Processing equipment and processing system

Abstract

The utility model belongs to the field of semiconductors and photovoltaic processing equipment, and relates to processing equipment and a processing system, the processing equipment comprises a reaction chamber with an internal space, at least one chamber wall of the reaction chamber is composed of a heating assembly, and the heating assembly is configured to heat a sheet-shaped material in the internal space. The heating assembly comprises a first shell and a heating piece, the wall of the first shell is configured to be the chamber wall of the reaction chamber, the first shell is provided with a vacuum cavity, and the heating piece is installed in the vacuum cavity. According to the treatment equipment, the heating assembly is adopted as the chamber wall of the reaction chamber, the heating assembly is located in the vacuum cavity, and the vacuum cavity has the heat insulation characteristic, so that the heating efficiency is improved.

Description

Technical Field

[0001] The present application relates to semiconductor and photovoltaic processing equipment, and more specifically, to a processing device and a processing system. Background Art

[0002] Many products need to undergo heat treatment in a heating furnace during the manufacturing process. For example, in semiconductor wafer manufacturing, photovoltaic cell coating, metal material annealing and other processes. Among them, the heating device is the core component of the heating furnace. The heating device can not only achieve a high temperature environment in the heating furnace and maintain stability, but also accelerate the process and improve the preparation quality.

[0003] The heating device in the existing heating furnace usually adopts the form of winding a resistance wire around the outer wall of a quartz tube or the resistance wire is located outside the quartz tube, and uses the resistance wire to heat the target (silicon chip or wafer) located in the quartz tube. However, the above method has the problem of low heating efficiency. Utility Model Content

[0004] In view of this, it is necessary to provide a processing device and a processing system to solve the technical problem of low heating efficiency of the existing heating furnace.

[0005] An embodiment of the present application provides a processing device, the processing device includes a reaction chamber having an internal space, at least one chamber wall of the reaction chamber is formed by a heating component, and the heating component is configured to heat a sheet material in the internal space. The heating component includes a first shell and a heating element, the wall of the first shell is configured as the chamber wall of the reaction chamber, the first shell is provided with a vacuum chamber, and the heating element is installed in the vacuum chamber.

[0006] In the above-mentioned processing equipment, a heating component is used as the chamber wall of the reaction chamber. Since the heating element is located in the vacuum chamber and the vacuum chamber has the characteristics of heat insulation and heat preservation, it is beneficial to improve the heating efficiency.

[0007] In some embodiments of the present application, the wall of the first shell is made of one or more metals.

[0008] In some embodiments of the present application, the heating assembly further includes an insulating layer and thermal insulation cotton, wherein the insulating layer is disposed between the chamber wall and the heating element; the thermal insulation cotton is disposed outside the first shell and is located on a side of the first shell away from the internal space.

[0009] In some embodiments of the present application, the heating assembly also includes a second shell, which is installed on a side of the first shell away from the internal space, and a accommodating cavity is formed between the first shell and the second shell, and the thermal insulation cotton is installed in the accommodating cavity.

[0010] In some embodiments of the present application, the heating assembly further includes a cooling member, which is installed on a side of the second shell away from the first shell.

[0011] In some embodiments of the present application, the cooling member includes a cooling pipe, a first joint and a second joint. The cooling pipe is coiled on the second shell, and the first joint and the second joint are respectively arranged at both ends of the cooling pipe; the external cooling medium flows into the cooling pipe through one of the first joint and the second joint, and flows out of the cooling pipe through the other of the first joint and the second joint.

[0012] In some embodiments of the present application, the heating assembly further comprises a mirror plate, which is installed in the vacuum chamber and is located on a side of the heating element away from the chamber wall; the mirror plate is configured to reflect heat generated by the heating element.

[0013] In some embodiments of the present application, there are multiple heating components, and the multiple heating components are enclosed to form a reaction chamber.

[0014] In some embodiments of the present application, the reaction chamber has an opening, and the opening is connected to the internal space.

[0015] In some embodiments of the present application, a heating component is configured to close or open an opening.

[0016] In some embodiments of the present application, the processing equipment further includes an auxiliary heating element, which is installed on the chamber wall and is configured to heat the sheet material in the internal space.

[0017] An embodiment of the present application further provides a processing system, which includes a carrier and the above-mentioned processing equipment, wherein the carrier is used to carry the sheet material and deliver the sheet material to a reaction chamber of the processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope.

