LED support and LED equipment

Abstract

The utility model provides an LED support and an LED device, the LED support comprises a support chassis, a support wall and a plurality of bonding pads, the support wall is arranged on the top of the support chassis, each bonding pad comprises a first plate body, a second plate body and a third plate body, the first plate body is located between the support chassis and the support wall, the second plate body is connected with the side wall of the support chassis, and the third plate body is connected with the side wall of the support chassis. One end of the second plate body is connected with the first plate body, the other end of the second plate body is connected with the third plate body, the third plate body is located at the bottom of the support chassis, the first plate body comprises a protruding part, a through hole is formed in the first plate body, a connecting column is arranged in the through hole, one end of the connecting column is connected with the support wall, and the other end of the connecting column is connected with the support chassis. Through the arrangement of the clamping piece type structure of the bonding pad, the usage amount of copper materials is greatly reduced, through the arrangement of the protruding part, the through hole and the connecting column, the bonding strength of the bonding pad and the plastic part on the horizontal plane is greatly enhanced, and the tensile and anti-fracture capability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to an LED bracket and an LED device. Background Art

[0002] With the development of technology, LED devices are becoming more and more widely used. In the field of lighting, LED devices involve the packaging and lighting effects of lamp beads, which are crucial and the competition is fierce.

[0003] LED lamp beads use LED brackets to support and encapsulate LED chips, wherein the cost of the LED bracket is mainly affected by the cost of the solder pads, and in order to make the LED lamp beads high in quality, a silver-plated layer is usually prepared on the copper material.

[0004] The existing LED bracket is composed of a plastic bracket and a solder pad, wherein the solder pad has a larger area and is part of the bottom of the LED bracket. However, the plastic and the solder pad are made of different materials, and the joint is easy to break, which has a great negative impact on the quality of the lamp bead. In addition, since the copper material of the solder pad is silver-plated, the silver-plated layer is relatively smooth. When the chip is mounted on the bracket, it is mounted on the silver-plated solder pad, and the bonding force is insufficient, and the overall toughness of the lamp bead is insufficient. If the solder pad area is further increased, although the contact area between the plastic and the copper material is increased, the bonding strength between the two is slightly improved, but the cost of the solder pad is greatly increased, and the bonding strength between the chip and the bracket is insufficient. Utility Model Content

[0005] In view of the deficiencies of the prior art, the purpose of the present invention is to provide an LED bracket and an LED device, aiming to solve the problem in the prior art that the bonding strength between the soldering pad and the plastic bracket and the cost of the soldering pad cannot be balanced.

[0006] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0007] A LED bracket comprises a bracket chassis, a bracket wall and a plurality of soldering pads, wherein the bracket wall is arranged on the top of the bracket chassis, and a receiving cavity is arranged in the bracket wall, and the receiving cavity is used to place an LED chip, and the soldering pad comprises a first plate body, a second plate body and a third plate body, wherein the first plate body is located between the bracket chassis and the bracket wall, and is partially placed in the receiving cavity, the second plate body is connected to the side wall of the bracket chassis, one end of the second plate body is connected to the first plate body, and one end of the second plate body facing away from the first plate body is connected to the third plate body, and the third plate body is located at the bottom of the bracket chassis, the first plate body comprises a raised portion, and the raised portion is located inside the bracket wall, a through hole is arranged on the first plate body, and the through hole passes through the first plate body, and a connecting column is arranged in the through hole, one end of the connecting column is connected to the bracket wall, and the other end of the connecting column is connected to the bracket chassis, and the width of the first plate body is smaller than that of the second plate body.

[0008] Compared with the prior art, the beneficial effects of the utility model are as follows: by setting the clip-type structure of the first plate body, the second plate body and the third plate body, the end of the bracket chassis is clamped, and there is no need to use a whole piece of copper material to penetrate the bracket chassis, which greatly reduces the use of copper material, and still ensures the electrical connection between the LED chip and the external circuit, and still ensures that the bottom of the LED bracket and the light bar can be tightly combined when attached to the board; by setting the protruding portion, the through hole and the connecting column in the through hole, the bonding strength between the pad and the plastic part of the LED bracket in the horizontal plane is greatly enhanced, and the tensile and fracture resistance are improved. In addition, since the top area of ​​the pad placed in the accommodating cavity is small, the contact area between the LED chip and the pad is small, and it is mainly adhered to the bracket chassis by solid crystal glue, and there is no need to be affected by the overly smooth silver plating layer in the pad processing, thereby improving the toughness, stability and reliability of the finished lamp beads.

