Electronic equipment

Abstract

The utility model provides an electronic device, which comprises a shell provided with an inner cavity, an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are communicated with the inner cavity; the to-be-cooled piece is arranged in the inner cavity; the fan is arranged in the inner cavity, corresponds to the air inlet hole and is used for pushing air exchange between the inner cavity and the outside through the air inlet hole and the air outlet; the air cooling assembly is arranged in the inner cavity, the air cooling assembly is located between the fan and the to-be-cooled part, and the air cooling assembly is used for reducing the temperature of air blown into the inner cavity by the fan so that the temperature of the inner cavity and the temperature of the to-be-cooled part can be reduced; and the heat dissipation assembly is arranged in the inner cavity and used for absorbing heat of the part to be subjected to heat dissipation and the air cooling assembly, and air sucked into the inner cavity from the outside through the fan is blown to the heat dissipation assembly so as to reduce the temperature of the inner cavity and the heat dissipation assembly. Through the structure mode, the electronic equipment has a good heat dissipation effect, and the user experience is good.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to an electronic equipment. Background Art

[0002] A conventional electronic device includes a housing, a fan, a heat dissipation component and a heat dissipation assembly. The housing is provided with an inner cavity, an air inlet and an air outlet. The air inlet and the air outlet are both connected to the inner cavity. The heat dissipation component, the fan and the heat dissipation assembly are provided in the inner cavity, and the fan corresponds to the air inlet. When the electronic device is working, the heat dissipation component emits heat, causing the temperature of the inner cavity and the heat dissipation assembly to rise, and the fan pushes the gas in the inner cavity to flow toward the air outlet, so that the external gas enters the inner cavity from the air inlet, and the gas flows through the inner cavity and the heat dissipation assembly to take away the heat, thereby achieving heat dissipation of the electronic device.

[0003] However, in the process of implementing the present invention, the inventors found that the heat dissipation effect of the above electronic device is not good, resulting in a poor user experience. Utility Model Content

[0004] The utility model provides an electronic device, which has good heat dissipation effect and good user experience.

[0005] To solve the above technical problems, a technical solution adopted by the utility model is: to provide an electronic device, the electronic device includes a shell, a heat dissipation component, an air cooling component, a heat dissipation component and a fan, the shell is provided with an inner cavity, an air inlet and an air outlet, the air inlet and the air outlet are both connected to the inner cavity; the heat dissipation component is arranged in the inner cavity; the fan is arranged in the inner cavity, the fan corresponds to the air inlet, and the fan is used to promote the gas exchange between the inner cavity and the outside through the air inlet and the air outlet; the air cooling component is arranged in the inner cavity, the air cooling component is located between the fan and the heat dissipation component, the air cooling component is used to reduce the temperature of the gas blown into the inner cavity by the fan, so as to reduce the temperature of the inner cavity and the heat dissipation component; the heat dissipation component is arranged in the inner cavity, the heat dissipation component is used to absorb the heat of the heat dissipation component and the air cooling component, and the gas sucked into the inner cavity from the outside by the fan is blown toward the heat dissipation component, so as to reduce the temperature of the inner cavity and the heat dissipation component.

[0006] Optionally, the air cooling component includes a semiconductor refrigerator and a plurality of air cooling fins stacked in sequence, the semiconductor refrigerator is located between the fan and the heat dissipation element to be cooled, the plurality of air cooling fins are attached to the cold end of the semiconductor refrigerator, and the semiconductor refrigerator is used to reduce the temperature of the plurality of air cooling fins, and the plurality of air cooling fins are used to reduce the temperature of the gas drawn into the inner cavity from the outside by the fan.

[0007] Optionally, the air outlet hole includes a first hole and a second hole, and the heat dissipation component is located between the first hole and the plurality of air cooling fins; the heat dissipation assembly includes a plurality of heat dissipation fins stacked in sequence, and the plurality of heat dissipation fins are located between the second hole and the fan.

[0008] Optionally, the heat dissipation component also includes a first temperature conducting tube, which is arranged at the hot end of the semiconductor refrigerator. The first temperature conducting tube extends from the plurality of air cooling fins to the plurality of heat dissipation fins. The first temperature conducting tube is used to transfer the temperature of the plurality of air cooling fins to the plurality of heat dissipation fins to reduce the temperature of the hot end of the semiconductor refrigerator.

[0009] Optionally, the electronic device further comprises a heat conducting member, wherein the heat conducting member is arranged on the heat dissipation member, and the heat conducting member is used to cool the heat dissipation member.

[0010] Optionally, the heat conducting member is a copper sheet.

[0011] Optionally, the electronic device further includes a second thermal conductive tube, which is disposed at one end of the heat conductive member, and the other end of the second thermal conductive tube extends from the heat conductive member to the plurality of heat dissipation fins, and the second thermal conductive tube is used to cool the heat conductive member.

