Quick and automatic marking machine for PCB (Printed Circuit Board) circuit defects

Abstract

The utility model belongs to the technical field of circuit board manufacturing, and relates to a PCB (printed circuit board) line defect rapid automatic mark drawing machine which comprises a feeding area, a discharging area, a feeding unit, a discharging unit and a mark drawing unit, the feeding unit moves a PCB into the mark drawing unit from the feeding area, the mark drawing unit draws marks on false points on the PCB, and the discharging unit discharges the marks on the false points on the PCB. And the discharging unit is used for moving the marked PCBs from the marking unit to a discharging area. According to the method, most of false points can be eliminated by using the AI information processing module, meanwhile, real points and unidentified false points are directly circled by using the automatic marking machine, the circling efficiency of the automatic equipment is high, the original defect marking by personnel is avoided, and the time is saved; and a maintainer only needs to carry out secondary confirmation on the abnormal point positions, so that the identification time of the maintainer is remarkably shortened, only the position of the real point is repaired, and the qualified rate of the PCB is ensured. And the balance between the compression detection processing period and the guarantee of the product percent of pass is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board manufacturing, in particular to a PCB circuit defect fast automatic marking machine. Background Art

[0002] In the production process of PCB (Printed Circuit Board), semi-finished products need to be inspected for circuit defects. Generally, AOI (Automated Optical Inspection) is first performed on the circuit surface, and then VRS (Virtual Rescan) is used to judge the true and false defects and mark them with a marker, such as circuit gaps and short circuits between circuits. With the development of science and technology, especially the rise of AI, the application of PCB manufacturing inspection has become very mature and widespread, and AI defect screening is almost the same as manual.

[0003] Ideally, after AI defect screening and filtering, only true points are retained at the actual defect locations of VRS, and repairs are only made for true points. However, the situations of true points and false points are ever-changing, and there will always be missed detection rates. Chinese patent CN114418980A discloses a deep learning method for printed circuit board defect recognition. This method adjusts the weights of subtle defects in the deep learning model to improve the detection rate of subtle defects. However, this method is an operation independent of the detection process. Even if deep learning is required, it must be based on performance testing or manual screening, and it does not contribute to accelerating the efficiency of the detection process itself.

[0004] Therefore, a new PCB detection and processing method is needed to overcome the above problems. Utility Model Content

[0005] A main purpose of the utility model is to provide a PCB circuit defect fast automatic marking machine, which can quickly mark abnormal points according to the AOI automatic optical inspection results, replacing the industry's traditional operation mode of manual marking by VRS.

[0006] The utility model achieves the above-mentioned purpose through the following technical solutions: a PCB circuit defect fast automatic marking machine, comprising a loading area, a unloading area, a loading unit, an unloading unit and a marking unit, wherein the loading area stacks PCB boards whose AOI automatic optical inspection results contain false points, and the marking unit is divided into a first working position and a second working position, wherein the loading unit moves the PCB board from the loading area to the first working position, the marking unit marks the false points on the PCB board, and the unloading unit moves the marked PCB board from the second working position to the unloading area;

[0007] The marking unit includes a translation adsorption platform, a first translation module that drives the translation adsorption platform to move from a first working position to a second working position, and a first surface marking component fixed between the first working position and the second working position. A plurality of adsorption holes are arranged on the upper surface of the translation adsorption platform. The first surface marking component includes a fixed beam located above the upper surface of the translation adsorption platform and a plurality of first surface marking heads arranged along the length direction of the fixed beam.

[0008] Specifically, the marking unit also includes a flipping adsorption table located at the second working position, a flipping mechanism that drives the flipping adsorption table to flip up and down 180 degrees, a second translation module parallel to the first translation module, and a second surface marking component that passes over the flipping adsorption table in a horizontal posture under the drive of the second translation module, and a plurality of adsorption holes are arranged on the front and back sides of the flipping adsorption table; the second surface marking component includes a moving beam parallel to the fixed beam and a plurality of second surface marking heads arranged along the length direction of the moving beam, and the second surface marking component can be translated to outside the flipping range of the flipping adsorption table.

[0009] Furthermore, at least one X-direction reference convex edge and one Y-direction reference convex edge are provided on the adsorption surface of the translation adsorption platform.

[0010] Furthermore, the first surface marking heads are arranged in two rows alternately front and back on the fixed beam, and the center distances of adjacent first surface marking heads in the same row are both twice the preset marking distance.

[0011] Furthermore, at least one X-direction reference convex edge and one Y-direction reference convex edge are provided on the adsorption surface of the flip adsorption platform.

[0012] Furthermore, the second surface marking heads are arranged in two rows alternately front and back on the moving beam, and the center distances of adjacent second surface marking heads in the same row are both twice the preset marking distance.

