solution of the light-emitting device, the phosphor glue layer includes a second glue structure and phosphors arranged in the second glue structure, and the refractive index of the second glue structure is smaller than the refractive index of the first glue structure.

[0022] As a preferred technical solution of the light emitting device, the light emitting angle range of the light emitting device is 130° to 180°.

[0023] In a second aspect, a display device is provided, comprising a circuit board and a plurality of light-emitting devices as described in the aforementioned technical solution, wherein the plurality of light-emitting devices are arranged at intervals on the same side of the circuit board.

[0024] The beneficial effects of the utility model are:

[0025] By covering the light-emitting side of the light-emitting component with a bead lens layer and making the first light-emitting surface of the first glue structure a curved surface convex toward the outside of the bead lens layer, the light emitted by the light-emitting component can be diverged by the first light-emitting surface when it is emitted from the light-emitting surface of the bead lens layer to the outside, thereby improving the uniformity of the light intensity distribution of the light emitted by the light-emitting device as a whole. Furthermore, by making at least part of the glass beads be arranged in the top of the first glue structure, that is, buried in a position adjacent to the first light-emitting surface of the first glue structure, the glass beads can be used to diffusely reflect the light, thereby further improving the uniformity of the light intensity distribution of the light emitted by the light-emitting device as a whole and expanding the light-emitting angle of the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The utility model is further described in detail below based on the drawings and embodiments.

[0027] Figure 1 It is a schematic cross-sectional view of the first structure of the light-emitting device described in the embodiment.

[0028] Figure 2 for Figure 1 Schematic diagram of the structural decomposition of the light-emitting device shown in.

[0029] Figure 3 It is a schematic cross-sectional view of a second structure of the light emitting device described in the embodiment.

[0030] Figure 4 It is a schematic cross-sectional view of a third structure of the light-emitting device described in the embodiment.

[0031] Figure 5 It is a schematic cross-sectional view of a fourth structure of the light-emitting device described in the embodiment.

[0032] Figure 6 It is a schematic cross-sectional view of a fifth structure of the light-emitting device described in the embodiment.

[0033] Figure 7It is a schematic cross-sectional view of the sixth structure of the light-emitting device described in the embodiment.

[0034] Figure 8 It is a schematic cross-sectional view of the structure of the display device described in the embodiment.

[0035] In the figure:

[0036] 1. Light-emitting device; 10. Bracket; 10a. Cup cavity; 101. Substrate; 102. Frame; 11. Light-emitting element; 110. LED chip; 111. Fluorescent film layer; 112. Fluorescent powder adhesive layer; 112a. Second light-emitting surface; 112b. Second adhesive structure; 112c. Fluorescent powder; 12. Bead lens layer; 120. First adhesive structure; 120a. First light-emitting surface; 121. Glass beads;

[0037] 2. Display device; 20. Circuit board. DETAILED DESCRIPTION

[0038] In order to make the technical problems solved by the utility model, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the utility model will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0039] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0041] like Figure 1 and Figure 2 As shown, the utility model provides a light-emitting device 1, including a bracket 10, a light-emitting element 11 and a micro-bead lens layer 12, the light-emitting element 11 is arranged on the bracket 10, the micro-bead lens layer 12 and the light-emitting element 11 are arranged on the same side of the bracket 10, the micro-bead lens layer 12 includes a first glue structure 120 and glass micro-beads 121 arranged in the first glue structure 120, the first glue structure 120 is at least covered on the light-emitting side of the light-emitting element 11, the first light-emitting surface 120a of the first glue structure 120 is a curved surface convex toward the outside of the micro-bead lens layer 12, at least part of the glass micro-beads 121 are located on the top of the first glue structure 120, wherein, for the convenience of observation, Figure 1 and Figure 2 The first adhesive structure 120 is not filled with a cross-hatching line.

[0042] By covering the light-emitting side of the light-emitting component 11 with a microbead lens layer 12 and making the first light-emitting surface 120a of the first glue structure 120 a curved surface convex toward the outside of the microbead lens layer 12, the light emitted by the light-emitting component 11 can be diverged by the first light-emitting surface 120a when it is emitted from the light-emitting surface of the microbead lens layer 12 to the outside, thereby improving the uniformity of the light intensity distribution of the light emitted by the light-emitting device 1 as a whole. Furthermore, by making at least part of the glass microbeads 121 be arranged in the top of the first glue structure 120, that is, buried in the position of the first light-emitting surface 120a of the first glue structure 120, the light can be diffusely reflected by the glass microbeads 121, so as to further improve the uniformity of the light intensity distribution of the light emitted by the light-emitting device 1 as a whole and expand the light-emitting angle of the light-emitting device 1.