[0019] Figure 1 A schematic diagram of the structure of a processing device provided in one embodiment of the present application;

[0020] Figure 2 for Figure 1 A schematic diagram of a partially exploded structure of the processing equipment shown;

[0021] Figure 3 for Figure 1 A schematic diagram of the exploded structure of the processing equipment shown;

[0022] Figure 4 for Figure 1 A schematic diagram of the structure of a heating component in the processing equipment shown;

[0023] Figure 5A cross-sectional structural block diagram of a heating assembly provided in one embodiment of the present application;

[0024] Figure 6 for Figure 3 A schematic diagram of the exploded structure of the heating assembly shown;

[0025] Figure 7 A structural block diagram of a processing system provided in one embodiment of the present application.

[0026] Description of main component symbols:

[0027] 1. Processing system; 10. Processing equipment; 11. Reaction chamber; 111. Internal space; 112. Opening; 12. Heating assembly; 121. First shell; 122. Heating element; 123. Vacuum chamber; 124. Insulating layer; 125. Mirror plate; 126. Insulating cotton; 127. Second shell; 128. Accommodating chamber; 129. Cooling element; 1291. Cooling pipe; 1292. First joint; 1293. Second joint; 13. Auxiliary heating element; 20. Carrier. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0030] An embodiment of the present application provides a processing device, the processing device includes a reaction chamber having an internal space, at least one chamber wall of the reaction chamber is formed by a heating component, and the heating component is configured to heat a sheet material in the internal space. The heating component includes a first shell and a heating element, the wall of the first shell is configured as the chamber wall of the reaction chamber, the first shell is provided with a vacuum chamber, and the heating element is installed in the vacuum chamber.

[0031] In the above-mentioned processing equipment, a heating component is used as the chamber wall of the reaction chamber. Since the heating element is located in the vacuum chamber and the vacuum chamber has the characteristics of heat insulation and heat preservation, it is beneficial to improve the heating efficiency.

[0032] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0033] An embodiment of the present application provides a processing device 10, such as Figure 1 and Figure 2As shown, the processing equipment 10 includes a reaction chamber 11 having an internal space 111. At least one chamber wall of the reaction chamber 11 is formed by a heating component 12. The heating component 12 is configured to heat the sheet material in the internal space 111. The sheet material can be a silicon slice or a wafer to be processed.

[0034] In some embodiments, Figure 4 , Figure 5 and Figure 6 As shown, the heating assembly 12 includes a first shell 121 and a heating element 122, and a wall of the first shell 121 (specifically, a side wall of the first shell 121 facing the reaction chamber 11) is configured as a chamber wall of the reaction chamber 11. In other words, the chamber wall of the reaction chamber 11 shares the same side wall with the first shell 121. The first shell 121 is provided with a vacuum chamber 123, and the heating element 122 is installed in the vacuum chamber 123.

[0035] It can be understood that when the heating element 122 is working, the heat generated by the heating element 122 will be directly absorbed by the wall of the reaction chamber 11, and then transferred to the target in the internal space 111 through the wall of the reaction chamber 11. At the same time, since the vacuum chamber 123 has good thermal insulation performance, the vacuum chamber 123 can effectively prevent the heating element 122 from directly contacting the external environment, reduce heat loss, and thus facilitate uniform heating of the processing device 10 and improve thermal efficiency.

[0036] In some embodiments, the chamber wall of the reaction chamber 11 is made of one or more metals, such as iron, copper, iron-copper alloy, etc. Metal materials have good thermal conductivity and high heat transfer efficiency, which is conducive to improving the uniform heat effect of the processing device 10.

[0037] In some embodiments, Figure 5 and Figure 6 As shown, in the vacuum chamber 123, the heating element 122 is mounted on the wall of the reaction chamber 11 (specifically, the side wall of the first shell 121 for the wall of the reaction chamber 11). On the one hand, since the heating element 122 is closely attached to the wall of the reaction chamber 11, the heat can be directly transferred to the internal space 111 through the wall of the reaction chamber 11, reducing the loss of heat during the transfer process, thereby improving the heat transfer efficiency of the heating element 122. On the other hand, the side wall of the first shell 121 can act as a uniform heat plate, which is conducive to improving the temperature uniformity of the entire processing equipment 10.

[0038] In other embodiments, the heating element 122 may also be disposed inside the vacuum chamber 123 without contacting the wall of the reaction chamber 11, and heating is performed by thermal radiation. This application does not limit this, and technicians in this field may choose according to actual conditions.

