Stirring and cooling device for polishing solution

Abstract

The utility model discloses a stirring and cooling device for polishing solution, which comprises an outer cylinder body supported on the ground through a support frame, an inner cylinder body is arranged in the outer cylinder body, a spiral cooling pipe is arranged between the inner cylinder body and the outer cylinder body, a heat exchange box is fixed on the outer wall of one side of the outer cylinder body, and the heat exchange box is fixed on the outer wall of the other side of the outer cylinder body. A heat exchange pipe communicating with the two ends of the spiral cooling pipe is arranged in the heat exchange box, a semiconductor refrigeration plate is arranged on one side of the heat exchange pipe, and a heat exchange fan is arranged on one side of the hot end of the semiconductor refrigeration plate. By arranging the spiral cooling pipe, the heat exchange box, the heat exchange pipe, the semiconductor refrigeration plate and the heat exchange fan, when the temperature sensor detects that the temperature of polishing liquid rises, the circulating pump is started, so that cooling liquid in the spiral cooling pipe circularly flows along the spiral cooling pipe and the heat exchange pipe for heat exchange and cooling, and meanwhile, the semiconductor refrigeration plate and the heat exchange fan are started; cooling liquid is cooled at the heat exchange pipe, and the situation that polishing is affected due to temperature rising of the polishing liquid is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer polishing, in particular to a stirring and cooling device for polishing liquid. Background Art

[0002] In recent years, with the development and progress of domestic technology, chemical mechanical polishing has also become a commonly used and effective technical means in the field of domestic semiconductor processing. Chemical mechanical polishing is a new technology that can provide comprehensive flattening in the process of ultra-large-scale integrated circuit manufacturing. This method can truly flatten the surface of the entire silicon circle, gallium nitride and other semiconductor wafers, and this method has the advantages of simple processing and low processing cost. In order to improve the efficiency and accuracy of polishing liquid preparation, a polishing liquid stirring device came into being.

[0003] The existing device realizes easy liquid level detection and alarm by setting a motor, a barrel, a stirring rod, a reducer, a liquid outlet pipe, a liquid inlet cover, a barrel cover, an upper liquid level sensor port and a lower liquid level sensor port for use together, such as the patent publication number CN214051340U; but at present, in order to reduce production costs, a recovery device is usually used to recover the used polishing liquid and return it to the stirring device. The temperature of the polishing liquid will increase during polishing. If it is not cooled after reflux, the recovered polishing liquid will be put into use again, which will affect the polishing effect. Summary of the invention

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a stirring and cooling device for polishing liquid.

[0005] In order to solve the above technical problems, the utility model provides a stirring and cooling device for polishing liquid, comprising an outer cylinder supported on the ground by a support frame, an inner cylinder arranged inside the outer cylinder, a spiral cooling pipe arranged between the inner cylinder and the outer cylinder, a heat exchange box fixed to the outer wall of one side of the outer cylinder, a heat exchange pipe connected to both ends of the spiral cooling pipe arranged inside the heat exchange box, a circulating pump arranged at one end of the heat exchange pipe connected to the spiral cooling pipe, a semiconductor refrigeration plate arranged on one side of the heat exchange pipe, the semiconductor refrigeration plate and the heat exchange pipe close to one end are the cold end of the semiconductor refrigeration plate, and a heat exchange fan is arranged on the hot end side of the semiconductor refrigeration plate.

[0006] As a further solution of the utility model: the material of the inner cylinder is resin, and the bottom end of the inner cylinder is connected to a discharge pipe connected to the polishing equipment.

[0007] As a further solution of the utility model: a stirring motor is fixed to the outer wall of the top end of the outer cylinder, a stirring shaft is rotatably connected to the inner wall of the top end of the outer cylinder, a rotating shaft is rotatably connected to the inner wall of the stirring shaft, and the other end of the rotating shaft is connected to the output shaft of the stirring motor.

