Ultrafine flexible double-sided circuit board for medical equipment

Abstract

The utility model provides an ultra-fine flexible double-sided circuit board for medical equipment, which comprises a substrate layer, the front and back of the substrate layer are both provided with conductive connection lines, the substrate layer is provided with an upper substrate copper layer, a substrate and a lower substrate copper layer from top to bottom, the upper substrate copper layer and the lower substrate copper layer are both tightly attached to the surface of the substrate, and the substrate copper layer is provided with a plurality of conductive connection lines. A plurality of blind holes are formed between the base material copper layer and the base material, the upper surface and the lower surface of each blind hole are respectively plated with a copper layer, the upper base material copper layer and the lower base material copper layer are electrically connected through the copper layers, and the front face and the back face of the base plate layer are respectively connected with a front face protection layer and a back face protection layer. According to the utility model, the plurality of blind holes are arranged between the base material copper layer and the base material, the hollow areas of the blind holes are filled with the electro-coppering, the electro-coppering enables the upper base material copper layer and the lower base material copper layer to be electrically connected, the total thickness of the circuit board just reaches 50 microns, and the requirements of the circuit board for the medical equipment, which is provided with the through holes with the line width of 100 microns and the line width of less than 50 microns, are met.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an ultra-fine and flexible double-sided circuit board used for medical equipment. Background Art

[0002] With the continuous development of science and technology, medical equipment is moving towards a more miniaturized and sophisticated direction, and the thin, soft and light characteristics of flexible circuit boards are very suitable for the development needs of medical mechanical equipment.

[0003] The most special feature of flexible circuit boards is that they are thin and soft, but there is no limit to how thin they can be. The manufacturing process of flexible circuit boards in the prior art is: drilling-copper plating-circuit-covering film-immersion gold-copper plating-outline. Since flexible circuit boards need to be drilled and copper plated during production, but most of them are copper plated on the entire board, the material thickness is already 30μm + 20μm added after copper electroplating + 50μm double-sided covering film, and the total thickness is already 100μm, resulting in the thickness of the entire flexible circuit board being too large, but the market requires a total thickness of less than 50μm, and the actual produced flexible circuit boards are not convenient for actual use in medical devices in terms of thickness. The current flexible circuit boards still have room for improvement to be more suitable for use in medical devices; in addition, the formation of through holes requires drilling holes with a diameter of 40μm on a line with a line width of 100μm, and the offset must be less than 30μm. The runout tolerance during laser drilling, the expansion and contraction of the material, and the tolerance of the exposure machine when forming the line will cause the hole to deviate from the line and cause product defects. Summary of the invention

[0004] The utility model aims to provide an ultra-fine and flexible double-sided circuit board for medical equipment in view of the deficiencies of the prior art, which has the advantages of smaller line width and thinner thickness.

[0005] The technical solution adopted by the utility model is as follows:

[0006] An ultra-fine and dense flexible double-sided circuit board for medical equipment comprises a substrate layer, the front and back sides of the substrate layer are both provided with conducting circuits, the substrate layer comprises an upper substrate copper layer, a substrate and a lower substrate copper layer, the upper substrate copper layer, the substrate and the lower substrate copper layer are arranged in sequence from top to bottom, the upper substrate copper layer and the lower substrate copper layer are both tightly fitted to the surface of the substrate, a plurality of blind holes are arranged between the upper substrate copper layer and the substrate, the upper and lower surfaces of the blind holes are plated with a copper layer, the copper layer electrically connects the upper substrate copper layer and the lower substrate copper layer, and the front and back sides of the substrate layer are respectively connected with a front protective layer and a back protective layer.

[0007] Furthermore, a plurality of conducting lines are arranged on the substrate layer, and the plurality of conducting lines are arranged parallel to each other, the line width of the conducting lines is 100 μm, and the line distance between the conducting lines is 60 μm.

[0008] Furthermore, the substrate is made of PI polymer material with a thickness of 12 μm, and the thickness of the upper substrate copper layer and the lower substrate copper layer are both 9 μm.

[0009] Furthermore, the copper layer electroplated on the surface of the blind hole has a thickness of 4-5 μm.