[0043] Exemplarily, the light emitting angle range of the light emitting device 1 is 130° to 180°. For example, the light emitting angle of the light emitting device 1 may be 130°, 135°, 140°, 145°, 150°, 155°, 160°, 165°, 170°, 175° or 180°, etc.

[0044] Optionally, the glass beads 121 may be made of a material including but not limited to an alkaline earth borosilicate glass system, an ultra-low alkali borosilicate glass system, an aluminosilicate glass system, and an aluminoborate glass system, so that the glass beads 121 are insoluble in water and have stable chemical properties.

[0045] Optionally, the first adhesive structure 120 may be formed by curing a transparent packaging adhesive.

[0046] The first adhesive structure 120 has a volume V1, and the sum of the volumes of all the glass beads 121 is a total volume V2. It can be understood that the larger the ratio V2 / V1 of the total volume V2 of the glass beads 121 to the volume V1 of the first adhesive structure 120, the better the diffuse reflection effect of the microbead lens layer 12 on light, but the worse the bonding stability of the first adhesive structure 120 to the glass beads 121 and the light-emitting component 11, the smaller the ratio V2 / V1 of the total volume V2 of the glass beads 121 to the volume V1 of the first adhesive structure 120, the better the first adhesive structure 120 to the glass beads 121 and the light-emitting component The better the bonding stability of 11, the worse the diffuse reflection effect of the microbead lens layer 12 on light. Therefore, the ratio V2 / V1 of the total volume V2 of the glass microbeads 121 to the volume V1 of the first adhesive structure 120 cannot be too large or too small. Based on this, optionally, the ratio V2 / V1 of the total volume V2 of the glass microbeads 121 to the volume V1 of the first adhesive structure 120 can satisfy: 0.1%≤V2 / V1≤10%. For example, V2 / V1 can be: 0.1%, 0.5%, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9% or 10%, etc.

[0047] Optionally, the density of the glass beads 121 is less than the density of the colloid before the first glue structure 120 is cured, so that when the first glue structure 120 is not completely cured, the glass beads 121 can naturally float in the uncured colloid to the top of the first glue structure 120, so that the microbead lens layer 12 structure in which at least part of the glass beads 121 are located on the top of the first glue structure 120 can be manufactured more easily, so that the manufacturing difficulty of the light-emitting device 1 is lower, so that the manufacturing cost of the light-emitting device 1 can be effectively reduced. Exemplarily, the density of the glass beads 121 can range from 0.12g / ml to 0.6g / ml, for example, the density of the glass beads 121 can be 0.12g / ml, 0.15g / ml, 0.2g / ml, 0.25g / ml, 0.3g / ml, 0.35g / ml, 0.4g / ml, 0.45g / ml, 0.5g / ml, 0.55g / ml or 0.6g / ml, etc., and The colloid density of the first glue structure 120 before curing may range from 1 g / ml to 1.5 g / ml. For example, the colloid density of the first glue structure 120 before curing may range from 1 g / ml to 1.5 g / ml. For example, the colloid density of the first glue structure 120 before curing may be 1 g / ml, 1.05 g / ml, 1.1 g / ml, 1.15 g / ml, 1.2 g / ml, 1.25 g / ml, 1.3 g / ml, 1.35 g / ml, 1.4 g / ml, 1.45 g / ml or 1.5 g / ml, etc.

[0048] like Figure 3As shown, optionally, at least part of the glass beads 121 are gathered in the middle of the top of the first glue structure 120, so that the bead lens layer 12 can diffusely reflect the light irradiated to the middle of the top of the first glue structure 120 to a greater extent, so as to reduce the light output intensity of the central part of the light-emitting device 1 to a greater extent, improve the light uniformity of the light-emitting device 1, and expand the light-emitting angle of the light-emitting device 1.

