Light processing device

Abstract

The embodiment of the utility model provides a light treatment device, the light treatment device comprises a shell, a light emitting assembly, a cold compress part, a refrigerator and a heat dissipation system, the light emitting assembly is arranged in the shell, and the light emitting assembly is used for generating light rays emitted to skin to be treated through a light outlet of the shell; the cold compress piece is arranged at the light outlet and used for conducting cold compress on the skin. The refrigerating surface of the refrigerator is in heat conduction connection with the cold compress piece; the heat dissipation system comprises a liquid cooling plate, a heat dissipation pipe, cooling liquid and a liquid pump, and the liquid cooling plate is in heat conduction connection with the heating surface of the refrigerator so as to be used for absorbing heat generated by the heating surface; the liquid cooling plate is provided with a cooling liquid containing cavity, a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both communicated with the cooling liquid containing cavity, the heat dissipation pipe is communicated with the liquid inlet and the liquid outlet, the liquid pump is connected to the heat dissipation pipe, and the liquid pump is configured to drive cooling liquid to circularly flow in the cooling liquid containing cavity and the heat dissipation pipe, so that the cooling liquid flows through the heat dissipation part of the heat dissipation pipe for heat dissipation; and the condition that external hair impurities are attached to the heating surface of the refrigerator is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of skin treatment equipment, and in particular to a light treatment device. Background Art

[0002] The light treatment devices such as hair removal devices and skin rejuvenation devices in related technologies usually have a light output component, which is used to emit light for treating the skin. The light emitted by the light output component will cause a burning sensation to the user when it shines on the skin. The light treatment devices are usually equipped with cold compresses and refrigerators to reduce the burning sensation of the user.

[0003] However, the refrigerator generates heat during operation, and the optical processing device is also equipped with an air cooling structure to cool the refrigerator. During the cooling process, the air cooling structure will absorb external hair impurities into the device and blow them toward the refrigerator, which can easily cause the refrigerator to adhere to hair impurities and affect heat dissipation. Utility Model Content

[0004] The embodiments of the present application provide a light processing device to solve the above technical problems.

[0005] The embodiments of the present application achieve the above-mentioned objectives through the following technical solutions.

[0006] An embodiment of the present application provides a light treatment device, which includes a shell, a light output component, a cold compress, a refrigerator and a heat dissipation system, wherein the shell has a light output port; the light output component is arranged in the shell, and the light output component is used to generate light that is emitted to the skin to be treated through the light output port; the cold compress is arranged at the light output port for cold compressing the skin; the cooling surface of the refrigerator is thermally connected to the cold compress; the heat dissipation system includes a liquid cooling plate, a heat dissipation pipe, a coolant and a liquid pump, the liquid cooling plate is thermally connected to the heating surface of the refrigerator for absorbing the heat generated by the heating surface; the liquid cooling plate is provided with a cooling liquid holding chamber, a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both connected to the cooling liquid holding chamber, the heat dissipation pipe is connected to the liquid inlet and the liquid outlet, the liquid pump is connected to the heat dissipation pipe, the heat dissipation pipe has a heat dissipation part, and the liquid pump is configured to drive the cooling liquid to circulate in the cooling liquid holding chamber and the heat dissipation pipe so that the cooling liquid flows through the heat dissipation part to dissipate heat.

[0007] In some embodiments, the cold compress is located in the optical path of the light emitted by the light emitting component, so that the light emitted by the light emitting component passes through the cold compress and is emitted toward the skin to be treated; alternatively, the cold compress is located outside the optical path of the light emitted by the light emitting component, and the cold compress is arranged on the surrounding side or beside the light outlet.

[0008] In some embodiments, the cold compress, the refrigerator, and the liquid cooling plate are stacked in sequence along the thickness direction of the liquid cooling plate.

[0009] In some embodiments, the liquid cooling plate includes a plate body assembly and a heat sink, the plate body assembly is provided with a cooling liquid receiving chamber, a liquid inlet and a liquid outlet, and the heat sink is connected to the plate body assembly and is located in the cooling liquid receiving chamber.

[0010] In some embodiments, the plate assembly includes a first plate and a second plate, the first plate and the second plate together form a cooling liquid holding chamber, the first plate is thermally connected to the heating surface of the refrigerator, and the heat sink is connected to the first plate; and / or, the heat sink is arranged corresponding to the refrigerator.

[0011] In some embodiments, the plate assembly includes a first plate body and a second plate body, the first plate body and the second plate body together form a cooling liquid containing chamber, the first plate body is thermally connected to the heating surface of the refrigerator, and the heat sink is connected to the first plate body; the heat sink is in contact with or abuts against the second plate body; and / or the heat sink is a heat dissipation protrusion protruding from the surface of the first plate body and extending from the liquid inlet to the liquid outlet.

[0012] In some embodiments, the cooling liquid containing chamber includes a liquid inlet chamber, a first heat conducting chamber and a liquid outlet chamber, the liquid inlet is connected to the liquid inlet chamber, the liquid outlet is connected to the liquid outlet chamber, the first heat conducting chamber connects the liquid inlet chamber and the liquid outlet chamber, the first heat conducting chamber is arranged corresponding to the heating surface, the heat sink is located in the first heat conducting chamber, and the heat sink extends from the liquid inlet chamber to the liquid outlet chamber.

[0013] In some embodiments, there are multiple heat sinks, which are spaced apart in the first heat conduction cavity, and a cooling liquid channel is formed between any two adjacent heat sinks. One end of the cooling liquid channel is connected to the liquid inlet cavity, and the other end is connected to the liquid outlet cavity.

[0014] In some embodiments, the liquid cooling plate includes a first plate body and a second plate body, the first plate body includes a flat plate structure, the second plate body is provided with a groove, the flat plate structure of the first plate body covers the groove and fits with the second plate body to form a cooling liquid containing cavity.

[0015] In some embodiments, the first plate body includes a liquid inlet end and a liquid outlet end, the liquid inlet end is provided with a liquid inlet, and the liquid outlet end is provided with a liquid outlet.

[0016] In some embodiments, the liquid cooling plate is also thermally connected to the light emitting component to absorb the heat generated by the light emitting component.

[0017] In some embodiments, the liquid cooling plate is provided with a cooling liquid containing chamber, a liquid inlet and a liquid outlet; the cooling liquid containing chamber includes a liquid inlet chamber, a first heat conduction chamber, a second heat conduction chamber and a liquid outlet chamber, the liquid inlet is connected to the liquid inlet chamber, the liquid outlet is connected to the liquid outlet chamber, the first heat conduction chamber is connected to the liquid inlet chamber and the liquid outlet chamber, and the first heat conduction chamber is arranged corresponding to the refrigerator; the second heat conduction chamber is connected to the liquid inlet chamber and the liquid outlet chamber, and the second heat conduction chamber is arranged corresponding to the light output component.

[0018] In some embodiments, the liquid cooling plate includes a partition, which is arranged in the cooling liquid containing cavity and separates the first heat conducting cavity and the second heat conducting cavity. One end of the first heat conducting cavity and the second heat conducting cavity are connected to the liquid inlet cavity, and the other end is connected to the liquid outlet cavity.

[0019] In some embodiments, the liquid cooling plate also includes a first plate body and a second plate body, the first plate body and the second plate body together form a cooling liquid containing cavity, the first plate body is thermally connected to the heating surface of the refrigerator, and the partition is protruding from the surface of the second plate body facing the first plate body.

[0020] In some embodiments, there are multiple liquid cooling plates, at least one liquid cooling plate is thermally connected to the heating surface of the refrigerator, and at least another liquid cooling plate is thermally connected to the light output component.

[0021] In some embodiments, the optical treatment device further includes a hair removal mechanism, which includes a light output component and a cold compress; multiple liquid cooling plates are distributed on the same side of the hair removal mechanism, or liquid cooling plates are distributed on opposite sides of the hair removal mechanism along the thickness direction of the optical treatment device.

[0022] In some embodiments, the optical treatment device further includes a hair removal mechanism, which includes a light output component and a cold compress, and liquid cooling plates are distributed on opposite sides of the hair removal mechanism along the thickness direction of the optical treatment device, and at least two liquid cooling plates are interconnected.

[0023] In some embodiments, the hair removal mechanism includes a first side and a second side opposite to each other, the direction of the first side along the second side is the thickness direction of the light treatment device, the liquid cooling plate located on the first side is thermally connected to the heating surface of the refrigerator, the liquid cooling plate located on the second side is thermally connected to the light output component, and the liquid cooling plate located on the first side is connected to the liquid cooling plate located on the second side.

[0024] In some embodiments, the heat dissipation system further includes a heat dissipation fan, and the heat dissipation pipe is located at an air inlet side or an air outlet side of the heat dissipation fan.

[0025] In some embodiments, the shell has a head and a tail, and the shell is provided with a first vent and a second vent, the first vent is located at the tail, and the second vent is closer to the head relative to the tail, one of the first vent and the second vent is an air inlet, and the other is an air outlet; the heat dissipation part includes a heat sink; the light output component and the cold compress are both located at the head; the heat dissipation system is located in the shell, and the heat dissipation fan is suitable for guiding the airflow from the air inlet through the heat sink to the air outlet.

[0026] In some embodiments, the shell has a head and a tail, the shell is provided with a first vent and a second vent, the first vent is located at the tail, and the second vent is closer to the tail relative to the head, one of the first vent and the second vent is an air inlet, and the other is an air outlet; the heat dissipation portion includes a heat sink; the light output component and the cold compress are both located at the head; the heat dissipation system is located inside the shell, and the heat dissipation fan is suitable for guiding the airflow from the air inlet to the air outlet through the heat sink.

[0027] In some embodiments, the shell further has a grip portion, the grip portion is located between the head portion and the tail portion, and the second vent is located at the tail portion.

[0028] In some embodiments, the housing further has a gripping portion, and the head portion, the gripping portion, and the tail portion are sequentially arranged along the length direction of the light processing device.

[0029] In some embodiments, the heat sink is located between the air outlet and the heat dissipation fan.

[0030] In some embodiments, the heat dissipation pipe is a fin-type heat dissipation coil, and the fins of the heat dissipation pipe are located on the air inlet side or the air outlet side of the heat dissipation fan.

