Thermal expansion stress relieving structure and lifting mechanism

Abstract

The utility model discloses a thermal expansion stress relief structure and a lifting mechanism, and relates to the technical field of semiconductor production, the thermal expansion stress relief structure comprises a bearing plate and a first lifting assembly, the first lifting assembly comprises a first guide column and a first sliding sleeve, and the first sliding sleeve is arranged in a first mounting hole of the bearing plate in a penetrating manner; a gap is formed between the inner wall of the first mounting hole and the outer wall of the first sliding sleeve and used for containing thermal expansion relative displacement between the bearing plate and the first lifting assembly in the radial direction of the first guide column. A mounting plate is arranged on the bearing plate, the first sliding sleeve is provided with a first connecting part located on one side of the bearing plate, the mounting plate and the first connecting part are fixedly connected and arranged on the two sides of the bearing plate respectively, and a plug pin abutting against the mounting plate and the first connecting part is arranged between the mounting plate and the first connecting part. The minimum distance between the mounting plate and the first connecting part is larger than the maximum thickness of the bearing plate, different degrees of thermal displacement can be generated between the bearing plate and the first lifting assembly, internal stress between the bearing plate and the first lifting assembly is further avoided, and normal operation of the lifting mechanism is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a thermal expansion stress elimination structure and a lifting mechanism. Background Art

[0002] In the packaging process of semiconductor devices, the substrate needs to be degassed before coating to remove H2O gas, organic solvents, etc. adsorbed on the surface of the substrate. In this process, the substrate is often placed in a negative pressure chamber for heating to achieve the degassing process. Currently, a lifting mechanism is used to load multiple substrates, and the substrates need to be lifted and transported in actual processing. Due to the large temperature changes in the negative pressure chamber, the lifting mechanism expands due to heat. Due to the different thermal expansion coefficients between different metal materials, internal stress will be generated between the moving parts due to different deformation amplitudes, which will cause the moving mechanisms such as screws, guide rails, sliders, etc. to become stuck in motion or even stuck, seriously affecting production efficiency. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a thermal expansion stress elimination structure and a lifting mechanism, which can eliminate the internal stress between various components, avoid motion jamming, and ensure production efficiency.

[0004] A thermal expansion stress relief structure according to an embodiment of the first aspect of the utility model includes:

[0005] Loading plate;

[0006] The first lifting component includes a first guide column and a first sliding sleeve slidably connected to the first guide column, the first sliding sleeve is inserted into the first mounting hole of the supporting plate, and there is a gap between the inner wall of the first mounting hole and the outer wall of the first sliding sleeve. A mounting plate is provided on the supporting plate, and the first sliding sleeve is provided with a first connecting portion located on one side of the supporting plate. The mounting plate and the first connecting portion are fixedly connected, and the two are respectively arranged on both sides of the supporting plate. A pin is provided between the mounting plate and the first connecting portion to abut against the two, and the minimum distance between the mounting plate and the first connecting portion is greater than the maximum thickness of the supporting plate.

[0007] A thermal expansion stress elimination structure according to an embodiment of the first aspect of the utility model has at least the following beneficial effects: the embodiment is provided with a bearing plate and a first lifting component, the first lifting component includes a first guide column and a first sleeve slidably connected to the first guide column, the first sleeve is inserted into the first mounting hole of the bearing plate, and a gap is provided between the inner wall of the first mounting hole and the outer wall of the first sleeve, which is used to accommodate the relative displacement of thermal expansion between the bearing plate and the first lifting component along the radial direction of the first guide column; a mounting plate is provided on the bearing plate, and the first sleeve is provided with a first connecting portion located on one side of the bearing plate, the mounting plate and the first connecting portion are fixedly connected, and the two are respectively provided on both sides of the bearing plate, and a pin is provided between the mounting plate and the first connecting portion to abut against the two, and the minimum distance between the mounting plate and the first connecting portion is greater than the maximum thickness of the bearing plate, so that there is a gap between the bearing plate and the first lifting component, so that when the two have different degrees of thermal displacement along the axial direction of the first guide column, thermal stress is not generated, and the occurrence of movement jamming is further avoided.

[0008] According to the embodiment of the first aspect of the utility model, it also includes a second lifting assembly, the second lifting assembly includes a second guide column and a second sliding sleeve slidably connected to the second guide column, and the second sliding sleeve is fixedly connected to the bearing plate.

[0009] According to an embodiment of the first aspect of the utility model, along the radial direction of the second guide pillar, at least two first lifting assemblies are arranged on both sides of the second lifting assembly.

[0010] According to an embodiment of the first aspect of the utility model, a second mounting hole for passing the plug is provided on the bearing plate, and the minimum inner diameter of the second mounting hole is greater than the maximum outer diameter of the plug.