[0013] Furthermore, it also includes a paper partition moving unit, the loading area and the unloading area are located at adjacent positions in the Y direction, and the paper partition moving unit includes a paper partition moving module straddling above the loading area and the unloading area, a paper partition lifting module moving along the Y direction driven by the paper partition moving module, and a paper partition suction and release mechanism driven to be lifted and lowered by the paper partition lifting module.

[0014] Furthermore, the loading unit and the unloading unit both include an X-direction translation module, an angle adjustment mechanism driven by the X-direction translation module to move along the X-direction, and a suction head mechanism whose angle is adjusted around a vertical axis by the angle adjustment mechanism.

[0015] The beneficial effects of the technical solution of the utility model are:

[0016] This automatic marking machine can automatically and quickly complete non-false point marking. The mechanical marking efficiency is high, which saves the time of manual marking. It replaces the industry's traditional operation mode of manual marking through VRS. The automatic equipment has high efficiency in marking. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A three-dimensional diagram of the main components of the automatic marking machine of the embodiment;

[0018] Figure 2 It is a top view of the main components of the automatic marking machine of the embodiment;

[0019] Figure 3 A three-dimensional image of the marking unit;

[0020] Figure 4 is a three-dimensional diagram of the loading unit;

[0021] Figure 5 A three-dimensional diagram of a paper separation moving unit;

[0022] Figure 6 This is a flow chart of PCB board detection processing.

[0023] The numbers in the figure represent:

[0024] 1- Loading area;

[0025] 2- Unloading area;

[0026] 3a-loading unit, 3b-unloading unit, 31-X-axis translation module, 32-angle adjustment mechanism, 33-suction head mechanism;

[0027] 4-marking unit, 4a-first working position, 4b-second working position, 41-translation adsorption platform, 42-first translation module, 43-first surface marking assembly, 431-fixed beam, 432-first surface marking head, 44-flipping adsorption platform, 45-flipping mechanism, 46-second translation module, 47-second surface marking assembly, 471-moving beam, 472-second surface marking head;

[0028] 5-paper partition moving unit, 51-paper partition moving module, 52-paper partition lifting module, 53-paper partition suction and release mechanism. DETAILED DESCRIPTION

[0029] The utility model is further described in detail below in conjunction with specific embodiments.

[0030] Example:

[0031] like Figure 1 and Figure 2As shown, a PCB circuit defect fast automatic marking machine of the utility model comprises a loading area 1, a unloading area 2, a loading unit 3a, a unloading unit 3b and a marking unit 4. The loading area 1 is stacked with PCB boards containing false points in AOI automatic optical inspection results. The marking unit 4 is divided into a first working position 4a and a second working position 4b. The loading unit 3a moves the PCB board from the loading area 1 to the first working position 4a, the marking unit 4 marks the false points on the PCB board, and the unloading unit 3b moves the marked PCB board from the second working position 4b to the unloading area 2.

[0032] like Figure 3 As shown, the marking unit 4 includes a translation adsorption platform 41, a first translation module 42 for driving the translation adsorption platform 41 to move from the first working position 4a to the second working position 4b, and a first surface marking component 43 fixed between the first working position 4a and the second working position 4b. A plurality of adsorption holes are arranged on the upper surface of the translation adsorption platform 41. The first surface marking component 43 includes a fixed beam 431 located above the upper surface of the translation adsorption platform 41 and a plurality of first surface marking heads 432 arranged along the length direction of the fixed beam 431.

[0033] Here, relative movement is achieved by moving the PCB board while keeping the first-side marking head 432 stationary. After the marking position has been confirmed, each first-side marking head 432 will determine the timing of inkjet, and the translation adsorption platform 41 will pass under the fixed beam 431 along the Y direction, and each first-side marking head 432 will mark the first side of the PCB board. The inkjet range of each first-side marking head 432 basically covers the entire board surface, so during each marking process, the translation adsorption platform 41 only needs to move in one direction to complete the front marking. This automatic marking machine can automatically and quickly complete non-false point marking, and the mechanical marking efficiency is high, saving manual marking time.

[0034] like Figure 3 As shown, the marking unit 4 also includes a flipping adsorption table 44 located at the second working position 4b, a flipping mechanism 45 driving the flipping adsorption table 44 to flip up and down 180 degrees, a second translation module 46 parallel to the first translation module 42, and a second surface marking component 47 driven by the second translation module 46 to pass above the flipping adsorption table 44 in a horizontal posture, and a plurality of adsorption holes are arranged on the front and back sides of the flipping adsorption table 44; the second surface marking component 47 includes a moving beam 471 parallel to the fixed beam 431 and a plurality of second surface marking heads 472 arranged along the length direction of the moving beam 471, and the second surface marking component 47 can be translated to outside the flipping range of the flipping adsorption table 44.