[0031] In some embodiments, the heat dissipation pipe includes a first pipe, a second pipe, and a third pipe connected in sequence, the first pipe is connected to the liquid inlet, the third pipe is connected to the liquid outlet, the second pipe is located on the air inlet side or the air outlet side of the heat dissipation fan, the heat dissipation part includes a second pipe and a heat sink, and the heat sink is arranged on the outer periphery of the second pipe.

[0032] In some embodiments, the second pipe is a flat pipe structure or the longitudinal cross-section of the second pipe is elliptical.

[0033] In some embodiments, the second pipe is bent at least once.

[0034] In some embodiments, the second pipe is bent at least twice, and at least the two bending directions are different.

[0035] In some embodiments, the second conduit is racetrack-shaped or zigzag-shaped.

[0036] In some embodiments, the second pipe includes multiple pipe segments and multiple bends, the pipe segments and the bends are alternately connected to form a coil-like structure, each pipe segment extends along a first direction, and multiple pipe segments are arranged at intervals along a second direction, one of the first direction and the second direction is the length direction of the light processing device, and the other is the width direction of the light processing device.

[0037] In some embodiments, there are multiple heat sinks, and the same heat sink is sleeved on the outer circumference of multiple pipe segments, and the multiple heat sinks are arranged at intervals along the first direction.

[0038] In some embodiments, one end of the second pipe is rounded to connect to the first pipe, and the other end of the second pipe is rounded to connect to the third pipe.

[0039] In some embodiments, one end of the second pipe is plugged into the first pipe, and / or the other end of the second pipe is plugged into the third pipe.

[0040] In some embodiments, the first pipe and / or the third pipe is a round pipe.

[0041] In some embodiments, the heat dissipation fan and the second pipe are arranged along the thickness direction, width direction or length direction of the light processing device.

[0042] In some embodiments, the light processing device also includes a circuit board, the circuit board has a first side and a second side opposite to each other, the liquid cooling plate is located on the first side, the cooling fan and the second pipe are both located on the second side, and at least one of the first pipe and the third pipe is bent from the first side to the second side.

[0043] In some embodiments, a pipe slot is disposed on a side of the circuit board, and at least one of the first pipe and the third pipe is disposed in the pipe slot.

[0044] In some embodiments, a pipe slot is provided on the side of the circuit board, and at least one of the first pipe and the third pipe includes a first extension tube and a second extension tube connected to each other. The first extension tube extends along the width direction or the length direction of the circuit board, and the second extension tube extends from the first side to the second side. The second extension tube is clamped in the pipe slot.

[0045] In some embodiments, the cooling fan and the second pipe are arranged along the thickness direction of the optical processing device; the optical processing device also includes a fan bracket, which is fixed to the circuit board and located on the second side, the cooling fan is installed on the fan bracket, and the air outlet of the cooling fan is spaced from the circuit board.

[0046] In some embodiments, the light processing device further includes a power interface located at the second side.

[0047] In some embodiments, the light processing device further includes a switch valve, which is connected to the heat dissipation pipe and can selectively turn on or off the heat dissipation pipe.

[0048] In some embodiments, the switch valve is a one-way valve.

[0049] In some embodiments, the light processing device further includes a supporting structure having an installation cavity and a heat dissipation port connected to the installation cavity. The light output assembly is installed in the installation cavity and is thermally connected to the liquid cooling plate at the heat dissipation port.

[0050] In some embodiments, the light processing device also includes a supporting structure, and the supporting structure and the liquid cooling plate are arranged along the thickness direction of the light processing device. The top wall and side walls of the supporting structure jointly surround the light output component, the light output component is penetrated through the bottom wall of the supporting structure and contacts the liquid cooling plate, and the cooling fan is opposite to the side wall of the supporting structure.

[0051] In some embodiments, the circuit board is provided with a notch, the top wall of the support structure is located on the second side, the bottom wall of the support structure is at least partially embedded in the notch, or the bottom wall of the support structure passes through the notch from the second side and protrudes from the first side.

[0052] In some embodiments, the light output component includes a light source and a lampshade, the light source is used to emit care light so that the light is emitted from the light output port of the lampshade, and the lampshade is thermally connected to the liquid cooling plate; the lampshade is an insulating thermally conductive lampshade; or, the lampshade is an electrically conductive thermally conductive lampshade, and an insulating thermally conductive layer is provided between the lampshade and the liquid cooling plate.

[0053] In any of the above embodiments of the present application, a light emitting component of the optical treatment device is disposed in a housing, the light emitting component is used to generate light that is emitted to the skin to be treated through the light emitting port of the housing, a cold compress is disposed at the light emitting port for cold compressing the skin, the cooling surface of the refrigerator is thermally connected to the cold compress, and the liquid cooling plate of the heat dissipation system is thermally connected to the heating surface of the refrigerator for absorbing the heat generated by the heating surface, so that the liquid cooling plate can dissipate heat for the heating surface of the refrigerator, and also helps to reduce the situation where external hair or other impurities adhere to the heating surface of the refrigerator and affect the heat dissipation of the refrigerator. The liquid cooling plate is provided with a cooling liquid holding chamber, a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both connected to the cooling liquid holding chamber, the heat dissipation pipe is connected to the liquid inlet and the liquid outlet, the liquid pump is connected to the heat dissipation pipe, the heat dissipation pipe has a heat dissipation part, and the liquid pump is configured to drive the cooling liquid to circulate in the cooling liquid holding chamber and the heat dissipation pipe, so that the cooling liquid flows through the heat dissipation part to dissipate heat, which helps to improve the heat dissipation effect of the liquid cooling plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0055] Figure 1 The schematic diagram of the structure of the light processing device provided by some embodiments of the present application is illustrated.

[0056] Figure 2 Example Figure 1 A cross-sectional schematic diagram of an optical processing device of an embodiment.

[0057] Figure 3 Example Figure 1A schematic diagram of the structure of a portion of a light processing device of an embodiment.

[0058] Figure 4 Example Figure 1 A schematic structural diagram of a liquid cooling plate of an optical processing device according to an embodiment of the present invention.

[0059] Figure 5 Example Figure 4 A schematic cross-sectional view of a liquid cooling plate of an optical processing device according to an embodiment of the present invention.

[0060] Figure 6 Example Figure 4 An exploded schematic diagram of a liquid cooling plate of an optical processing device of an embodiment.

[0061] Figure 7 Example Figure 1 A schematic diagram of the structure of another part of the light processing device of the embodiment.

[0062] Figure 8 Example Figure 1 A schematic diagram of the structure of another part of the light processing device of an embodiment.

[0063] Fig. 9 A partial structural schematic diagram illustrating another embodiment of a light processing device of the present application.

[0064] Fig.10 A schematic cross-sectional view illustrating a light processing device according to another embodiment of the present application. DETAILED DESCRIPTION

[0065] In order to make those skilled in the art better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0066] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0067] See also Figure 1 and Figure 2The embodiment of the present application provides a light treatment device 100, which is a device that adjusts and improves the body and skin conditions according to the physiological functions of the human body. It has whitening, skin rejuvenation, freckle removal, wrinkle removal, hair removal and other effects. Based on optics, different effects can be achieved by irradiating the skin with light of special wavelengths or different types of light. For example, currently, strong pulsed light, LED light, laser, etc. are widely used.

[0068] In some embodiments, the light treatment device 100 may be a hair removal device or a skin rejuvenation device.

[0069] In some embodiments, the light treatment device 100 may include a housing 10, a light output component 20, a cold compress 30 and a refrigerator 40, and the light output component 20, the cold compress 30 and the refrigerator 40 may all be arranged in the housing 10. The housing 10 may have a light output port 11. The light output component 20 is arranged in the housing 10 to generate light that is emitted to the skin to be treated through the light output port 11. The cooling surface 41 of the refrigerator 40 is thermally connected to the cold compress 30, so that the refrigerator 40 can provide coldness for the cold compress 30. The cold compress 30 is arranged at the light output port 11 for cold compressing the skin, so that the coldness generated by the refrigerator 40 can be transferred to the skin through the cold compress 30, and then the pain or burning sensation generated when the light acts on the skin can be reduced or even eliminated.

[0070] In some embodiments, the light outlet 11 may be an opening structure such as a light outlet slot or a light outlet hole provided on the housing 10 .

[0071] In some embodiments, the light outlet 11 may also be formed by some light-transmitting areas on the housing 10. For example, at least part of the housing of the light processing device 100, such as the head housing, may be made of a light-transmitting material, and a light-shielding layer is provided in a local area of ​​the head housing to form the light outlet 11 where the light-shielding layer is not provided on the head housing.

[0072] In some embodiments, the light processing device 100 can be divided into different types according to the different types of light generated by the light output component 20. For example, the light output component 20 can be used to generate laser, which is a laser light source 21 component, and the light processing device 100 is a laser processing device; for example, the light output component 20 can be used to generate intense pulsed light (IPL), which is an IPL light source 21 component (such as a xenon lamp component), and the light processing device 100 is an intense pulsed light processing device; for example, the light output component 20 can be an LED light source 21 component.

[0073] This application mainly uses the light-emitting component 20 as an IPL light source 21 component as an example for explanation. The light-emitting principle of this type of light processing device is: the capacitor is connected to the power supply, and the transformer component boosts the voltage to charge the capacitor. When the capacitor is charged to a preset value and the controller receives a trigger signal, the electric energy in the capacitor is released, and the instantaneous voltage can reach several hundred volts, thereby stimulating the lamp tube to instantly release strong pulsed light, thereby completing a light emission.

[0074] In some embodiments, the cold compress 30 is arranged at the light outlet 11. For example, the cold compress 30 can be installed on the light outlet 11, so that the cold compress 30 is located in the optical path of the light emitted by the light outlet component 20, so that the light emitted by the light outlet component 20 passes through the cold compress 30 and is emitted to the skin to be treated. In this case, the light outlet and cold compress positions of the optical treatment device 100 are the same or partially overlap. For another example, the cold compress 30 can be arranged on the peripheral side or side of the light outlet 11, so that the cold compress 30 is outside the optical path of the light emitted by the light outlet component 20, and the light emitted by the light outlet component 20 does not pass through the cold compress 30. In this case, the light outlet and cold compress positions of the optical treatment device 100 are not the same.

[0075] In some embodiments, the cold compress 30 may be sapphire. The cold compress 30 may be generally in the shape of a block, a sheet, or other shapes.