[0011] According to an embodiment of the first aspect of the utility model, the latch includes an abutting section and an inserting section, two ends of the abutting section abut against the mounting plate and the first connecting portion, and the inserting section is inserted into the mounting plate.

[0012] According to an embodiment of the first aspect of the utility model, at least two latches are arranged at intervals along the circumferential direction of the first sliding sleeve.

[0013] According to the embodiment of the first aspect of the utility model, at least two second lifting assemblies are provided, the second sliding sleeve in any second lifting assembly is connected to the mounting plate, and a latch is provided between the second sliding sleeve and the mounting plate to abut against the two.

[0014] According to an embodiment of the first aspect of the utility model, a third mounting hole is provided on the mounting plate, the plug-in section is plugged into the third mounting hole, and there is a clearance fit between the plug-in section and the third mounting hole.

[0015] According to the embodiment of the first aspect of the utility model, the axial directions of the first guide column and the second guide column are parallel and extend in the vertical direction, and the second lifting assembly drives the carrying plate to move in the vertical direction.

[0016] According to an embodiment of the second aspect of the utility model, a lifting mechanism is provided, comprising the above-mentioned thermal expansion stress relief structure.

[0017] A lifting mechanism according to the second aspect of the present invention has at least the following beneficial effects:

[0018] Compared with the prior art, a thermal expansion stress elimination structure and a lifting mechanism have a first lifting component, which includes a first guide column and a first sleeve. The first sleeve is inserted into the first mounting hole of the bearing plate, and a gap is provided between the inner wall of the first mounting hole and the outer wall of the first sleeve, which is used to accommodate the relative displacement of thermal expansion between the bearing plate and the first lifting component along the radial direction of the first guide column; a mounting plate is provided on the bearing plate, and the first sleeve is provided with a first connecting portion located on one side of the bearing plate, the mounting plate and the first connecting portion are fixedly connected, and the two are respectively arranged on both sides of the bearing plate, and a pin is provided between the mounting plate and the first connecting portion to abut against the two, and the minimum distance between the mounting plate and the first connecting portion is greater than the maximum thickness of the bearing plate, so that different degrees of thermal displacement are generated between the bearing plate and the first lifting component along the axial direction of the first guide column, further avoiding the generation of internal stress between the two, and ensuring the normal operation of the lifting mechanism.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 It is an axonometric view of a thermal expansion stress relief structure in an embodiment of the first aspect of the utility model;

[0022] Figure 2 for Figure 1 A magnified view of center A;

[0023] Figure 3 for Figure 1 Magnified view of middle B;

[0024] Figure 4 A top view of a first lifting assembly in an embodiment of the first aspect of the utility model;

[0025] Figure 5 A cross-sectional view showing the connection between the first lifting assembly and the carrying plate in the embodiment of the first aspect of the utility model;

[0026] Figure 6 for Figure 5 Magnified view of center C.

[0027] Reference numerals:

[0028] The bearing plate 100; the first mounting hole 101; the second mounting hole 102; the mounting plate 103; the third mounting hole 104; the latch 105; the abutting section 106; the plug section 107; the bolt 108;

[0029] A first lifting assembly 110; a first guide post 111; a first sliding sleeve 112; a first connecting portion 113; a second connecting portion 114;

[0030] The second lifting assembly 120 ; the second guide column 121 ; and the second sliding sleeve 122 . DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0033] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0034] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0035] Reference Figure 1In the first aspect of the present invention, a thermal expansion stress relief structure of an embodiment includes a carrier plate 100, a first lifting assembly 110 and a second lifting assembly 120. The first lifting assembly 110 includes a first guide column 111 and a first sliding sleeve 112 slidably connected to the first guide column 111. The first sliding sleeve 112 is inserted into the first mounting hole 101 of the carrier plate 100. Figure 3 The second lifting assembly 120 includes a second guide post 121 and a second sleeve 122 slidably connected to the second guide post 121, and the second sleeve 122 is fixedly connected to the carrier plate 100. Further, the axis directions of the first guide post 111 and the second guide post 121 are parallel and extend in the vertical direction, and the second lifting assembly 120 drives the carrier plate 100 to move in the vertical direction.

[0036] Specifically, the second guide column 121 is a screw rod, the second sleeve 122 is a nut threadedly connected to the second guide column 121, the first guide column 111 is a cylindrical linear guide rail, and the first sleeve 112 is a slider slidably connected to the first guide column 111. It can be understood that when the second guide column 121 rotates, it can drive the second sleeve 122 and the supporting plate 100 to move up and down in the vertical direction. The cooperation between the first guide column 111 and the first sleeve 112 provides guidance for the lifting and lowering activities of the supporting plate 100, thereby realizing stable movement of the supporting plate 100.

