Heat dissipation structure of audio equipment

Abstract

The utility model relates to the field of audio equipment, in particular to a heat dissipation structure of audio equipment, which is characterized by comprising a metal groove strip and at least one heat dissipation fan, one surface of the metal groove strip is open, an inner groove of the metal groove strip forms a heat dissipation groove for mounting a circuit board, and two ends of the heat dissipation groove penetrate to the outer wall of the metal groove strip. And the heat dissipation fan is arranged on a notch of the heat dissipation groove. According to the utility model, not only can the heat dissipation performance be greatly improved, but also the electromagnetic interference can be reduced, so that the audio equipment has better use performance, and the audio equipment has the advantages of simple structure, low manufacturing difficulty, good heat dissipation effect and the like.

Description

Technical Field

[0001] The utility model relates to the field of audio equipment, in particular to a heat dissipation structure of audio equipment. Background Art

[0002] At present, with the improvement of people's living standards, the demand for audio equipment (such as power amplifiers, multimedia machines, speakers, etc.) is also increasing. In the existing audio equipment, most of the circuit modules that realize different functions are respectively set on different circuit boards (for example: China's authorization announcement number CN204119517U and other patent documents disclosed), and the circuit boards are set in the same large casing. In order to meet the heat dissipation requirements, through holes are generally opened on the casing, and heat dissipation fans are set on the through holes to achieve heat dissipation. Since the existing casing is generally made larger, and the electronic components on each circuit board are easy to affect the air flow, it is easy to cause the heat dissipation air to be difficult to effectively act on each electronic component, which is easy to cause high heat to be unable to be effectively removed, and then it is easy to cause poor heat dissipation performance; at the same time, the circuit boards are set in the same large casing, which is easy to generate electromagnetic interference between the circuit modules; so the use performance of the existing audio equipment is poor.

[0003] Therefore, it is very necessary to design a heat dissipation structure of an audio device to solve the above technical problems. Utility Model Content

[0004] The purpose of the utility model is to solve the above-mentioned problems and shortcomings and to provide a heat dissipation structure of an audio device, which can not only greatly improve the heat dissipation performance, but also reduce the effect of electromagnetic interference, thereby enabling the audio device to have better performance. The utility model has the advantages of simple structure, low manufacturing difficulty, good heat dissipation effect, etc.

[0005] The technical solution of the utility model is achieved in this way:

[0006] A heat dissipation structure of an audio device, characterized in that it includes a metal slot bar with an open side and at least one heat dissipation fan, wherein the inner groove of the metal slot bar constitutes a heat dissipation groove for installing a circuit board, the two ends of the heat dissipation groove penetrate the outer wall of the metal slot bar, and the heat dissipation fan is arranged on the notch of the heat dissipation groove.

[0007] Preferably, a positioning plate is provided on the notch of the heat dissipation slot, and the heat dissipation fan is connected to the notch of the heat dissipation slot through the positioning plate.

[0008] Preferably, two ends of the positioning plate are respectively connected to two notch edges of the heat dissipation slot, a ventilation hole penetrating into the heat dissipation slot is opened on the outer wall of the positioning plate, and the heat dissipation fan is arranged on the ventilation hole.

[0009] Preferably, at least one end of the positioning plate is bent toward the inside of the heat dissipation slot to form a reinforcement strip.

[0010] Preferably, the positioning plate is a metal mesh plate.

[0011] Preferably, an elastic pressing sheet for pressing the chip tightly against the slot wall is provided on the slot wall of the heat dissipation slot.

[0012] Preferably, a mounting notch is provided on the notch of the heat dissipation slot, a second bolt is embedded in the mounting notch, and the elastic pressing sheet is locked on the metal slot bar by the second bolt.

[0013] Preferably, the metal slot includes a horizontal strip and two vertical strips, the lower ends of the two vertical strips are respectively connected to the front and rear ends of the horizontal strip, and the heat dissipation groove is formed between the two vertical strips.

[0014] Preferably, the metal channel bar is composed of metal strips bent in the same direction at both ends in the width direction.

[0015] Preferably, at least one fixing notch is formed on the metal channel bar.

[0016] The beneficial effects of the utility model are as follows: in the heat dissipation structure, a metal slot bar with an open side is adopted, and the inner slot of the metal slot bar constitutes a heat dissipation slot for installing the circuit board, and the two ends of the heat dissipation slot are penetrated to the outer wall of the metal slot bar, and the heat dissipation fan is arranged on the notch of the heat dissipation slot. This can not only utilize the metal slot bar to absorb heat, but also facilitate the air flow generated by the heat dissipation fan to act on the circuit board in the heat dissipation slot stably and accurately, so that the heat dissipation air can effectively act on the electronic components of the circuit board, so as to effectively remove high heat, which can achieve a very good heat dissipation effect; and such a metal slot bar can also play a role in reducing electromagnetic interference; the heat dissipation structure can help the audio equipment have better performance. At the same time, the overall structure of the heat dissipation structure is relatively simple, and its manufacturing difficulty is relatively low. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the heat dissipation structure in the utility model.