[0010] Furthermore, the front protective layer includes a first covering film and a first covering film glue, and the first covering film and the first covering film glue are arranged in sequence from top to bottom.

[0011] Furthermore, the first covering film is made of PI polymer material, and its thickness is 5 μm; the first covering film glue is made of AD glue, and its thickness is 5 μm.

[0012] Furthermore, the back protective layer includes a second covering film and a second covering film glue, and the second covering film and the second covering film glue are arranged in sequence from bottom to top.

[0013] Furthermore, the second covering film is made of PI polymer material, and its thickness is 5 μm; the second covering film glue is made of AD glue, and its thickness is 5 μm.

[0014] Compared with the prior art, the utility model has the following advantages:

[0015] The utility model has a simple structure and a reasonable design. A plurality of blind holes are arranged between the substrate copper layer and the substrate, and the hollow areas of the blind holes are filled with electroplated copper. The electroplated copper electrically connects the upper substrate copper layer and the lower substrate copper layer to allow current to pass through. In addition, the blind hole electroplating increases the surface copper by only 4-5 μm, and the copper increased by electroplating can be removed by microetching. Since the blind holes are filled, the conduction performance is not affected and the board thickness is not increased. The total thickness of the circuit board just reaches 50 μm, meeting the process requirements. The above structure meets the requirements for circuit boards for medical equipment with a through hole line width of 100 μm and a line width of less than 50 μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attached Figure 1 It is a front view cross-sectional structural diagram of the ultra-fine and dense flexible double-sided circuit board for medical equipment described in the utility model;

[0017] Attached Figure 2 It is a front plan view of the structure of the ultra-fine and dense flexible double-sided circuit board for medical equipment described in the utility model. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The utility model will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0019] like Figure 1 , Figure 2 As shown, an ultra-fine and dense flexible double-sided circuit board for medical equipment includes a substrate layer 1, and the front and back sides of the substrate layer 1 are both provided with conductive lines 2. A plurality of conductive lines 2 are provided on the substrate layer 1, and the plurality of conductive lines 2 are arranged parallel to each other. The line width of the conductive lines 2 is 100 μm, and the line spacing between the conductive lines 2 is 60 μm, so that it can be well connected to the internal circuit of the medical device and ensure the safety of the connection. The front and back sides of the substrate layer 1 are respectively connected with a front protective layer 3 and a back protective layer 4, and the front protective layer 3 and the back protective layer 4 protect the front and back sides of the flexible circuit board respectively. The thickness of the front protective layer 3 and the back protective layer 4 are both 10 μm. Through the front protective layer 3 and the back protective layer 4, the flexible circuit board will not be easily damaged by the internal structure of the medical device when connected to the inside of the medical device.

[0020] The substrate layer 1 includes an upper substrate copper layer 11, a substrate 12 and a lower substrate copper layer 13, which are arranged in sequence from top to bottom, and the upper substrate copper layer 11 and the lower substrate copper layer 13 are both tightly attached to the surface of the substrate 12, wherein the substrate 12 is made of PI polymer material with a thickness of 12 μm, and the thickness of the upper substrate copper layer 11 and the lower substrate copper layer 13 are both 9 μm.

[0021] A plurality of blind holes 5 are arranged between the upper substrate copper layer 11 and the substrate 12. The aperture of the blind holes 5 is 40 μm. The blind holes are used to connect the wires between the substrate copper layer 11 and the substrate 12. The upper and lower surfaces of the blind holes are plated with a copper layer of 4-5 μm. The selective plating process is adopted during electroplating to reduce the overall thickness of the flexible circuit board, so that the flexible circuit board will not have the problem of excessive thickness when connected with the medical device; the hollow area of ​​the blind hole is filled with electroplated copper, and the electroplated copper layer electrically connects the upper substrate copper layer 11 and the lower substrate copper layer 13 to allow current to pass. In addition, the electroplating of the blind hole increases the surface copper by only 4-5 μm, and the copper increased by electroplating can be removed by micro-etching. Since the blind hole is filled, the conductive performance is not affected and the board thickness is not increased, which meets the process requirements.

