Connecting structure and vehicle

By using expanding glue to connect the connection structure between thermoplastic materials and thermosetting materials, the problem of reduced connection stability during thermoplastic materials is solved, and higher connection stability and reliability are achieved.

CN222859581UActive Publication Date: 2025-05-13BYD CO LTD +1
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Patent Information

Application Number
CN202421716626.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-19
Publication Date
2025-05-13
Estimated Expiration
2034-07-19

AI Technical Summary

Technical Problem

When thermoplastic materials are combined with other materials, the heating treatment of thermoplastic materials will affect the connection stability and lead to a decrease in stability.

Method used

A connecting structure is adopted, wherein one of the first substrate and the second substrate is a thermoplastic material and the other is a thermoset material, which is connected by an expanded glue. When the expansion glue expands under heat, the expansion force pressed on the expansion glue compacts the heat-formed first substrate to avoid material stress concentration, and prevents direct contact between the first substrate and the second substrate at high temperature, affecting the performance of the second substrate.

Benefits of technology

Through this connection structure, the connection stability of thermoplastic materials when composited with other materials is improved, the material stress concentration and performance influence is avoided, and the overall connection structure is improved.

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Abstract

The connecting structure comprises a first base material, expansion glue and a second base material, the second base material is connected with the first base material through the expansion glue, one of the first base material and the second base material is made of a thermoplastic material, and the other of the first base material and the second base material is made of a thermosetting material. The expansion glue is arranged between the first base material and the second base material, so that when the expansion glue is heated to expand, expansion force applied to the expansion glue compacts the heated and formed first base material, material stress concentration is avoided, meanwhile, direct contact between the first base material and the lower portion of the second base material at a high temperature is avoided, and the performance of the second base material is prevented from being affected; and the reliability of the whole connection structure is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of vehicle processing, in particular to a connection structure and a vehicle. Background Art

[0002] When thermoplastic composites are combined with other materials, the thermoplastic materials need to be heated during processing, which affects the stability of the connection. Therefore, how to reduce the impact of thermoplastic materials on the stability of the connection when they are compounded with other materials becomes the key. Utility Model Content

[0003] The utility model aims to provide a connection structure and a vehicle, which can solve the problem of decreased stability after thermoplastic materials and other materials are compounded.

[0004] In order to achieve the purpose of the utility model, the utility model provides the following technical solutions:

[0005] In a first aspect, the utility model provides a connection structure, including a first substrate, an expansion adhesive and a second substrate, wherein the second substrate is connected to the first substrate via the expansion adhesive, and one of the first substrate and the second substrate is a thermoplastic material, and the other is a thermosetting material.

[0006] In one embodiment, the connection structure further includes a metal connector, and the thermoplastic material is connected to the expansion adhesive through the metal connector.

[0007] In one embodiment, the metal connector is an integrated structure, and a thickness L7 of the metal connector is 0.1 mm to 0.3 mm.

[0008] In one embodiment, the thickness L8 of the expansion glue is 0.1 mm to 0.3 mm.

[0009] In one embodiment, the surface roughness Ra of the metal connector is 40 μm to 60 μm.

[0010] In one embodiment, the connection structure further includes an adhesive member, the adhesive member connects the first substrate and the second substrate, and the adhesive member covers one end of the first substrate or the second substrate.

[0011] In one embodiment, the thermoplastic material is provided with a groove, and the expansion adhesive is connected to the thermoplastic material through the groove.

[0012] In one embodiment, the first substrate has a boss, the second substrate has a groove, the expansion adhesive is connected to the boss, the groove and the boss cooperate, and the second substrate is connected to the boss through the expansion adhesive.

[0013] In one embodiment, the second substrate further includes a support column and a second substrate body, the second substrate body encloses a cavity, the support column is accommodated in the cavity, the support column extends along the thickness direction of the second substrate, and both ends of the support column are connected to the second substrate body.

[0014] In one embodiment, the support column includes multiple stacked first material layers, and the outer peripheral wall of the second substrate body includes multiple stacked second material layers, and the number of the second material layers is greater than the number of the first material layers.

[0015] In one embodiment, the plurality of first material layers include at least two woven composite layers and at least one unidirectional material layer; and / or the plurality of second material layers include at least two woven composite layers and at least one unidirectional material layer.

[0016] In a second aspect, the utility model provides a vehicle, comprising the connection structure as described in the first aspect.