[0076] In some embodiments, the cooler 40 may be a thermocouple cooler, which helps to simplify the structure of the cooler 40 and to miniaturize the cooler 40 , thereby facilitating the application of the cooler 40 in locations with limited space.

[0077] In some embodiments, the refrigerator 40 may include a semiconductor refrigeration sheet. The semiconductor refrigeration sheet utilizes the Peltier effect of semiconductor materials. When direct current passes through a couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the couple, respectively, to achieve the purpose of refrigeration. The semiconductor refrigeration sheet can be directly attached to the cold compress 30 to be thermally connected to the cold compress 30, or it can be indirectly connected to the cold compress 30 through a thermal conductive medium such as thermal grease, thereby cooling the cold compress 30.

[0078] In some embodiments, the refrigerator 40 may be a laser refrigerator, which also helps to simplify the structure of the refrigerator 40 and to miniaturize the refrigerator 40, making it easier to apply the refrigerator 40 to locations with limited space and making it less susceptible to electromagnetic influences.

[0079] In some embodiments, the light processing device 100 may further include a heat dissipation system 50, which may be located in the housing 10. The heat dissipation system 50 is used to dissipate heat from the heating surface 42 of the refrigerator 40. Of course, the heat dissipation system 50 may be used only to dissipate heat from the heating surface 42 of the refrigerator 40, or may be used to dissipate heat from at least two structures, for example, the heat dissipation system 50 may be used to dissipate heat from the heating surface 42 of the refrigerator 40 and the light output component 20.

[0080] See also Figure 2 and Figure 3 In some embodiments, the heat dissipation system 50 includes a liquid cooling plate 51 and a heat dissipation pipe 52, and the liquid cooling plate 51 and the heat dissipation pipe 52 are connected. The liquid cooling plate 51 is thermally connected to the heating surface 42 of the refrigerator 40 to absorb the heat generated by the heating surface 42, so that the liquid cooling plate 51 can dissipate heat for the heating surface 42 of the refrigerator 40, and also helps to reduce the situation where foreign hair or other impurities adhere to the heating surface 42 of the refrigerator 40 and affect the heat dissipation of the refrigerator 40, and the liquid cooling method of the liquid cooling plate 51 is better than other methods such as air cooling for the heat dissipation effect of the heating surface 42 of the refrigerator 40. Since the liquid cooling plate 51 is a plate-shaped structure, the liquid cooling plate 51 helps to increase the contact area with the heating surface 42 of the refrigerator 40 compared with other shapes such as a circular pipe, and then helps to improve the heat dissipation effect of the liquid cooling plate 51 on the heating surface 42 of the refrigerator 40. In addition, the heat dissipation pipe 52 helps to increase the contact area between the heat dissipation system 50 and the air, so that the heat dissipation pipe 52 can dissipate the heat of the liquid cooling plate 51 to the surrounding environment more quickly.

[0081] In some embodiments, the liquid cooling plate 51 can be connected to the heating surface 42 of the refrigerator 40 by directly adhering to the heating surface 42 of the refrigerator 40, or it can be indirectly connected to the heating surface 42 of the refrigerator 40 through a heat-conducting medium such as thermal grease, thereby dissipating the heat from the heating surface 42 of the refrigerator 40.

[0082] See also Figures 4 to 6 In some embodiments, the liquid cooling plate 51 may be provided with a cooling liquid containing chamber 510, a liquid inlet 511 and a liquid outlet 512, and the liquid inlet 511 and the liquid outlet 512 are both connected to the cooling liquid containing chamber 510. The heat dissipation pipe 52 is connected to the liquid inlet 511 and the liquid outlet 512, and the heat dissipation pipe 52 has a heat dissipation portion 520. The heat dissipation system 50 may further include a cooling liquid, and the cooling liquid may flow back and forth between the liquid cooling plate 51 and the heat dissipation pipe 52, so that the cooling liquid can transfer the heat of the liquid cooling plate 51 to the heat dissipation portion 520 of the heat dissipation pipe 52 for heat dissipation, which helps to improve the heat dissipation effect of the heat dissipation system 50, and the internal space of the heat dissipation pipe 52 and the liquid cooling plate 51 also helps to increase the capacity of the heat dissipation system 50 to store cooling liquid.

[0083] In some embodiments, the coolant may be a flowing liquid. For example, the coolant may be an inorganic liquid, such as pure water, calcium chloride liquid, etc. For another example, the coolant may be an organic liquid, such as insulating oil, methanol, ethanol, ethylene glycol, ethanol, glycerol, etc. In addition, the coolant may also be other liquids with low viscosity but large specific heat capacity.

[0084] See also Figure 2 In some embodiments, the cooling surface 41 and the heating surface 42 of the refrigerator 40 can be located on opposite sides of the refrigerator 40, respectively, which helps to reduce the interference between the cold compress 30 and the liquid cooling plate 51.

[0085] In some embodiments, the cooling surface 41 and the heating surface 42 of the refrigerator 40 may be respectively located on both sides of the thickness direction of the refrigerator 40. The thickness direction of the refrigerator 40 may be consistent with the thickness direction z of the optical processing device 100.

[0086] In some embodiments, the cold compress 30, the refrigerator 40 and the liquid cooling plate 51 may be stacked in sequence along the thickness direction z of the liquid cooling plate 51. The thickness direction of the liquid cooling plate 51 may be consistent with the thickness direction z of the optical processing device 100, which helps to make the cold compress 30, the refrigerator 40 and the liquid cooling plate 51 more compact along the thickness direction z of the optical processing device 100.

[0087] In some embodiments, the heat dissipation system 50 may further include a liquid pump 53, which is connected to the heat dissipation pipe 52, and is configured to drive the coolant to circulate in the coolant receiving chamber 510 and the heat dissipation pipe 52, so that the coolant flows through the heat dissipation portion 520 to dissipate heat. In this way, the liquid pump 53 helps to speed up the flow of the coolant between the liquid cooling plate 51 and the heat dissipation pipe 52, helps to increase the speed at which the heat of the liquid cooling plate 51 is transferred to the heat dissipation pipe 52, and then helps to improve the heat dissipation effect of the heat dissipation system 50 on the heating surface 42 of the refrigerator 40.

[0088] In some embodiments, the liquid pump 53 may be a diaphragm pump, or a gear pump or other structures.

[0089] See also Figures 4 to 6 In some embodiments, the liquid cooling plate 51 may include a plate assembly 513 and a heat sink 514. The plate assembly 513 may be provided with the above-mentioned cooling liquid receiving chamber 510, the liquid inlet 511 and the liquid outlet 512. The heat sink 514 is connected to the plate assembly 513 and is located in the cooling liquid receiving chamber 510. In this way, the heat sink 514 helps to increase the contact area between the liquid cooling plate 51 and the cooling liquid, so that heat can be transferred from the liquid cooling plate 51 to the cooling liquid more quickly, thereby helping to improve the heat dissipation effect of the liquid cooling plate 51.

[0090] In some embodiments, the cooling liquid containing chamber 510 may include a liquid inlet chamber 515, a first heat conduction chamber 516, and a liquid outlet chamber 517. The liquid inlet 511 is connected to the liquid inlet chamber 515, the liquid outlet 512 is connected to the liquid outlet chamber 517, the first heat conduction chamber 516 is connected to the liquid inlet chamber 515 and the liquid outlet chamber 517, and the first heat conduction chamber 516 is arranged corresponding to the heating surface 42 of the refrigerator 40. In this way, the cooling liquid can flow from the liquid inlet 511 into the liquid inlet chamber 515, and flow from the liquid inlet chamber 515 to the first heat conduction chamber 516. The cooling liquid in the first heat conduction chamber 516 can receive the heat emitted by the heating surface 42 of the refrigerator 40 through the liquid cold plate 51 and heat up. The heated cooling liquid then flows from the first heat conduction chamber 516 to the liquid outlet chamber 517, and finally flows from the liquid outlet chamber 517 to the liquid outlet 512.

[0091] In some embodiments, the heat sink 514 may be disposed corresponding to the refrigerator 40, which helps the heat sink 514 to better transfer the heat of the heating surface 42 of the refrigerator 40 to the cooling liquid. The heat sink 514 is disposed corresponding to the refrigerator 40, which may mean that the heat sink 514 is opposite to the refrigerator 40 along the thickness direction of the liquid cooling plate 51 or the thickness direction z of the optical processing device 100.

[0092] In some embodiments, the heat sink 514 can be located in the first heat conduction cavity 516, and the heat sink 514 extends from the liquid inlet cavity 515 toward the liquid outlet cavity 517, which helps to increase the area of ​​contact between the liquid cooling plate 51 and the coolant in the first heat conduction cavity 516, and helps to improve the heat dissipation effect of the first heat conduction cavity 516.

[0093] In some embodiments, the plate assembly 513 may include a first plate 5131 and a second plate 5132, the first plate 5131 and the second plate 5132 together enclose a cooling liquid receiving chamber 510, and the first plate 5131 is thermally connected to the heating surface 42 of the refrigerator 40. This helps to simplify the way in which the plate assembly 513 forms the cooling liquid receiving chamber 510.

[0094] In some embodiments, the first plate 5131 may include a flat plate structure, and the second plate 5132 may be provided with a groove 5135. The flat plate structure of the first plate 5131 covers the groove 5135 and fits with the second plate 5132 to form a cooling liquid receiving chamber 510. This helps to simplify the structure of the first plate 5131 and the second plate 5132, so that the two can form a cooling liquid receiving chamber 510.

[0095] In some embodiments, the plate-like structure may be substantially in the shape of a square plate, a rectangular plate, a circular plate, an elliptical plate, or other shapes. The groove 5135 may be substantially in the shape of a square, a rectangle, a circle, an ellipse, or other shapes.

[0096] In some embodiments, the first plate body 5131 may include a liquid inlet end 5133 and a liquid outlet end 5134, wherein the liquid inlet end 5133 is provided with the above-mentioned liquid inlet port 511, and the liquid outlet end 5134 is provided with the above-mentioned liquid outlet port 512. In this way, it is helpful to avoid dispersing the liquid inlet end 5133 and the liquid outlet end 5134 on different plates, and by centrally arranging the liquid inlet end 5133 and the liquid outlet end 5134 on the first plate body 5131, it is more convenient to manufacture the liquid inlet end 5133 and the liquid outlet end 5134.