[0012] Optionally, the electronic device further comprises a pressing plate, a first mounting groove is arranged at one end of the pressing plate facing the heat dissipation element, the heat conductive element is arranged in the first mounting groove, and the heat conductive element is clamped by the pressing plate and the heat dissipation element.

[0013] Optionally, the pressure plate has a first surface and a second surface arranged opposite to each other, the first mounting groove is arranged on the first surface, the pressure plate is provided with a second mounting groove on the second surface, the first mounting groove is connected to the second mounting groove, and part of the second temperature conducting pipe is arranged in the second mounting groove.

[0014] Optionally, the electronic device also includes a partition, which is located in the inner cavity, and extends from the air inlet toward the air outlet. The partition and the wall of the inner cavity together form a heat dissipation channel, and the heat dissipation element to be dissipated, the heat dissipation assembly and the fan are all located in the heat dissipation channel.

[0015] The beneficial effects of the embodiments of the present application are as follows: the electronic device includes a shell, a heat dissipation component, an air cooling component, a heat dissipation component and a fan, the shell is provided with an inner cavity, an air inlet and an air outlet, the air inlet and the air outlet are both connected to the inner cavity, the heat dissipation component, the air cooling component, the heat dissipation component and the fan are all arranged in the inner cavity, the fan corresponds to the air inlet, and the air cooling component is located between the fan and the heat dissipation component. When the electronic device is working, the heat dissipated component emits heat, causing the temperature of the inner cavity to rise. At the same time, the fan can promote the gas exchange between the inner cavity and the outside through the air inlet and the air outlet, that is, the fan promotes the gas in the inner cavity to flow toward the air outlet, so that the outside gas enters the inner cavity from the air inlet, further realizing the gas exchange between the inner cavity and the outside. Part of the gas entering the inner cavity from the air inlet passes through the air cooling component, and the air cooling component can reduce the temperature of the gas blown into the inner cavity by the fan, so as to reduce the temperature of the inner cavity and the heat dissipated component. The heat dissipation component absorbs the heat of the heat dissipated component and the air cooling component, and another part of the gas sucked into the inner cavity from the outside by the fan is blown toward the heat dissipation component, so as to reduce the temperature of the inner cavity and the heat dissipation component. Compared with the prior art, the electronic device provided by the present application has a good heat dissipation effect and a good user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the drawings without paying creative work.

[0017] Figure 1 The utility model provides a view of the electronic device in a three-dimensional state;

[0018] Figure 2 The utility model provides an exploded view of an electronic device in a three-dimensional state.

[0019] Reference numerals:

[0020] 100, electronic device; 10c, air outlet; 10c1, first hole; 10c2, second hole; 30, air cooling component; 31, semiconductor refrigerator; 32, a plurality of air cooling fins; 40, fan; 50, heat dissipation component; 51, a plurality of heat dissipation fins; 52, first thermal conductive tube; 53, second thermal conductive tube; 60, heat conducting member; 70, pressure plate; 70a, first mounting groove; 70b, second mounting groove; 80, partition. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by technicians in the technical field of the present invention. The terms used in this specification are only for the purpose of describing specific embodiments and are not used to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0023] See also Figure 1-Figure 2 The electronic device 100 includes a housing (not shown), a heat dissipation component (not shown), an air cooling component 30, a fan 40 and a heat dissipation component 50. The housing is provided with an inner cavity, an air inlet and an air outlet 10c, the air inlet and the air outlet 10c are both connected to the inner cavity, the heat dissipation component, the air cooling component 30, the fan 40 and the heat dissipation component 50 are all provided in the inner cavity, the fan 40 corresponds to the air inlet, and the air cooling component 30 is located between the fan 40 and the heat dissipation component. When the electronic device 100 is working, the heat dissipation component to be cooled generates heat, causing the temperature of the inner cavity to rise. At the same time, the fan 40 can promote the gas exchange between the inner cavity and the outside through the air inlet and the air outlet, that is, the fan 40 promotes the gas in the inner cavity to flow toward the air outlet 10c, so that the outside gas enters the inner cavity from the air inlet, further realizing the gas exchange between the inner cavity and the outside. Part of the gas entering the inner cavity from the air inlet passes through the air cooling component 30, and the air cooling component 30 can reduce the temperature of the gas blown into the inner cavity by the fan 40, so as to reduce the temperature of the inner cavity and the heat dissipation component 50. The heat dissipation component 50 absorbs the heat of the heat dissipation component to be cooled and the air cooling component 30, and another part of the gas sucked from the outside into the inner cavity by the fan 40 is blown to the heat dissipation component 50, so as to reduce the temperature of the inner cavity and the heat dissipation component 50. Compared with the prior art, the electronic device 100 provided by the present application has a good heat dissipation effect and a good user experience.