[0037] It can be understood that the minimum inner diameter of the first mounting hole 101 is greater than the maximum outer diameter of the first sleeve 112, so that a gap is provided between the inner wall of the first mounting hole 101 and the outer wall of the first sleeve 112, and the gap is used to accommodate the relative displacement of thermal expansion between the carrier plate 100 and the first lifting assembly 110 along the radial direction of the first guide column 111. When heated, different degrees of thermal expansion occur between the carrier plate 100 and the first lifting assembly 110. The gap between the first mounting hole 101 and the first sleeve 112 can avoid the generation of internal stress between the two, thereby avoiding the deformation of the first sleeve 112 and the occurrence of activity jamming.

[0038] Further, refer to Figure 2 , Figure 4 and Figure 5, a mounting plate 103 is provided on the carrier plate 100, and a first sliding sleeve 112 is provided with a first connecting portion 113 located on one side of the carrier plate 100, and the outer diameter of the first connecting portion 113 is greater than the inner diameter of the first mounting hole 101, so that the side wall of the first connecting portion 113 can abut against the carrier plate 100. The mounting plate 103 and the first connecting portion 113 are fixedly connected, and the two are respectively arranged on both sides of the carrier plate 100, and a latch 105 is provided between the mounting plate 103 and the first connecting portion 113 to abut against the two, and the minimum distance between the mounting plate 103 and the first connecting portion 113 is greater than the maximum thickness of the carrier plate 100, so that there is a gap between the carrier plate 100 and the first lifting assembly 110 along the axial direction of the first guide column 111, thereby allowing the two to generate different degrees of thermal displacement without generating internal stress, and further avoiding the occurrence of motion jamming.

[0039] Reference Figure 6 The carrier plate 100 is provided with a second mounting hole 102 for inserting the plug 105. The minimum inner diameter of the second mounting hole 102 is greater than the maximum outer diameter of the plug 105, so that a certain range of displacement can be generated between the carrier plate 100 and the plug 105, so that different degrees of thermal expansion of the two can be accommodated, internal stress can be avoided, and the difficulty of installation can be reduced. Further, the plug 105 includes an abutting section 106 and an inserting section 107. The abutting section 106 is inserted in the second mounting hole 102, and its two ends abut against the mounting plate 103 and the first connecting portion 113. The inserting section 107 is inserted into the mounting plate 103. It can be understood that the minimum inner diameter of the second mounting hole 102 is greater than the maximum outer diameter of the abutting section 106, so that a gap can be achieved between the plug 105 and the carrier plate 100 along the radial direction of the second mounting hole 102. This gap can accommodate different degrees of thermal expansion of the two, thereby achieving the effect of eliminating stress.

[0040] Furthermore, the minimum outer diameter of the abutment section 106 is greater than the maximum outer diameter of the plug-in section 107, so that the abutment section 106 can press against the end surface of the mounting plate 103, and the abutment section 106 is used to achieve a minimum distance between the mounting plate 103 and the first connecting portion 113 greater than the maximum thickness of the bearing plate 100, that is, the minimum length of the abutment section 106 is greater than the maximum thickness of the bearing plate 100, so that a gap is provided between the bearing plate 100 and the first sliding sleeve 112 along the thickness direction of the bearing plate 100, and this gap can accommodate different degrees of thermal expansion of the two, thereby achieving the effect of eliminating stress.

[0041] Furthermore, the mounting plate 103 is provided with a third mounting hole 104, the plug-in section 107 is plugged into the third mounting hole 104, and there is a clearance fit between the plug-in section 107 and the third mounting hole 104. It can be understood that the plug-in section 107 is plugged into the third mounting hole 104 to achieve the installation and positioning of the plug pin 105, and the clearance between the plug-in section 107 and the third mounting hole 104 is smaller than the clearance between the abutting section 106 and the second mounting hole 102, thereby ensuring the effective installation and positioning of the plug pin 105.

[0042] Furthermore, at least two latches 105 are arranged at intervals along the circumferential direction of the first sliding sleeve 112, which helps to increase the pressure contact stability between the mounting plate 103 and the first sliding sleeve 112. In the embodiment of the present application, at least four latches 105 are provided. It can be understood that a bolt 108 is provided between the first connecting portion 113 of the first sliding sleeve 112 and the mounting plate 103, and the bolt 108 keeps the first connecting portion 113 and the mounting plate 103 in pressure contact.

[0043] Furthermore, at least two first lifting assemblies 110 are arranged on both sides of the second lifting assembly 120. It can be understood that since the second sleeve 122 is fixedly connected to the carrier plate 100, the second sleeve 122 and the carrier plate 100 do not produce relative displacement after the installation is completed, and the relative position between the carrier plate 100 and the second lifting assembly 120 is fixed. When at least two first lifting assemblies 110 are arranged on both sides of the second lifting assembly 120, the thermal expansion direction of the carrier plate 100 extends along the radial direction of the second guide column 121 away from the second lifting assembly 120, thereby eliminating the thermal expansion stress while maintaining the installation position of the carrier plate 100 accurately.

