High-temperature ultrapure water circulating water supply device with return water waste heat recycling function

Abstract

The utility model discloses a high-temperature ultrapure water circulating water supply device with a return water waste heat recycling function. The high-temperature ultrapure water circulating water supply device comprises a pure water tank, a polishing resin bed, a first heat exchanger, a second heat exchanger, a terminal filter and a water consumption point, the ultrapure water return water is guided into the hot water side of the first heat exchanger, waste heat is used for heating effluent of the polishing resin bed on the cold water side, meanwhile, the return water is cooled, and then the return water flows into the pure water tank at the front end to be recycled. Water produced by the polishing resin bed is heated to a certain temperature through the first heat exchanger and then enters the second heat exchanger to be heated through high-temperature hot water, and the temperature is increased to the required temperature. According to the utility model, one-stage heating is replaced by sectional heating, and the temperature of return water passing through the first heat exchanger is reduced to be close to the temperature of incoming water of the pure water tank, so that a heat exchanger does not need to be additionally arranged, and the use amount of cold and heat sources is saved.

Description

Technical Field

[0001] The utility model relates to the field of physics, in particular to a pure water supply device, in particular to a high-temperature ultrapure water circulation water supply device with the function of recycling waste heat of returned water. Background Art

[0002] The chip manufacturing industry has many complex processes and places high demands on energy, water, and chemicals. It is a resource-intensive industry. One of the main sources of carbon emissions in the semiconductor industry is purchased electricity, steam, heating, and cooling equipment. Furthermore, the semiconductor process requires pure water to clean impurities on the chip, so there is also a very high demand for water consumption. The increasing carbon emissions and the pressure to reduce emissions from end customers have prompted semiconductor manufacturers to pay more attention to improving energy efficiency and saving water.

[0003] Most semiconductor plants have temperature requirements for the water quality at the point of use of ultrapure water. Some manufacturing processes in the existing technology (see Figure 1 ), ultrapure water with a relatively high temperature (generally ranging from 40 to 70°C) will be used. Therefore, the water from the polishing system must be heated by heat exchanger 1 to meet the water requirements. The heat source of the general heat exchanger comes from the hot water supply device in the semiconductor factory. The water from the polishing system serves as the cold water side of heat exchanger 1. After heat exchange with the hot water on the hot water side, it finally enters the use end through the terminal filter. Since the return water at the use end still retains residual heat, if it is not cooled, the temperature of the water entering the polishing resin bed will increase, affecting the water quality of the produced water and the service life of the polishing resin. Therefore, before the return water enters the pure water tank, it is usually necessary to set up an additional heat exchanger 2 and provide a cold water source to cool the return water. At present, the industry needs to use a large amount of cold and hot water sources in high-temperature ultrapure water systems, resulting in unnecessary consumption. Summary of the invention

[0004] The purpose of the utility model is to provide a high-temperature ultrapure water circulating water supply device with the function of recycling waste heat of return water. The high-temperature ultrapure water circulating water supply device with the function of recycling waste heat of return water is to solve the technical problem of unnecessary consumption of additional cold water sources for return water in the prior art.

[0005] The utility model discloses a high-temperature ultrapure water circulation water supply device with the function of recycling waste heat of returned water, comprising a pure water tank, a polishing resin bed, a first heat exchanger, a second heat exchanger, a terminal filter and a water point, wherein the outlet of the pure water tank is connected to the inlet of the polishing resin bed through a water inlet pump and a pipeline, the outlet of the polishing resin bed is connected to the refrigerant inlet of the first heat exchanger through a pipeline, the refrigerant outlet of the first heat exchanger is connected to the refrigerant inlet of the second heat exchanger through a pipeline, the refrigerant outlet of the second heat exchanger is connected to the inlet of the terminal filter through a pipeline, the outlet of the terminal filter is connected to the inlet of the water point through a pipeline, the outlet of the water point is connected to the heat medium inlet of the first heat exchanger through a pipeline, and the heat medium outlet of the first heat exchanger is connected to the inlet of the pure water tank through a pipeline.

[0006] Furthermore, a temperature transmitter is provided on the pipeline between the second heat exchanger and the terminal filter, a heat medium inlet of the second heat exchanger is connected to a heat medium pipeline, and a temperature control valve group is provided on the heat medium pipeline.

[0007] Furthermore, a pressure transmitter and a pressure control valve group are provided on the pipeline between the water use point and the first heat exchanger.