[0017] The utility model aims to provide a connection method between a second substrate and a first substrate, wherein one of the first substrate and the second substrate is a thermoplastic material and the other is a thermosetting material, and the two are connected by an expansion adhesive, so that when the expansion adhesive expands due to heat, the expansion force exerted on the expansion adhesive compacts the heat-formed first substrate and avoids material stress concentration, while avoiding direct contact between the first substrate and the lower part of the second substrate at high temperature, avoiding affecting the performance of the second substrate, and improving the reliability of the overall connection structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 is a cross-sectional schematic diagram of a connection structure of an embodiment;

[0020] Figure 2 is a schematic cross-sectional view of a first substrate in one embodiment;

[0021] Figure 3 is a schematic cross-sectional view of a second substrate in one embodiment;

[0022] Figure 4 is a schematic cross-sectional view of a metal connector and an expansion adhesive according to an embodiment;

[0023] Figure 5 is a schematic cross-sectional view of a stack of multiple layers of material according to an embodiment;

[0024] Figure 6 It is a cross-sectional schematic diagram of another embodiment of a multi-layer material stack.

[0025] Description of reference numerals:

[0026] 1-first substrate, 1A-boss, 11-first section, 111-first surface, 112-first groove, 12-second section, 121-second surface, 122-second groove, 13-third section, 131-third surface, 132-fourth surface;

[0027] 2- expansion glue;

[0028] 3-second substrate, 3A-groove, 31-second substrate body, 311-connecting surface, 312-cavity, 32-fourth section, 33-fifth section, 34-sixth section, 35-seventh section, 36-support column;

[0029] 4-metal connector, 41-metal segment 1, 42-metal segment 2, 43-metal segment 3, 44-metal segment 4, 45-metal segment 5;

[0030] 5- Adhesive parts;

[0031] A-woven composite layer, B-unidirectional material layer;

[0032] X-thickness direction, Y-width direction. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there can be a central component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time.

[0035] Unless otherwise defined, all technical and scientific terms used in this utility model have the same meaning as those commonly understood by technicians in the technical field of this utility model. The terms used in the specification of this utility model are only for the purpose of describing specific embodiments and are not intended to limit this utility model. The term "and / or" used in this utility model includes any and all combinations of one or more related listed items.

[0036] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0037] The utility model provides a connection structure suitable for connection to a mounting base surface. The specific mounting base surface may be a vehicle body in white. That is, the connection structure provided by the utility model is for mounting a specific profile to a preset position of the vehicle.

[0038] Please refer to Figure 1 The connection structure includes a first substrate 1, an expansion adhesive 2 and a second substrate 3. The second substrate 3 is connected to the first substrate 1 through the expansion adhesive 2. One of the first substrate 1 and the second substrate 3 is a thermoplastic material, and the other is a thermosetting material.

[0039] Specifically, the first substrate 1 can be a thermoplastic fiber composite material plate, and the second substrate 3 can be a thermosetting fiber composite material second substrate 3; and both the first substrate 1 and the second substrate 3 can be a composite of a multilayer fiber woven prepreg and a thermoplastic resin matrix. Setting the first substrate 1 and the second substrate 3 to be both fiber composite materials is conducive to improving the connection strength, improving the reliability of the overall structure, and reducing the weight of the product to meet the demand for lightweight products.

[0040] Optionally, the fiber woven prepreg in the first substrate 1 and the second substrate 3 includes, but is not limited to, one or more of carbon fiber, glass fiber, hemp fiber, basalt fiber, Kevlar fiber, ultra-high molecular weight polyethylene fiber, and PP fiber.

[0041] Optionally, the thermoplastic resin matrix in the first substrate 1 and the second substrate 3 includes but is not limited to one or more of PP (polypropylene), PC (polycarbonate), PA6 (nylon 6), PA66 (nylon 66), PPS (polyphenylene sulfide), PEEK (polyetheretherketone), and PEKK (polyaryletherketone).

[0042] Expansion adhesive 2 is an adhesive specially used for target part connection or shock absorption area. Expansion adhesive 2 has the advantages of shock absorption and noise reduction, strong adhesion, easy construction, high expansion rate, good temperature resistance and chemical stability.

[0043] Optionally, the expansion adhesive 2 includes one or more of CBS expansion adhesive film, rubber expansion adhesive film, and butyl sealing tape.

[0044] Optionally, the expansion adhesive 2 is a low-temperature expansion adhesive. When the expansion adhesive 2 is heated (80°C to 100°C), the adhesive film melts and expands. The expansion ratio of the expansion adhesive 2 is 10 to 50 times, the expansion force of the expansion adhesive 2 is 1 MPa to 5 MPa, and the bonding strength of the expansion adhesive 2 reaches 60 MPa-80 MPa.

