Semiconductor crystal grain weighing and counting device

Abstract

The utility model relates to the technical field of semiconductor crystal grain weighing auxiliary devices, in particular to a semiconductor crystal grain weighing and counting device, which is characterized in that a retainer ring is integrally arranged on the edge of a supporting plate, a partition plate is fixedly connected to the inner wall of the retainer ring, a plurality of crystal grain grooves communicated with a negative pressure chamber are uniformly distributed on the partition plate, and the crystal grain grooves are communicated with the negative pressure chamber. The check ring is integrally provided with an air exhaust nozzle communicated with the negative pressure chamber, a negative pressure air pump is arranged on one side of the supporting plate and fixedly communicated with one end of a metal hose, the other end of the metal hose is fixedly connected with one end of a plug, and the other end of the plug is connected with the air exhaust nozzle in an inserted mode. A sealing assembly matched with the plug is arranged in the air exhaust nozzle, and thin gauze is fixedly connected to the lower portion of the partition plate. The sealing assembly comprises two sets of elastic connecting pieces which are symmetrically arranged about the axis of the air exhaust nozzle, the two sets of elastic connecting pieces are jointly and fixedly connected with a sealing ring, and the sealing ring is coaxially and fixedly connected with a sealing ring abutting against the end of the plug.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor crystal grain weighing auxiliary devices, in particular to a semiconductor crystal grain weighing and counting device. Background Art

[0002] With the vigorous development of the semiconductor industry, the demand for semiconductor grains, which are the basic components of semiconductors, is increasing. However, semiconductor grains are small in size and light in weight, which makes it more troublesome to count them during production. The current conventional counting method is weighing and counting, that is, first collect a certain number of semiconductor grains and weigh them, then convert the quantity relationship, then weigh the total weight of the semiconductors to be counted, and then the number of semiconductor grains can be obtained based on the converted quantity relationship.

[0003] At present, when this method is used, it often takes a considerable amount of time to collect a certain number of semiconductors in the first step, which in turn affects the overall work efficiency. Therefore, how to quickly collect a corresponding number of semiconductors becomes a technical problem that needs to be solved. Utility Model Content

[0004] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a semiconductor grain weighing and counting device, and the technical solution to the problem is to include a support plate, characterized in that a retaining ring is integrally arranged at the edge of the support plate, a partition is fixedly connected to the inner wall of the retaining ring, the partition, the retaining ring and the support plate form a negative pressure chamber, a plurality of grain grooves connected to the negative pressure chamber are evenly distributed on the partition, the retaining ring is integrally arranged with an exhaust nozzle connected to the negative pressure chamber, a negative pressure air pump is arranged on one side of the support plate, the negative pressure air pump is fixedly connected to one end of a metal hose, the other end of the metal hose is fixedly connected to one end of a plug, the other end of the plug is plugged with the exhaust nozzle, a sealing component matching the plug is arranged in the exhaust nozzle, and a gauze cloth is fixedly connected under the partition;

[0005] The sealing assembly includes two groups of elastic connectors symmetrically arranged about the axis of the exhaust nozzle. The two groups of elastic connectors are commonly fixedly connected with a sealing ring. The sealing ring is coaxially fixedly connected with a sealing ring abutting the end of the plug. The sealing ring and the sealing ring are both in sliding abutment with the inner wall of the exhaust nozzle.

[0006] Preferably, each group of the elastic connecting parts includes a support sleeve fixedly connected to the inner wall of the exhaust nozzle, the support sleeve is slidably connected to a connecting rod, one end of the connecting rod is fixedly connected to the end face of the sealing ring, the other end of the connecting rod is fixedly connected to a stopper, the connecting rod is coaxially sleeved with a spring, and the two ends of the spring are respectively fixedly connected to the support sleeve and the sealing ring.

[0007] Preferably, the limiting device comprises an L-shaped limiting groove formed on the upper edge of the exhaust nozzle, and a limiting rod cooperating with the L-shaped limiting groove is fixedly connected to the outer edge of the plug.

[0008] Preferably, the number of the grain grooves is one thousand.