[0049] It can be understood that the smaller the particle size of the glass microbeads 121 is, the greater the compressive strength of the glass microbeads 121 is, and the more glass microbeads 121 that the microbead lens layer 12 can include is, so the diffuse reflection effect of the microbead lens layer 12 on light is better. However, the greater the density of the glass microbeads 121 is, the larger the particle size of the glass microbeads 121 is, the smaller the compressive strength of the glass microbeads 121 is, and the more glass microbeads that the microbead lens layer 12 can include is, the greater the density of the glass microbeads 121 is, and the smaller the compressive strength of the glass microbeads 121 is, and the more glass microbeads that the microbead lens layer 12 can include is, the greater the density of the glass microbeads 121 is. The fewer the number of beads 121, the worse the diffuse reflection effect of the micro-bead lens layer 12 on light is. However, the smaller the density of the glass micro-beads 121, the greater the density difference between the glass micro-beads 121 and the colloid before the first glue structure 120 is, the faster the glass micro-beads 121 automatically float in the colloid, and the shorter the working time required for the manufacturing process of the micro-bead lens layer 12. Therefore, the particle size of the glass micro-beads 121 cannot be too large or too small. Based on this, optionally, the particle size range of the glass micro-beads 121 can meet: 15μm to 135μm, for example, the particle size of the glass micro-beads 121 can be: 15μm, 20μm, 30μm, 50μm, 70μm, 100μm, 110μm, 120μm, 130μm or 135μm, etc.

[0050] Among them, optionally, among the glass beads 121 included in the microbead lens layer 12, at least two glass beads 121 have different particle sizes, so that on the one hand, the different densities, different diffuse reflection properties and other characteristics of the glass beads 121 with different particle sizes can be used to make the microbead lens layer 12 have a better effect of enlarging the light-emitting component 11 of the light-emitting device 1. On the other hand, the accuracy of the particle size of the glass beads 121 can be reduced. In other words, glass beads 121 with a particle size range of 15μm to 135μm can be selected, thereby reducing the manufacturing difficulty and manufacturing cost of the glass beads 121, and further reducing the manufacturing cost of the light-emitting device 1.

[0051] like Figure 3As shown, the microbead lens layer 12 has a first light emitting surface 120a. Optionally, at least a portion of the first light emitting surface 120a may be a curved surface convex toward the outside of the microbead lens layer 12, so that the light emitted by the light emitting element 11 can be scattered on the first light emitting surface 120a when it is emitted from the first light emitting surface 120a to the outside, so as to further improve the uniformity of the light intensity distribution of the light emitted from the microbead lens layer 12, thereby further expanding the light emitting angle of the light emitting device 1.

[0052] Specifically, the first light emitting surface 120 a may be in various shapes, at least a portion of which is convex toward the outside of the micro-bead lens layer 12 .

[0053] like Figures 1 to 3 As shown, in an optional embodiment, the first light emitting surface 120 a is in the shape of an elliptical curved surface with a convex middle portion, so that the first light emitting surface 120 a as a whole has the function of diverging the light emitted by the light emitting element 11 .

[0054] At this time, when the glass beads 121 are floated in the colloid of the uncured first glue structure 120 under the action of buoyancy to manufacture the bead lens layer 12 as in the aforementioned technical solution, the glass beads 121 are easy to float and gather in the middle of the top of the first glue structure 120.

[0055] like Figure 4 As shown, in another optional embodiment, the first light emitting surface 120a is in a shape with a flat top and a curved surface convex toward the outside at the periphery, so that the light emitted by the light emitting element 11 can be refracted at the top of the first light emitting surface 120a and scattered at the periphery of the first light emitting surface 120a.

[0056] like Figure 5 and Figure 6 As shown, in another optional embodiment, the first light emitting surface 120a is in the shape of a curved surface with the middle portion being concave toward the inside of the microbead lens layer 12 and the outer periphery being convex toward the outside, so that the light emitted by the light emitting element 11 can be scattered at the first light emitting surface 120a, and the middle portion of the first light emitting surface 120a can scatter the light emitted from the middle portion of the light emitting element 11 to a greater extent, so as to further reduce the light intensity emitted from the middle portion of the first light emitting surface 120a, thereby better improving the uniformity of the light.

[0057] Please see again Figure 1 and Figure 2Optionally, the bracket 10 has a cup cavity 10a, the light-emitting element 11 is arranged in the cup cavity 10a, and the microbead lens layer 12 is at least partially located in the cup cavity 10a and connected to the side wall of the cup cavity 10a, so that the side wall of the cup cavity 10a can provide a certain support for the uncured colloid before the first glue structure 120 is cured, so that the first light-emitting surface 120a of the microbead lens layer 12 can be formed into a shape with a higher arch height. In other words, the microbead lens layer 12 can be formed into more shapes, so that the shape of the microbead lens layer 12 can be designed more flexibly.