[0045] The purpose of the utility model is to provide a connection method between a second substrate 3 and a first substrate 1, wherein one of the first substrate 1 and the second substrate 3 is a thermoplastic material and the other is a thermosetting material, and the two are connected by an expansion adhesive 2, so that when the expansion adhesive 2 expands due to heat, the expansion force exerted on the expansion adhesive 2 compacts the heat-formed first substrate 1 and avoids material stress concentration, while avoiding direct contact between the first substrate 1 and the lower part of the second substrate 3 at high temperature, avoiding affecting the performance of the second substrate 3, and improving the reliability of the overall connection structure.

[0046] In one embodiment, the thermoplastic material is provided with a groove, and the expansion adhesive is connected to the thermoplastic material through the groove.

[0047] In one embodiment, the first substrate 1 has a boss 1A, the second substrate 3 has a groove 3A, the expansion adhesive 2 is connected to the boss 1A, the groove 3A and the boss 1A cooperate, and the second substrate 3 is connected to the boss 1A through the expansion adhesive 2.

[0048] Further, the first substrate 1 is mounted and fixed on the mounting base, the boss 1A is a portion of the first substrate 1 protruding from the side facing away from the mounting base, the side of the boss 1A facing away from the mounting base is provided with expansion glue 2 and the second substrate 3, and the second substrate 3 is connected to the first substrate 1 through the expansion glue 2. Optionally, in the thickness direction X of the first substrate 1, the boss 1A protrudes from the top surface of the first substrate 1. It should be explained that the first substrate 1 can be a plate-shaped profile, such as Figure 1 As shown, the direction perpendicular to the mounting base surface is the thickness direction X of the first substrate 1 . The thickness direction X of the first substrate 1 mentioned below is the direction shown in the figure.

[0049] In order to achieve the matching between the second substrate 3 and the boss 1A, a groove 3A is opened on the second substrate 3 so that the groove 3A and the boss 1A can be matched, the boss 1A extends into the groove 3A, and the expansion glue 2 is arranged in the groove 3A to enhance the matching connection between the second substrate 3 and the first substrate 1.

[0050] In a specific embodiment, the manufacturing method of the above-mentioned connection structure can be: after the first substrate 1 is laid in the mold, it is heated until the thermoplastic resin matrix is ​​melted, and an expansion glue 2 and a second substrate 3 are arranged on the substrate. The first substrate 1, the expansion glue 2 and the second substrate 3 are molded together by compression molding; wherein the expansion glue 2 is connected to the thermoplastic resin matrix in the first substrate 1, and the second substrate 3 is connected through the expansion glue 2.

[0051] The purpose of the utility model is to provide a connection method between a second substrate 3 and a first substrate 1, wherein the first substrate 1 and the second substrate 3 are assembled through a boss 1A and a groove 3A, and then an expansion adhesive 2 is arranged between the boss 1A of the first substrate 1 and the second substrate 3, so that when the expansion adhesive 2 expands due to heat, the expansion force exerted on the expansion adhesive 2 compacts the heat-formed first substrate 1 and avoids material stress concentration, while avoiding direct contact between the first substrate 1 and the lower part of the second substrate 3 at high temperature, avoiding affecting the performance of the second substrate 3, and improving the reliability of the overall connection structure.

[0052] In one implementation, please refer to Figure 2 The first substrate 1 includes a first section 11, a second section 12 and a third section 13, and there is a spacing distance between the first section 11 and the second section 12. The first section 11 includes a first surface 111 facing the second substrate 3, and the second section 12 includes a second surface 121 facing the second substrate 3. The two opposite ends of the third section 13 are respectively connected to the first surface 111 and the second surface 121, and the third section 13 is a boss 1A; the expansion glue 2 is connected to the side of the third section 13 facing away from the first surface 111.

[0053] Specifically, the first substrate 1 is an integrated structure, but can be divided into three sections, namely the first section 11, the second section 12 and the third section 13, wherein the first section 11, the third section 13 and the second section 12 are connected in sequence. The first section 11 and the second section 12 can both be connected to the above-mentioned mounting base, and there is a spacing distance between the first section 11 and the second section 12.

[0054] The first surface 111 and the second surface 121 are both facing away from the mounting base surface, and the two opposite ends of the third section 13 are connected to the first surface 111 and the second surface 121, respectively, that is, compared with the first section 11 and the second section 12, the boss 1A in the above embodiment is formed, and there is a gap between the third section 13 and the mounting base surface, and the gap width of the gap in the thickness direction X is the thickness of the first section 11 and the second section 12. Therefore, the first section 11, the second section 12 and the third section 13 together form a "J"-shaped structure.

[0055] Optionally, in a specific embodiment, the thickness of the first section 11 and the second section 12 may be the same, and the thickness of the third section 13 is different from the thickness of the first section 11 and the second section 12, and the thickness of the third section 13 may be thicker. Because the third section 13 is a suspended section, the third section 13 has a greater thickness to improve the support strength of the structural section.