[0009] The beneficial effects of the utility model are:

[0010] 1. The present application needs to be used in conjunction with a high-precision electronic scale. Optimally, there are one thousand grain slots on the partition, which makes it easier to convert quantity relationships. When collecting grains, first use a negative pressure air pump to pump air into the negative pressure chamber to form a negative pressure in the negative pressure chamber. Then pour the semiconductor grains onto the partition and shake them. Under the action of the negative pressure, each grain slot absorbs a grain, and then the grains that are not absorbed are poured out. At this time, there are one thousand grains absorbed on the partition. Turn off the negative pressure pump, and put the one thousand grains on a high-precision electronic scale for weighing, and then you can get the conversion factor between weight and quantity. Then you can weigh the semiconductor grains in batches according to the conversion factor, and calculate the number of semiconductor grains.

[0011] 2. The vacuum nozzle and the plug are arranged to be plug-in, thereby ensuring the interchangeability of the connection parts of the present application. Furthermore, the provided sealing assembly ensures the airtightness of the connection between the plug and the vacuum nozzle, ensuring the working effect of the negative pressure air pump. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a three-dimensional cross-sectional view of the utility model from the first viewing angle.

[0013] Figure 2 For this utility model Figure 1 Magnified view of area A.

[0014] Figure 3 For this utility model Figure 2 Magnified view of area B.

[0015] Figure 4 This is a partial three-dimensional cross-sectional view from a second viewing angle of the utility model.

[0016] Figure 5 This is a three-dimensional view from the third viewing angle of the present invention.

[0017] Figure 6 For this utility model Figure 5 Magnified view of area C.

[0018] Figure 7 This is a three-dimensional cross-sectional view from the fourth viewing angle of the utility model.

[0019] Reference numerals

[0020] 1. Support plate, 2. Retaining ring, 3. Partition, 4. Negative pressure chamber, 5. Grain groove, 6. Vacuum nozzle, 7. Negative pressure air pump, 8. Metal hose, 9. Plug, 10. Sealing assembly, 11. Gauze, 12. Elastic connector, 13. Sealing ring, 14. Sealing ring, 15. Support sleeve, 16. Connecting rod, 17. Stopper, 18. Spring, 19. L-shaped limit groove, 20. Limit rod. DETAILED DESCRIPTION

[0021] The following is combined with Figure 1-7 The specific implementation methods of the utility model are further described in detail.

[0022] Embodiment 1, the technical solution is that the present application needs to be used in conjunction with a high-precision electronic scale. Optimally, there are one thousand grain slots 5 on the partition 3, which is convenient for converting the quantity relationship. When collecting grains, the negative pressure chamber 4 is first evacuated by the negative pressure air pump 7. Under the action of the negative pressure air pump 7, the air in the negative pressure chamber 4 is extracted through the suction nozzle 6, the plug 9 and the metal hose 8, thereby forming a negative pressure environment in the negative pressure chamber 4. After the negative pressure environment is formed in the negative pressure chamber 4, the semiconductor grains are poured onto the partition 3 and shaken. During the shaking process, the semiconductor grains will be adsorbed by each grain slot 5 under the action of negative pressure. After each grain slot 5 adsorbs a grain respectively, the grains that are not adsorbed are poured out. At this time, there are one thousand grains adsorbed on the partition 3. After that, the negative pressure pump is disconnected, and the thousand grains are placed on a high-precision electronic scale for weighing, and then the conversion factor between weight and quantity can be obtained. Then, the semiconductor grains can be weighed in batches according to the conversion factor, and the number of semiconductor grains can be calculated. In the present application, the vacuum nozzle 6 and the plug 9 are arranged to be plug-in, thereby ensuring the interchangeability of the connecting parts of the present application. Furthermore, the sealing assembly 10 is provided to ensure the airtightness of the connection between the plug 9 and the vacuum nozzle 6, and to ensure the working effect of the negative pressure air pump 7.

[0023] When the present application is in use, a gauze cloth 11 is arranged under the partition 3 to fit closely therewith, thereby preventing the crystal grains from slipping into the negative pressure chamber 4 through the crystal grain slots 5. In order to obtain the conversion factor, the number of crystal grain slots 5 is set to one thousand.

