Cooling system for control box of reactive power compensation device of charging station

Abstract

A charging station reactive power compensation device control box cooling system comprises a box body, a partition plate is arranged in the middle of the box body, the partition plate divides the interior of the box body into an air duct and an equipment cavity, the air duct is communicated with the bottom of the equipment cavity, a ventilation opening is formed in the upper portion of the partition plate, and a circulating fan is arranged at the ventilation opening. The heating face of the semiconductor chilling plate is attached to the inner side wall of the box body of the air channel and provided with cooling fins, and the refrigerating face of the semiconductor chilling plate is connected with refrigerating fins. The utility model provides a cooling system for a control box of a reactive power compensation device of a charging station, which adopts an internal circulation mode, prevents external dust from entering, realizes internal circulation of the control box, realizes uniform and controllable temperature, and is small in module size and relatively low in price. The problem of dust on the operation stability of devices in a control room is solved, and meanwhile the problem of cost increase caused by use of an industrial air conditioner is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of reactive power compensation, in particular to a cooling system for a control box of a reactive power compensation device of a charging station. Background Art

[0002] The dynamic reactive power compensation device of the charging station is divided into the control part and the power part. The power part is the main part that generates heat and is cooled by a special high-power radiator. The controller where the control department is located usually shares the power heat dissipation and uses forced air cooling to dissipate heat. In order to improve the operating stability of the control part and avoid interference from dust and moisture, some manufacturers use expensive industrial air conditioners to design the heat dissipation of the control room.

[0003] The existing reactive power compensation device of charging stations uses a common cooling duct for the control system and the power part, which will bring external pollution to the control panel, reducing the service life and stability of the control system. At the same time, the forced air cooling method will cause low temperature in the place where the wind circulates, and high temperature in the place where the wind does not circulate, resulting in uneven temperature distribution. The use of industrial air solves the problems of pollution and uneven temperature, but the air conditioner is expensive and too large, which ultimately leads to increased costs. Summary of the invention

[0004] The technical problem to be solved by the utility model is to provide a cooling system for a control box of a reactive power compensation device in a charging station, which adopts an internal circulation method to cool the control box of the reactive power compensation device.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a cooling system for a control box of a reactive power compensation device of a charging station, comprising a box body, a partition is provided in the middle of the box body, the partition divides the interior of the box body into an air duct and an equipment cavity, the air duct is connected to the bottom of the equipment cavity, a vent is provided on the upper part of the partition, and a circulating fan is provided at the vent;

[0006] The heating surface of the semiconductor refrigeration sheet is in contact with the inner wall of the air duct box body and is provided with heat dissipation fins. The cooling surface of the semiconductor refrigeration sheet is connected with the cooling fins.

[0007] Preferably, an IGBT module is provided on the side wall of the box below the semiconductor refrigeration plate, and the IGBT module is connected to the IGBT heat dissipation fins.

[0008] Preferably, it also includes a cooling system control board, and a temperature sensor is provided at the IGBT module. The temperature sensor is electrically connected to the input end of the MCU through a temperature acquisition circuit, and the output end of the MCU is electrically connected to the fan through a fan control circuit. The output end of the MCU is also electrically connected to the semiconductor refrigeration plate through a semiconductor refrigeration plate control circuit.

[0009] Preferably, the MCU is also electrically connected to the serial communication circuit.

[0010] The utility model provides a control box cooling system for a reactive power compensation device in a charging station. The system adopts an internal circulation method to avoid the entry of external dust, realizes internal circulation in the control box, and achieves uniform and controllable temperature. At the same time, the module is small in size and relatively low in price. The problem of dust affecting the operating stability of components in the control room is solved, and the cost increase caused by the use of industrial air conditioners is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 This is the structural block diagram of the control system of the utility model;

[0014] Figure 3 This is a control circuit diagram of a semiconductor refrigeration plate of the utility model. DETAILED DESCRIPTION

[0015] like Figure 1 As shown, a cooling system for a control box of a reactive power compensation device of a charging station includes a box body 1, a partition 9 is provided in the middle of the box body 1, the partition 9 divides the interior of the box body 1 into an air duct 11 and an equipment cavity 8, the air duct 11 is connected to the bottom of the equipment cavity 8, a vent is provided on the upper part of the partition 9, and a circulating fan 2 is provided at the vent;

[0016] The heating surface of the semiconductor cooling plate 3 is in contact with the inner wall of the air duct 11 and is provided with heat dissipation fins 4. The cooling surface of the semiconductor cooling plate 3 is connected with cooling fins 5. The equipment cavity 8 is used to place primary devices, switches, filter inductors, capacitors, connecting reactors, and secondary wiring.