[0056] The following advantages are achieved by setting the structure of the first substrate 1 to be a "J"-shaped structure: 1) The first substrate 1 has high bending stiffness and bearing capacity, because the first substrate 1 with a "J"-shaped structure has high bending stiffness and bending bearing capacity due to its special cross-sectional shape, and can effectively withstand horizontal and vertical forces; 2) The force on the first substrate 1 is uniform, and the shape of the "J"-shaped structure is symmetrical, which makes the force more uniform, thereby improving the stability and reliability of the first substrate 1; 3) The first substrate 1 has high compressive resistance and seismic resistance, and can withstand greater pressure.

[0057] However, since the first substrate 1 of the "J"-shaped structure has many folded corners, it will be difficult for the second substrate 3 to be compacted with the first substrate 1 at the folded corners, that is, there will be gaps at the folded corners. Therefore, by arranging the expansion glue 2 on the third section 13, it can not only effectively avoid the direct contact between the third section 13 under high temperature melting and the lower part of the second substrate 3, but also play a role in protecting the second substrate 3; and the expansion force generated by the expansion glue 2 when heated will compact the first substrate 1 formed by heat, which can solve the problem that the first substrate 1 and the second substrate 3 of the "J"-shaped structure cannot be compacted.

[0058] In one implementation, please refer to Figure 2 and Figure 3 The second substrate 3 includes a second substrate body 31, a fourth section 32 and a fifth section 33. The second substrate body 31 is connected to the third section 13 through the expansion glue 2. The fourth section 32 and the fifth section 33 are both connected to a side of the first substrate 1 facing the second substrate body 31, and the fourth section 32 extends toward the first section 11, and the fifth section 33 extends toward the second section 12. The third section 13 is located between the fourth section 32 and the fifth section 33; the third section 13 includes a third surface 131 and a fourth surface 132 facing each other. The third surface 131 faces the fourth section 32, and the fourth surface 132 faces the fifth section 33. The expansion glue 2 is connected to both the third surface 131 and the fourth surface 132.

[0059] Specifically, the second substrate 3 includes a second substrate body 31, and the cross-sectional profile of the second substrate body 31 may be a quadrilateral, such as Figure 3 As shown, the second substrate body 31 includes a thickness direction X and a width direction Y, wherein the thickness direction X of the second substrate 3 is the thickness direction X of the first substrate 1 mentioned above, and the width direction Y of the second substrate 3 is the direction perpendicular to the thickness direction X in the figure.

[0060] On the basis of the above embodiments, the second substrate body 31 has a connection surface 311. The connection surface 311 is the side facing the third section 13 in the thickness direction X, that is, the bottom surface of the groove 3A above is the connection surface 311, and the connection surface 311 is connected to the expansion adhesive 2. The fourth section 32 and the fifth section 33 are connected to both ends of the connection surface 311 in the width direction Y, and both the fourth section 32 and the fifth section 33 are located on the side facing the first substrate 1 in the thickness direction X. It can be understood that the fourth section 32 and the fifth section 33 are actually protruding sections protruding from the connection surface 311 on the second substrate body 31.

[0061] Optionally, the height of the protrusion of the fourth section 32 and the fifth section 33 (in the thickness direction X) is equal to the thickness of the third section 13. It can be understood that the first substrate 1 has a "ji" - shaped structure, and by providing the fourth section 32 and the fifth section 33, the second substrate 3 can be snap - connected to the boss 1A of the first substrate 1. Thus, the second substrate 3 is prevented from shaking in the width direction Y.

[0062] Furthermore, in the width direction Y, the third section 13 includes two opposite side surfaces, namely the third surface 131 and the fourth surface 132. The third surface 131 can be connected to the first surface 111, and the fourth surface 132 can be connected to the second surface 121. Expansion adhesives 2 are provided on both the third surface 131 and the fourth surface 132, so that the expansion adhesives 2 in the connection structure form a "冖" - shaped pattern.

[0063] In one embodiment, please refer to Figure 2 and Figure 3 , a first groove 112 is formed on the first surface 111, a second groove 122 is formed on the second surface 121. The third surface 131 is connected to the side wall of the first groove 112, the fourth surface 132 is connected to the side wall of the second groove 122. The fourth section 32 is disposed opposite to the first groove 112, the fifth section 33 is disposed opposite to the second groove 122, and expansion adhesives 2 are received in both the first groove 112 and the second groove 122.

[0064] Specifically, both the first groove 112 and the second groove 122 are used to fill the expansion adhesive 2, and the expansion adhesive 2 connects the sides of the fourth section 32 and the fifth section 33 facing the first substrate 1.