[0039] In some embodiments, Figure 4As shown, the heating component 12 also includes an insulating layer 124, which is disposed between the chamber wall of the reaction chamber 11 and the heating element 122 to prevent the metal chamber wall from contacting and conducting electricity with the heating element 122, thereby ensuring the safe use of the processing equipment 10 and extending the service life of the processing equipment 10.

[0040] In some embodiments, Figure 5 and Figure 6 As shown, the heating assembly 12 further includes a mirror plate 125, which is installed in the vacuum chamber 123 and is located on a side of the heating element 122 away from the chamber wall. The mirror plate 125 is a sheet material configured to reflect the heat generated by the heating element 122 to the inner space 111.

[0041] Specifically, when the heating element 122 is heated, a portion of the heat will flow in a direction away from the reaction chamber 11. When the dissipated heat flows to the mirror plate 125, the mirror plate 125 will reflect the heat back to the sheet material in the internal space 111 of the reaction chamber 11, rather than letting the heat dissipate into the environment, so that more heat is effectively used to heat the sheet material, rather than being wasted. In other words, through the provision of the mirror plate 125, most of the heat generated by the heating element 122 can be transferred to the sheet material in the internal space 111, thereby further improving the thermal efficiency of the processing device 10.

[0042] In some embodiments, the heating assembly 12 further includes a heat-insulating cotton 126, which is disposed outside the first shell 121 and located on a side of the first shell 121 away from the internal space 111. By disposing the heat-insulating cotton 126 outside the first shell 121, it is possible to reduce heat loss, that is, to prevent heat from being lost from the inside of the processing device 10 to the external environment, thereby improving the thermal efficiency of the processing device 10. At the same time, it is also possible to protect the first shell 121 and prevent the first shell 121 from being damaged due to long-term high-temperature operation, thereby extending the service life of the first shell 121 and reducing the frequency and cost of maintenance and replacement.

[0043] In some embodiments, Figure 5 and Figure 6 As shown, the heating component 12 also includes a second shell 127, which is installed on a side of the first shell 121 away from the internal space 111, and an accommodating cavity 128 is formed between the first shell 121 and the second shell 127, and the thermal insulation cotton 126 is installed in the accommodating cavity 128 to provide protection for the thermal insulation cotton 126.

[0044] It can be understood that since the thermal insulation cotton 126 is placed in the accommodating cavity 128 between the first shell 121 and the second shell 127, the thermal insulation cotton 126 will not directly contact the external environment, thereby reducing the risk of the thermal insulation cotton 126 being damaged by the influence of the external environment, such as humidity, pollution or mechanical damage, thereby extending the service life of the thermal insulation cotton 126 and reducing the frequency and cost of maintenance and replacement.

[0045] In addition, by placing the heat preservation cotton 126 in the accommodation cavity 128, the heat preservation cotton 126 can be prevented from directly contacting operators, thereby improving the safety of the processing device 10. At the same time, the appearance of the processing device 10 can be kept neat and tidy, improving its aesthetics.

[0046] In some embodiments, Figure 4 and Figure 6 As shown, the heating assembly 12 further includes a cooling member 129, which is mounted on a side of the second housing 127 away from the first housing 121 to reduce the temperature of the second housing 127. In this way, the thermal fatigue in the second housing 127 (specifically, fatigue of the material under thermal cycle, which may cause the performance of the material to deteriorate or even break if not properly cooled) can be reduced, thereby improving the safety and service life of the processing device 10, and the temperature of the second housing 127 can be prevented from being too high, thereby preventing technicians from being scalded.

[0047] In some more specific embodiments, the cooling member 129 includes a cooling pipe 1291, a first joint 1292, and a second joint 1293. The cooling pipe 1291 is coiled and arranged on the second housing 127. The first joint 1292 and the second joint 1293 are respectively arranged at both ends of the cooling pipe 1291. The cooling medium flows into the cooling pipe 1291 through one of the first joint 1292 and the second joint 1293, and flows out of the cooling pipe 1291 through the other of the first joint 1292 and the second joint 1293. The cooling medium can be a liquid (such as water or a refrigerant) or a gas (such as air).

[0048] It can be understood that when the cooling medium flows through the cooling pipe 1291, the cooling medium absorbs the heat of the cooling pipe 1291 and the second shell 127, and then flows out of the cooling pipe 1291 through the other of the first joint 1292 and the second joint 1293, taking away the heat, thereby reducing the temperature of the second shell 127.