[0024] Optionally, the heat dissipation component is a computer central processing unit.

[0025] The air cooling component 30 mentioned above includes a semiconductor refrigerator 31 and a plurality of air cooling fins 32 stacked in sequence. The semiconductor refrigerator 31 is located between the fan 40 and the heat dissipation component to be cooled. The semiconductor refrigerator 31 is electrically connected to the power supply of the electronic device 100. The semiconductor refrigerator 31 has a cold end and a hot end arranged relatively. A plurality of air cooling fins 32 are attached to the cold end of the semiconductor refrigerator 31, and the semiconductor refrigerator 31 is used to reduce the temperature of the plurality of air cooling fins 32. When part of the gas entering the inner cavity through the air inlet is blown toward the air cooling component 30, the gas passes through the plurality of air cooling fins 32, and the temperature of the cold end of the semiconductor refrigerator 31 can be conducted to the plurality of air cooling fins 32. It can be understood that the gas sucked into the inner cavity from the outside by the fan 40 is treated at low temperature by the plurality of air cooling fins 32 before being blown toward the heat dissipation component to be cooled, so that the heat dissipation component to be cooled has a good heat dissipation effect.

[0026] In some embodiments, the semiconductor refrigerator 31 includes a first semiconductor, a second semiconductor, a first terminal electrode, and a second terminal electrode, the first semiconductor and the second semiconductor are alternately arranged, the first semiconductor is electrically connected to one end of the first terminal electrode, the other end of the first terminal electrode is connected to the positive electrode of the power supply, the second semiconductor is electrically connected to one end of the second terminal electrode, and the other end of the second terminal electrode is connected to the negative electrode of the power supply. Optionally, the first semiconductor is an N-type semiconductor, and the second semiconductor is a P-type semiconductor.

[0027] The air outlet 10c includes a first hole 10c1 and a second hole 10c2, the heat dissipation element is located between the first hole 10c1 and the plurality of air cooling fins 32, and the partial heat dissipation assembly 50 is located between the second hole 10c2 and the fan 40. When the electronic device 100 is working, part of the gas entering the inner cavity from the air inlet hole passes through the plurality of air cooling fins 32 and the heat dissipation element in sequence and is discharged to the outside through the first hole 10c1, and another part of the gas entering the inner cavity from the air inlet hole passes through the partial heat dissipation assembly 50 and is discharged to the outside through the second hole 10c2.

[0028] The heat dissipation assembly 50 includes a plurality of heat dissipation fins 51 and a first heat conducting pipe 52 stacked in sequence. The plurality of heat dissipation fins 51 are located between the second hole 10c2 and the fan 40. The first heat conducting pipe 52 is arranged at the hot end of the semiconductor refrigerator 31. The first heat conducting pipe 52 extends from the plurality of air cooling fins 32 to the plurality of heat dissipation fins 51. When the electronic device 100 is working, the first heat conducting pipe 52 can transfer the temperature of the plurality of air cooling fins 32 to the plurality of heat dissipation fins 51. Another part of the gas entering the inner cavity from the air inlet hole passes through the plurality of heat dissipation fins 51 and is discharged to the outside through the second hole 10c2. The gas can take away the heat of the plurality of heat dissipation fins 51, thereby further reducing the temperature of the hot end of the semiconductor refrigerator 31.

[0029] For the electronic device 100, the electronic device 100 further includes a heat conductor 60, which is disposed on the heat dissipation component. The heat conductor 60 is used to cool the heat dissipation component. When part of the heat generated by the heat dissipation component is shared by the heat conductor 60, the heat is transferred to the outside through the heat conductor 60. Optionally, the heat conductor 60 is a copper sheet.

[0030] The electronic device 100 further includes a second thermal conductive tube 53, which is disposed at one end of the heat conductive member 60, and the other end of the second thermal conductive tube 53 extends from the heat conductive member 60 to the plurality of heat dissipation fins 51. When the heat dissipation member generates heat, the second thermal conductive tube 53 conducts the heat of the heat conductive member 60 to the plurality of heat dissipation fins 51, thereby cooling the heat conductive member 60.

[0031] The electronic device 100 also includes a pressing plate 70, which has a first mounting groove 70a at one end thereof facing the heat dissipation element. The heat conductive element 60 is disposed in the first mounting groove 70a. The heat conductive element 60 is clamped by the pressing plate 70 and the heat dissipation element together. The first mounting groove 70a has a limiting function on the heat conductive element 60, thereby reducing the risk of the heat conductive element 60 being offset.

[0032] In some embodiments, the pressure plate 70 has a first surface and a second surface that are relatively arranged, a first mounting groove 70a is arranged on the first surface, and a second mounting groove 70b is arranged on the second surface of the pressure plate 70, the first mounting groove 70a is connected to the second mounting groove 70b, and part of the second thermal conductive tube 53 is arranged in the second mounting groove 70b, and the second mounting groove 70b has a limiting function on the second thermal conductive tube 53, thereby reducing the risk of the second thermal conductive tube 53 being offset.