[0065] Optionally, the top surface of the expansion adhesive 2 in the first groove 112 and the second groove 122 is flush with the first surface 111 (the second surface 121), that is, the expansion adhesive 2 exactly fills the first groove 112 and the second groove 122, avoiding increasing the thickness of the connection structure and the gaps caused by the thickness difference.

[0066] In one embodiment, please refer to Figure 2, the width L1 of the first groove 112 is 2 mm to 2.4 mm; and / or, the depth L2 of the first groove 112 is 0.2 mm to 0.4 mm; and / or, the width L3 of the second groove 122 is 2 mm to 2.4 mm; and / or, the depth L4 of the second groove 122 is 0.2 mm to 0.4 mm.

[0067] In a specific embodiment, the width L1 of the first groove 112 and the width L3 of the second groove 122 are the same, and are both 2.2 mm. The depth L2 of the first groove 112 and the depth L4 of the second groove 122 are the same, and are both 0.4 mm.

[0068] In one implementation, please refer to Figure 2 and Figure 3 The second substrate 3 also includes a sixth section 34 and a seventh section 35 . The sixth section 34 is connected to the fourth section 32 at an angle, and the seventh section 35 is connected to the fifth section 33 at an angle. The sixth section 34 is connected to the first section 11 , and the seventh section 35 is connected to the second section 12 .

[0069] Specifically, the sixth section 34 is connected to the fourth section 32 and extends in a direction away from the third section 13, and the seventh section 35 is connected to the fifth section 33 and extends in a direction away from the third section 13. Optionally, the connection angle between the sixth section 34 and the fourth section 32 is 90°, and the connection angle between the seventh section 35 and the fifth section 33 is 90°. Therefore, the sixth section 34 and the fourth section 32 can form an "L" shape, and the seventh section 35 and the fifth section 33 can form an "L" shape.

[0070] Therefore, in the present invention, the transverse base surface of the second substrate 3 can be regarded as a special-shaped structure consisting of a quadrilateral (the second substrate body 31) and two "L"-shaped structures (the sixth section 34 and the fourth section 32 / the seventh section 35 and the fifth section 33). This structure can be adapted to the "J"-shaped structure of the first substrate 1, thereby achieving a high degree of connection tightness.

[0071] Optionally, the sixth section 34 and the seventh section 35 may be directly connected to the first section 11 and the second section 12 , that is, the expansion glue 2 is not provided on the sixth section 34 and the seventh section 35 .

[0072] In one implementation, please refer to Figure 2 and Figure 3 The second substrate 3 further includes a support column 36 . The second substrate body 31 encloses a cavity 312 . The support column 36 is received in the cavity 312 . The support column 36 extends along the thickness direction X of the third section 13 , and both ends of the support column 36 are connected to the second substrate body 31 .

[0073] Specifically, the second substrate body 31 is a hollow structure, and the second substrate body 31 encloses a cavity 312 with a quadrilateral cross-sectional profile. The second substrate body 31 includes a top plate, a bottom plate and two side plates, wherein the bottom plate includes the connection surface 311 in the above embodiment, the top plate and the bottom plate are arranged relatively spaced apart, and the two side plates are respectively connected to the bottom plate and the top plate. The support column 36 is accommodated in the cavity 312, and the two ends of the support column 36 are respectively connected to the bottom plate and the bottom plate.

[0074] In one embodiment, there are multiple support columns 36 , and there is a spacing distance between the multiple support columns 36 .

[0075] In one implementation, please refer to Figure 3 The number of the support columns 36 is two, namely the first support column 36 and the second support column 36. The spacing distance L5 between the first support column 36 and the second substrate body 31 is 10 mm to 20 mm. The spacing distance L6 between the first support column 36 and the second support column 36 satisfies 2≤L6 / L5≤3. In a specific embodiment, the second substrate 3 has a central symmetrical structure, and the left and right dimensions of the symmetrical structure are consistent.

[0076] In one implementation, please refer to Figure 3 , the thickness L14 of the support column 36 is less than the wall thickness of the second substrate body 31. It should be explained that the thickness of the support column 36 is the dimension in the width direction Y of the second substrate 3, and the wall thickness of the second substrate body 31 is the thickness of the bottom plate (or top plate / side plate).

[0077] In a specific embodiment, the thickness of the support column 36 may be 1.2 mm, and the wall thickness of the second substrate body 31 may be 2 mm.

[0078] In one embodiment, the support column 36 includes multiple stacked first material layers, and the outer peripheral wall of the second substrate body 31 includes multiple stacked second material layers, and the number of the second material layers is greater than the number of the first material layers.