[0009] Furthermore, two opposite sides of the first plate body are connected to transition parts, the transition part is located at one end of the first plate body facing the second plate body, and one side of the transition part is connected to the second plate body.

[0010] Furthermore, the sum of the widths of the first plate body and the two transition portions is equal to the width of the second plate body.

[0011] Furthermore, a contact portion is provided on the second plate body, the contact portion is located at one end of the second plate body close to the third plate body, and the width of the second plate body is smaller than the contact portion.

[0012] Furthermore, the width of the third plate body is smaller than that of the contact portion.

[0013] Furthermore, the bottom surface of the third plate body is coplanar with the bottom surface of the contact portion.

[0014] Furthermore, the protrusion is in a truncated cone shape, and the through hole extends from the top surface of the protrusion to a side of the first plate body facing the bracket chassis.

[0015] Furthermore, a silver-plated layer is provided on the portion of the first plate body disposed in the accommodating cavity.

[0016] An LED device comprises the LED bracket as described in the above technical solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the top view of the LED bracket in the embodiment of the utility model;

[0018] Figure 2 This is a schematic diagram of the disassembled structure of the LED bracket in the embodiment of the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the soldering pad in the LED bracket in the embodiment of the utility model;

[0020] Description of main component symbols:

[0021] Plastic bracket 100 Bracket chassis 110 Bracket wall 120 Connecting column 121 The first plate 210 Raised part 211 Through Hole 212 Transition Department 213 The second plate 220 The third plate 230 Contact Department 240

[0022] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] See also Figures 1 to 3 The LED bracket in the embodiment of the utility model comprises a bracket chassis 110, a bracket wall 120 and a plurality of solder pads, the bracket chassis 110 is provided with the bracket wall 120 on the top, the bracket wall 120 is provided with a receiving cavity, the receiving cavity is used to place the LED chip, the solder pad comprises a first plate body 210, a second plate body 220 and a third plate body 230, the first plate body 210 is located between the bracket chassis 110 and the bracket wall 120, and is partially placed in the receiving cavity, the portion of the first plate body 210 placed in the receiving cavity is provided with a silver-plated layer, the second plate body 220 and the third plate body 230 are provided with a silver-plated layer, and the third plate body 230 is provided with a silver-plated layer. A plate body 210 includes a protrusion 211, and the protrusion 211 is located inside the bracket wall 120. A through hole 212 is set on the first plate body 210, and the through hole 212 passes through the first plate body 210. A connecting column 121 is set in the through hole 212, one end of the connecting column 121 is connected to the bracket wall 120, and the other end of the connecting column 121 is connected to the bracket chassis 110. The protrusion 211 is frustum-shaped, and the through hole 212 extends from the top surface of the protrusion 211 to the side of the first plate body 210 facing the bracket chassis 110. Preferably, two pads are used, corresponding to the positive and negative electrodes respectively, and the pads are made of copper. The bracket chassis 110 and the bracket wall 120 are usually formed by injection molding and combined with the metal pads. The existing LED bracket material often uses plastic, which has a certain plasticity. During the combination process, the plastic material can enter the through hole 212 to form the connecting column 121, and the connecting column 121 adapts to and abuts the through hole 212, that is, abuts the inner wall of the raised portion 211. The diameter of the through hole 212 is equal to the diameter of the top surface of the truncated cone of the raised portion 211. The side of the truncated cone abuts against the plastic and cooperates with the connecting column 121 to form a horizontal bonding force between the metal pad and the plastic. It can be understood that the pad and the plastic are effectively prevented from breaking at the connection due to different materials and insufficient bonding force, thereby improving the fracture resistance and tensile strength of the LED bracket, and improving the toughness of the LED bracket, which is beneficial to improving the quality of the finished LED lamp beads.

[0027] Preferably, the first plate 210 is in the shape of a long strip, and is narrower than the width of a traditional whole metal pad. In the traditional method, since the pad part at the bottom of the accommodating cavity has a larger area, the LED chip is bonded to the metal pad. Due to the manufacturing requirements of the LED lamp beads, the metal pad is often silver-plated. The surface of the silver-plated metal pad is smooth, and the LED chip is not firmly bonded to it and is easy to fall off. The first plate 210 and the silver-plated layer have a small contact area with the LED chip. The LED chip is bonded to the LED bracket in the embodiment of the utility model by using a solid crystal glue to bond the LED chip to the bracket chassis 110. The bonding is more firm and not easy to fall off, and the amount of silver material used is reduced, which greatly reduces the cost. Furthermore, the plastic of the bracket chassis 110 and the bracket wall 120 is white, and the area of ​​the first plate 210 is smaller than that of the traditional metal pad, exposing more of the bracket chassis 110. The white light emission makes the LED lamp beads prepared by the LED bracket have better light effect. Furthermore, the area of ​​the first board 210 placed in the accommodating cavity is relatively small, and the distance between the first board 210 in the two opposite solder pads is relatively far, so the insulating groove and insulating material at the bottom of the traditional bracket can be omitted.