[0058] Optionally, the bracket 10 includes a substrate 101 and a frame 102, the frame 102 is disposed on the substrate 101, and the frame 102 surrounds the cup cavity 10a, and the light transmittance of the frame 102 is greater than or equal to 50%, so that the influence of the frame 102 on the lateral light of the light emitting device 1 can be reduced, so that the light uniformity of the light emitting device 1 is better. Exemplarily, the light transmittance of the frame 102 can be 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95% or 100%, etc.

[0059] like Figure 6 As shown, at this time, optionally, the first light emitting surface 120a of the microbead lens layer 12 can also be formed as a plane.

[0060] like Figure 7 As shown, in other embodiments, a plurality of light-emitting elements 11 may be arranged in a large bracket 10 array, and the first glue structure 120 mixed with glass beads 121 before curing is laid flat on the outside of all the light-emitting elements 11, and then the first glue structure 120 is cut after curing to obtain a single light-emitting device 1 having a microbead lens layer 12 arranged on the light-emitting side of the light-emitting element 11, and the first light-emitting surface 120a of the microbead lens layer 12 is formed into a plane, wherein, Figure 7 exemplarily shows a single light emitting device 1 in which a micro-bead lens layer 12 is provided on the light emitting side of the light emitting element 11 and the first light emitting surface 120a is a plane.

[0061] Please see again Figure 3 The light-emitting element 11 may include an LED (light-emitting diode) chip 110, and the light-emitting angle range of the LED chip 110 actually selected may be 125° to 136°. It can be seen that by providing a microbead lens layer 12, the light-emitting angle of the light-emitting device 1 can be increased to 130° to 180°.

[0062] like Figure 4As shown, in order to make the color of the light emitted by the LED chip 110 different from the color of the light emitted by the light emitting element 11, and at the same time make the light emitting device 1 suitable for long-term use in a high temperature and high humidity environment, a phosphor 112c with good high temperature and high humidity resistance can be used to adjust the color of the light emitted by the LED chip 110.

[0063] Exemplarily, the LED chip 110 can emit blue light, and the phosphor 112c may include at least red phosphor and green phosphor, so that part of the light emitted by the LED chip 110 excites the phosphor 112c to emit red and green light, and the remaining light is mixed with the red and green light, so that the light emitted by the light-emitting element 11 is white light.

[0064] Wherein, optionally, the phosphor 112c may include but is not limited to silicate, nitride, fluoride. Exemplarily, the phosphor 112c may include nitride-based β-salon green phosphor and fluoride-based KSF red phosphor, so that the light emitted by the light-emitting element 11 is suitable for realizing a high color gamut display.

[0065] In addition, the phosphor 112 c can be disposed outside the light emitting element 11 in a variety of different ways.

[0066] like Figure 5 As shown, in an optional embodiment, the light-emitting component 11 is a CSP light-emitting component 11, and the light-emitting component 11 may also include a fluorescent film layer 111, and the fluorescent film layer 111 covers the light-emitting surface of the LED chip 110. The microbead lens layer 12 is covered on the fluorescent film layer 111, so that the fluorescent powder can be set on the light-emitting side of the LED chip 110 through the fluorescent film layer 111, and because the structure of the fluorescent film layer 111 is relatively light and thin, the overall volume of the LED chip 110 and the fluorescent film layer 111 can be further miniaturized. In other words, the light-emitting component 11 can achieve a more miniaturized design.

[0067] Exemplarily, packaging glue and phosphor powder may be mixed, molded, and cured on the light-emitting side of the LED chip 110 to form the fluorescent film layer 111 .

[0068] In addition, multiple LED chips 110 distributed in an array can be molded simultaneously to form a fluorescent film layer 111, and the fluorescent film layer 111 can be cut to obtain a single LED chip 110 and the fluorescent film layer 111 as a whole, that is, to obtain a single light-emitting component 11, which is formed into a CSP device.

[0069] like Figure 4As shown, in another optional embodiment, the light-emitting component 11 may further include a phosphor glue layer 112, and the phosphor glue layer 112 is at least covered on the light-emitting side of the LED chip 110, and the microbead lens layer 12 is covered on the phosphor glue layer 112, so that the phosphor 112c can be set on the light-emitting side of the light-emitting component 11 through the phosphor glue layer 112.

[0070] Exemplarily, the packaging glue and the phosphor 112 c may be mixed, disposed on the light emitting side of the LED chip 110 by dispensing or spraying, and cured to form the phosphor glue layer 112 .