[0097] In some embodiments, the heat sink 514 can be connected to the first plate 5131, and the heat sink 514 helps to speed up the transfer of heat from the first plate 5131 to the cooling liquid, which helps to improve the heat dissipation effect of the liquid cooling plate 51, and the heat sink 514 also helps to improve the strength of the first plate 5131, so that the first plate 5131 is not easily deformed. The heat sink 514 can be connected to the flat plate structure of the first plate 5131.

[0098] In some embodiments, the heat sink 514 may contact or abut the second plate 5132, so that the first plate 5131 can directly transfer heat to the second plate 5132, transfer heat to the second plate 5132 through the cooling liquid, or transfer heat to the second plate 5132 through the heat sink 514, thereby helping to increase the path for the first plate 5131 to transfer heat to the second plate 5132. In other embodiments, when the heat sink 514 is connected to the first plate 5131, the heat sink 514 and the second plate 5132 may also be spaced apart.

[0099] In some embodiments, the heat sink 514 may also be connected to the second plate 5132 and spaced apart from the first plate 5131 .

[0100] In some embodiments, the heat sink 514 may be a sheet-like structure, for example, the heat sink 514 may be a long sheet-like structure.

[0101] In some embodiments, the heat sink 514 may be a heat dissipation protrusion protruding from the surface of the first plate 5131 and extending from the liquid inlet 511 to the liquid outlet 512, which helps to simplify the structure of the heat sink 514 and the first plate 5131 and facilitates the integrated manufacturing of the two.

[0102] In some embodiments, the heat sink 514 and the first plate 5131 may be an integral structure. For example, the heat sink 514 and the first plate 5131 may be integrally formed by a mold; or, for another example, the heat sink 514 and the first plate 5131 may be connected to the integral structure by welding, gluing, or fasteners, wherein the fasteners may be screws, bolts, or other fastening structures.

[0103] In some embodiments, the number of heat sinks 514 can be multiple, and the multiple heat sinks 514 are spaced apart in the first heat conduction cavity 516, and a cooling liquid channel 518 is formed between any two adjacent heat sinks 514, and one end of the cooling liquid channel 518 is connected to the liquid inlet cavity 515, and the other end is connected to the liquid outlet cavity 517. In this way, the multiple heat sinks 514 help to increase the contact area between the liquid cooling plate 51 and the coolant, and help to improve the heat dissipation effect of the liquid cooling plate 51.

[0104] In addition, the coolant channel 518 formed between any two adjacent heat sinks 514 helps to ensure the stability of the coolant flowing through the first heat conduction cavity 516, helps to disperse the heat in the first heat conduction cavity 516, reduces the temperature difference among various parts in the first heat conduction cavity 516, and helps to avoid local overheating and saturation.

[0105] In the present application, the term “plurality” means greater than or equal to two. For example, the number of the heat dissipation elements 514 may be two, three, four, five, six or other numbers.

[0106] In some embodiments, when there are multiple heat dissipation elements 514 , the shapes, thicknesses, lengths, or other parameters of the multiple heat dissipation elements 514 may be the same or different.

[0107] See also Figure 7 In some embodiments, the liquid cooling plate 51 can also be thermally connected to the light emitting component 20 to absorb the heat generated by the light emitting component 20, so that the liquid cooling plate 51 can dissipate heat for the light emitting component 20, and also help reduce the situation where foreign hair or other impurities adhere to the light emitting component 20 and affect the heat dissipation of the light emitting component 20, and the liquid cooling method of the liquid cooling plate 51 is better than other methods such as air cooling for the heat dissipation effect of the light emitting component 20. Since the liquid cooling plate 51 is a plate-shaped structure, the liquid cooling plate 51 helps to increase the contact area with the light emitting component 20 compared with other shapes such as a circular pipe, which in turn helps to improve the heat dissipation effect of the liquid cooling plate 51 on the light emitting component 20.

[0108] In some embodiments, the liquid cooling plate 51 can be thermally connected to the surface of the light emitting component 20 by directly adhering to the surface of the light emitting component 20. The liquid cooling plate 51 can also be indirectly thermally connected to the surface of the light emitting component 20 through a thermal conductive medium such as thermal grease or other thermal conductive structures.

[0109] In some embodiments, the number of liquid cooling plates 51 may be one or more. When the number of liquid cooling plates 51 is one, the refrigerator 40 and the light output component 20 may be cooled by the same liquid cooling plate 51. When the number of liquid cooling plates 51 is multiple, the refrigerator 40 and the light output component 20 may be cooled by different liquid cooling plates 51; or, a part of the liquid cooling plates 51 may be used to cool the refrigerator 40 and the light output component 20, and another part of the liquid cooling plates 51 may be used to cool one of the refrigerator 40 and the light output component 20.

[0110] See also Figures 4 to 6 In some embodiments, when the liquid cooling plate 51 is configured to dissipate heat for the refrigerator 40 and the light output component 20, the cooling liquid holding chamber 510 may further include a second heat conducting chamber 519, and the second heat conducting chamber 519 is connected to the liquid inlet chamber 515 and the liquid outlet chamber 517. The second heat conducting chamber 519 is arranged corresponding to the light output component 20, which helps the heat sink 514 to better transfer the heat of the light output component 20 to the cooling liquid.

[0111] In this way, the cooling liquid in the liquid inlet cavity 515 can flow to the first heat conduction cavity 516 on the one hand, and can flow to the second heat conduction cavity 519 on the other hand. The cooling liquid located in the first heat conduction cavity 516 can receive the heat emitted by the heating surface 42 of the refrigerator 40 through the liquid cooling plate 51 and heat up. The heated cooling liquid then flows from the first heat conduction cavity 516 to the liquid outlet cavity 517; and the cooling liquid located in the second heat conduction cavity 519 can receive the heat emitted by the light output component 20 through the liquid cooling plate 51 and heat up. The heated cooling liquid then flows from the second heat conduction cavity 519 to the liquid outlet cavity 517. Finally, the cooling liquid flowing from the first heat conduction cavity 516 to the liquid outlet cavity 517 and the cooling liquid flowing from the second heat conduction cavity 519 to the liquid outlet cavity 517 converge in the liquid outlet cavity 517 and flow to the liquid outlet 512.

[0112] In some embodiments, the liquid cooling plate 51 may further include a partition 54, which is disposed in the cooling liquid containing cavity 510 and separates the first heat conducting cavity 516 from the second heat conducting cavity 519. One end of the first heat conducting cavity 516 is connected to the liquid inlet cavity 515, and the other end is connected to the liquid outlet cavity 517; one end of the second heat conducting cavity 519 is connected to the liquid inlet cavity 515, and the other end is connected to the liquid outlet cavity 517. In this way, it is helpful to reduce the thermal influence between the cooling liquid in the first heat conducting cavity 516 and the cooling liquid in the second heat conducting cavity 519, so that the cooling liquid in the first heat conducting cavity 516 can more stably take away the heat of the heating surface 42 of the refrigerator 40, and the cooling liquid in the second heat conducting cavity 519 can more stably take away the heat of the optical component 20.

[0113] In some embodiments, the partition 54 can be protruded from the surface of the second plate 5132 facing the first plate 5131, and the partition 54 helps to increase the strength of the second plate 5132, so that the second plate 5132 is not easily deformed. In addition, since the partition 54 and the heat sink 514 are respectively arranged on different plates, the manufacturing of the partition 54 and the heat sink 514 is facilitated, and the partition 54 and the heat sink 514 are avoided from being concentrated on the same plate to increase the manufacturing difficulty.

[0114] In some embodiments, the partition 54 and the second plate 5132 can be integrally formed by a mold, and both can also be formed by sheet metal processing or other methods.

[0115] In some embodiments, there may be multiple liquid cooling plates 51, at least one liquid cooling plate 51 is thermally connected to the heating surface 42 of the refrigerator 40, and at least another liquid cooling plate 51 is thermally connected to the light output component 20. In this way, the refrigerator 40 and the light output component 20 dissipate heat through different liquid cooling plates 51, effectively reducing the thermal impact caused by the refrigerator 40 and the light output component 20 on each other. Among them, the size, shape, internal cooling liquid capacity or type of the liquid cooling plate 51 for cooling the refrigerator 40 and the liquid cooling plate 51 for cooling the light output component 20 can be the same or different.

[0116] In the case where there are multiple liquid cooling plates 51, the positions of the multiple liquid cooling plates 51 can be arranged according to the requirements. For example, the optical treatment device 100 can also include a hair removal mechanism 101, and the hair removal mechanism 101 can include the above-mentioned light output component 20 and cold compress 30, which can also be understood as the light output component 20 and cold compress 30 as at least a part of the structure of the hair removal mechanism 101.

[0117] In some embodiments, multiple liquid cooling plates 51 can be distributed on the same side of the hair removal mechanism 101. For example, multiple liquid cooling plates 51 can be distributed below, above, left, right, behind or at other positions of the hair removal mechanism 101, so as to facilitate the arrangement of multiple liquid cooling plates 51 on the same side of the hair removal mechanism 101, and the arrangement positions are simple and uniform.

[0118] See also Fig. 9 In some embodiments, liquid cooling plates 51 may be distributed on opposite sides of the hair removal mechanism 101 along the thickness direction z of the optical treatment device 100. For example, the liquid cooling plate 51 for dissipating heat for the refrigerator 40 and the liquid cooling plate 51 for dissipating heat for the light output component 20 are respectively located on opposite sides of the hair removal mechanism 101 along the thickness direction z of the optical treatment device 100, which helps to reduce the influence of interference between the two liquid cooling plates 51.

[0119] In some embodiments, at least two liquid cooling plates 51 can be interconnected. Different liquid cooling plates 51 can be connected through heat dissipation pipes 52. For example, there are two liquid cooling plates 51 that are interconnected, and the two liquid cooling plates 51 serve as the first liquid cooling plate and the second liquid cooling plate respectively; there are also two heat dissipation pipes 52, and the two heat dissipation pipes 52 serve as the first heat dissipation pipe and the second heat dissipation pipe respectively, then the liquid outlet of the first liquid cooling plate can be connected to the liquid inlet of the second liquid cooling plate through the first heat dissipation pipe, and the liquid outlet of the second liquid cooling plate can be connected to the liquid inlet of the first liquid cooling plate through the second heat dissipation pipe. In this way, the coolant can flow from the first liquid cooling plate to the first heat dissipation pipe, and can also flow from the first heat dissipation pipe to the second liquid cooling plate, and can also flow from the second liquid cooling plate to the second heat dissipation pipe, and can also flow from the second heat dissipation pipe to the first liquid cooling plate, so that the coolant can circulate between multiple liquid cooling plates 51 and multiple heat dissipation pipes 52.

