Fingerprint module and electronic equipment

Abstract

The utility model relates to a fingerprint module and electronic equipment. The fingerprint module comprises a fingerprint packaging substrate, and the fingerprint packaging substrate comprises a packaging circuit. The first circuit board is electrically connected with the packaging circuit; and the reinforcing part is bonded with the first circuit board through a bonding layer, and the reinforcing part is a plastic-containing part.

Description

Technical Field

[0001] The present disclosure relates to the field of terminal technology, and in particular to a fingerprint module and an electronic device. Background Art

[0002] In the related art, electronic devices such as mobile phones and tablets are equipped with fingerprint detection modules and antennas on the side frames. When the side frame forms an installation opening for the fingerprint detection module and also acts as a radiator to radiate antenna signals, the fingerprint detection module has a negative impact on the clearance of the radiator, thereby causing the antenna performance to deteriorate. Utility Model Content

[0003] The present disclosure provides a fingerprint module and an electronic device to solve the deficiencies in the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, there is provided a fingerprint module, including:

[0005] A fingerprint packaging substrate, wherein the fingerprint packaging substrate comprises a packaging circuit;

[0006] a first circuit board, the first circuit board being electrically connected to the packaging circuit;

[0007] A reinforcing piece, wherein the reinforcing piece is bonded to the first circuit board via an adhesive layer, and the reinforcing piece is a plastic piece.

[0008] Optionally, the plastic-containing part includes a metal sheet and an injection-molded part, the metal sheet is bonded to the first circuit board, and the injection-molded part is connected to a side of the metal sheet facing away from the first circuit board.

[0009] Optionally, the injection molded part includes a polycarbonate part or a polyamide part.

[0010] Optionally, the injection molded part includes a limiting opening, and a depth direction of the limiting opening is perpendicular to a pressing direction of the fingerprint package substrate.

[0011] Optionally, the reinforcing member is made of plastic.

[0012] Optionally, the fingerprint package substrate includes a fingerprint sensing surface, the FR4-type plastic part includes a limiting circular hole, and the axial direction of the limiting circular hole is arranged parallel to the fingerprint sensing surface.

[0013] Optionally, the reinforcing member is a FR4 type plastic member.

[0014] Optionally, the fingerprint packaging substrate includes a limiting skirt, and the limiting skirt limits the fingerprint packaging substrate when in contact with a middle frame of the electronic device.

[0015] Optionally, the fingerprint module further includes:

[0016] A conductive base, wherein the conductive base is fixedly arranged relative to the reinforcing member, and the conductive base is located on a side of the reinforcing member away from the fingerprint packaging substrate;

[0017] A second circuit board and a key circuit module, wherein the second circuit board is electrically connected to the key circuit module.

[0018] Optionally, the first circuit board and the second circuit board are the same circuit board, and the same circuit board is a flexible circuit board arranged in a bent shape.

[0019] According to a second aspect of an embodiment of the present disclosure, there is provided an electronic device, including:

[0020] A middle frame, wherein the middle frame includes a stepped groove;

[0021] In the fingerprint module as described in any of the above embodiments, the fingerprint package base is partially disposed in the step groove, and the step surface in the step groove limits the movement of the fingerprint package base toward the inside of the electronic device.

[0022] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0023] It can be seen from the above embodiments that the reinforcement part of the present invention is a plastic part, at least part of which is made of plastic material, which is beneficial to improving the clearance environment of the radiator assembled on the same side of the side frame of the electronic device as the fingerprint module, and can reduce the impact on the performance of the antenna.

[0024] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0026] Figure 1 The figure is a schematic diagram of an exploded view of a fingerprint module according to an exemplary embodiment.

[0027] Figure 2 yes Figure 1 A cross-sectional schematic diagram of a fingerprint module when it is arranged in an electronic device.

[0028] Figure 3 yes Figure 1 Another cross-sectional schematic diagram of a fingerprint module disposed in an electronic device.

[0029] Figure 4 It is a schematic structural diagram of an FR4 type plastic part according to an exemplary embodiment.

[0030] Figure 5 The figure is a schematic structural diagram of a fingerprint packaging substrate according to an exemplary embodiment. DETAILED DESCRIPTION

[0031] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0032] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0033] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0034] Figure 1 is a schematic diagram of a fingerprint module according to an exemplary embodiment. Figure 2 yes Figure 1 A cross-sectional schematic diagram of a fingerprint module when it is set in an electronic device, Figure 3 yes Figure 1 Another cross-sectional schematic diagram of a fingerprint module disposed in an electronic device. Figure 1-Figure 3As shown, the fingerprint module includes a fingerprint packaging substrate 1, a first circuit board 2 and a reinforcement 3. Among them. The fingerprint packaging substrate 1 includes a packaging circuit, which may include a fingerprint detection chip and related circuits connected to the fingerprint detection chip. The fingerprint packaging substrate 1 may be provided with a sensing surface, and the fingerprint can be collected through the packaging circuit when the user's finger contacts the sensing surface. The first circuit board 2 is electrically connected to the packaging circuit of the fingerprint packaging substrate 1, so that the sampling information related to the fingerprint can be transmitted to the processor of the electronic device through the first circuit board 2 to be compared with the standard fingerprint stored in the electronic device. The reinforcement 3 is bonded to the first circuit board 2 through an adhesive layer, so that when the first circuit board 2 is connected to the packaging circuit of the fingerprint packaging substrate 1 through the SMT (Surface Mounted Technology, surface mounting technology) process, the strength of the first circuit board 2 can be improved by the reinforcement 3, which is conducive to the mounting between the fingerprint packaging substrate 1 and the first circuit board 2.