[0008] Compared with the prior art, the utility model has a positive and obvious effect. The utility model introduces the ultrapure water return water into the hot water side of the first heat exchanger, uses the remaining heat to heat the polishing resin bed outlet water on the cold water side, and cools the return water itself at the same time, and then flows into the front pure water tank for reuse. After the water produced by the polishing resin bed is heated to a certain temperature through the first heat exchanger, it enters the second heat exchanger and is heated with high-temperature hot water to the required temperature. The utility model replaces one-stage heating with segmented heating. The return water through the first heat exchanger has been cooled to a temperature close to the incoming water temperature of the pure water tank. There is no need to add a new heat exchanger, which saves the use of cold and heat sources, saves the cost of equipment construction, greatly saves the energy consumption of heating equipment in the factory, improves the overall energy efficiency of the system, and achieves the environmental protection goals of energy conservation, emission reduction and low carbon. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of a high-temperature ultrapure water circulation supply device in the prior art.

[0010] Figure 2 It is a schematic diagram of a high-temperature ultrapure water circulation water supply device with the function of recycling waste heat of return water according to the utility model. DETAILED DESCRIPTION

[0011] The present invention is further described below in conjunction with an embodiment, but the present invention is not limited to the embodiment. Any similar structure and similar changes of the present invention should be included in the protection scope of the present invention. The use of directions such as up, down, front, back, left, and right in the present invention is only for the convenience of clear description and is not a limitation on the technical solution of the present invention.

[0012] like Figure 2 As shown, the utility model is a high-temperature ultrapure water circulating water supply device with the function of recycling waste heat of returned water, comprising a pure water tank 21, a polishing resin bed 22, a first heat exchanger 31, a second heat exchanger 32, a terminal filter 23 and a water point 9, the outlet of the pure water tank 21 is connected to the inlet of the polishing resin bed 22 through a water inlet pump 61 and a pipeline 7, the outlet of the polishing resin bed 22 is connected to the refrigerant inlet of the first heat exchanger 31 through a pipeline 1, the refrigerant outlet of the first heat exchanger 31 is connected to the refrigerant inlet of the second heat exchanger 32 through a pipeline 2, the refrigerant outlet of the second heat exchanger 32 is connected to the inlet of the terminal filter 23 through a pipeline 3, the outlet of the terminal filter 23 is connected to the inlet of the water point 9 through a pipeline 4, the outlet of the water point 9 is connected to the heat medium inlet of the first heat exchanger 31 through a pipeline 5, and the heat medium outlet of the first heat exchanger 31 is connected to the inlet of the pure water tank 21 through a pipeline 6.

[0013] Furthermore, a temperature transmitter 52 is provided on the pipe 3 between the second heat exchanger 32 and the terminal filter 23 , a heat medium inlet of the second heat exchanger 32 is connected to a heat medium pipe 8 , and a temperature control valve group 42 is provided on the heat medium pipe 8 .

[0014] Furthermore, a pressure transmitter 51 and a pressure control valve group 41 are provided on the pipeline 5 between the water use point 9 and the first heat exchanger 31 .

[0015] Specifically, the pure water tank 21, polishing resin bed 22, first heat exchanger 31, second heat exchanger 32, terminal filter 23, water point 9, temperature transmitter 52, temperature control valve group 42, pressure transmitter 51, pressure control valve group 41, etc. in this embodiment all adopt well-known solutions in the prior art, which are well understood by those skilled in the art and will not be repeated here.

[0016] The working principle of this embodiment:

[0017] The pressure transmitter 51 and the pressure control valve group 41 form a set of pressure control devices. The temperature transmitter 52 and the temperature control valve group 42 form a set of temperature control devices. The first heat exchanger 31 and the second heat exchanger 32 are connected in series to heat the incoming water in a segmented manner.

