LED circuit board glue pouring mold

Abstract

The utility model provides an LED circuit board glue pouring mold, which relates to the technical field of LED packaging and comprises a mold shell, and a heat dissipation assembly is slidably connected in the mold shell. A demolding assembly is fixedly connected to the interior of the mold shell, a heat dissipation assembly comprises a cover plate, the outer side of the cover plate is slidably connected to the inner wall of the mold shell, cooling cavities are fixedly connected to the two sides of the interior of the cover plate, and sealing plates are fixedly connected to the interiors of the cooling cavities, so that redundant heat can be effectively removed from a curing area; the glue is ensured to be quickly and uniformly cured, and the physical property change, such as shrinkage, cracking or non-uniform curing, of the glue due to over-high temperature is prevented. And the circuit board can be smoothly demoulded under the condition that other parts of the mould are not contacted, so that the possible damage or deformation to the circuit board in the demoulding process is minimized, and the problem of glue filling flaws caused by non-uniform glue solidification due to natural cooling in an environment with higher temperature or higher humidity is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to a glue-filling mold for an LED circuit board. Background Art

[0002] LED circuit board is a specially designed circuit board used to support and connect light emitting diode components. It is a key part in electronic devices to ensure the correct connection, power supply and control of LEDs.

[0003] The existing patent CN209111345U discloses an LED circuit board glue pouring mold for encapsulating an LED circuit board. The LED circuit board includes a substrate and a plurality of LED units arranged on the substrate. It includes a first mold and a second mold. The bottom of the accommodating groove is convexly provided with a plurality of protrusions so that when the back side of the substrate is mounted inward in the accommodating groove, there is a glue injection gap between the back side of the substrate and the bottom of the accommodating groove; the second mold is formed with a glue pouring surface opposite to the front side of the LED circuit board and a mating surface cooperating with the first mold.

[0004] In order to solve the problem that the back of the LED panel is still exposed and cannot provide all-round waterproof and moisture-proof protection for the LED panel, this patent encapsulates the insulating waterproof layer on the lower surface of the substrate on the back of the LED circuit board through a vacuum infusion process, thereby effectively improving the waterproof and moisture-proof performance of the LED circuit board.

[0005] However, in actual use, there are still the following shortcomings, such as: most of the current glue casting molds rely on natural cooling to solidify the colloid after the casting process. This natural cooling process depends on the ambient temperature. Therefore, in an environment with high temperature or high humidity, natural cooling is often uncontrollable. This can easily cause uneven curing of the colloid, thereby affecting the quality and performance of the final product.

[0006] Therefore, the utility model provides a LED circuit board glue pouring mold. Utility Model Content

[0007] The purpose of the utility model is to solve the shortcomings of the prior art and provide a LED circuit board glue pouring mold.

[0008] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an LED circuit board glue-filling mold, comprising a mold shell, a heat dissipation component is slidably connected to the interior of the mold shell; a demoulding component is fixedly connected to the interior of the mold shell;

[0009] The heat dissipation assembly includes a cover plate, the outer side of the cover plate is slidably connected to the inner wall of the mold shell, both sides of the cover plate are fixedly connected to cooling cavities, the interior of the cooling cavity is fixedly connected to a closing plate, the interior of the cooling cavity is fixedly connected to a partition, the interior of the partition is fixedly connected to fins, and the interior of the closing plate is fixedly connected to a cold air duct.

[0010] As a preferred embodiment, the demolding assembly includes an air transfer column, the outer side of which is fixedly connected to both sides of the bottom end of the inner wall of the mold shell, one end of which is fixedly connected to a sealing valve, the other end of which is fixedly connected to an airbag, and the top of the airbag is fixedly connected to a demolding plate.

[0011] The technical effect of adopting the above technical solution is: it can prevent the mold from overheating, thereby reducing the thermal stress of the mold material, extending the service life of the mold, and making the LED circuit board easier to demold from the mold after curing, reducing the risk of product damage.

[0012] As a preferred implementation, an ultraviolet lamp is fixedly connected to the top of the inner wall of the cover plate, a circuit board is provided on the inner wall of the mold shell, and a glue injection tube is fixedly connected to the top of the cover plate.

[0013] The technical effect of adopting the above technical solution is to ensure that the glue can be transferred to the circuit board and solidified.

[0014] As a preferred embodiment, the outer side of the stripping plate is slidably connected to the inner wall of the mold shell.

[0015] The technical effect of adopting the above technical solution is to reduce the physical pressure and friction on the LED circuit board during the demoulding process, thereby reducing the risk of damage or deformation of the product surface.

[0016] As a preferred embodiment, the outer bottom end of the airbag is fixedly connected to the inner wall bottom end of the mold shell.

[0017] The technical effect of adopting the above technical solution is to ensure that the circuit board in the mold remains stable during the process of pushing it out of the mold shell.