[0035] The reinforcing piece 3 may be a plastic-containing piece, that is, at least a portion of the material of the reinforcing piece 3 is plastic. The proportion of plastic in the reinforcing piece 3 may be greater than 50% or less than 50% or equal to 50%, or the proportion of plastic may be 100%, that is, the reinforcing piece 3 is a plastic-made piece made of all plastic. The specific design is based on demand, and the present disclosure does not limit this. Through the technical solution of the present disclosure, the reinforcing piece 3 is designed as a plastic-containing piece. Under the condition of equal volume, compared with the use of a full metal support steel sheet in the related art, the performance impact on the antenna can be reduced.

[0036] In some embodiments, the reinforcement part is a full plastic part, which includes a FR4 type plastic part. By utilizing the high temperature resistance of the FR4 type plastic part, the FR4 plastic part can be connected to the first circuit board 2 for later processing. When the FR4 plastic part supports the first circuit board 2, the SMT mounting process between the first circuit board 2 and the packaging circuit is realized.

[0037] However, since FR4 plastic parts are prone to cracks during data processing, in order to achieve relative fixation between the FR4 plastic parts and the middle frame of the electronic device. Figure 4 As shown, the FR4 plastic part includes a limiting circular hole 31, the axial direction of which is arranged parallel to the fingerprint sensing surface 12 of the fingerprint package substrate 1, so that the movement of the fingerprint module can be limited in the direction in which the fingerprint package substrate 1 moves toward the outside of the electronic device. Figure 2As shown, the present disclosure also provides an electronic device, which includes a middle frame 101 and a plug-in 102, and the plug-in 102 is fixedly connected to the middle frame 101, for example, the plug-in 102 can be an integral part with the middle frame 101, or fixed by other parts. The plug-in 102 can be a deformable part, and the plug-in 102 is inserted into the limiting circular hole 31. When the key function is realized by the fingerprint module, when the fingerprint module is pressed, the plug-in 102 is deformed in the limiting circular hole 31. After the user releases the pressure, the plug-in 102 restores the deformation and the fingerprint module rebounds. Based on this, the movement of the fingerprint module can be limited by the limitation of the limiting opening 331 and the plug-in 102 of the middle frame. The formation of the limiting circular hole 31 on the FR4 type plastic part can be achieved by drilling, so as to avoid cracks in the FR4 type plastic part caused by data processing, which affects the strength of the FR4 type plastic part.

[0038] Of course, the middle frame 101 of the electronic device may also include a stepped groove 103, and the fingerprint package substrate 1 of the fingerprint module described in any embodiment of the present disclosure may be partially located in the stepped groove 103, and the stepped surface 1031 in the stepped groove 103 may limit the movement of the fingerprint module toward the inside of the electronic device. Based on this, the movement of the fingerprint module toward the inside of the electronic device can assist in realizing the key function of the fingerprint module. The step surface can be limited with the fingerprint package substrate 1, or it can be limited with the reinforcement 3, which is specifically designed as needed, and the present disclosure does not limit this. Among them, according to the type of use, the electronic device may include a mobile phone or a tablet computer, etc., and according to the structural setting, the electronic device may include a straight-type device or a folding device, and the folding device may include an up-and-down folding device and a left-and-right folding device. In particular, for the up-and-down folding device, due to the problem of morphological space, the device is extremely arranged, so the antenna radiator and the fingerprint module are relatively close, and by setting the reinforcement as a plastic part, the radiation performance of the antenna radiator can be reduced.

[0039] In some other embodiments, the reinforcing member 3 may include a metal sheet 32 ​​and an injection molded part 33. The metal sheet 32 ​​is bonded to the first circuit board 2, and the injection molded part 33 is connected to the side of the metal sheet 32 ​​facing away from the first circuit board 2. Based on this, the metal sheet 32 ​​can be bonded to the first circuit board 2 and then processed. When the SMT process is implemented between the first circuit board 2 and the packaging circuit, the metal sheet 32 ​​is used for support, and the injection molded part 33 can be injection molded and then bonded to the metal sheet 32 ​​after the SMT process is completed, thereby improving the reinforcement performance of the reinforcing member 3. In this way, on the one hand, the metal content of the reinforcing member 3 can be reduced, which is beneficial to improving the antenna performance. On the other hand, the injection molded part 33 is injection molded, so any required limiting hole structure can be formed, such as Figure 1 As shown in , a racetrack-shaped hole can be formed to cooperate with the insert 102.