[0008] As a further solution of the utility model: a plurality of stirring rods are rotatably connected to the side wall of the stirring shaft, a driving bevel gear is fixed to the outer wall of the rotating shaft, and a driven bevel gear meshing with the driving bevel gear is fixed to one end of the stirring rod.

[0009] As a further solution of the utility model: a driving gear is fixed on the outer wall of the top end of the rotating shaft, a gear ring is fixed on the inner wall of the stirring shaft, and the gear ring is meshed with the driving gear through a driven gear.

[0010] As a further solution of the utility model: an input pipe is connected to one side of the top end of the outer cylinder, one end of the input pipe faces the inner cylinder, and the other end of the input pipe is connected to an external water supply device.

[0011] As a further solution of the utility model: a connecting pipe is provided in the middle section of the input pipe, a flow meter is provided on one side of the connecting pipe, one side of the connecting pipe is connected to the polishing stock solution storage barrel through a stock solution pipe, and an electromagnetic regulating valve is provided in the middle section of the stock solution pipe.

[0012] As a further solution of the utility model: an accelerating cone is arranged on the inner wall of the connecting pipe away from the outer cylinder, and a mixing section is arranged on the inner wall of the connecting pipe close to the outer cylinder.

[0013] Beneficial effects of the utility model:

[0014] The utility model is provided with a spiral cooling tube, a heat exchange box, a heat exchange tube, a semiconductor refrigeration plate and a heat exchange fan. When the temperature sensor detects that the temperature of the polishing liquid rises, the circulation pump is started to make the coolant in the spiral cooling tube circulate along the spiral cooling tube and the heat exchange tube for heat exchange cooling. At the same time, the semiconductor refrigeration plate and the heat exchange fan are started to dissipate the heat of the coolant at the heat exchange tube, thereby avoiding the polishing being affected by the temperature rise of the polishing liquid.

[0015] The utility model stirs the polishing liquid in the inner cylinder in multiple directions by arranging a stirring shaft, a stirring rod, a rotating shaft, a driving bevel gear, a driving gear, a driven gear and a gear ring, thereby improving the stirring and mixing effect.

[0016] The utility model is provided with an input pipe, a raw liquid pipe, a flow meter, an electromagnetic regulating valve, a connecting pipe, an accelerating cone pipe and a mixing section. When the concentration of the polishing liquid in the inner cylinder changes, the concentration of the polishing liquid in the inner cylinder can be adjusted to avoid the backflow of the recovered polishing liquid, which affects the concentration of the polishing liquid in the inner cylinder and interferes with the polishing accuracy.

[0017] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. The utility model has a simple structure and is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of a stirring and cooling device for polishing liquid proposed by the utility model;

[0019] Figure 2 This is a schematic diagram of the internal structure of a stirring barrel of a stirring and cooling device for polishing liquid proposed by the utility model;

[0020] Figure 3 It is a partial structural schematic diagram of a stirring shaft of a stirring and cooling device for polishing liquid proposed by the utility model;

[0021] Figure 4 This is a schematic diagram of the transmission structure of the driving gear and the gear ring of the stirring and cooling device for polishing liquid proposed by the utility model;

[0022] Figure 5 This is a schematic diagram of the internal structure of a heat exchange box of a stirring and cooling device for polishing liquid proposed by the utility model;

[0023] Figure 6 The utility model is a schematic structural diagram of a connecting pipe of a stirring and cooling device for polishing liquid.

[0024] In the figure: 1. outer cylinder; 2. inner cylinder; 3. discharge pipe; 4. stirring motor; 5. stirring shaft; 6. stirring rod; 7. rotating shaft; 8. driving bevel gear; 9. driving gear; 10. driven gear; 11. gear ring; 12. spiral cooling tube; 13. heat exchange box; 14. heat exchange tube; 15. semiconductor refrigeration plate; 16. heat exchange fan; 17. reflux pipe; 18. input pipe; 19. raw liquid pipe; 20. flow meter; 21. electromagnetic regulating valve; 22. connecting pipe; 23. accelerating cone tube; 24. mixing section. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0026] Example 1