[0033] For the above-mentioned electronic device 100, the electronic device 100 also includes a partition 80, which is located in the inner cavity. The partition 80 extends from the air inlet toward the air outlet 10c, and the partition 80 and the wall of the inner cavity together enclose a heat dissipation channel, and the heat dissipation element to be cooled, the heat dissipation component 50 and the fan 40 are all located in the heat dissipation channel. The gas entering the inner cavity from the air inlet can be concentrated on the heat dissipation element to be cooled, thereby increasing the heat dissipation effect of the heat dissipation element to be cooled.

[0034] It should be noted that the preferred embodiments of the utility model are given in the specification and drawings of the utility model, but the utility model can be implemented in many different forms and is not limited to the embodiments described in the specification. These embodiments are not used as additional restrictions on the content of the utility model. The purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the description of the utility model; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the scope of protection of the claims attached to the utility model.

Claims

1. An electronic device, characterized in that: include: The housing is provided with an inner cavity, an air inlet hole and an air outlet hole, wherein the air inlet hole and the air outlet hole are both connected to the inner cavity; The heat dissipation component is arranged in the inner cavity; A fan is disposed in the inner cavity, the fan corresponds to the air inlet, and the fan is used to promote gas exchange between the inner cavity and the outside through the air inlet and the air outlet; An air cooling component is arranged in the inner cavity, the air cooling component is located between the fan and the heat dissipation element to be cooled, and the air cooling component is used to reduce the temperature of the gas blown into the inner cavity by the fan, so as to reduce the temperature of the inner cavity and the heat dissipation element to be cooled; A heat dissipation component is arranged in the inner cavity. The heat dissipation component is used to absorb the heat of the heat dissipation component and the air cooling component, and the gas sucked into the inner cavity from the outside by the fan is blown toward the heat dissipation component to reduce the temperature of the inner cavity and the heat dissipation component.

2. The electronic device according to claim 1, characterized in that: The air cooling component includes a semiconductor refrigerator and a plurality of air cooling fins stacked in sequence. The semiconductor refrigerator is located between the fan and the heat dissipation element to be cooled. The plurality of air cooling fins are attached to the cold end of the semiconductor refrigerator, and the semiconductor refrigerator is used to reduce the temperature of the plurality of air cooling fins. The plurality of air cooling fins are used to reduce the temperature of the gas drawn into the inner cavity from the outside by the fan.

3. The electronic device according to claim 2, characterized in that: The air outlet hole comprises a first hole and a second hole, and the heat dissipation element is located between the first hole and the plurality of air cooling fins; The heat dissipation assembly includes a plurality of heat dissipation fins stacked in sequence, and the plurality of heat dissipation fins are located between the second hole and the fan.

4. The electronic device according to claim 3, characterized in that: The heat dissipation component also includes a first temperature conducting tube, which is arranged at the hot end of the semiconductor refrigerator. The first temperature conducting tube extends from the plurality of air cooling fins to the plurality of heat dissipation fins. The first temperature conducting tube is used to conduct the temperature of the plurality of air cooling fins to the plurality of heat dissipation fins to reduce the temperature of the hot end of the semiconductor refrigerator.

5. The electronic device according to claim 3, characterized in that: The electronic device further comprises a heat conducting member, which is arranged on the heat dissipation member and is used to cool the heat dissipation member.

6. The electronic device according to claim 5, characterized in that: The heat conducting member is a copper sheet.

7. The electronic device according to claim 5, characterized in that: The electronic device further comprises a second thermal conductive tube, one end of which is arranged on the thermal conductive member, and the other end of which extends from the thermal conductive member to the plurality of heat dissipation fins, and the second thermal conductive tube is used to cool the thermal conductive member.

8. The electronic device according to claim 7, characterized in that: The electronic device further comprises a pressing plate, wherein a first mounting groove is arranged at one end of the pressing plate facing the heat dissipation element, the heat conductive element is arranged in the first mounting groove, and the heat conductive element is clamped by the pressing plate and the heat dissipation element.

9. The electronic device according to claim 8, characterized in that: The pressure plate has a first surface and a second surface arranged opposite to each other, the first mounting groove is arranged on the first surface, the pressure plate is provided with a second mounting groove on the second surface, the first mounting groove is connected to the second mounting groove, and part of the second thermal conductive pipe is arranged in the second mounting groove.

10. The electronic device according to claim 1, characterized in that: The electronic device also includes a partition, which is located in the inner cavity, extends from the air inlet toward the air outlet, and the partition and the wall of the inner cavity together form a heat dissipation channel, and the heat dissipation element to be dissipated, the heat dissipation assembly and the fan are all located in the heat dissipation channel.

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