[0120] For another example, if three liquid cooling plates 51 are interconnected, the number of heat dissipation pipes 52 is also three, and different liquid cooling plates 51 are connected through different heat dissipation pipes 52 , respectively. For details, refer to the above embodiment in which two liquid cooling plates 51 are connected.

[0121] In some embodiments, the hair removal mechanism 101 may include a first side 61 and a second side 62 opposite to each other, the direction of the first side 61 along the second side 62 may be the thickness direction z of the light treatment device 100, the liquid cooling plate 51 located on the first side 61 is thermally connected to the heating surface 42 of the refrigerator 40, the liquid cooling plate 51 located on the second side 62 is thermally connected to the light output assembly 20, and the liquid cooling plate 51 located on the first side 61 is connected to the liquid cooling plate 51 located on the second side 62. Among them, the liquid cooling plate 51 located on the first side 61 may be the first liquid cooling plate described above, and the liquid cooling plate 51 located on the second side 62 may be the second liquid cooling plate described above.

[0122] In some embodiments, the first side 61 may be below the hair removal mechanism 101 and the second side 62 may be above the hair removal mechanism 101 ; or, the first side 61 may be above the hair removal mechanism 101 and the second side 62 may be below the hair removal mechanism 101 .

[0123] In other embodiments, at least two liquid cooling plates 51 are not connected to each other, for example, there are two liquid cooling plates 51 and two heat dissipation tubes 52, the first heat dissipation tube is connected to the liquid inlet and liquid outlet of the first liquid cooling plate, and the second heat dissipation tube is connected to the liquid inlet and liquid outlet of the second liquid cooling plate, the first heat dissipation tube and the second heat dissipation tube are independent of each other and not connected to each other, and the first liquid cooling plate and the second liquid cooling plate are also independent of each other and not connected to each other.

[0124] See also Figures 1 to 3In some embodiments, the heat dissipation system 50 may further include a heat dissipation fan 55, and the heat dissipation pipe 52 may be located on the air inlet side or the air outlet side of the heat dissipation fan 55. The heat dissipation fan 55 can drive the air flow so that the air flow passing through the heat dissipation pipe 52 can take away the heat of the heat dissipation pipe 52, thereby achieving heat dissipation for the heat dissipation pipe 52, which helps to improve the heat dissipation effect of the heat dissipation system 50.

[0125] In some embodiments, the housing 10 may be provided with a first vent 12 and a second vent 13, one of which is an air inlet and the other is an air outlet. For example, the first vent 12 may be an air inlet and the second vent 13 may be an air outlet; for another example, the first vent 12 may be an air outlet and the second vent 13 may be an air inlet.

[0126] In some embodiments, the housing 10 may have a head 14 and a tail 15, and the light output assembly 20 and the cold compress 30 may be located at the head 14. The heat dissipation portion 520 may include a heat sink 5200, and the heat dissipation fan 55 is suitable for guiding the air flow from the air inlet through the heat sink 5200 of the heat dissipation pipe 52 to the air outlet, so as to better take away the heat of the heat sink 5200.

[0127] In some embodiments, the first vent 12 may be located at the rear portion 15 , which helps to better utilize the spatial location of the rear portion 15 .

[0128] In some embodiments, the second vent 13 may be located on the peripheral side of the housing 10. This helps to fully utilize the peripheral space of the housing 10, increase the surface area for air circulation, and facilitate air to enter and exit the housing 10 from multiple directions, thereby helping to improve the efficiency of the heat dissipation system 50.

[0129] See also Figure 2 In some embodiments, the second vent 13 may be closer to the head 14 relative to the tail 15 , which helps to extend the airflow path of the cooling fan 55 .

[0130] See also Fig.10 In some embodiments, the second vent 13 can be closer to the tail 15 relative to the head 14, which helps to prevent the second vent 13 from being too close to the light output component 20, the cold compress 30 and other structures, thereby helping to reduce the airflow formed by the cooling fan 55 from attaching foreign hair or other impurities to the light output component 20, the cold compress 30 and other structures, thereby affecting the heat dissipation. In addition, by using the liquid cooling plate 51 for heat conduction and heat dissipation, it is possible to transfer heat to the tail 15 or the air outlet near the tail 15 for heat dissipation, which helps to improve the heat dissipation effect of the liquid cooling plate 51.

[0131] In some embodiments, the second vent 13 and the first vent 12 can both be located at the tail 15, which helps to better utilize the spatial position of the tail 15. Since the air inlet and the air outlet are far away from the head 14, when the user puts the head 14 against the skin to use it, it can reduce the user's skin from blocking the air inlet and affecting the air intake and heat dissipation, and it can also reduce the user's skin from blocking the air outlet and affecting the air outlet and heat dissipation, and it can also reduce the situation where the hot air blows to the user's hair removal area and causes the user's discomfort.

[0132] See also Figures 1 to 3 In some embodiments, the housing 10 may further include a gripping portion 16, which is located between the head portion 14 and the tail portion 15. The gripping portion 16 facilitates the user to grip the light processing device 100. When the second vent 13 is located at the tail portion 15, the gripping portion 16 also helps the user to grip the light processing device 100, thereby reducing the obstruction to the second vent 13.

[0133] In some embodiments, the head 14, the holding portion 16 and the tail 15 can be arranged in sequence along the length direction y of the light processing device 100, which helps to simplify the appearance of the light processing device 100. The head 14, the holding portion 16 and the tail 15 are visually streamlined, which is convenient for carrying or storage, and also helps the user to intuitively grasp the head 14 and the tail 15 for easy operation.

[0134] See also Fig.10 In some embodiments, the cooling fan 55 may be located at the rear portion 15 of the housing 10 , which may reduce the noise generated during operation of the cooling fan 55 that is directly heard by the user during use, thereby helping to improve the user experience.

[0135] In some embodiments, the cooling fan 55 can be located at the second vent 13 , which helps the cooling fan 55 to directly act on the air flow vent, thereby easily pushing the hot air out to reduce hot air reflux, or easily drawing the outside cold air into the shell 10 .

[0136] In some embodiments, the heat dissipation fan 55 may be an axial flow fan, and the heat dissipation fan 55 may be located between the second vent 13 and the first vent 12. In this way, the heat is effectively taken out from the inside of the housing 10, which helps to improve the overall heat dissipation efficiency. In addition, compared with other types of fans, such as centrifugal fans, axial flow fans usually have lower noise and less vibration when running at the same air volume.

[0137] In some embodiments, the air inlet direction and the air outlet direction of the axial flow fan may be the thickness direction z of the light processing device 100 .

[0138] In some embodiments, the cooling fan 55 may be a centrifugal fan, which can effectively concentrate and accelerate the airflow, thereby forming a strong air pressure difference in a limited space and improving the cooling efficiency.

[0139] In some embodiments, the air inlet side of the heat dissipation fan 55 is opposite to the first vent 12, and the air outlet side of the heat dissipation fan 55 is opposite to the second vent 13, or the air outlet side of the heat dissipation fan 55 is opposite to the first vent 12, and the air inlet side of the heat dissipation fan 55 is opposite to the second vent 13. This helps to ensure that the airflow is smoothly sucked in from the vent, and after being accelerated by the centrifugal fan, it is forcefully discharged from another vent, forming an efficient heat dissipation cycle.

[0140] In some embodiments, when the cooling fan 55 is a centrifugal fan, the heat sink 5200 is located on the side of the cooling fan 55 facing away from the light output component 20, so that the heat sink 5200 is arranged away from the light output component 20, which helps to reduce the thermal impact of the heat dissipated by the heat sink 5200 on the light output component 20.

[0141] In some embodiments, the cooling fan 55 can be tilted so that the cooling fan 55 can change the direction and coverage of the airflow, so that the airflow can blow more comprehensively and evenly toward heat source areas such as the heat pipe 52, which helps to reduce local hot spots and improve heat dissipation efficiency.

[0142] In some embodiments, the heat sink 5200 may be located between the air outlet and the heat dissipation fan 55 , which helps the heat dissipation fan 55 to promptly remove the heat of the heat sink 5200 to the external environment, thereby helping to reduce heat accumulation in the housing 10 .

[0143] In some embodiments, the heat sink 5200 may be located on the air inlet side of the heat dissipation fan 55 , or the heat sink 5200 may be located on the air outlet side of the heat dissipation fan 55 .

[0144] In some embodiments, the heat sink 5200 and the cooling fan 55 can be stacked to help maximize the use of the airflow generated by the fan, so that the airflow can directly pass through the heat sink 5200 and quickly remove the heat on the heat sink 5200, which helps to increase the rate of heat exchange and enhance the heat dissipation effect.

[0145] In some embodiments, the heat sink 5200 and the heat dissipation fan 55 can be distributed along the direction from the head 14 to the tail 15, or the heat sink 5200 and the heat dissipation fan 55 can be distributed along the direction from the tail 15 to the head 14. This helps to form a direct and continuous airflow channel, helps the airflow generated by the heat dissipation fan 55 to pass through the heat sink 5200 more smoothly and efficiently, and can directly take away the heat of the heat sink 5200, thereby helping to improve the heat dissipation efficiency.

[0146] See also Figure 3 and Figure 8 In some embodiments, the heat dissipation pipe 52 may include a first pipe 521, a second pipe 522, and a third pipe 523 that are connected in sequence, the first pipe 521 is connected to the liquid inlet 511, the third pipe 523 is connected to the liquid outlet 512, and the second pipe 522 is located at the air inlet side or the air outlet side of the heat dissipation fan 55. The heat dissipation portion 520 may include the above-mentioned second pipe 522 and the heat dissipation fin 5200. The heat dissipation fin 5200 may be arranged on the periphery of the second pipe 522, and the heat dissipation fin 5200 helps to increase the contact area between the heat dissipation portion 520 and the air, and helps to improve the heat dissipation effect of the heat dissipation portion 520.

[0147] In some embodiments, the first pipe 521 may be a round pipe, which helps to simplify the structure of the first pipe 521. The third pipe 523 may be a round pipe, which helps to simplify the structure of the third pipe 523.