[0027] A stirring and cooling device for polishing liquid, such as Figures 1 to 5As shown, it includes an outer cylinder 1 supported on the ground by a support frame, a liquid injection port is arranged at the top of the outer cylinder 1, an inner cylinder 2 is arranged inside the outer cylinder 1, the material of the inner cylinder 2 is resin, and the bottom end of the inner cylinder 2 is connected to a discharge pipe 3 connected to a polishing device, a spiral cooling pipe 12 is arranged between the inner cylinder 2 and the outer cylinder 1, and the spiral cooling pipe 12 is filled with cooling liquid, and a temperature sensor is arranged on the inner wall of the inner cylinder 2, a heat exchange box 13 is fixed to the outer wall of one side of the outer cylinder 1, and a heat exchange tube 14 connected to both ends of the spiral cooling tube 12 is arranged inside the heat exchange box 13, and a circulating pump is arranged at one end of the heat exchange tube 14 connected to the spiral cooling tube 12, and a semiconductor refrigeration plate 15 is arranged on one side of the heat exchange tube 14, and the semiconductor refrigeration plate 15 is close to one end of the heat exchange tube 14. The cold end of the semiconductor refrigeration plate 15, a heat exchange fan 16 is arranged on one side of the hot end of the semiconductor refrigeration plate 15, a stirring motor 4 is fixed to the outer wall of the top end of the outer cylinder 1, a stirring shaft 5 is rotatably connected to the inner wall of the top end of the outer cylinder 1, a rotating shaft 7 is rotatably connected to the inner wall of the stirring shaft 5, the other end of the rotating shaft 7 is connected to the output shaft of the stirring motor 4, a plurality of stirring rods 6 are rotatably connected to the side wall of the stirring shaft 5, a driving bevel gear 8 is fixed to the outer wall of the rotating shaft 7, a driven bevel gear meshed with the driving bevel gear 8 is fixed to one end of the stirring rod 6, a driving gear 9 is fixed to the outer wall of the top end of the rotating shaft 7, a gear ring 11 is fixed to the inner wall of the stirring shaft 5, the gear ring 11 is meshed with the driving gear 9 through the driven gear 10, and a scraper for scraping up the bottom sediment is connected to the bottom of the stirring shaft 5.

[0028] When in use, the prepared polishing liquid is injected into the inner cylinder 2, and the stirring motor 4 drives the rotating shaft 7 to rotate, and the driving gear 9, the driven gear 10 and the gear ring 11 drive the stirring shaft 5 to rotate. At the same time, the driving bevel gear 8 drives the stirring rod 6 to rotate, and the polishing liquid in the inner cylinder 2 is stirred in multiple directions. The polishing liquid is supplied to the polishing equipment through the discharge pipe 3, and the polishing liquid treated by the recovery equipment flows back into the inner cylinder 2 through the reflux pipe 17 and mixes with the polishing liquid in the inner cylinder 2. Since the friction of polishing will increase the temperature of the polishing liquid, the refluxed polishing liquid will increase the temperature of the polishing liquid in the inner cylinder 2 after mixing. When the temperature sensor detects that the temperature of the polishing liquid has increased, the circulating pump is started to make the coolant in the spiral cooling tube 12 circulate along the spiral cooling tube 12 and the heat exchange tube 14 for heat exchange cooling. At the same time, the semiconductor refrigeration plate 15 and the heat exchange fan 16 are started to dissipate heat from the coolant at the heat exchange tube 14.

[0029] By arranging the spiral cooling tube 12, the heat exchange box 13, the heat exchange tube 14, the semiconductor refrigeration plate 15 and the heat exchange fan 16, when the temperature sensor detects that the temperature of the polishing liquid has risen, the circulation pump is started, so that the coolant in the spiral cooling tube 12 circulates along the spiral cooling tube 12 and the heat exchange tube 14 for heat exchange cooling. At the same time, the semiconductor refrigeration plate 15 and the heat exchange fan 16 are started to dissipate the heat of the coolant at the heat exchange tube 14, so as to avoid the polishing being affected by the temperature rise of the polishing liquid.