[0018] As a preferred implementation, the bottom end of the circuit board contacts the top end of the stripping plate.

[0019] The technical effect of adopting the above technical solution is: ensuring that the thrust of the stripper plate can be transmitted to the circuit board.

[0020] Compared with the prior art, the advantages and positive effects of the utility model are:

[0021] The utility model sets a heat dissipation component and a heat dissipation component structure. When the glue flows to the predetermined glue filling area through the glue injection tube, the tightly fitted circuit board and the inner wall of the mold shell ensure that the glue is evenly transferred to the surface of the circuit board to form a uniform glue coating. Then the ultraviolet lamp is started and irradiated on the newly injected glue, effectively accelerating the curing process of the glue and ensuring rapid and uniform curing. When the glue is cured, the partition and fin structure in the cooling chamber effectively transfer the heat generated during the curing process to the top, and the introduced cold air continuously cools the fins through the cold air pipe to dissipate heat. This design can effectively remove excess heat from the curing area, ensure that the glue is cured quickly and evenly, and prevent the physical property changes of the glue due to excessive temperature, such as shrinkage, cracking or uneven curing. And it allows the circuit board to be demoulded smoothly without contacting other parts of the mold, minimizing the damage or deformation that may be caused to the circuit board during the demoulding process, and effectively solves the problem that natural cooling easily causes uneven curing of the colloid and causes glue filling defects in an environment with high temperature or high humidity. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional diagram of a LED circuit board glue-filling mold provided by the utility model;

[0023] Figure 2 A schematic diagram of the circuit board structure of an LED circuit board glue-filling mold provided by the utility model;

[0024] Figure 3 A schematic diagram of the heat dissipation component structure of a LED circuit board glue-filling mold provided by the utility model;

[0025] Figure 4 The utility model provides a schematic diagram of the heat dissipation component structure of an LED circuit board glue-filling mold.

[0026] Legend:

[0027] 1. Mold shell;

[0028] 2. heat dissipation assembly; 21. cover plate; 22. cooling chamber; 23. closing plate; 24. partition plate; 25. fin; 26. cold air duct;

[0029] 3. Heat dissipation component; 31. Air transfer column; 32. Sealing valve; 33. Air bag; 34. Stripping plate;

[0030] 4. Ultraviolet lamp; 5. Circuit board; 6. Glue injection tube. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] like Figure 1 - Figure 3 As shown, this embodiment provides a technical solution: an LED circuit board glue-filling mold, comprising a mold shell 1, a heat dissipation component 2 is slidably connected to the inside of the mold shell 1; a demoulding component 3 is fixedly connected to the inside of the mold shell 1;

[0033] The heat dissipation component 2 includes a cover plate 21, the outer side of the cover plate 21 is slidably connected to the inner wall of the mold shell 1, the inner sides of the cover plate 21 are fixedly connected with cooling chambers 22, the inner part of the cooling chamber 22 is fixedly connected with a closing plate 23, the inner part of the cooling chamber 22 is fixedly connected with a partition plate 24, the inner part of the partition plate 24 is fixedly connected with a fin 25, and the inner part of the closing plate 23 is fixedly connected with a cold air duct 26. The heat dissipation component 2 effectively manages the heat generated after the glue injection process, wherein the cover plate 21 is connected to the inner wall of the mold shell 1 by a sliding connection to ensure a close fit. The cooling chamber 22 is sealed by a closing plate 23, wherein the interior of the cooling chamber 22 includes a partition 24 and fins 25, so that the heat generated during the curing process of the glue can be transferred to the top for heat dissipation, and cold air is introduced through a cold air pipe 26 connected to the inside of the closing plate 23 to continuously cool the top fins 25. The cold air absorbs heat from the fins 25 and becomes hot, and its density decreases, and it naturally rises, thereby forming an ascending hot air flow, and the cold air sinks and absorbs more heat, while the hot air rises and is discharged, thereby achieving a continuous natural cooling effect;

[0034] Furthermore, Figure 2 As shown: an ultraviolet lamp 4 is fixedly connected to the top of the inner wall of the cover plate 21, a circuit board 5 is arranged on the inner wall of the mold shell 1, and a glue injection tube 6 is fixedly connected to the top of the cover plate 21. The design of the ultraviolet lamp 4 ensures that after the glue is injected, the ultraviolet light can evenly and effectively irradiate the entire glue coating, thereby accelerating the curing speed and improving the curing quality. The circuit board 5 is tightly fitted with the mold shell 1, ensuring that the glue can be stably transferred to the surface of the circuit board 5. The design and installation position of the glue injection tube 6 ensure that the glue can accurately flow to the predetermined glue injection area;

