Positioning clamp for scribing silicon wafer

Abstract

The utility model discloses a positioning clamp for scribing a silicon wafer, and belongs to the technical field of silicon wafer clamps. Comprising a bottom plate, two sliding grooves are formed in the top of the bottom plate, clamping assemblies are arranged in the two sliding grooves, each clamping assembly comprises a lead screw, a worm gear is arranged in the middle of the outer wall of the circumference of the lead screw, a worm is arranged on the worm gear in a meshed mode, sliding blocks are in threaded connection with the two ends of the lead screw, and limiting rods are arranged at the tops of the two sliding blocks; adsorption assemblies are arranged on the tops of the supporting columns. According to the utility model, the rotary knob is screwed to enable the worm to rotate to drive the worm wheel to rotate, so that the sliding block is driven to move, the two limiting rods are contracted to clamp the silicon wafer, the silicon wafer scribing device is convenient to adapt to silicon wafers of different sizes, the silicon wafer is protected from being abraded through the protective pad made of nitrile rubber, and the stability of the silicon wafer during scribing is improved through the adsorption assembly. The silicon wafer clamping device is compact and reasonable in structural design, convenient to adapt to silicon wafers of different sizes, good in clamping effect and low in stability.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer clamps, and more specifically to a positioning clamp for silicon wafer dicing. Background Art

[0002] Silicon wafers are important raw materials for manufacturing chips and various semiconductor devices. When they are diced, a positioning device is required. The positioning device is mainly used to ensure that the battery can be accurately positioned after clamping for precise processing. It is generally mechanical. The process of separating each chip with independent electrical properties is called dicing.

[0003] A patent document with publication number CN213617668U in the prior art provides a dicing machine for a semiconductor fixture. The device moves the extrusion plate downward to squeeze the spring and drive the connecting rod to move. The connecting rod moves downward to drive the positioning plate to move downward through the connecting hole and the moving hole to move into the circular groove. The push rod is then rotated to drive the positioning plate to rotate in the circular groove, thereby limiting the position of the semiconductor plate and improving convenience.

[0004] Although the device has many beneficial effects, the following problems still exist: first, the device cannot adapt to silicon wafers of different sizes during use, and the clamping effect is not good enough; second, the device does not adsorb the silicon wafer during use, resulting in insufficient stability, which needs to be improved. In view of this, we propose a positioning fixture for silicon wafer dicing. Utility Model Content

[0005] 1. Technical problems to be solved

[0006] The utility model aims to provide a positioning fixture for silicon wafer dicing, so as to solve the problems in the above background technology that the existing fixture cannot adapt to silicon wafers of different sizes, has an insufficient clamping effect and insufficient stability.

[0007] 2. Technical solution

[0008] A positioning fixture for silicon wafer dicing comprises a base plate, two slide grooves are provided on the top of the base plate, clamping assemblies are provided inside the two slide grooves, the clamping assembly comprises a lead screw, a worm wheel is provided in the middle of the circumferential outer wall of the lead screw, a worm is meshed with the worm wheel, a knob is provided at one end of the worm, sliders are threadedly connected at both ends of the lead screw, limit rods are provided on the top of the two sliders, protective pads are provided on the inner walls of one end of the two limit rods, a plurality of support columns are provided on the top of the base plate, and an adsorption assembly is provided on the top of the support columns.

[0009] Preferably, a screw rod is threadedly connected to the bottom of one end of the limiting rod, a clamping rod is provided on the top of the screw rod, and a clamping plate is provided on the bottom of one side of the clamping rod.

[0010] Preferably, the adsorption assembly includes a vacuum plate, a plurality of vacuum suction cups are embedded on the top of the vacuum plate, a vacuum pump is provided on the side wall of the vacuum plate, a pipe connected to the inside of the vacuum plate is provided at the output end of the vacuum pump, and the vacuum pump is electrically connected to an external power supply.

[0011] Preferably, the threads at both ends of the lead screw are arranged in opposite directions, and the worm wheel is located in the groove at the top of the base plate.

[0012] Preferably, the material of the protective pad is nitrile rubber, and the material of the abutting plate is vulcanized rubber.

[0013] Preferably, the plurality of support columns are evenly distributed at the four corners of the top of the bottom plate, and the height of the support columns is greater than the thickness of the limiting rod.