[0071] Optionally, the second light-emitting surface 112a of the phosphor glue layer 112 is a curved surface convex toward the microbead lens layer 12, so that on the one hand, the second light-emitting surface 112a can cover the light-emitting surface of the LED chip 110, and on the other hand, the light emitted from the phosphor glue layer 112 can be scattered to a certain extent at the second light-emitting surface 112a, so as to further expand the light-emitting angle of the light-emitting device 1.

[0072] Optionally, the phosphor glue layer 112 includes a second glue structure 112b and a phosphor 112c arranged in the second glue structure 112b, and the refractive index of the second glue structure 112b is less than the refractive index of the first glue structure 120, so that the phosphor glue layer 112 and the microbead lens layer 12 have a refractive index difference, so that the degree of scattering of light when passing through the interface between the phosphor glue layer 112 and the microbead lens layer 12 is greater, which is beneficial to further improve the uniformity of the light emitted by the light-emitting device 1.

[0073] It can be understood that no matter what shape the first light emitting surface 120a of the micro-bead lens layer 12 is in the aforementioned technical solution, the specific structure of the light emitting element 11 can be any one of the aforementioned three optional implementations.

[0074] like Figure 8 As shown, the utility model also provides a display device 2, including a circuit board 20 and a plurality of light-emitting devices 1 as described in the aforementioned technical solution, wherein the plurality of light-emitting devices 1 are arranged at intervals on the same side of the circuit board 20, and by using the aforementioned light-emitting device 1 with a large light-emitting angle as a light source, the display brightness uniformity of the display device 2 can be improved.

[0075] In the description of this article, it should be understood that the terms "upper", "lower", "left", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0076] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0077] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0078] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A light emitting device, characterized in that: include: Bracket; a light emitting member, the light emitting member being arranged on the bracket; and A microbead lens layer, wherein the microbead lens layer and the light-emitting component are arranged on the same side of the bracket, the microbead lens layer includes a first glue structure and glass microbeads arranged in the first glue structure, the first glue structure is at least covered on the light-emitting side of the light-emitting component, the first light-emitting surface of the first glue structure is a curved surface convex toward the outside of the microbead lens layer, and at least part of the glass microbeads are located on the top of the first glue structure.

2. The light emitting device according to claim 1, characterized in that: The first glue structure has a volume V1, the sum of the volumes of all the glass microbeads is a total volume V2, and 0.1%≤V2 / V1≤10%.

3. The light emitting device according to claim 1, characterized in that: The density of the glass microbeads is less than the density of the colloid before the first glue structure is cured.

4. The light emitting device according to claim 1, characterized in that: At least part of the glass beads are gathered in the middle of the top of the first glue structure.

5. The light emitting device according to claim 1, characterized in that: The particle size of the glass microbeads ranges from 15 μm to 135 μm.

6. The light emitting device according to any one of claims 1 to 5, characterized in that: The bracket has a cup cavity, the light-emitting element is arranged in the cup cavity, and the micro-bead lens layer is at least partially located in the cup cavity and connected to the side wall of the cup cavity.

7. The light emitting device according to claim 6, characterized in that: The support comprises a substrate and a frame. The frame is arranged on the substrate and surrounds the cup cavity. The light transmittance of the frame is greater than or equal to 50%.

8. The light emitting device according to any one of claims 1 to 5, characterized in that: The light-emitting component is a CSP light-emitting component, and the light-emitting component comprises an LED chip and a fluorescent film layer, wherein the fluorescent film layer covers the light-emitting surface of the LED chip, and the micro-bead lens layer is covered on the fluorescent film layer.

9. The light emitting device according to any one of claims 1 to 5, characterized in that: The light-emitting component comprises an LED chip and a fluorescent powder adhesive layer. The fluorescent powder adhesive layer is at least covered on the light-emitting side of the LED chip, and the micro-bead lens layer is covered on the fluorescent powder adhesive layer.

10. The light emitting device according to claim 9, characterized in that: The second light-emitting surface of the phosphor glue layer is a curved surface convex toward the micro-bead lens layer.

11. The light emitting device according to claim 9, characterized in that: The phosphor glue layer includes a second glue structure and phosphor disposed in the second glue structure, and the refractive index of the second glue structure is smaller than the refractive index of the first glue structure.

12. The light emitting device according to any one of claims 1 to 5, characterized in that: The light emitting angle of the light emitting device is in the range of 130° to 180°.

13. A display device, characterized in that: It comprises a circuit board and a plurality of light-emitting devices according to any one of claims 1 to 12, wherein the plurality of light-emitting devices are arranged at intervals on the same side of the circuit board.

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