[0079] Specifically, the multiple first material layers in the support column 36 and the second material layer in the outer peripheral wall of the second substrate body 31 can be the fiber woven prepreg in the above embodiment. The fiber types of the first material layer and the second material layer can be the same, and the details can be referred to the above embodiment and will not be repeated here.

[0080] The first material layer and the second material layer have the same thickness, so when the number of the second material layers is greater than the number of the first material layers, the thickness of the support column 36 is smaller than the wall thickness of the second substrate body 31 .

[0081] In one implementation, please refer to Figure 5The multi-layer first material layer includes at least two woven composite layers A and at least one unidirectional material layer B; and / or the multi-layer second material layer includes at least two woven composite layers A and at least one unidirectional material layer B.

[0082] It needs to be explained that the woven composite layer A can be formed by modifying the fibers according to a preset angle, and the fibers in the woven composite layer A are arranged at more than two angles; the fibers in the unidirectional material layer B are all arranged at the same angle.

[0083] In a specific embodiment, the first material layer includes two layers of woven composite layers A and ten layers of unidirectional material layers B, and the two layers of woven composite layers A are located on both sides, and the ten layers of unidirectional material layers B are located between the two layers of woven composite layers. The two layers of woven composite layers A and the ten layers of unidirectional material layers B are symmetrically laid in the manner of 0 / 90 (+45 / -45), 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0 / 90 (+45 / -45).

[0084] In a specific embodiment, the second material layer includes two layers of woven composite layers A and fifteen layers of unidirectional material layers B, and the two layers of woven composite layers A are located on both sides, and the fifteen layers of unidirectional material layers B are located between the two layers of woven composite layers. The two layers of woven composite layers A and the fifteen layers of unidirectional material layers B are symmetrically laid in the manner of 0 / 90 (+45 / -45), 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0°, 0 / 90 (+45 / -45).

[0085] The first material layer and the second material layer are arranged in the manner of the above embodiment, so that the second substrate 3 presents a centrally symmetrical structure, and the left and right dimensions of the symmetrical structure are consistent.

[0086] In one embodiment, the thickness of the first section 11 (the second section 12) is less than the thickness of the third section 13. In a specific embodiment, the thickness of the first section 11 may be 1.8 mm, and the thickness of the third section 13 may be 2 mm.

[0087] In one embodiment, the first section 11 includes multiple stacked third material layers, and the third section 13 includes multiple stacked fourth material layers, and the number of the fourth material layers is greater than the number of the third material layers.

[0088] Specifically, based on the above embodiment, the first section 11, the second section 12 and the third section 13 can all be formed by stacking multiple layers of fiber woven prepreg. The fiber types of the third material layer and the fourth material layer can be the same, and the details can be referred to the above embodiment and will not be repeated here. In addition, the first section 11 and the second section 12 can both include multiple layers of the third material layer stacked with the same thickness.

[0089] In one implementation, please refer to Figure 5 and Figure 6 The multi-layer fourth material layer includes at least two woven composite layers A and at least one unidirectional material layer B; and / or, all the multi-layer third material layers are woven composite layers A.

[0090] In a specific embodiment, the third material layer includes eight woven composite layers A, and the eight woven composite layers A are laid in a symmetric laying manner of 0 / 90, +45 / -45, 0 / 90, +45 / -45, +45 / -45, 0 / 90, +45 / -45, 0 / 90 or +45 / -45, 0 / 90, +45 / -45, 0 / 90, 0 / 90, +45 / -45, 0 / 90, +45 / -45.

[0091] In a specific embodiment, in a specific embodiment, the fourth material layer includes eight woven composite layers A and two unidirectional material layers B, and four woven composite layers A are located on one side, and another four woven composite layers A are located on the other side, and the two unidirectional material layers B are both located in the middle of the eight woven composite layers A. The two woven composite layers A and the ten unidirectional material layers B are symmetrically laid in the manner of 0 / 90, +45 / -45, 0 / 90, +45 / -45, 0°, 0°, +45 / -45, 0 / 90, +45 / -45, 0 / 90; or in the manner of +45 / -45, 0 / 90, +45 / -45, 0 / 90, 0°, 0°, 0 / 90, +45 / -45, 0 / 90, +45 / -45.

[0092] In one embodiment, please refer to Figure 1 and Figure 4 The connecting structure further includes a metal connector 4, and the thermoplastic material is connected in cooperation with the expansion adhesive 2 through the metal connector 4.

[0093] Specifically, the metal connector 4 includes one of steel, aluminum alloy, and magnesium alloy. The metal connector 4 can cover the third section 13 (boss 1A), and the expansion adhesive 2 is connected to the side of the metal connector 4 facing away from the first base material 1. On the basis of the above embodiment, the cross-sectional shape of the metal connector 4 can be in the shape of "冖" or "几".