[0018] The pressure control valve group 41 adjusts the opening in real time according to the value of the pressure transmitter 51, controls the return water flow rate to maintain a constant pressure at the water point 9; the return water flow rate will fluctuate within the range of 0 to 100% of the water supply flow rate. The return water passes through the first heat exchanger 31 and the outlet water of the polishing resin bed 22 for sufficient heat exchange, and the outlet water temperature of the polishing resin bed 22 is increased, while the return water temperature is reduced. Since the return water flow rate is fluctuating, the outlet water temperature of the first heat exchanger 31 is also fluctuating and cannot reach the final required temperature. It needs to pass through the second heat exchanger 32 and the temperature control valve group 42 that controls the hot water supply of the second heat exchanger 32 to continue to raise the temperature to the required temperature. Among them, the temperature control valve group 42 will adjust the opening in real time according to the value of the temperature transmitter 52 to control the hot water supply water volume, ensuring that the temperature of the water produced by the ultrapure water system meets the requirements of the use point. Compared with the one-stage heating of the traditional process, the use of hot water in the segmented heating can be greatly reduced. In addition, after the return water of the pure water system passes through the first heat exchanger 31, its water temperature drops and can be directly returned to the front pure water tank 21, without adding a set of heat exchangers and cold sources for cooling.

[0019] The specific embodiments are as follows:

[0020] like Figure 2 As shown, the pure water tank 21 is used to store the produced water of its front-end preparation system and is connected to the polishing resin bed 22 through the pipeline 7. The water inlet pump 61 delivers the raw water stored in the pure water tank 21 to the polishing resin bed 22. The temperature of the raw water in the pure water tank is usually around 23°C.

[0021] The first heat exchanger 31 is used for heat exchange. The water from the polishing resin bed 22 flows into the first heat exchanger 31 through the pipe 1; and the return water from the water point 9 flows into the heat source side of the first heat exchanger 31 through the pipe 5 and flows out from the other end through the pipe 6. The temperature of the return water is about 70°C, and its water volume is usually 30% of the water consumption. The return water and the water from the polishing resin bed 22 pass through the first heat exchanger 31 at the same time. Due to the temperature difference between the two waters, heat exchange occurs in the first heat exchanger 31 in order to achieve thermal balance, so that the temperature of the return water flowing out of the pipe 6 through the first heat exchanger 31 is lower than the temperature of the water flowing into the first heat exchanger 31 through the pipe 5, that is, the water temperature of the pipe 5 drops from about 70°C to about 23°C in the pipe 6; and the water from the polishing resin bed 22 will rise in temperature after being preheated by the first heat exchanger 31, that is, the water temperature of the pipe 1 is about 23°C, and the water temperature of the pipe 2 rises to about 34°C.

[0022] After the return water is heat-exchanged in the first heat exchanger 31, it can reach a water temperature close to that of the pure water tank 21, and the return water flows directly into the pure water tank 21 through the pipe 6. Different from the traditional process that usually needs to set up a set of heat exchangers 33 and cold sources to cool the return water before it flows back to the pure water tank, the utility model uses the water outlet of the polishing resin bed 22 to absorb part of the heat of the return water at the water point 9, and reduces the return water temperature to a suitable temperature, saving the amount of cold water required to reduce the return water temperature at the water point 9, and reducing the energy consumption generated in the cold source supply process.

[0023] The pressure transmitter 51 is used to detect the pressure of the return water. The pressure control valve 41 controls the return water flow rate by adjusting the opening of its valve body according to the return water pressure measured by the pressure transmitter 51. That is, when the measured return water pressure value is greater than the required pressure of the water point 9, the pressure control valve 41 will increase the valve body opening to reduce the return water pressure, and when the measured return water pressure value is less than the required pressure of the water point 9, the valve body opening will be reduced to increase the return water pressure. The pressure control valve 41 maintains a constant pressure at the water point 9 by controlling the return water flow rate within the range of 0 to 100% of the water consumption.

[0024] Therefore, although the return water flow entering the heat source side of the first heat exchanger 31 is usually 30% of the water consumption, in fact, the return water flow fluctuates depending on the usage of the water point 9. This causes the water temperature of the polishing resin bed 22 to fluctuate after passing through the first heat exchanger 31 and flowing out through the pipe 2. In addition, the water temperature of the pipe 2 is usually lower than the requirement of the usage point and needs to be reheated by the second heat exchanger 32 to raise the water temperature to the required temperature.