[0030] By arranging the stirring shaft 5, stirring rod 6, rotating shaft 7, driving bevel gear 8, driving gear 9, driven gear 10 and gear ring 11, the polishing liquid in the inner cylinder 2 is stirred in multiple directions to improve the stirring and mixing effect.

[0031] Example 2

[0032] A stirring and cooling device for polishing liquid. This embodiment is based on the embodiment 1, and the following improvements are made: Figure 1 and Figure 6 As shown, an input pipe 18 is connected to one side of the top of the outer cylinder 1, one end of the input pipe 18 faces the inner cylinder 2, and the other end of the input pipe 18 is connected to an external water supply device. A connecting pipe 22 is provided in the middle section of the input pipe 18, a flow meter 20 is provided on one side of the connecting pipe 22, one side of the connecting pipe 22 is connected to the polishing stock liquid storage barrel through the raw liquid pipe 19, an electromagnetic regulating valve 21 is provided in the middle section of the raw liquid pipe 19, an acceleration cone 23 is provided on the inner wall of the connecting pipe 22 away from the outer cylinder 1, a mixing section 24 is provided on the end of the connecting pipe 22 close to the outer cylinder 1, and a density detection probe and a water level detection sensor are provided inside the inner cylinder 2.

[0033] Since the polishing liquid will be lost during polishing, when the recovered polishing liquid flows back, it will affect the concentration of the polishing liquid in the inner cylinder 2. When the density detection probe detects that the concentration exceeds the preset concentration, the external water supply component injects water into the inner cylinder 2 through the input pipe 18. At this time, the electromagnetic regulating valve 21 is closed, and the concentration of the polishing liquid is adjusted by injecting water. The flow meter 20 detects the flow rate; when the density detection probe detects that the concentration is lower than the preset concentration, the external water supply component injects water into the inner cylinder 2 through the input pipe 18, and the flow is accelerated through the acceleration cone tube 23. A negative pressure is formed on the rear side of the acceleration cone tube 23, and the polishing stock liquid is sucked from the polishing stock liquid storage barrel through the stock liquid tube 19, and preliminarily mixed in the mixing section 24. The electromagnetic regulating valve 21 controls the inflow of polishing stock liquid according to the concentration that needs to be adjusted.

[0034] By providing an input pipe 18, a raw liquid pipe 19, a flow meter 20, an electromagnetic regulating valve 21, a connecting pipe 22, an accelerating cone pipe 23 and a mixing section 24, the concentration of the polishing liquid in the inner cylinder 2 can be adjusted when the concentration of the polishing liquid in the inner cylinder 2 changes, thereby avoiding the backflow of the recovered polishing liquid, which affects the concentration of the polishing liquid in the inner cylinder 2 and interferes with the polishing accuracy.

[0035] Working principle: When in use, the prepared polishing liquid is injected into the inner cylinder 2, and the stirring motor 4 drives the rotating shaft 7 to rotate, and the driving gear 9, the driven gear 10 and the gear ring 11 drive the stirring shaft 5 to rotate. At the same time, the driving bevel gear 8 drives the stirring rod 6 to rotate, and the polishing liquid in the inner cylinder 2 is stirred in multiple directions. The polishing liquid is supplied to the polishing equipment through the discharge pipe 3. The polishing liquid treated by the recovery equipment flows back into the inner cylinder 2 through the reflux pipe 17 and mixes with the polishing liquid in the inner cylinder 2. The friction of polishing will increase the temperature of the polishing liquid. The refluxed polishing liquid will increase the temperature of the polishing liquid in the inner cylinder 2 after mixing. When the temperature sensor detects that the temperature of the polishing liquid has increased, the circulation pump starts to make the coolant in the spiral cooling tube 12 circulate along the spiral cooling tube 12 and the heat exchange tube 14 for heat exchange cooling. At the same time, the semiconductor refrigeration plate 15 and the heat exchange fan 16 are started to dissipate the heat of the coolant at the heat exchange tube 14; due to the loss of polishing liquid during polishing, when the recovered polishing liquid flows back, it will affect the concentration of the polishing liquid in the inner cylinder 2. When the density detection probe detects that the concentration exceeds the preset concentration, the external water supply component injects water into the inner cylinder 2 through the input pipe 18. At this time, the electromagnetic regulating valve 21 is closed, and the concentration of the polishing liquid is adjusted by injecting water. The flow meter 20 detects the flow rate; when the density detection probe detects that the concentration is lower than the preset concentration, the external water supply component injects water into the inner cylinder 2 through the input pipe 18, and the flow is accelerated through the accelerating cone tube 23, forming a negative pressure on the rear side of the accelerating cone tube 23, and the polishing stock liquid is sucked from the polishing stock liquid storage barrel through the stock liquid pipe 19, and preliminarily mixed in the mixing section 24. The electromagnetic regulating valve 21 controls the inflow of polishing stock liquid according to the concentration that needs to be adjusted.