[0148] In some embodiments, the second pipe 522 may be a flat pipe structure, or the longitudinal section of the second pipe 522 may be substantially elliptical. Thus, the second pipe 522 with a flat pipe structure or an elliptical longitudinal section helps to increase the contact area between the second pipe 522 and the heat sink 5200 compared to a round pipe structure.

[0149] In some embodiments, one end of the second pipe 522 may be substantially rounded to connect with the first pipe 521. The other end of the second pipe 522 may be substantially rounded to connect with the third pipe 523. In this way, the rounded ends of the second pipe 522 help reduce the difficulty of connecting the second pipe 522 with the first pipe 521, and also help reduce the difficulty of connecting the second pipe 522 with the third pipe 523.

[0150] In some embodiments, one end of the second pipe 522 can be plugged into the first pipe 521, so that the connection between the second pipe 522 and the first pipe 521 is relatively simple and convenient. The other end of the second pipe 522 can be plugged into the third pipe 523, so that the connection between the second pipe 522 and the third pipe 523 is relatively simple and convenient.

[0151] In some embodiments, the heat dissipation portion 520 may be bent at least once, which helps the heat dissipation portion 520 to extend in different directions, increases the contact area between the heat dissipation portion 520 and the air, and improves the heat dissipation effect of the heat dissipation pipe 52, thereby helping the heat dissipation fan 55 to better dissipate heat and cool the heat dissipation pipe 52. For example, the heat dissipation portion 520 may be bent once, twice, three times, four times, five times, or other times.

[0152] In some embodiments, the bending angle of the heat dissipation portion 520 may be greater than 0 and less than or equal to 180 degrees. For example, the bending angle of the heat dissipation portion 520 may be 30 degrees, 60 degrees, 90 degrees, 120 degrees, 150 degrees, 180 degrees or other angles.

[0153] In some embodiments, the second pipe 522 may be bent at least once, which helps the second pipe 522 to extend in different directions and helps increase the contact area between the second pipe 522 and the air. For example, the second pipe 522 may be bent once, twice, three times, four times, five times, or other times.

[0154] In some embodiments, the bending angle of the second pipe 522 can be greater than 0 and less than or equal to 180 degrees. For example, the bending angle of the second pipe 522 can be 30 degrees, 60 degrees, 90 degrees, 120 degrees, 150 degrees, 180 degrees or other angles.

[0155] In some embodiments, the second pipe 522 can be bent at least twice, and at least the two bending directions are different, which helps the second pipe 522 to extend in multiple directions.

[0156] In some embodiments, the bending direction of the second pipe 522 may include at least one of the length direction y, the width direction x, and the thickness direction z of the light processing device 100 .

[0157] In some embodiments, the bending direction of the second pipe 522 may include bending from one plane to another plane, wherein one plane forms an angle with the other plane, and by allowing the second pipe 522 to be flexibly bent in a three-dimensional space, the space utilization rate in the housing 10 can be improved. Among them, one of the planes may be a horizontal plane, and the other plane may be a vertical plane.

[0158] In some embodiments, the second pipe 522 may be generally in a racetrack shape or in a zigzag shape, which helps to extend the length of the second pipe 522, thereby helping to increase the contact area between the second pipe 522 and the air and the capacity of the cooling liquid, thereby helping to improve the heat dissipation effect of the second pipe 522.

[0159] In some embodiments, the second pipe 522 may include multiple pipe segments 524 and multiple bends 525. The pipe segments 524 and the bends 525 are alternately connected to form a coil-like structure. The pipe design of the coil-like structure helps to increase the capacity for accommodating the coolant. The multiple tortuous paths formed in the second pipe 522 help to ensure sufficient contact between the coolant and the second pipe 522 for heat exchange.

[0160] In some embodiments, each pipe segment 524 may extend along a first direction, and a plurality of pipe segments 524 may be arranged at intervals along a second direction, wherein one of the first direction and the second direction is the length direction y of the light treatment device 100, and the other is the width direction x of the light treatment device 100. In this way, the shape of the coil-like structure helps to adapt to the layout of the length direction y and the width direction x of the light treatment device 100, making full use of the space of the light treatment device 100 and making the overall design compact.

[0161] In some embodiments, there may be multiple heat sinks 5200, and the same heat sink 5200 may be sleeved on the outer periphery of multiple pipe segments 524, and the multiple heat sinks 5200 are arranged at intervals along the first direction. In this way, the multiple heat sinks 5200 help increase the heat exchange area between the heat pipe 52 and the air, and the multiple heat sinks 5200 arranged at intervals along the first direction help prevent local overheating accumulation and help disperse heat. The same heat sink 5200 sleeved on the outer periphery of multiple pipe segments 524 helps reduce the complexity of assembly between the heat sink 5200 and the pipe segment 524.

[0162] In some embodiments, the heat dissipation pipe 52 may be a fin-type heat dissipation coil. The fin structure helps the heat dissipation pipe 52 to have a larger heat dissipation surface area, thereby increasing the contact area with the air and improving the heat exchange rate.

[0163] In some embodiments, the fins of the heat pipe 52 may be located on the air inlet side or the air outlet side of the heat dissipation fan 55 , which helps to improve the heat exchange efficiency between the fins and the air, and further helps to improve the heat dissipation effect of the heat pipe 52 .

[0164] In some embodiments, the heat dissipation fan 55 and the heat dissipation pipe 52 can be arranged along the thickness direction z or the length direction y of the light processing device 100. In this way, the arrangement of the heat dissipation fan 55 and the heat dissipation pipe 52 is adapted to the layout of the thickness direction z and the length direction y of the light processing device 100, which helps to fully utilize the space of the light processing device 100 and make the overall design compact.

[0165] In some embodiments, the heat dissipation fan 55 and the second pipe 522 of the heat dissipation pipe 52 can be arranged along the thickness direction z, width direction x, or length direction y of the light processing device 100. In this way, the arrangement of the heat dissipation fan 55 and the second pipe 522 is adapted to the layout of the thickness direction z, length direction y, and width direction x of the light processing device 100, which helps to fully utilize the space of the light processing device 100 and make the overall design compact.

[0166] In some embodiments, the optical processing device 100 may further include a circuit board 60, the circuit board 60 having a first side 61 and a second side 62 opposite to each other, the liquid cooling plate 51 is located on the first side 61, and the heat dissipation fan 55 and the second pipe 522 are both located on the second side 62. In this way, the circuit board 60 is used to separate the liquid cooling plate 51 and the heat dissipation fan 55, which helps to reduce the external hair or other impurities blowing toward the liquid cooling plate 51, so that there is no need to add an additional separation structure, the number of parts is reduced, and it also helps to improve the utilization rate of the circuit board 60.

[0167] In some embodiments, when the cooling fan 55 is an axial flow fan, the heat sink 5200 can be located on the side of the cooling fan 55 away from the circuit board 60 , which helps to improve the space utilization of the side of the cooling fan 55 away from the circuit board 60 .

[0168] In some embodiments, at least one of the first pipe 521 and the third pipe 523 may include a first extension pipe 5213 and a second extension pipe 5214 connected to each other, the first extension pipe 5213 extends along the width direction x or the length direction y of the circuit board 60, the second extension pipe 5214 extends from the first side 61 to the second side 62, and the second extension pipe 5214 is clamped in the pipe clamping groove 63. For example, the second extension pipe 5214 of the first pipe 521 is clamped in the pipe clamping groove 63 of the circuit board 60; for another example, the second extension pipe 5214 of the second pipe 522 is clamped in another pipe clamping groove 63 of the circuit board 60; for another example, the second extension pipe 5214 of the first pipe 521 and the second extension pipe 5214 of the second pipe 522 are respectively clamped in different pipe clamping grooves 63 of the circuit board 60.

[0169] In some embodiments, at least one of the first pipe 521 and the third pipe 523 can be bent from the first side 61 to the second side 62. For example, the first pipe 521 is bent from the first side 61 to the second side 62; for example, the second pipe 522 is bent from the first side 61 to the second side 62; for example, both the first pipe 521 and the second pipe 522 are bent from the first side 61 to the second side 62.

[0170] In some embodiments, the bending part where the first pipe 521 is bent from the first side 61 to the second side 62 may be located on the side of the heat dissipation fan 55 close to the light output component 20, or the bending part where the first pipe 521 is bent from the first side 61 to the second side 62 may be located on the side of the heat dissipation fan 55 away from the light output component 20. The specific position of the bending part of the first pipe 521 may be arranged according to the actual spatial position in the housing 10, so as to improve the stability of the position of the bending part of the first pipe 521.

[0171] In some embodiments, the first pipe 521 may include a first pipe body 5210, a second pipe body 5211, and a third pipe body 5212 that are connected to each other. The first pipe body 5210 extends in a direction away from the liquid inlet 511, and the third pipe body 5212 extends from the first side 61 to the second side 62. The extension direction of the second pipe body 5211 is different from the extension direction of the first pipe body 5210 and the extension direction of the third pipe body 5212. In this way, the first pipe 521 can extend in different directions, which helps to increase the length of the first pipe 521 and prolong the heat exchange time between the coolant and the first pipe 521 to help achieve sufficient heat exchange.

[0172] In some embodiments, the bending part where the third pipe 523 is bent from the first side 61 to the second side 62 may be located on the side of the heat dissipation fan 55 close to the light output component 20, or the bending part where the third pipe 523 is bent from the first side 61 to the second side 62 may be located on the side of the heat dissipation fan 55 away from the light output component 20. The specific position of the bending part of the third pipe 523 may be arranged according to the actual spatial position in the housing 10, so as to improve the stability of the position of the bending part of the third pipe 523.

[0173] In some embodiments, the third pipe 523 may include a fourth pipe body 5230, a fifth pipe body 5231, and a sixth pipe body 5232 that are connected to each other, the fourth pipe body 5230 extends in a direction away from the liquid outlet 512, the sixth pipe body 5232 extends from the first side 61 to the second side 62, and the extension direction of the fifth pipe body 5231 is different from the extension direction of the fourth pipe body 5230 and the extension direction of the sixth pipe body 5232. In this way, the third pipe 523 can extend in different directions, which helps to increase the length of the third pipe 523 and prolong the heat exchange time between the coolant and the third pipe 523 to help achieve sufficient heat exchange.