[0094] In one embodiment, please refer to Figure 1 and Figure 4 The metal connector 4 includes a metal section one 41, a metal section two 42, a metal section three 43, a metal section four 44, and a metal section five 45 that are sequentially connected at an angle. The metal section one 41 is received in the first groove 112, the metal section two 42 is connected to the third surface 131, the metal section three 43 is connected to the side of the third section 13 facing away from the first surface 111, the metal section four 44 is connected to the fourth surface 132, and the metal section five 45 is received in the second groove 122.

[0095] Specifically, the cross-section of the metal connector 4 is in a "ji" shape. Therefore, the metal connector 4 includes a first metal section 41, a second metal section 42, a third metal section 43, a fourth metal section 44, and a fifth metal section 45. The five metal sections are of an integral structure, and the thicknesses of the five metal sections are the same, that is, the metal connector 4 can be obtained by stamping a metal plate.

[0096] By inlaying the metal connector 4 on the first substrate 1 and disposing the expansion adhesive 2 on the metal connector 4, a metal inlay structure is jointly formed by the metal connector 4 and the expansion adhesive 2. The metal connector 4 can cause the expansion adhesive 2 that expands when heated to uniformly press on the first substrate 1, avoiding stress concentration caused by uneven pressure on the first substrate 1.

[0097] In one embodiment, please refer to Figure 4 , the metal connector 4 is of an integral structure. The thickness L7 of the metal connector 4 is 0.1 mm to 0.3 mm, and the thickness L8 of the expansion adhesive 2 is 0.1 mm to 0.3 mm. In a specific embodiment, the thickness L7 of the metal connector 4 can be 0.2 mm, and the thickness L8 of the expansion adhesive 2 can be 0.2 mm.

[0098] It can be understood that both the first metal section 41 and the fifth metal section 45 are received in the groove. Therefore, in order to prevent the expansion adhesive 2 from overflowing from the groove, the sum of the thickness of the first metal section 41 and the thickness of the expansion adhesive 2 should not be greater than the depth L2 (L4) of the groove.

[0099] In a specific embodiment, the widths of the first metal section 41 and the fifth metal section 45 can be 2 mm. It can be understood that the first metal section 41 and the fifth metal section 45 are received in the groove, so the widths of the first metal section 41 and the fifth metal section 45 are not greater than the groove width L1 (L3) of the groove.

[0100] In one embodiment, the surface roughness Ra of the metal connector 4 is 40 μm to 60 μm. Specifically, the surface of the metal connector 4 can be roughened so that the metal connector 4 is more firmly connected to the expansion adhesive 2 and the first substrate 1. In a specific embodiment, the surface roughening method of the metal connector 4 includes one or more of sandblasting roughening, electrophoresis, plasma surface roughening, or T treatment.

[0101] It should be explained that the T treatment mainly "excavates" nano-pores on the metal plate surface; in this process, an anodic oxidation film with a thickness of 70 nm to 1500 nm is first formed; the anodic oxidation film contains triazine thiol, and triazine thiol can promote the vulcanization crosslinking of polymers, which is beneficial to the bonding between the first substrate 1 and the metal connector 4.

[0102] In one embodiment, please refer to Figure 1The connection structure further includes an adhesive member 5, which connects the first substrate 1 and the second substrate 3, and covers one end of the first substrate 1 or the second substrate 3. Specifically, in order to ensure the connection stability between the second substrate 3 and the first substrate 1, an adhesive member 5 can also be provided at the contact position between the second substrate 3 and the first substrate 1.

[0103] Optionally, the adhesive member 5 is made of the same material as that of the first substrate 1 , and includes resin and filling fibers. The filling fibers may specifically be glass fibers or carbon fibers, and the fiber content in the adhesive member 5 may be 30% to 50%.

[0104] In one implementation, please refer to Figure 1 The adhesive member 5 includes a first adhesive member and a second adhesive member, the first adhesive member connects the sixth segment 34 and the first segment 11 , and the second adhesive member connects the seventh segment 35 and the second segment 12 .

[0105] Specifically, based on the above embodiment, since the expansion glue 2 is not set on the sixth section 34 and the seventh section 35, but directly contacts the first section 11 and the second section 12, an adhesive 5 (a first adhesive 5 and a second adhesive 5) can be set at the sixth section 34 and the seventh section 35 to improve the connection strength at this position.

[0106] By providing the injection-molded adhesive 5 at the connecting edge (the sixth section 34 and the seventh section 35) of the second substrate 3 and the first substrate 1, the connection strength of the connecting structure can be improved and the problem of failure due to stress can be avoided.