[0014] 3. Beneficial effects

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] The utility model manually turns the knob to rotate the worm and drive the worm wheel to rotate, thereby driving the slider connected to the lead screw thread to move, and then the two limit rods are contracted to clamp the silicon wafer, which is convenient for adapting to silicon wafers of different sizes. The tightening rod is lowered by manually turning the screw rod, so that the tightening plate contacts the top edge of the silicon wafer, thereby improving the clamping effect. The protective pad made of nitrile rubber and the tightening plate made of vulcanized rubber protect the silicon wafer from wear.

[0017] Secondly, by turning on the vacuum pump switch, the vacuum pump draws out the gas inside the vacuum plate, so that a vacuum is formed on the contact surface between the vacuum suction cup and the silicon wafer, the adsorption effect is strong, and the stability is high when the silicon wafer is diced; the structure design of the utility model is compact and reasonable, which is easy to adapt to silicon wafers of different sizes, has a good clamping effect and low stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a partial structural schematic diagram of the utility model;

[0020] Figure 3 It is a partial structural cross-sectional schematic diagram of the utility model;

[0021] Figure 4 for Figure 3 The enlarged schematic diagram at A in the middle;

[0022] Figure 5 It is a partial structural schematic diagram of the adsorption component of the utility model;

[0023] Explanation of the numbers in the figure: 1. Base plate; 2. Slide; 3. Clamping assembly; 4. Support column; 5. Adsorption assembly; 301. Screw; 302. Worm gear; 303. Worm; 304. Knob; 305. Slider; 306. Limit rod; 307. Protective pad; 308. Screw; 309. Clamping rod; 310. Clamping plate; 501. Vacuum plate; 502. Vacuum suction cup; 503. Vacuum pump; 504. Pipeline. DETAILED DESCRIPTION

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0025] In the description of the present invention, "plurality" means two or more than two, unless otherwise clearly and specifically defined.

[0026] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] See also Figure 1-5 ,The utility model provides a technical solution:

[0028] A positioning fixture for silicon wafer dicing includes a bottom plate 1, two slide grooves 2 are provided on the top of the bottom plate 1, a clamping assembly 3 is rotatably connected inside the two slide grooves 2, the clamping assembly 3 includes a lead screw 301, a worm wheel 302 is fixedly provided in the middle of the circumferential outer wall of the lead screw 301, a worm 303 is meshed with the worm wheel 302, a knob 304 is fixedly provided at one end of the worm 303, a slider 305 is threadedly connected at both ends of the lead screw 301, a limiting rod 306 is fixedly provided on the top of the two sliders 305, a protective pad 307 is fixedly provided on the inner wall of one end of the two limiting rods 306, a plurality of support columns 4 are fixedly provided on the top of the bottom plate 1, and an adsorption assembly 5 is fixedly provided on the top of the support column 4. The utility model manually turns the knob 304 to rotate the worm 303 to drive the worm wheel 302 to rotate, thereby driving the slider 305 threadedly connected to the lead screw 301 to move, and then the two limiting rods 306 are contracted to clamp the silicon wafer, so as to adapt to silicon wafers of different sizes.

[0029] Specifically, a screw rod 308 is threadedly connected to the bottom of one end of the limiting rod 306, a clamping rod 309 is fixedly provided at the top of the screw rod 308 through the limiting rod 306, and a clamping plate 310 is fixedly provided at the bottom of one side of the clamping rod 309. The clamping rod 309 is lowered by manually rotating the screw rod 308, so that the clamping plate 310 contacts the top edge of the silicon wafer, thereby improving the clamping effect.

[0030] Furthermore, the adsorption assembly 5 includes a vacuum plate 501, a plurality of vacuum suction cups 502 are embedded on the top of the vacuum plate 501, a vacuum pump 503 is fixedly installed on the side wall of the vacuum plate 501, a pipe 504 connected to the inside of the vacuum plate 501 is fixedly installed at the output end of the vacuum pump 503, and the vacuum pump 503 is electrically connected to an external power supply. By turning on the switch of the vacuum pump 503, the vacuum pump 503 extracts the gas inside the vacuum plate 501, so that the contact surface between the vacuum suction cup 502 and the silicon wafer forms a vacuum, the adsorption effect is strong, and the stability is high when the silicon wafer is diced.

[0031] It is worth noting that the threads at both ends of the lead screw 301 are arranged in opposite directions, and the worm gear 302 is located in the groove at the top of the bottom plate 1. Through the threads arranged in opposite directions at both ends of the lead screw 301, when the lead screw 301 rotates, the two sliders 305 move inward or outward at the same time, which is convenient for improving the convenience of the silicon wafer dicing positioning fixture.