[0174] In some embodiments, a pipe slot 63 may be provided on the side of the circuit board 60, and at least one of the first pipe 521 and the third pipe 523 is secured in the pipe slot 63. For example, the first pipe 521 is secured in the pipe slot 63; another example, the second pipe 522 is secured in the pipe slot 63; another example, both the first pipe 521 and the second pipe 522 are secured in the pipe slot 63, wherein the first pipe 521 and the second pipe 522 may be secured in different slots, respectively.

[0175] In this way, the circuit board 60 is used to fix and limit the first pipe 521 or the third pipe 523. On the one hand, it helps to improve the stability of the first pipe 521 or the third pipe 523 and prevent excessive shaking. On the other hand, there is no need to add additional fixed limiting structures, thereby reducing the number of parts.

[0176] In some embodiments, the two opposite sides of the circuit board 60 may be provided with pipe slots 63, the first pipe 521 is bent from the first side 61 to the second side 62 and is clamped in the pipe slot 63 on one side of the circuit board 60, and the third pipe 523 is bent from the first side 61 to the second side 62 and is clamped in the pipe slot 63 on the other side of the circuit board 60. In this way, the stability of the positions of the first pipe 521 and the third pipe 523 is improved.

[0177] In some embodiments, the bending part where the first pipe 521 is bent from the first side 61 to the second side 62 and the bending part where the third pipe 523 is bent from the first side 61 to the second side 62 can be respectively clamped in different pipe clamping grooves 63 on the same side of the circuit board 60. In this way, the stability of the positions of the first pipe 521 and the third pipe 523 can also be improved.

[0178] See also Figure 2 and Figure 3 In some embodiments, the heat dissipation fan 55 and the second pipe 522 may be arranged along the thickness direction z of the light processing device 100. The light processing device 100 may further include a fan bracket 70, which is fixed to the circuit board 60 and located at the second side 62. The heat dissipation fan 55 is mounted on the fan bracket 70, and the air outlet of the heat dissipation fan 55 is spaced from the circuit board 60. In this way, it is helpful to improve the space utilization rate of the second side 62 of the circuit board 60, making the layout more compact, and also facilitating the air flow to be sucked in or blown out from the space between the air outlet of the heat dissipation fan 55 and the circuit board 60.

[0179] In some embodiments, the heat dissipation fan 55 and the circuit board 60 may be spaced apart along the thickness direction z of the light processing device 100 .

[0180] In some embodiments, the optical processing device 100 may further include a power interface 71 , which is located at the second side 62 , so that the airflow formed by the cooling fan 55 can also dissipate heat for the power interface 71 .

[0181] In some embodiments, the optical processing device 100 may further include a switch valve 72, which is connected to the heat dissipation pipe 52, and the switch valve 72 may selectively open or close the heat dissipation pipe 52. Thus, during the assembly of the optical processing device 100, when it is necessary to inject the cooling liquid into the heat dissipation pipe 52, the switch valve 72 may open the heat dissipation pipe 52, thereby facilitating the smooth injection of the cooling liquid into the heat dissipation pipe 52; when the injection of the cooling liquid is completed, the switch valve 72 may close the heat dissipation pipe 52, so that the cooling liquid does not leak out, thereby facilitating the connection of the heat dissipation pipe 52 with other structures.

[0182] In some embodiments, the switch valve 72 may be connected to the first pipeline 521 or the third pipeline 523 .

[0183] In some embodiments, the switch valve 72 may be a one-way valve, which helps to simplify the structure of the switch valve 72 . Compared with other electronic valves, there is no need to configure a wire for the switch valve 72 .

[0184] In some embodiments, the switch valve 72 may be a Tesla valve, a diaphragm valve or other structures.

[0185] See also Figure 2 and Figure 7 In some embodiments, the light processing device 100 may further include a support structure 80, and the light output component 20 may be disposed in the support structure 80. In this way, the support structure 80 may provide a stable platform for the light output component 20, so that the light output component 20 is stably located at the position and is not easily displaced due to vibration.

[0186] In some embodiments, the support structure 80 may have a mounting cavity 81 and a heat dissipation port 82 communicating with the mounting cavity 81. The light output assembly 20 is mounted in the mounting cavity 81 and is thermally connected to the liquid cooling plate 51 at the heat dissipation port 82. The heat dissipation port 82 helps to quickly transfer the heat generated by the light output assembly 20 to the liquid cooling plate 51, helps to avoid overheating accumulation, improves the heat dissipation efficiency of the light processing device 100, and also helps to reduce the entry of impurities into the support structure 80.

[0187] In some embodiments, the support structure 80 and the liquid cooling plate 51 can be arranged along the thickness direction z of the light processing device 100, the top wall 83 and the side wall 84 of the support structure 80 jointly surround the light output component 20, the light output component 20 is arranged through the bottom wall of the support structure 80 and contacts the liquid cooling plate 51, and the cooling fan 55 is opposite to the side wall 84 of the support structure 80. In this way, the heat generated by the light output component 20 is also facilitated to be quickly transferred to the liquid cooling plate 51, which helps to avoid overheating accumulation, improve the heat dissipation efficiency of the light processing device 100, and also helps to reduce the entry of impurities into the support structure 80.

[0188] In some embodiments, the circuit board 60 may be provided with a notch 64, the top wall 83 of the support structure 80 is located on the second side 62, the bottom wall of the support structure 80 is at least partially embedded in the notch 64, or the bottom wall of the support structure 80 is penetrated from the second side 62 through the notch 64 and protrudes from the first side 61. In this way, the notch 64 of the circuit board 60 helps to provide a space for the bottom wall of the support structure 80 to be embedded or penetrated, making the circuit board 60 and the support structure 80 more compact, helping to improve the stability of the position of the support structure 80, and making the support structure 80 less likely to be displaced.

[0189] In some embodiments, the light emitting component 20 may include a light source 21 and a lampshade 22. The light source 21 is used to emit care light so that the light is emitted from the light outlet 11 of the lampshade 22. The lampshade 22 is thermally connected to the liquid cooling plate 51 to facilitate the liquid cooling plate 51 to dissipate heat for the lampshade 22, thereby achieving heat dissipation for the light source 21.

[0190] In some embodiments, the lampshade 22 may be an insulating heat-conductive lampshade, which helps to isolate the electrical conduction between the light source 21 and the liquid cooling plate 51 .

[0191] In some embodiments, the lampshade 22 may be a conductive and heat-conductive lampshade, and an insulating and heat-conductive layer is provided between the lampshade 22 and the refrigerator 40 . The insulating and heat-conductive layer also helps to isolate the electrical conduction between the light source 21 and the liquid cooling plate 51 .

[0192] In some embodiments, the lampshade 22 may be made of graphene or other materials.

[0193] In this application, unless otherwise clearly specified or limited, the terms "installation", "connection" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be internal communication between two elements, it can be only surface contact, or it can be connected through surface contact through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0194] In addition, the terms "first", "second", etc. are only used to distinguish descriptions and cannot be understood as specific or special structures. The description of the term "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0195] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A light processing device, characterized in that: include: A housing having a light outlet; A light emitting component is disposed in the housing, and is used to generate light that is emitted toward the skin to be treated through the light emitting port; A cold compress, disposed at the light outlet, for applying cold compress to the skin; A refrigerator, wherein a cooling surface of the refrigerator is thermally connected to the cold compress; as well as A heat dissipation system, the heat dissipation system includes a liquid cooling plate, a heat dissipation pipe, a coolant and a liquid pump, the liquid cooling plate is thermally connected to the heating surface of the refrigerator to absorb the heat generated by the heating surface; the liquid cooling plate is provided with a cooling liquid holding chamber, a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both connected to the cooling liquid holding chamber, the heat dissipation pipe is connected to the liquid inlet and the liquid outlet, the liquid pump is connected to the heat dissipation pipe, the heat dissipation pipe has a heat dissipation part, and the liquid pump is configured to drive the cooling liquid to circulate in the cooling liquid holding chamber and the heat dissipation pipe so that the cooling liquid flows through the heat dissipation part to dissipate heat.

2. The optical processing device according to claim 1, characterized in that: The cold compress is located in the optical path of the light emitted by the light emitting component, so as to make the light emitted by the light emitting component pass through the cold compress and be emitted to the skin to be treated; or, the cold compress is located outside the optical path of the light emitted by the light emitting component, and the cold compress is arranged on the surrounding side or beside the light outlet.

3. The optical processing device according to claim 1, characterized in that: The cold compress, the refrigerator and the liquid cooling plate are stacked in sequence along the thickness direction of the liquid cooling plate.

4. The optical processing device according to claim 1, characterized in that: The liquid cooling plate comprises a plate assembly and a heat sink, wherein the plate assembly is provided with the cooling liquid containing cavity, the liquid inlet and the liquid outlet, and the heat sink is connected to the plate assembly and is located in the cooling liquid containing cavity.

5. The light processing device according to claim 4, characterized in that: The plate assembly comprises a first plate and a second plate, the first plate and the second plate together enclose the cooling liquid containing chamber, the first plate is thermally connected to the heating surface of the refrigerator, and the heat sink is connected to the first plate; and / or, The heat sink is arranged corresponding to the refrigerator.

6. The optical processing device according to claim 4, characterized in that: The plate assembly comprises a first plate and a second plate, the first plate and the second plate together enclose the cooling liquid containing chamber, the first plate is thermally connected to the heating surface of the refrigerator, and the heat sink is connected to the first plate; The heat sink contacts or abuts against the second plate; and / or, The heat sink is a heat dissipation protrusion protruding from the surface of the first plate body and extending along the liquid inlet toward the liquid outlet.

7. The optical processing device according to claim 4, characterized in that: The cooling liquid containing chamber includes a liquid inlet chamber, a first heat conducting chamber and a liquid outlet chamber, the liquid inlet is connected to the liquid inlet chamber, the liquid outlet is connected to the liquid outlet chamber, the first heat conducting chamber connects the liquid inlet chamber and the liquid outlet chamber, the first heat conducting chamber is arranged corresponding to the heating surface, the heat sink is located in the first heat conducting chamber, and the heat sink extends from the liquid inlet chamber to the direction of the liquid outlet chamber.