[0022] The front protective layer 3 includes a first covering film 31 and a first covering film glue 32, which are arranged in sequence from top to bottom. The first covering film 31 is a PI polymer material with a thickness of 5 μm, and the first covering film glue 32 is an AD glue with the same thickness as the first covering film 31, both of which are 5 μm. The two are combined and connected to protect the front side of the flexible circuit board.

[0023] The back protective layer 4 includes a second covering film 41 and a second covering film glue 42, which are arranged in sequence from bottom to top, and the structure of the back protective layer 4 is exactly the same as that of the front protective layer 3. The second covering film 41 is made of PI polymer material with a thickness of 5μm, and the second covering film glue 42 is made of AD glue with the same thickness as the second covering film 41, both of which are 5μm. The two are combined and connected to protect the front side of the flexible circuit board.

[0024] The utility model has a simple structure and a reasonable design. A plurality of blind holes are arranged between the substrate copper layer and the substrate, and the hollow areas of the blind holes are filled with electroplated copper. The electroplated copper electrically connects the upper substrate copper layer and the lower substrate copper layer to allow current to pass through. In addition, the blind hole electroplating increases the surface copper by only 4-5 μm, and the copper increased by electroplating can be removed by microetching. Since the blind holes are filled, the conduction performance is not affected and the board thickness is not increased. The total thickness of the circuit board just reaches 50 μm, meeting the process requirements. The above structure meets the requirements for circuit boards for medical equipment with a through hole line width of 100 μm and a line width of less than 50 μm.

[0025] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An ultra-fine and flexible double-sided circuit board for medical equipment, comprising a substrate layer (1), wherein the front and back sides of the substrate layer (1) are both provided with conductive circuits (2), characterized in that: The substrate layer (1) comprises an upper substrate copper layer (11), a substrate (12) and a lower substrate copper layer (13), wherein the upper substrate copper layer (11), the substrate (12) and the lower substrate copper layer (13) are arranged in sequence from top to bottom, and the upper substrate copper layer (11) and the lower substrate copper layer (13) are both tightly attached to the surface of the substrate (12), a plurality of blind holes (5) are arranged between the upper substrate copper layer (11) and the substrate (12), and a copper layer is plated on the upper and lower surfaces of the blind holes (5), and the copper layer electroplated on the surface of the blind holes has a thickness of 4-5 μm, and the copper layer electrically connects the upper substrate copper layer (11) and the lower substrate copper layer (13), and the front and back surfaces of the substrate layer (1) are respectively connected to a front protective layer (3) and a back protective layer (4).

2. The ultra-fine and dense flexible double-sided circuit board for medical equipment according to claim 1, characterized in that: A plurality of conducting circuits (2) are arranged on the substrate layer (1), and the plurality of conducting circuits (2) are arranged parallel to each other. The line width of the conducting circuits (2) is 100 μm, and the line spacing between the conducting circuits (2) is 60 μm.

3. The ultra-fine flexible double-sided circuit board for medical equipment according to claim 1, characterized in that: The substrate (12) is made of PI polymer material and has a thickness of 12 μm. The thickness of the upper substrate copper layer (11) and the lower substrate copper layer (13) are both 9 μm.

4. The ultra-fine flexible double-sided circuit board for medical equipment according to claim 1, characterized in that: The front protective layer (3) comprises a first covering film (31) and a first covering film glue (32), and the first covering film (31) and the first covering film glue (32) are arranged in sequence from top to bottom.

5. The ultra-fine flexible double-sided circuit board for medical equipment according to claim 4, characterized in that: The first covering film (31) is made of PI polymer material and has a thickness of 5 μm. The first covering film glue (32) is made of AD glue and has a thickness of 5 μm.

6. The ultra-fine and dense flexible double-sided circuit board for medical equipment according to claim 1, characterized in that: The back protective layer (4) comprises a second covering film (41) and a second covering film glue (42), and the second covering film (41) and the second covering film glue (42) are arranged in sequence from bottom to top.

7. The ultra-fine flexible double-sided circuit board for medical equipment according to claim 6, characterized in that: The second covering film (41) is made of PI polymer material and has a thickness of 5 μm. The second covering film glue (42) is made of AD glue and has a thickness of 5 μm.

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