[0049] It is worth noting that by coiling the cooling tube 1291 on the second shell 127, the contact area between the cooling tube 1291 and the second shell 127 can be increased, thereby improving the cooling efficiency. At the same time, by providing the first joint 1292 and the second joint 1293, the cooling medium can be easily introduced into and discharged from the cooling tube 1291, thereby realizing the circulation of the cooling medium. In other embodiments, other suitable cooling structures can also be used, and this application does not limit this.

[0050] In some embodiments, Figure 1 and Figure 2 As shown, there are multiple heating components 12, and the multiple heating components 12 enclose the above-mentioned reaction chamber 11, so that technicians can realize zoned temperature control of the reaction chamber 11, thereby ensuring the temperature uniformity in the entire reaction chamber 11. It is worth noting that the arrangement of the multiple heating components 12 can be optimized according to the shape and size of the sheet material to achieve the best heating effect.

[0051] It should be understood that all chamber walls of the reaction chamber 11 are composed of heating components 12. Any chamber wall of the reaction chamber 11 can be composed of one heating component 12, or can be assembled from multiple heating components 12. The present application does not limit the number of heating components 12 of any chamber wall, and the number of heating components 12 can be set according to demand.

[0052] Specifically, the technician can adjust the heating component 12 of the corresponding area as needed. For example, when the temperature at the end of the reaction chamber 11 is lower than the temperature in the middle of the reaction chamber 11, the technician can increase the power of the heating component 12 corresponding to the end of the reaction chamber 11, thereby increasing the temperature at the end of the reaction chamber 11.

[0053] In some embodiments, the two connected heating assemblies 12 are sealed to isolate the internal space 111 of the reaction chamber 11 from the outside of the processing device 10. This not only helps to prevent the heat in the reaction chamber 11 from leaking out and improve the heating efficiency, but also prevents the external environment from interfering with the heating process and ensures the stability of the heating process.

[0054] In some specific embodiments, multiple heating components 12 are sealed and connected by welding to form the above-mentioned reaction chamber 11. For example, multiple heating components 12 are welded in sequence to form a reaction chamber 11 similar to a rectangular parallelepiped. By adopting the welding method, it is possible to ensure a tight connection between the heating components 12, avoid gaps between the heating components 12, and reduce the risk of heat leakage of the processing device 10. At the same time, welding can provide a strong connection without other connecting elements (such as bolts or screws), thereby improving the structural strength of the entire processing device 10.

[0055] In some specific embodiments, the plurality of heating components 12 are connected by threaded members (such as bolts or screws, etc.) and sealed by sealing members (such as rubber pads or gaskets) to form a reaction chamber 11. The threaded connection method is conducive to the disassembly and storage of the processing device 10, thereby improving the flexibility of the processing device 10.

[0056] In other embodiments, other suitable sealing connection methods may also be used, which is not limited in the present application and those skilled in the art may choose according to actual conditions.

[0057] In some embodiments, Figure 2 and Figure 3 As shown, the reaction chamber 11 has an opening 112 , which is in communication with the inner space 111 , so that a technician can take out a sheet material from the inner space 111 of the reaction chamber 11 or place the sheet material in the inner space 111 of the reaction chamber 11 .

[0058] In some more specific embodiments, one of the heating components 12 among the multiple heating components 12 is configured to close or open the opening 112, which is beneficial to auxiliary heating of the opening 112 area of ​​the processing equipment 10 to ensure the uniformity of heat in the reaction chamber 11. It should be noted that when the technician places or takes the sheet material through the opening 112, the heat in the opening 112 area will flow at a fast rate, that is, the gas in the reaction chamber 11 flows from the high temperature area to the low temperature area, resulting in uneven heat dispersion. Therefore, by configuring the heating component 12 to close or open the opening 112, when the technician closes the opening 112, the heating component 12 at the opening 112 will heat the opening 112 area to reduce the heat flowing from the high temperature area to the low temperature area, thereby improving the uniformity of heat in the reaction chamber 11.

[0059] In some embodiments, the processing device 10 further includes an auxiliary heating element 13, which is mounted on the chamber wall of the reaction chamber 11, and the auxiliary heating element 13 is configured to heat the sheet material in the internal space 111. It can be understood that the processing device 10 can heat the sheet material in the internal space 111 through the auxiliary heating element 13 and the heating assembly 12, thereby further improving the heating efficiency of the processing device 10.