[0028] The second plate body 220 is connected to the side wall of the bracket chassis 110, one end of the second plate body 220 is connected to the first plate body 210, and the end of the second plate body 220 facing away from the first plate body 210 is connected to the third plate body 230. The opposite sides of the first plate body 210 are connected to the transition part 213, and the transition part 213 is located at the end of the first plate body 210 facing the second plate body 220. One side of the transition part 213 is connected to the second plate body 220. The sum of the widths of the first plate body 210 and the two transition parts 213 is equal to the width of the second plate body 220. The second plate body 220 is provided with a contact part 240, and the contact part 240 is located at the end of the second plate body 220 close to the third plate body 230, and the width of the second plate body 220 is smaller than the contact part 240. Preferably, the transition portion 213 simultaneously connects the first plate body 210 and the second plate body 220, thereby increasing the stability between the metal strips of the soldering pad, that is, the first plate body 210 and the second plate body 220 form a bend, and the transition portion 213 is used at the bend for structural reinforcement to ensure the structural strength of the soldering pad. The contact portion 240 is relatively wide, which is convenient for the bottom of the LED bracket and the light bar to be solidified, and is also convenient for detection.

[0029] The third plate 230 is located at the bottom of the bracket chassis 110, the width of the third plate 230 is smaller than the contact portion 240, and the bottom surface of the third plate 230 is coplanar with the bottom surface of the contact portion 240. It can be understood that the traditional metal pad setting method is to use a whole piece of copper material to penetrate the bottom of the LED bracket, and the first plate 210, the second plate 220 and the third plate 230 form a clip-type structure, so that the accommodating cavity and the bottom of the LED bracket can form an electrical connection loop while greatly saving copper materials, and the clip-type structure has a certain toughness, combined with the setting of the protrusion 211 and the through hole 212, so that the LED bracket has the advantages of both fracture resistance and low cost.

[0030] The utility model also provides an LED device, and the LED device comprises the LED bracket as described in the above embodiment.

[0031] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0032] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An LED bracket, characterized in that: The present invention comprises a bracket chassis, a bracket wall and a plurality of welding pads, wherein the bracket wall is arranged on the top of the bracket chassis, and a receiving cavity is arranged in the bracket wall, and the receiving cavity is used to place the LED chip, and the welding pad comprises a first plate body, a second plate body and a third plate body, the first plate body is located between the bracket chassis and the bracket wall, and is partially placed in the receiving cavity, the second plate body is connected to the side wall of the bracket chassis, one end of the second plate body is connected to the first plate body, and one end of the second plate body facing away from the first plate body is connected to the third plate body, and the third plate body is located at the bottom of the bracket chassis, the first plate body comprises a raised portion, and the raised portion is located inside the bracket wall, a through hole is arranged on the first plate body, and the through hole passes through the first plate body, and a connecting column is arranged in the through hole, one end of the connecting column is connected to the bracket wall, and the other end of the connecting column is connected to the bracket chassis, and the width of the first plate body is smaller than that of the second plate body.

2. The LED bracket according to claim 1, characterized in that: Two opposite sides of the first plate body are connected to transition parts, the transition part is located at one end of the first plate body facing the second plate body, and one side of the transition part is connected to the second plate body.

3. The LED bracket according to claim 2, characterized in that: The sum of the widths of the first plate body and the two transition portions is equal to the width of the second plate body.

4. The LED bracket according to claim 1, characterized in that: A contact portion is disposed on the second plate body. The contact portion is located at one end of the second plate body close to the third plate body. The width of the second plate body is smaller than the contact portion.

5. The LED bracket according to claim 4, characterized in that: The third plate has a width smaller than that of the contact portion.

6. The LED bracket according to claim 4, characterized in that: The bottom surface of the third plate body is coplanar with the bottom surface of the contact portion.

7. The LED bracket according to claim 1, characterized in that: The protrusion is in a truncated cone shape, and the through hole extends from the top surface of the protrusion to a side of the first plate body facing the bracket chassis.

8. The LED bracket according to claim 1, characterized in that: A silver-plated layer is disposed on the portion of the first plate body disposed in the accommodating cavity.

9. An LED device, characterized in that: It comprises the LED bracket as described in any one of claims 1 to 8.

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