[0025] The second heat exchanger 32 is used for heat exchange between two incoming water streams. The outlet water heated by the first heat exchanger 31 flows into the cold water side of the second heat exchanger 32 through the pipe 2 and flows out from the other end through the pipe 3. In order to make the above water flow reach a temperature that meets the requirements of the water point 9 when it flows out from the pipe 3 after passing through the second heat exchanger 32, the heat source side of the second heat exchanger 32 is also connected to a hot water source. The temperature of the hot water from the hot water source is about 90°C. The hot water flows into the heat source side of the second heat exchanger 32 through the heat medium pipe 8 and flows out from the other end, so that the water flow flowing in from the pipe 2 can fully exchange heat with the hot water flowing in from the pipe 8 in the second heat exchanger 32. Since the temperature of the water flowing in from the pipe 2 through the first heat exchanger 31 fluctuates, the temperature transmitter 52 is used to detect the outlet water temperature of the second heat exchanger 32, and the temperature control valve group 42 will adjust its valve body opening in real time according to the temperature value measured by the temperature transmitter 52 to regulate the supply of hot water, thereby ensuring that the temperature of the water flowing out from the pipe 3 through the second heat exchanger 32 reaches the required temperature of 70°C for the ultrapure water circulation supply.

[0026] The first heat exchanger 31 is used to preheat the water out of the polishing resin bed 22, and the waste heat of the return water is used to increase the temperature of the water flowing into the second heat exchanger 32. In this way, when the second heat exchanger 32 performs heat exchange with the hot water on the heat source side, the amount of hot water consumed can be greatly reduced. The utility model uses the return water that needs to be cooled to preheat the pure water raw water. Taking the return water volume as 23% of the water supply volume as an example, the raw water temperature can be increased from 23°C to 34°C, and the water temperature is increased by 11°C. Then, the hot water is used to heat the water temperature from 34°C to the required temperature of 70°C, which reduces the heating energy consumption by about 23% and the cooling energy consumption by 100% compared with the traditional process. Since the ultrapure water supply in semiconductor factories is mostly in a 24-hour continuous uninterrupted mode, even if some machines do not need water, the water supply device will continue to circulate without stopping the water supply. The utility model maintains the stability of the system water supply to a great extent and reduces energy consumption. Especially when the return water volume is 100%, almost no additional heat source is consumed, and the dual effects of supply water heating and return water cooling are achieved.

[0027] The utility model introduces the ultrapure water return water into the hot water side of the first heat exchanger 31, and uses the remaining heat to heat the water outlet of the polishing resin bed 22 on the cold water side, while cooling the return water itself, and then flows into the front pure water tank 21 for reuse. After the water produced by the polishing resin bed 22 is heated to a certain temperature through the first heat exchanger 31, it enters the second heat exchanger 32 and is heated by high-temperature hot water to the required temperature. The utility model replaces one-stage heating with segmented heating. The return water after the first heat exchanger 31 has been cooled to a temperature close to the incoming water temperature of the pure water tank, and there is no need to add a new heat exchanger, which saves the use of cold and heat sources, saves the cost of equipment construction, greatly saves the energy consumption of heating equipment in the factory, improves the overall energy efficiency of the system, and achieves the environmental protection goals of energy conservation, emission reduction and low carbon.

Claims

1. A high-temperature ultrapure water circulation water supply device with the function of recycling waste heat of return water, characterized in that: It includes a pure water tank, a polishing resin bed, a first heat exchanger, a second heat exchanger, a terminal filter and a water point. The outlet of the pure water tank is connected to the inlet of the polishing resin bed through a water inlet pump and a pipeline, the outlet of the polishing resin bed is connected to the refrigerant inlet of the first heat exchanger through a pipeline, the refrigerant outlet of the first heat exchanger is connected to the refrigerant inlet of the second heat exchanger through a pipeline, the refrigerant outlet of the second heat exchanger is connected to the inlet of the terminal filter through a pipeline, the outlet of the terminal filter is connected to the inlet of the water point through a pipeline, the outlet of the water point is connected to the heat medium inlet of the first heat exchanger through a pipeline, and the heat medium outlet of the first heat exchanger is connected to the inlet of the pure water tank through a pipeline.

2. A high-temperature ultrapure water circulation water supply device with the function of recycling waste heat of return water according to claim 1, characterized in that: A temperature transmitter is arranged on the pipeline between the second heat exchanger and the terminal filter, a heat medium inlet of the second heat exchanger is connected to a heat medium pipeline, and a temperature control valve group is arranged on the heat medium pipeline.

3. A high-temperature ultrapure water circulation water supply device with the function of recycling waste heat of return water according to claim 1, characterized in that: A pressure transmitter and a pressure control valve group are arranged on the pipeline between the water use point and the first heat exchanger.

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