[0060] For example, in some cases, the desired heating effect may not be achieved only by the heating assembly 12, or the heating time is too long. In this case, the auxiliary heating element 13 can provide additional heating energy on the basis of the heating assembly 12, thereby improving the heating efficiency.

[0061] For example, when the reaction chamber 11 is opened to take out the sheet material in the internal space 111, the temperature in the reaction chamber 11 drops rapidly. At this time, the temperature cannot be quickly raised to the reaction temperature by the heating component 12 alone. At this time, the auxiliary heating element 13 needs to be started, and the auxiliary heating element 13 and the heating component 12 heat the sheet material in the internal space 111 together.

[0062] In some embodiments, the auxiliary heating element 13 can be an electric heating element, such as an armored heating wire, silicon carbide heating, a ceramic heater, etc., or it can be other types of heating elements, such as infrared radiation heating, which is not limited in the present application.

[0063] An embodiment of the present application also provides a processing system 1, such as Figure 7 As shown, the processing system 1 includes a carrier 20 and the above-mentioned processing equipment 10 . The carrier 20 is used to carry the sheet material and send the sheet material to the reaction chamber 11 of the processing equipment 10 .

[0064] In the prior art, the heating device in the heating furnace is usually a resistance wire usually wound around the outer wall of a quartz tube or the resistance wire is directly located outside the quartz tube. Since the inner cavity of the quartz tube is the vacuum cavity, and the resistance wire is in a non-vacuum environment, the heating efficiency of the heating device is reduced. The processing system 1 adopts the above-mentioned processing equipment 10, and the processing equipment 10 adopts the heating component 12 as the chamber wall of the reaction chamber 11. Since the heating element 122 is located in the vacuum cavity 123, and the vacuum cavity 123 has the characteristics of heat insulation and heat preservation, it is conducive to improving the heating efficiency.

[0065] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A processing device, characterized in that: include: A reaction chamber having an interior space, wherein at least one chamber wall of the reaction chamber is formed by a heating assembly, and the heating assembly is configured to heat a sheet material in the interior space; The heating assembly includes a first shell and a heating element. The wall of the first shell is configured as a chamber wall of the reaction chamber. The first shell is provided with a vacuum chamber. The heating element is installed in the vacuum chamber.

2. The processing device according to claim 1, characterized in that The wall of the first housing is formed of one or more metals.

3. The processing device according to claim 2, characterized in that The heating assembly also includes an insulating layer and thermal insulation cotton, wherein the insulating layer is arranged between the chamber wall and the heating element; the thermal insulation cotton is arranged outside the first shell and is located on a side of the first shell away from the internal space.

4. The processing device according to claim 3, characterized in that The heating component also includes a second shell, which is installed on a side of the first shell away from the internal space, and a receiving cavity is formed between the first shell and the second shell, and the thermal insulation cotton is installed in the receiving cavity.

5. The processing device according to claim 4, characterized in that The heating assembly further comprises a cooling member, which is mounted on a side of the second shell away from the first shell; The cooling member includes a cooling pipe, a first joint and a second joint. The cooling pipe is coiled on the second shell, and the first joint and the second joint are respectively arranged at both ends of the cooling pipe. The external cooling medium flows into the cooling pipe through one of the first joint and the second joint, and flows out of the cooling pipe through the other of the first joint and the second joint.

6. The processing device according to claim 1, characterized in that The heating assembly further comprises a mirror plate, which is installed in the vacuum chamber and is located at a side of the heating element away from the chamber wall; the mirror plate is configured to reflect heat generated by the heating element.

7. The processing device according to claim 1, characterized in that There are multiple heating components, and the multiple heating components are surrounded to form the reaction chamber.

8. The processing device according to claim 1, characterized in that The reaction chamber has an opening, and the opening is connected to the internal space; One of the heating components is configured to close or open the opening.

9. The processing device according to claim 1, characterized in that The processing apparatus further includes an auxiliary heating element installed at the chamber wall, the auxiliary heating element being configured to heat the sheet material in the inner space.

10. A processing system, characterized in that: The invention comprises a carrier and the processing equipment according to any one of claims 1 to 9, wherein the carrier is used for carrying a sheet material and delivering the sheet material to the reaction chamber of the processing equipment.

Images