[0018] Figure 2 It is a schematic diagram of the split structure of the heat dissipation structure in the utility model.

[0019] Figure 3 It is a schematic diagram of the three-dimensional structure of the metal slot in the utility model. DETAILED DESCRIPTION

[0020] like Figures 1 to 3As shown, the heat dissipation structure of an audio device described in the utility model comprises a metal slot bar 1 with an opening on one side and at least one heat dissipation fan 2, wherein the inner slot of the metal slot bar 1 constitutes a heat dissipation slot 11 for mounting a circuit board, both ends of the heat dissipation slot 11 penetrate the outer wall of the metal slot bar 1, and the heat dissipation fan 2 is arranged on the notch of the heat dissipation slot 11.

[0021] In the heat dissipation structure, a metal slot bar 1 with an open side is used, and the inner slot of the metal slot bar 1 constitutes a heat dissipation slot 11 for installing the circuit board, and the two ends of the heat dissipation slot 11 are penetrated to the outer wall of the metal slot bar 1, and the heat dissipation fan 2 is set on the notch of the heat dissipation slot 11. This can not only utilize the metal slot bar 1 to absorb heat, but also facilitate the air flow generated by the heat dissipation fan 2 to act on the circuit board in the heat dissipation slot 11 stably and accurately, so that the heat dissipation air can effectively act on the electronic components of the circuit board, so as to effectively remove high heat, which can achieve a very good heat dissipation effect; and such a metal slot bar 1 can also play a role in reducing electromagnetic interference; this heat dissipation structure can help the audio equipment have better performance. At the same time, the overall structure of the heat dissipation structure is relatively simple, and its manufacturing difficulty is relatively low.

[0022] like Figure 1 As shown, in the actual manufacturing process, the width and length of the metal slot 1 are determined according to the size of the circuit board, and the number of the heat dissipation fans 2 is determined according to the width and length of the metal slot 1, so as to meet the actual manufacturing and use requirements.

[0023] like Figure 1 and Figure 2 As shown, a positioning plate 3 is provided on the notch of the heat dissipation slot 11, and the heat dissipation fan 2 is connected to the notch of the heat dissipation slot 11 through the positioning plate 3. In this way, the heat dissipation fan 2 can be conveniently installed and positioned, thereby facilitating the convenience of assembly.

[0024] like Figure 1 and Figure 2 As shown, the two ends of the positioning plate 3 are respectively connected to the two notch edges of the heat dissipation slot 11, and the outer wall of the positioning plate 3 is provided with a ventilation hole 31 penetrating into the heat dissipation slot 11, and the heat dissipation fan 2 is arranged on the ventilation hole 31. This can help improve the stability and reliability of the installation and positioning of the positioning plate 3, which can not only help improve the stability and reliability of the installation and positioning of the heat dissipation fan 2, but also enable the heat dissipation fan 2 to play a more stable and reliable heat dissipation role, thereby helping to further improve the reliability and applicability of the heat dissipation structure.

[0025] like Figure 1 and Figure 2As shown, in the actual manufacturing process, the heat dissipation fan 2 can be used to blow air into the heat dissipation slot 11, and the heat dissipation fan 2 can also be used to absorb the heat in the heat dissipation slot 11. Both methods can meet the heat dissipation requirements and can be selected according to the actual heat dissipation size.

[0026] like Figure 2 As shown, at least one end of the positioning plate 3 is bent toward the inside of the heat dissipation slot 11 to form a reinforcing strip 32. This can help improve the structural strength of the positioning plate 3, so that the positioning plate 3 can have a more stable and reliable positioning effect on the heat dissipation fan 2.

[0027] like Figure 1 and Figure 2 As shown, the positioning plate 3 is a metal mesh plate, which not only enables the positioning plate 3 to have a high structural strength, but also plays a certain role in heat absorption and shielding, thereby helping to further improve the performance of the heat dissipation structure.

[0028] like Figure 1 and Figure 2 As shown, a connecting lug 33 is provided on the end of the positioning plate 3, and the connecting lug 33 is fixed to the metal slot bar 1 by a first bolt 10 or a screw. In this way, the installation and positioning requirements of the positioning plate 3 can be met.

[0029] like Figure 2 and Figure 3 As shown, the slot wall 111 of the heat dissipation slot 11 is provided with an elastic pressing piece 4 for pressing the chip against the slot wall 111. In this way, when the chip 101 is arranged on the circuit board 100, the chip 101 can be pressed against the slot wall 111 by the elastic pressing piece 4, which can facilitate the heat generated by the chip 101 to be quickly transferred to the metal slot bar 1, thereby achieving the purpose of reducing the chip temperature.

[0030] In the actual assembly process, a thermally conductive adhesive pad (not shown) can be sandwiched between the chip 101 and the slot wall 111 , which not only ensures very good heat dissipation, but also plays a role of flexible squeezing to avoid crushing the chip 101 .