[0024] Embodiment 2, based on embodiment 1, as shown in the accompanying drawings Figure 1-3 As shown, at this time, the plug 9 is plugged into the exhaust nozzle 6, and the limiting rod 20 is restricted in the L-shaped limiting groove 19, so that the plug 9 is tightly connected to the exhaust nozzle 6, and the spring 18 of the elastic connecting member is in a compressed state. Under the reaction force of the spring 18, the sealing ring 14 is tightly combined with the end of the plug 9, thereby ensuring air tightness.

[0025] When it is necessary to unplug the plug 9, first contact the restriction of the limit device, that is, rotate the adjustment position plug 9, so that the limit rod 20 can be separated from the L-shaped limit groove 19, and then the plug 9 can be easily unplugged. When the plug 9 is pulled out, the spring 18 will automatically extend, and then drive the sealing ring 13 and the connecting rod 16 and other components to move along the support sleeve 15 in the opposite direction of the negative pressure chamber 4. The blocking body provided can prevent the connecting rod 16 from being separated from the support sleeve 15 during the movement.

[0026] When the plug 9 needs to be inserted into the exhaust nozzle 6 again, pay attention to the correspondence between the limit rod 20 and the L-shaped limit groove 19 during the insertion process. As the plug 9 is inserted, the end of the plug 9 will act on the sealing ring 14, and press the sealing ring 13 through the sealing ring 14 to move towards the negative pressure chamber 4, and then the connecting rod 16 will also slide relative to the support sleeve 15 with the movement of the sealing ring 13, thereby compressing the spring 18 until the limit rod 20 slides to the bottom of the L-shaped limit groove 19. At this time, the plug 9 cannot be inserted further. At this time, the spring 18 is compressed to the maximum extent. Under the action of the reaction force of the spring 18, the sealing ring 13 and the plug 9 are tightly abutted, thereby ensuring air tightness. Then the plug 9 is rotated to adjust the position of the limit rod 20 in the L-shaped limit groove 19, so that the limit device can produce a limiting effect, thereby avoiding the separation of the plug 9 and the exhaust nozzle 6.

Claims

1. A semiconductor grain weighing and counting device, comprising a support plate (1), characterized in that: A retaining ring (2) is integrally arranged at the edge of the support plate (1), and a partition (3) is fixedly connected to the inner wall of the retaining ring (2). The partition (3), the retaining ring (2) and the support plate (1) enclose a negative pressure chamber (4). A plurality of grain grooves (5) connected to the negative pressure chamber (4) are evenly distributed on the partition plate (3). The retaining ring (2) is integrally arranged with an air suction nozzle (6) connected to the negative pressure chamber (4). A negative pressure air pump (7) is arranged on one side of the support plate (1), and the negative pressure air pump (7) is fixedly connected to one end of a metal hose (8). The other end of the metal hose (8) is fixedly connected to one end of a plug (9). The other end of the plug (9) is plugged into the air suction nozzle (6). A sealing component (10) matching the plug (9) is arranged in the air suction nozzle (6). A gauze cloth (11) is fixedly connected below the partition plate (3); The sealing assembly (10) comprises two groups of elastic connectors (12) symmetrically arranged about the axis of the air extraction nozzle (6); the two groups of elastic connectors (12) are fixedly connected to a sealing ring (13); the sealing ring (13) is coaxially fixedly connected to a sealing ring (14) abutting against the end of the plug (9); the sealing ring (14) and the sealing ring (13) are both in sliding abutment with the inner wall of the air extraction nozzle (6).

2. A semiconductor grain weighing and counting device according to claim 1, characterized in that: Each group of the elastic connecting members (12) comprises a support sleeve (15) fixedly connected to the inner wall of the exhaust nozzle (6); the support sleeve (15) is slidably connected to a connecting rod (16); one end of the connecting rod (16) is fixedly connected to the end surface of the sealing ring (13); the other end of the connecting rod (16) is fixedly connected to a stopper (17); the connecting rod (16) is coaxially sleeved with a spring (18); the two ends of the spring (18) are respectively fixedly connected to the support sleeve (15) and the sealing ring (13).

3. A semiconductor grain weighing and counting device according to claim 1, characterized in that: It also includes a limiting device, which includes an L-shaped limiting groove (19) formed on the upper edge of the air extraction nozzle (6), and a limiting rod (20) that cooperates with the L-shaped limiting groove (19) is fixedly connected to the outer edge of the plug (9).

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