[0017] Preferably, an IGBT module 7 is provided on the side wall of the box body 1 below the semiconductor cooling sheet 3, and the IGBT module 7 is connected to the IGBT heat sink fin 6. Separating the IGBT module 7 from other devices improves the heat dissipation efficiency on the one hand, and reduces the influence of the heat emitted by the IGBT module 7 on other devices on the other hand.

[0018] Preferably, Figure 2 As shown, it also includes a cooling system control board 10, and a temperature sensor 12 is provided at the IGBT module 7. The temperature sensor 12 is electrically connected to the input end of the MCU 13 through a temperature acquisition circuit 14, and the output end of the MCU 13 is electrically connected to the fan 2 through a fan control circuit 15. The output end of the MCU 13 is also electrically connected to the semiconductor cooling plate 3 through a semiconductor cooling plate control circuit 16.

[0019] Preferably, the MCU 13 is also electrically connected to the serial communication circuit 17 .

[0020] When in use, the cooling system control board 10 collects 12 temperature sensor values, and the collected values ​​are calculated by the MCU 13 to control the semiconductor refrigeration plate 3 to output the cooling capacity corresponding to the power, and then the cold air is brought into the entire control box through the circulating fan 2, so as to ensure the constant temperature in the entire control box. The circulating fan 2 is a fan with adjustable wind speed, and its speed is controlled by PWM to control the wind speed. The semiconductor refrigeration plate 3 is also pulse-width modulated through temperature feedback to achieve linear output of cooling capacity.

[0021] The working principle of the cooling system control panel is as follows Figure 2 As shown, its working principle is to collect the temperature data of the external 18B20 through the temperature acquisition circuit 14 and send it to the microprocessor MCU, which obtains the control signal through the benchmark comparison, coordinates the power output through the semiconductor refrigerator control circuit 16 and the fan control circuit 19 15, and then closes the loop again through the temperature acquisition circuit 14, and finally realizes the uniform balance of the temperature of the entire controller.

[0022] Semiconductor cooler control circuit Figure 3 As shown, its input comes from the cooling system control board, then passes through the current limiting resistor 19, and then through the high-speed optical coupler 18 level conversion and voltage isolation, and then passes through the filter capacitor 20 to enter the power electronic switch 21 to output the corresponding pulse signal, and is connected to the semiconductor refrigerator through the terminal 23. Since the external inductive element will need a current loop after the power electronic switch 21 is turned off, the freewheeling diode 22 is used as a freewheeling channel for the external inductive component.

[0023] The above embodiments are only preferred technical solutions of the present invention and should not be regarded as limitations of the present invention. The protection scope of the present invention shall be the technical solutions recorded in the claims, including equivalent replacement solutions of the technical features in the technical solutions recorded in the claims. That is, equivalent replacement improvements within this scope are also within the protection scope of the present invention.

Claims

1. A cooling system for a control box of a reactive power compensation device in a charging station, comprising a box (1), characterized in that: A partition (9) is provided in the middle of the box body (1), the partition (9) divides the interior of the box body (1) into an air duct (11) and an equipment chamber (8), the air duct (11) is connected to the bottom of the equipment chamber (8), a vent is provided on the upper part of the partition (9), and a circulating fan (2) is provided at the vent; The heating surface of the semiconductor refrigeration sheet (3) is in contact with the inner wall of the box body of the air duct (11) and is provided with heat dissipation fins (4). The cooling surface of the semiconductor refrigeration sheet (3) is connected to cooling fins (5).

2. According to claim 1, a cooling system for a control box of a reactive power compensation device of a charging station, characterized in that: An IGBT module (7) is provided on the side wall of the box body (1) below the semiconductor cooling sheet (3), and the IGBT module (7) is connected to the IGBT heat dissipation fins (6).

3. According to claim 2, a cooling system for a control box of a reactive power compensation device of a charging station, characterized in that: It also includes a cooling system control board (10), a temperature sensor (12) is provided at the IGBT module (7), the temperature sensor (12) is electrically connected to the input end of the MCU (13) via a temperature acquisition circuit (14), the output end of the MCU (13) is electrically connected to the fan (2) via a fan control circuit (15), and the output end of the MCU (13) is also electrically connected to the semiconductor cooling plate (3) via a semiconductor cooling plate control circuit (16).

4. According to claim 3, a cooling system for a control box of a reactive power compensation device of a charging station, characterized in that: The MCU (13) is also electrically connected to the serial communication circuit (17).

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