[0031] like Figure 2 and Figure 3 As shown, the notch of the heat sink 11 is provided with a mounting notch 112, and a second bolt 20 is embedded in the mounting notch 112, and the elastic pressing piece 4 is locked to the metal slot bar 1 by the second bolt 20. This not only ensures that the installation and positioning of the elastic pressing piece 4 is very stable, but also facilitates the disassembly and assembly of the elastic pressing piece 4, thereby facilitating maintenance.

[0032] like Figure 2 and Figure 3As shown, in the actual manufacturing process, the same number of elastic pressing plates 4 and second bolts 20 can be set according to the number of chips 101 that need to be close to the groove wall 111 for heat dissipation; and the number of installation notches 112 is selected according to the disassembly requirements, so as to meet the actual manufacturing and use requirements.

[0033] like Figure 3 As shown, the metal slot bar 1 includes a horizontal strip 12 and two vertical strips 13, the lower ends of the two vertical strips 13 are respectively connected to the front and rear ends of the horizontal strip 12, and the heat dissipation slot 11 is formed between the two vertical strips 13. Such a metal slot bar 1 is very simple and applicable, which is not only convenient for manufacturing, but also convenient for horizontally installing the circuit board 100, thereby improving the convenience and stability of the circuit board installation and positioning.

[0034] like Figure 2 and Figure 3 As shown, in the actual manufacturing process, the circuit board 100 is arranged in the heat dissipation groove 11, and the circuit board 100 is fixed to the horizontal strip 12 by screws or bolts (not shown in the figure), so that the requirement of stable installation of the circuit board 100 can be met.

[0035] like Figure 2 As shown, in the actual manufacturing process, the second bolt 20 can also be directly used to pass through the vertical slats 13 and the elastic pressing sheet 4 to lock the elastic pressing sheet 4, which can also meet the requirement of stably fixing the elastic pressing sheet 4.

[0036] like Figure 3 As shown, the metal channel bar 1 is composed of metal strips bent in the same direction at both ends in the width direction, which not only enables the metal channel bar 1 to have high structural strength, but also helps to improve the manufacturing efficiency of the metal channel bar 1.

[0037] like Figure 3 As shown, the metal slot bar 1 is provided with at least one fixing notch 14. The fixing notch 14 can be passed through by screws or bolts, which not only facilitates the installation and positioning of the metal slot bar 1 by screws or bolts, but also facilitates disassembly and assembly, thereby improving the convenience of maintenance.

[0038] In actual use, the heat dissipation structure is arranged in the casing of the audio device, and ventilation holes facing the heat dissipation fan 2 and the two ends of the heat dissipation groove 11 are respectively opened on the casing, so that the audio device can dissipate heat and reduce electromagnetic interference, thereby meeting the needs of actual use.

Claims

1. A heat dissipation structure of an audio device, characterized in that: It comprises a metal slot bar (1) with an opening on one side and at least one heat dissipation fan (2), wherein the inner slot of the metal slot bar (1) forms a heat dissipation slot (11) for mounting a circuit board, both ends of the heat dissipation slot (11) penetrate the outer wall of the metal slot bar (1), and the heat dissipation fan (2) is arranged on the slot opening of the heat dissipation slot (11).

2. The heat dissipation structure of the audio device according to claim 1, characterized in that: A positioning plate (3) is provided on the notch of the heat dissipation slot (11), and the heat dissipation fan (2) is connected to the notch of the heat dissipation slot (11) via the positioning plate (3).

3. The heat dissipation structure of the audio device according to claim 2, characterized in that: The two ends of the positioning plate (3) are respectively connected to the two notch edges of the heat dissipation groove (11); a ventilation hole (31) penetrating into the heat dissipation groove (11) is provided on the outer wall of the positioning plate (3); and the heat dissipation fan (2) is arranged on the ventilation hole (31).

4. The heat dissipation structure of the audio device according to claim 2, characterized in that: At least one end of the positioning plate (3) is bent toward the inside of the heat dissipation groove (11) to form a reinforcement strip (32).

5. The heat dissipation structure of the audio device according to any one of claims 2 to 4, characterized in that: The positioning plate (3) is a metal mesh plate.

6. The heat dissipation structure of the audio device according to claim 1, characterized in that: An elastic pressing sheet (4) for pressing the chip tightly against the slot wall (111) is provided on the slot wall (111) of the heat dissipation slot (11).

7. The heat dissipation structure of the audio device according to claim 6, characterized in that: The notch of the heat dissipation slot (11) is provided with a mounting notch (112), a second bolt (20) is embedded in the mounting notch (112), and the elastic pressing sheet (4) is locked to the metal slot bar (1) by the second bolt (20).

8. The heat dissipation structure of the audio device according to claim 1, characterized in that: The metal slot bar (1) comprises a horizontal strip (12) and two vertical strips (13), the lower ends of the two vertical strips (13) are respectively connected to the front and rear ends of the horizontal strip (12), and the heat dissipation slot (11) is formed between the two vertical strips (13).

9. The heat dissipation structure of the audio device according to claim 1 or 8, characterized in that: The metal slot bar (1) is composed of metal strips bent in the same direction at both ends in the width direction.

10. The heat dissipation structure of the audio device according to claim 1, characterized in that: At least one fixing notch (14) is provided on the metal slot (1).

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