8. The optical processing device according to claim 7, characterized in that: There are multiple heat sinks, which are spaced apart in the first heat conduction cavity. A cooling liquid channel is formed between any two adjacent heat sinks. One end of the cooling liquid channel is connected to the liquid inlet cavity, and the other end is connected to the liquid outlet cavity.

9. The light processing device according to claim 1, characterized in that: The liquid cooling plate includes a first plate body and a second plate body, the first plate body includes a flat plate structure, the second plate body is provided with a groove, the flat plate structure of the first plate body covers the groove and fits with the second plate body to form the cooling liquid containing chamber.

10. The light processing device according to claim 9, characterized in that: The first plate body includes a liquid inlet end and a liquid outlet end, the liquid inlet end is provided with the liquid inlet, and the liquid outlet end is provided with the liquid outlet.

11. The light processing device according to claim 1, characterized in that: The liquid cooling plate is also thermally connected to the light emitting component to absorb the heat generated by the light emitting component.

12. The light processing device according to claim 11, characterized in that: The liquid cooling plate is provided with the cooling liquid containing cavity, the liquid inlet and the liquid outlet; The cooling liquid containing cavity comprises a liquid inlet cavity, a first heat conducting cavity, a second heat conducting cavity and a liquid outlet cavity, the liquid inlet is connected to the liquid inlet cavity, the liquid outlet is connected to the liquid outlet cavity, the first heat conducting cavity is connected to the liquid inlet cavity and the liquid outlet cavity, and the first heat conducting cavity is arranged corresponding to the refrigerator; The second heat-conducting cavity is connected to the liquid inlet cavity and the liquid outlet cavity, and the second heat-conducting cavity is arranged corresponding to the light output component.

13. The light processing device according to claim 12, characterized in that: The liquid cooling plate includes a partition, which is arranged in the cooling liquid containing cavity and separates the first heat conducting cavity and the second heat conducting cavity. One end of the first heat conducting cavity and the second heat conducting cavity are both connected to the liquid inlet cavity, and the other end is both connected to the liquid outlet cavity.

14. The light processing device according to claim 13, characterized in that: The liquid cooling plate also includes a first plate body and a second plate body, the first plate body and the second plate body together enclose the cooling liquid containing chamber, the first plate body is thermally connected to the heating surface of the refrigerator, and the separator is protruding from the surface of the second plate body facing the first plate body.

15. The light processing device according to claim 1, characterized in that: There are multiple liquid cooling plates, at least one of which is thermally connected to the heating surface of the refrigerator, and at least another one of which is thermally connected to the light emitting component.

16. The light processing device according to claim 15, characterized in that: The optical treatment device further comprises a hair removal mechanism, and the hair removal mechanism comprises the light output component and the cold compress; The plurality of liquid cooling plates are distributed on the same side of the hair removal mechanism, or the liquid cooling plates are distributed on opposite sides of the hair removal mechanism along the thickness direction of the optical treatment device.

17. The light processing device according to claim 15, characterized in that: The optical treatment device also includes a hair removal mechanism, which includes the light output component and the cold compress. The liquid cooling plates are distributed on opposite sides of the hair removal mechanism along the thickness direction of the optical treatment device, and at least two of the liquid cooling plates are interconnected.

18. The light processing device according to claim 17, characterized in that: The hair removal mechanism includes a first side and a second side opposite to each other, the direction of the first side along the second side is the thickness direction of the light treatment device, the liquid cooling plate located on the first side is thermally connected to the heating surface of the refrigerator, the liquid cooling plate located on the second side is thermally connected to the light output component, and the liquid cooling plate located on the first side is connected to the liquid cooling plate located on the second side.

19. The light processing device according to any one of claims 1 to 18, characterized in that: The heat dissipation system further comprises a heat dissipation fan, and the heat dissipation pipe is located at an air inlet side or an air outlet side of the heat dissipation fan.

20. The light processing device according to claim 19, characterized in that The shell has a head and a tail, the shell is provided with a first vent and a second vent, the first vent is located at the tail, the second vent is closer to the head than the tail, one of the first vent and the second vent is an air inlet, and the other is an air outlet; the heat dissipation portion includes a heat sink; The light output assembly and the cold compress are both located on the head; the heat dissipation system is located in the shell, and the heat dissipation fan is suitable for guiding the air flow from the air inlet to the air outlet through the heat sink.

21. The light processing device according to claim 19, characterized in that The shell has a head and a tail, and is provided with a first vent and a second vent, wherein the first vent is located at the tail, and the second vent is closer to the tail than the head, and one of the first vent and the second vent is an air inlet, and the other is an air outlet; the heat dissipation portion includes a heat sink; The light output assembly and the cold compress are both located on the head; the heat dissipation system is located in the shell, and the heat dissipation fan is suitable for guiding the air flow from the air inlet to the air outlet through the heat sink.

22. The light processing device according to claim 21, characterized in that: The shell also has a holding portion, which is located between the head portion and the tail portion, and the second vent is located at the tail portion.

23. The light processing device according to claim 21, characterized in that The housing also has a gripping portion, and the head portion, the gripping portion and the tail portion are sequentially arranged along the length direction of the light processing device.

24. The light processing device according to claim 21, characterized in that The heat sink is located between the air outlet and the heat dissipation fan.

25. The light processing device according to claim 19, characterized in that The heat dissipation pipe is a fin-type heat dissipation coil, and the fins of the heat dissipation pipe are located on the air inlet side or the air outlet side of the heat dissipation fan.

26. The light processing device according to claim 19, characterized in that The heat dissipation pipe includes a first pipe, a second pipe and a third pipe which are connected in sequence, the first pipe is connected to the liquid inlet, the third pipe is connected to the liquid outlet, the second pipe is located on the air inlet side or the air outlet side of the heat dissipation fan, and the heat dissipation part includes the second pipe and a heat sink, and the heat sink is arranged on the outer periphery of the second pipe.

27. The light processing device according to claim 26, characterized in that: The second pipe is a flat pipe structure or the longitudinal section of the second pipe is elliptical.

28. The light processing device according to claim 26, characterized in that The second pipe is bent at least once.

29. The light processing device according to claim 26, characterized in that The second pipe is bent at least twice, and at least the two bending directions are different.

30. The light processing device according to claim 26, characterized in that The second pipeline is in a racetrack shape or a zigzag shape.

31. The optical processing device according to claim 26, characterized in that The second pipe includes a plurality of pipe segments and a plurality of bends, the pipe segments and the bends are alternately connected to form a coil-like structure, each of the pipe segments extends along a first direction, and a plurality of the pipe segments are arranged at intervals along a second direction, one of the first direction and the second direction is a length direction of the light processing device, and the other is a width direction of the light processing device.

32. The optical processing device according to claim 31, characterized in that: There are multiple heat sinks, and the same heat sink is sleeved on the outer circumference of multiple pipe sections. The multiple heat sinks are arranged at intervals along the first direction.

33. The optical processing device according to claim 27, characterized in that: One end of the second pipe is circular to be connected to the first pipe, and the other end of the second pipe is circular to be connected to the third pipe.

34. The light processing device according to claim 33, characterized in that One end of the second pipeline is plugged into the first pipeline, and / or the other end of the second pipeline is plugged into the third pipeline.

35. The light processing device according to claim 33, characterized in that The first pipe and / or the third pipe is a circular pipe.

36. The optical processing device according to claim 26, characterized in that The heat dissipation fan and the second pipe are arranged along the thickness direction, width direction or length direction of the light processing device.

37. The optical processing device according to claim 26, characterized in that The optical processing device also includes a circuit board, the circuit board has a first side and a second side opposite to each other, the liquid cooling plate is located on the first side, the cooling fan and the second pipe are both located on the second side, and at least one of the first pipe and the third pipe is bent from the first side to the second side.

38. The light processing device according to claim 37, characterized in that A pipe slot is provided on the side of the circuit board, and at least one of the first pipe and the third pipe is clamped in the pipe slot.

39. The optical processing device according to claim 37, characterized in that: A pipe slot is provided on the side of the circuit board, and at least one of the first pipe and the third pipe includes a first extension tube and a second extension tube connected to each other. The first extension tube extends along the width direction or the length direction of the circuit board, and the second extension tube extends from the first side to the second side. The second extension tube is clamped in the pipe slot.

40. The light processing device according to claim 37, characterized in that The heat dissipation fan and the second pipe are arranged along the thickness direction of the light processing device; The optical processing device further includes a fan bracket, which is fixed to the circuit board and located at the second side. The heat dissipation fan is installed on the fan bracket, and an air outlet of the heat dissipation fan is spaced apart from the circuit board.

41. The optical processing device according to claim 37, characterized in that The light processing device further includes a power interface located at the second side.

42. The optical processing device according to any one of claims 1 to 18, characterized in that: The light processing device further comprises a switch valve, which is connected to the heat dissipation pipe and can selectively turn on or off the heat dissipation pipe.

43. The optical processing device according to claim 42, characterized in that The switch valve is a one-way valve.

44. The light processing device according to any one of claims 1 to 18, characterized in that: The optical processing device further comprises a supporting structure having an installation cavity and a heat dissipation port communicating with the installation cavity. The light output assembly is installed in the installation cavity and is thermally connected to the liquid cooling plate at the heat dissipation port.

45. The optical processing device according to claim 19, characterized in that The light processing device also includes a supporting structure, and the supporting structure and the liquid cooling plate are arranged along the thickness direction of the light processing device. The top wall and the side wall of the supporting structure jointly surround the light output component, and the light output component is penetrated through the bottom wall of the supporting structure and contacts the liquid cooling plate, and the cooling fan is opposite to the side wall of the supporting structure.

46. ​​The optical processing device according to claim 44, characterized in that The optical processing device also includes a circuit board, which has a first side and a second side opposite to each other. The circuit board is provided with a notch, the top wall of the support structure is located on the second side, the bottom wall of the support structure is at least partially embedded in the notch or the bottom wall of the support structure passes through the notch from the second side and protrudes from the first side.

47. The optical processing device according to any one of claims 1 to 18, characterized in that: The light emitting assembly comprises a light source and a lampshade, the light source is used to emit nursing light so that the light is emitted from the light emitting port of the lampshade, and the lampshade is thermally connected to the liquid cooling plate; The lampshade is an insulating heat-conducting lampshade; or, the lampshade is an electrically conductive heat-conducting lampshade, and an insulating heat-conducting layer is provided between the lampshade and the liquid cooling plate.

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