[0036] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or modification made by a person skilled in the art based on the present invention is within the protection scope of the present invention.

Claims

1. A stirring and cooling device for polishing liquid, comprising an outer cylinder supported on the ground by a support frame, characterized in that: An inner cylinder is arranged inside the outer cylinder, a spiral cooling pipe is arranged between the inner cylinder and the outer cylinder, a heat exchange box is fixed to the outer wall of one side of the outer cylinder, a heat exchange pipe connected with both ends of the spiral cooling pipe is arranged inside the heat exchange box, a circulating pump is arranged at one end of the heat exchange pipe connected with the spiral cooling pipe, a semiconductor refrigeration plate is arranged on one side of the heat exchange pipe, the semiconductor refrigeration plate and the heat exchange pipe are close to one end as the cold end of the semiconductor refrigeration plate, and a heat exchange fan is arranged on the hot end side of the semiconductor refrigeration plate.

2. A stirring and cooling device for polishing liquid according to claim 1, characterized in that: The inner cylinder is made of resin, and the bottom end of the inner cylinder is connected to a discharge pipe connected to a polishing device.

3. A stirring and cooling device for polishing liquid according to claim 1, characterized in that: A stirring motor is fixed to the outer wall of the top end of the outer cylinder, a stirring shaft is rotatably connected to the inner wall of the top end of the outer cylinder, a rotating shaft is rotatably connected to the inner wall of the stirring shaft, and the other end of the rotating shaft is connected to the output shaft of the stirring motor.

4. A stirring and cooling device for polishing liquid according to claim 3, characterized in that: A plurality of stirring rods are rotatably connected to the side wall of the stirring shaft, a driving bevel gear is fixed to the outer wall of the rotating shaft, and a driven bevel gear meshed with the driving bevel gear is fixed to one end of the stirring rod.

5. The stirring and cooling device for polishing liquid according to claim 3, characterized in that: A driving gear is fixed on the outer wall of the top end of the rotating shaft, a gear ring is fixed on the inner wall of the stirring shaft, and the gear ring is meshed with the driving gear through a driven gear.

6. The stirring and cooling device for polishing liquid according to claim 1, characterized in that: An input pipe is connected to one side of the top end of the outer cylinder, one end of the input pipe faces the inner cylinder, and the other end of the input pipe is connected to an external water supply device.

7. A stirring and cooling device for polishing liquid according to claim 6, characterized in that: A connecting pipe is provided in the middle section of the input pipe, a flow meter is provided on one side of the connecting pipe, one side of the connecting pipe is connected with the polishing stock solution storage barrel through a stock solution pipe, and an electromagnetic regulating valve is provided in the middle section of the stock solution pipe.

8. A stirring and cooling device for polishing liquid according to claim 7, characterized in that: An accelerating cone is arranged at one end of the inner wall of the connecting pipe away from the outer cylinder, and a mixing section is arranged at one end of the connecting pipe close to the outer cylinder.

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