[0044] Further, refer to Figure 1 and Figure 3, at least two second lifting assemblies 120 are provided, and at least two second lifting assemblies 120 are located on both sides of the carrier plate 100 along the width direction, and the second sleeve 122 in any second lifting assembly 120 is connected to the mounting plate 103, and a latch 105 is provided between the second sleeve 122 and the mounting plate 103 to abut against the two. It can be understood that the second sleeve 122 is provided with a second connecting portion 114, and the second connecting portion 114 and the mounting plate 103 are respectively located on both sides of the carrier plate 100 along the thickness direction, and a latch 105 is provided between the second connecting portion 114 and the mounting plate 103, and both ends of the abutting section 106 of the latch 105 press against the second connecting portion 114 and the mounting plate 103, so that the minimum distance between the second connecting portion 114 and the mounting plate 103 is greater than the maximum thickness of the carrier plate 100, so as to realize the floating connection between the second lifting assembly 120 and the carrier plate 100, so as to eliminate the thermal stress generated after thermal expansion. It can be understood that the second sleeve 122 in one of the second lifting components 120 is fixedly connected to the carrier plate 100. After the carrier plate 100 expands due to heat, it expands outward with the fixedly connected second sleeve 122 as the center. Since there is a gap between the first lifting component 110 and the second lifting component 120 connected to the mounting plate 103 and the carrier plate 100, it is possible to avoid stress between the carrier plate 100 and the first lifting component 110 and the second lifting component 120 after thermal expansion, thereby ensuring stable lifting and lowering activities of the carrier plate 100.

[0045] The lifting mechanism of the second aspect of the utility model adopts all the technical solutions of the thermal expansion stress elimination structure of the above embodiment, and therefore has at least all the beneficial effects brought by the technical solutions of the above embodiment.

[0046] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A thermal expansion stress relief structure, characterized in that: include: Loading plate; The first lifting component includes a first guide column and a first sliding sleeve slidably connected to the first guide column, the first sliding sleeve is inserted into the first mounting hole of the supporting plate, and there is a gap between the inner wall of the first mounting hole and the outer wall of the first sliding sleeve. A mounting plate is provided on the supporting plate, and the first sliding sleeve is provided with a first connecting portion located on one side of the supporting plate. The mounting plate is fixedly connected to the first connecting portion, and the two are respectively arranged on both sides of the supporting plate. A pin is provided between the mounting plate and the first connecting portion to abut against the two, and the minimum distance between the mounting plate and the first connecting portion is greater than the maximum thickness of the supporting plate.

2. A thermal expansion stress relief structure according to claim 1, characterized in that: It also includes a second lifting assembly, which includes a second guide column and a second sliding sleeve slidably connected to the second guide column, and the second sliding sleeve is fixedly connected to the bearing plate.

3. A thermal expansion stress relief structure according to claim 2, characterized in that: Along the radial direction of the second guide column, at least two of the first lifting assemblies are arranged on both sides of the second lifting assembly.

4. A thermal expansion stress relief structure according to claim 1, characterized in that: The bearing plate is provided with a second mounting hole for passing the latch pin, and the minimum inner diameter of the second mounting hole is greater than the maximum outer diameter of the latch pin.

5. The thermal expansion stress relief structure according to claim 1, characterized in that: The latch includes an abutting section and an inserting section, two ends of the abutting section abut against the mounting plate and the first connecting portion, and the inserting section is inserted into the mounting plate.

6. The thermal expansion stress relief structure according to claim 1, characterized in that: At least two of the latches are arranged at intervals along the circumferential direction of the first sliding sleeve.

7. A thermal expansion stress relief structure according to claim 2, characterized in that: At least two second lifting assemblies are provided, and the second sliding sleeve in any one of the second lifting assemblies is connected to the mounting plate, and the latch for abutting the second sliding sleeve and the mounting plate is provided between the second sliding sleeve and the mounting plate.

8. The thermal expansion stress relief structure according to claim 5, characterized in that: The mounting plate is provided with a third mounting hole, the plug-in section is plugged into the third mounting hole, and there is a clearance fit between the plug-in section and the third mounting hole.

9. A thermal expansion stress relief structure according to claim 2, characterized in that: The axial directions of the first guide column and the second guide column are parallel and extend in the vertical direction, and the second lifting assembly drives the carrying plate to move in the vertical direction.

10. A lifting mechanism, characterized in that: The invention comprises a thermal expansion stress relief structure as claimed in any one of claims 1 to 9.

Images