[0107] In one implementation, please refer to Figure 3 , the thickness L9 of the second substrate 3 can be 50 mm to 100 mm, and the width L10 of the sixth segment 34 and the seventh segment 35 can be 10 mm to 15 mm. Specifically, in the thickness direction X, the thickness L9 of the second substrate 3 is from the connection between the sixth segment 34 and the first segment 11 to the top surface of the top plate of the second substrate body 31. In the width direction Y, the width L10 of the sixth segment 34 (seventh segment 35) is the distance from the connection between it and the fourth segment 32 (fifth segment 33) to its farthest end.

[0108] In one implementation, please refer to Figure 2 and Figure 4 , the width L11 of the third section 13 of the first substrate 1 can satisfy the formula: L11=L12-2L8, where L12 is the width of the metal section 3 43 of the metal connector 4.

[0109] In one implementation, please refer to Figure 2 and Figure 4, the width L1 of the first groove 112 (or the width L3 of the second groove 122) satisfies the formula: L1=L13+L7, where L13 is the width of the metal segment 1 41 (or the metal segment 5 45).

[0110] On the basis of the above method, the utility model provides a method for making a connection structure, and the specific steps are as follows:

[0111] Step S1, stacking the braided composite layer A and the unidirectional material layer B layer by layer; wherein, after the layering is completed, heating to a preset temperature on a heating device to melt and soften the thermoplastic resin matrix, and placing it into a mold for positioning. wherein, the stacking method and bevel type of the braided composite layer A and the unidirectional material layer B can refer to the above embodiment, and the heating temperature can be 280°C.

[0112] Step S2, bonding the expansion adhesive 2 and the metal connector 4 together, and embedding the combined composition in the concave portion of the second substrate 3 (between the fourth section 32 and the fifth section 33), and placing the second substrate 3 into the mold and positioning it.

[0113] Step S3, the mold is closed, and the first substrate 1 and the second substrate 3 are combined and molded into a product shape. When the two are combined and contacted, the temperature of the first substrate 1 causes the expansion glue 2 film to expand and flow due to heat, and under the action of the mold pressure, the second substrate 3 is tightly connected to the metal connector 4. Among them, the expansion ratio of the expansion glue 2 can be 20 times.

[0114] Step S4, using the adhesive 5 to perform injection molding coating on the sixth section 34 and the seventh section 35 of the second substrate 3. The adhesive 5 may be PA6 / GF30.

[0115] In one embodiment, the utility model further provides a vehicle, and the vehicle includes the connection structure provided in the above embodiment.

[0116] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship of terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are based on the orientation or positional relationship of the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0117] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A connection structure, characterized in that: The invention comprises a first substrate, an expansion adhesive and a second substrate, wherein the second substrate is connected to the first substrate via the expansion adhesive, and one of the first substrate and the second substrate is a thermoplastic material, and the other is a thermosetting material.

2. The connection structure according to claim 1, characterized in that: The connection structure also includes a metal connection piece, and the thermoplastic material is connected to the expansion adhesive through the metal connection piece.

3. The connection structure according to claim 2, characterized in that: The metal connector is an integrated structure, and the thickness L7 of the metal connector is 0.1 mm to 0.3 mm; and / or The thickness L8 of the expansion glue is 0.1 mm to 0.3 mm; and / or The surface roughness Ra of the metal connecting piece is 40 μm to 60 μm.

4. The connection structure according to claim 1, characterized in that: The connection structure further includes an adhesive member, the adhesive member connects the first substrate and the second substrate, and the adhesive member covers one end of the first substrate or the second substrate.

5. The connection structure according to claim 1, characterized in that: The thermoplastic material is provided with a groove, and the expansion adhesive is connected to the thermoplastic material through the groove.

6. The connection structure according to claim 1, characterized in that: The first substrate has a boss, the second substrate has a groove, the expansion adhesive is connected to the boss, the groove and the boss cooperate, and the second substrate is connected to the boss through the expansion adhesive.

7. The connection structure according to claim 1, characterized in that: The second substrate further includes a support column and a second substrate body. The second substrate body encloses a cavity. The support column is received in the cavity. The support column extends along the thickness direction of the second substrate, and two ends of the support column are connected to the second substrate body.

8. The connection structure according to claim 7, characterized in that: The support column includes multiple stacked first material layers, and the outer peripheral wall of the second substrate body includes multiple stacked second material layers, and the number of the second material layers is greater than the number of the first material layers.

9. The connection structure according to claim 8, characterized in that: The plurality of first material layers include at least two woven composite layers and at least one unidirectional material layer; and / or the plurality of second material layers include at least two woven composite layers and at least one unidirectional material layer.

10. A vehicle, characterized in that: The vehicle comprises the connection structure according to any one of claims 1-9.