[0032] It is worth noting that the material of the protective pad 307 is nitrile rubber, and the material of the abutting plate 310 is vulcanized rubber. The protective pad 307 made of nitrile rubber and the abutting plate 310 made of vulcanized rubber protect the silicon wafer from being worn.

[0033] In addition, multiple support columns 4 are evenly distributed at the top four corners of the bottom plate 1, and the height of the support columns 4 is greater than the thickness of the limit rods 306. The support columns 4 with a height greater than the thickness of the limit rods 306 support and fix the adsorption assembly 5 without affecting the movement of the two limit rods 306.

[0034] In addition, the circuits, electronic components and modules involved in the utility model are all prior art, and can be fully implemented by those skilled in the art. Needless to say, the content protected by the utility model does not involve improvements to the internal structure and method.

[0035] The device or equipment models involved in this article are as follows:

[0036] The model of the vacuum pump 503 may be: SKA2060.

[0037] Working principle: When the device is needed to position the silicon wafer for slicing, the staff will place the bottom plate 1 at the required position, place the silicon wafer on the top of the vacuum plate 501, and manually turn the knob 304 to rotate the worm 303 to drive the worm wheel 302 to rotate, thereby driving the slider 305 threadedly connected to the lead screw 301 to move, and then the two limit rods 306 will shrink to clamp the silicon wafer, which is convenient for adapting to silicon wafers of different sizes. Manually rotate the screw 308 to lower the clamping rod 309, so that the clamping plate 310 contacts the top edge of the silicon wafer to improve the clamping effect. The protective pad 307 made of nitrile rubber and the clamping plate 310 made of vulcanized rubber protect the silicon wafer from wear. Turn on the vacuum pump 503 switch to allow the vacuum pump 503 to extract the internal gas of the vacuum plate 501, so that the vacuum suction cup 502 forms a vacuum on the contact surface with the silicon wafer, thereby improving the adsorption effect and enhancing the stability of the silicon wafer during slicing.

[0038] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A positioning fixture for silicon wafer dicing, comprising a base plate (1), characterized in that: Two slide grooves (2) are provided at the top of the base plate (1), and a clamping assembly (3) is provided inside the two slide grooves (2). The clamping assembly (3) comprises a lead screw (301), a worm wheel (302) is provided in the middle of the circumferential outer wall of the lead screw (301), a worm (303) is meshed with the worm wheel (302), and a knob (304) is provided at one end of the worm (303), and sliders (305) are threadedly connected at both ends of the lead screw (301), and a limiting rod (306) is provided at the top of the two sliders (305), and a protective pad (307) is provided on the inner wall of one end of the two limiting rods (306), and a plurality of support columns (4) are provided at the top of the support columns (4), and an adsorption assembly (5) is provided at the top of each support column (4).

2. The positioning fixture for silicon wafer scribing according to claim 1, characterized in that: A screw rod (308) is threadedly connected to the bottom of one end of the limiting rod (306), a clamping rod (309) is provided on the top of the screw rod (308), and a clamping plate (310) is provided on the bottom of one side of the clamping rod (309).

3. The positioning fixture for silicon wafer scribing according to claim 2, characterized in that: The adsorption assembly (5) comprises a vacuum plate (501), a plurality of vacuum suction cups (502) are embedded on the top of the vacuum plate (501), a vacuum pump (503) is provided on the side wall of the vacuum plate (501), a pipe (504) connected to the inside of the vacuum plate (501) is provided at the output end of the vacuum pump (503), and the vacuum pump (503) is electrically connected to an external power supply.

4. The positioning fixture for silicon wafer scribing according to claim 3, characterized in that: The threads at both ends of the lead screw (301) are arranged in opposite directions, and the worm wheel (302) is located in a groove at the top of the base plate (1).

5. The positioning fixture for silicon wafer scribing according to claim 4, characterized in that: The material of the protective pad (307) is nitrile rubber, and the material of the abutting plate (310) is vulcanized rubber.

6. The positioning fixture for silicon wafer scribing according to claim 5, characterized in that: The plurality of support columns (4) are evenly distributed at the four corners of the top of the base plate (1), and the height of the support columns (4) is greater than the thickness of the limiting rod (306).

Images