[0040] The injection molded part 33 may be formed by injection molding using any material suitable for injection molding. For example, the injection molded part 33 may include a polycarbonate part or a polyamide part. Of course, the injection molded part 33 does not include a FR4 part that is not suitable for injection molding.

[0041] Similarly, the injection molded part 33 may include a limit opening 331, the depth direction of which is perpendicular to the pressing direction of the fingerprint package substrate 1, thereby limiting the fingerprint module in the direction in which the fingerprint package substrate 1 moves toward the outside of the electronic device. The limit opening 331 may be a runway-shaped hole or other regular or irregular hole structure, which is not limited in the present disclosure. In particular, when the key function is realized by the fingerprint module, during the rebound process after pressing, the movement of the fingerprint module can be limited by the limit opening 331 and the plug-in 102 of the middle frame.

[0042] In the above embodiments, Figure 5 As shown, the fingerprint package base 1 may include a limiting skirt 11, and when the limiting skirt 11 contacts the middle frame of the electronic device, the movement of the fingerprint package base 1 toward the outside of the electronic device can be limited. In this way, the protruding height of the fingerprint module relative to the middle frame of the electronic device can be limited by the limiting skirt 11. In particular, when the key function is realized by the fingerprint module, the movement of the fingerprint module can be limited by the limiting skirt 11 during the rebound process after pressing.

[0043] It should be noted that when the outward movement of the fingerprint module relative to the middle frame is limited by the limiting skirt 11, it is not necessary to form a hole on the reinforcing member 3 to cooperate with the plug-in 102, which is conducive to reducing the material requirements of the reinforcing member 3. Of course, in some other embodiments, if there is no contradiction, the rebound of the fingerprint module can be limited by both the limiting skirt 11 and the hole set in the reinforcing member 3.

[0044] In some embodiments, the fingerprint module can be used only to realize fingerprint detection; in other embodiments, the fingerprint module can be compatible with fingerprint detection and key functions. For example, the fingerprint module also includes a conductive base 4, a second circuit board 5 and a key circuit module 6, the conductive base 4 is fixedly arranged relative to the reinforcement 3, and the conductive base 4 is located on the side of the reinforcement 3 away from the fingerprint packaging substrate 1, and the second circuit board 5 is electrically connected to the key circuit module 6. Based on this, when the user presses the fingerprint detection substrate later, the reinforcement 3 and the conductive base 4 are pushed to move in the pressing direction to trigger the key circuit module 6 to realize the key function.

[0045] In some embodiments, the first circuit board 2 and the second circuit board 5 can be the same circuit board, for example Figure 1As shown in , the circuit board is a flexible circuit board arranged in a bent shape. In other embodiments, the first circuit board 2 and the second circuit board 5 can be two different circuit boards.

[0046] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the disclosure disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0047] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A fingerprint module, characterized in that: include: A fingerprint packaging substrate, wherein the fingerprint packaging substrate comprises a packaging circuit; a first circuit board, the first circuit board being electrically connected to the packaging circuit; A reinforcing piece, wherein the reinforcing piece is bonded to the first circuit board via an adhesive layer, and the reinforcing piece is a plastic piece.

2. The fingerprint module according to claim 1, characterized in that: The reinforcing piece includes a metal sheet and an injection molded piece. The metal sheet is bonded to the first circuit board, and the injection molded piece is connected to a side of the metal sheet that is away from the first circuit board.

3. The fingerprint module according to claim 2, characterized in that: The injection molded part includes a polycarbonate part or a polyamide part.

4. The fingerprint module according to claim 2, characterized in that: The injection molded part comprises a limiting opening, and a depth direction of the limiting opening is perpendicular to a pressing direction of the fingerprint packaging substrate.

5. The fingerprint module according to claim 1, characterized in that: The reinforcing piece is made of plastic.

6. The fingerprint module according to claim 5, characterized in that: The fingerprint package substrate comprises a fingerprint sensing surface, the reinforcing piece comprises a limiting circular hole, and the axial direction of the limiting circular hole is arranged parallel to the fingerprint sensing surface.

7. The fingerprint module according to claim 5, characterized in that: The reinforcing member is a FR4 type plastic member.

8. The fingerprint module according to claim 1, characterized in that: The fingerprint packaging substrate comprises a limiting skirt, and the limiting skirt limits the fingerprint packaging substrate when in contact with the middle frame of the electronic device.

9. The fingerprint module according to claim 1, characterized in that: The fingerprint module also includes: A conductive base, wherein the conductive base is fixedly arranged relative to the reinforcing member, and the conductive base is located on a side of the reinforcing member away from the fingerprint packaging substrate; A second circuit board and a key circuit module, wherein the second circuit board is electrically connected to the key circuit module.

10. The fingerprint module according to claim 9, characterized in that: The first circuit board and the second circuit board are the same circuit board, and the same circuit board is a flexible circuit board arranged in a bent shape.

11. An electronic device, characterized in that: include: A middle frame, wherein the middle frame includes a stepped groove; According to the fingerprint module described in any one of claims 1 to 10, the fingerprint package substrate is partially arranged in the step groove, and the step surface in the step groove limits the movement of the fingerprint package substrate toward the electronic device.

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