[0035] In order to realize the demoulding of the circuit board 5 after the glue is poured, Figure 2 - Figure 4As shown: In this scheme, the demoulding component 3 includes an air transfer column 31, the outer side of the air transfer column 31 is fixedly connected to both sides of the bottom end of the inner wall of the mold shell 1, one end of the air transfer column 31 is fixedly connected to a sealing valve 32, and the other end of the air transfer column 31 is fixedly connected to an air bag 33, the outer bottom end of the air bag 33 is fixedly connected to the bottom end of the inner wall of the mold shell 1, and the top of the air bag 33 is fixedly connected to a demoulding plate 34, and the outer side of the demoulding plate 34 is slidably connected to the inner wall of the mold shell 1. The bottom end of the circuit board 5 is in contact with the top end of the demoulding plate 34. The design of the air transfer column 31 allows air or gas to pass through. The sealing valve 32 ensures that the air transfer column 31 can be effectively closed or opened when needed to control the gas flow in the airbag 33. The function of the airbag 33 is to help push the circuit board 5 in the mold shell 1 out of the mold shell through the pressure change of air or gas after the glue filling is completed, so as to facilitate subsequent processing or packaging. The stripping plate 34 is in direct contact with the bottom end of the circuit board 5. This design ensures that during the demoulding process, the stripping plate 34 can accurately push the circuit board 5 out of the mold while avoiding any damage or deformation to the circuit board 5.

[0036] Working principle:

[0037] like Figure 1 - Figure 4 As shown:

[0038] When in use: First, when glue injection is required, the glue flows accurately to the predetermined glue injection area through the glue injection tube 6. At the same time, since the circuit board 5 is tightly fitted with the inner wall of the mold shell 1, the glue can be stably transferred to the surface of the circuit board 5 to form a uniform glue coating. At this time, the ultraviolet lamp 4 starts to work to ensure that the glue can be evenly and effectively irradiated after injection, thereby accelerating the curing speed of the glue and improving the curing quality. Then, as the glue is cured, the heat dissipation component 2 starts to work. Since the cover plate 21 is tightly fitted with the inner wall of the mold shell 1 through a sliding connection, the partition plate 24 and the fin 25 structure in the cooling cavity 22 can effectively cure the glue. The heat generated during the process is transferred to the top. At the same time, cold air is introduced through the cold air pipe 26 connected to the inside of the closing plate 23 to continuously cool the fins 25, so that the heat can be continuously and stably transferred step by step. When the glue is completely cured, the air transfer column 31 is opened by operating the sealing valve 32 to allow air or gas to enter the air transfer column 31. As the pressure of the air or gas changes, the airbag 33 begins to expand, pushing the stripping plate 34 to move upward. Since the stripping plate 34 is in direct contact with the bottom end of the circuit board 5, it can accurately push the circuit board 5 out of the mold. This design ensures that the circuit board 5 will not be damaged or deformed during the demolding process.

[0039] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A LED circuit board glue-filling mold, comprising a mold shell (1), characterized in that: The interior of the mold shell (1) is slidably connected to a heat dissipation component (2); the interior of the mold shell (1) is fixedly connected to a demoulding component (3); The heat dissipation component (2) comprises a cover plate (21), the outer side of the cover plate (21) is slidably connected to the inner wall of the mold shell (1), the inner sides of the cover plate (21) are fixedly connected to cooling cavities (22), the inner part of the cooling cavity (22) is fixedly connected to a closing plate (23), the inner part of the cooling cavity (22) is fixedly connected to a partition plate (24), the inner part of the partition plate (24) is fixedly connected to a fin (25), and the inner part of the closing plate (23) is fixedly connected to a cold air duct (26).

2. The LED circuit board glue-filling mold according to claim 1, characterized in that: The demoulding assembly (3) comprises an air transfer column (31), the outer sides of which are fixedly connected to the two sides of the bottom end of the inner wall of the mold shell (1), one end of which is fixedly connected to a sealing valve (32), the other end of which is fixedly connected to an air bag (33), and the top end of which is fixedly connected to a demoulding plate (34).

3. The LED circuit board glue-filling mold according to claim 1, characterized in that: An ultraviolet lamp (4) is fixedly connected to the top of the inner wall of the cover plate (21), a circuit board (5) is provided on the inner wall of the mold shell (1), and a glue injection tube (6) is fixedly connected to the top of the cover plate (21).

4. The LED circuit board glue-filling mold according to claim 2, characterized in that: The outer side of the stripping plate (34) is slidably connected to the inner wall of the mold shell (1).

5. The LED circuit board glue-filling mold according to claim 2, characterized in that: The outer bottom end of the air bag (33) is fixedly connected to the inner wall bottom end of the mold shell (1).

6. The LED circuit board glue-filling mold according to claim 3, characterized in that: The bottom end of the circuit board (5) contacts the top end of the stripping plate (34).

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