[0035] If only the front side of the PCB needs to be marked, the translation adsorption platform 41 is used to absorb the PCB, and only the first side marking component 43 completes the marking. The PCB board with the first side marking completed directly reaches the bottom of the flip adsorption platform 421; if the PCB board also needs to be marked on the back side, the flip adsorption platform 44 will absorb the PCB from the translation adsorption platform 41, and then the translation adsorption platform 41 will return to the first working position 4a, and then the flip adsorption platform 44 will flip the PCB to the back side facing up, and the second side marking component 47 will complete the marking. Because there must be a height difference between the flip adsorption platform 421 and the translation adsorption platform 41 when they face each other, so when the relative height of the two inkjet operations remains unchanged, the first side marking head 432 and the second side marking head 472 are not at the same height, so the two marking operations cannot share a set of marking components. In addition, considering work efficiency, it is more efficient to continuously mark the first side and the second side.

[0036] After the marking position has been confirmed, each second side marking head 472 will also determine the timing of inkjet. After the flipping adsorption platform 421 turns over the PCB board and is located on the Y direction side of the translation adsorption platform 41, the moving beam 471 passes over the flipping adsorption platform 421 along the Y direction, so that each second side marking head 472 marks the second side of the PCB board.

[0037] like Figure 3 As shown, at least one X-direction reference convex edge and one Y-direction reference convex edge are provided on the adsorption surface of the translation adsorption platform 41; the first-side marking heads 432 are distributed on the fixed beam 4131 in two rows alternately front and back, and the center distances of adjacent first-side marking heads 432 in the same row are both twice the preset marking distance; at least one X-direction reference convex edge and one Y-direction reference convex edge are provided on the adsorption surface of the flipping adsorption platform 421; the second-side marking heads 4152 are distributed on the moving beam 4251 in two rows alternately front and back, and the center distances of adjacent second-side marking heads 4252 in the same row are both twice the preset marking distance.

[0038] Both the translation adsorption table 41 and the flip adsorption table 421 rely on their respective X-axis reference convex edges and Y-axis reference convex edges to position the PCB board, so that the marking head can spray the correct position when the relative position between the PCB board and the two adsorption tables can be determined. The two marking heads themselves will occupy a certain width, which may be larger than the inkjet width. The single-row setting will easily lead to failure to take into account every area. This problem can be solved by alternating the front and back distribution on the moving beam. For each marking head, the inkjet pattern and color are selectable, and the inkjet pattern can be a circle, square, diamond, triangle, etc. When the pattern and color have defined non-false point abnormality types, the abnormality type obtained by AOI automatic optical detection can be more intuitively reflected, which can help maintenance personnel quickly identify and complete related repair actions.

[0039] like Figure 5As shown, it also includes a paper partition moving unit 5. The loading area 1 and the unloading area 2 are located at adjacent positions in the Y direction. The paper partition moving unit 5 includes a paper partition moving module 51 straddling the loading area 1 and the unloading area 2, a paper partition lifting module 52 moving along the Y direction under the drive of the paper partition moving module 51, and a paper partition suction and release mechanism 53 driven to rise and fall by the paper partition lifting module 52.

[0040] In order to protect the surface of the PCB board, stacked PCB boards are often separated by separators. Therefore, each time a PCB board is taken out, a piece of separator paper must be taken out. Here, the removed separator paper will be suspended above the unloading area 2 in advance, and the separator paper will be put on after the PCB board with marking is put down, so that no separator paper is wasted. The equipment layout is also more compact.

[0041] like Figure 4 As shown, the loading unit 3a and the unloading unit 3b include an X-direction translation module 31, an angle adjustment mechanism 32 driven by the X-direction translation module 31 to move along the X-direction, and a suction head mechanism 33 whose angle is adjusted around a vertical axis by the angle adjustment mechanism 32.

[0042] In this embodiment, the loading area 1 and the translation adsorption table 41 are respectively located at the two ends of the loading unit 3a. When the flip adsorption table 421 faces upward, its position is the same as the unloading area 2, which is respectively located at the two ends of the unloading unit 3b. Therefore, the loading unit 3a and the unloading unit 3b can complete the transfer of the PCB board with the same structure. The transfer action is that the suction head mechanism 33 moves to the material picking position, the suction head mechanism 33 sucks up the PCB board from the initial position, and then the X-axis translation module 31 moves it to the target position and puts it down. The role of the angle adjustment mechanism 32 is to fine-tune the angle of the PCB board. The position detection of the PCB board can be placed on the front of the translation adsorption table 41 and the front of the flip adsorption table 421.

[0043] like Figure 6 As shown, a PCB board detection and processing method of the utility model comprises the following steps:

[0044] S1. AOI automatic optical inspection: The PCB board to be inspected is sent to the AOI automatic optical inspection equipment. After the PCB board is positioned, the actual images of all set inspection positions are obtained in sequence and archived, and the actual images are sent to the AI ​​information processing module.

[0045] Because some performance problems can be directly discovered from the appearance of the PCB board, and some appearance problems can also be repaired, they need to be screened out using AOI automatic optical inspection. AOI automatic optical inspection targets defects in appearance, so the actual image must be captured first for subsequent comparison. The actual image archive will be used as a sample for false point judgment improvement and for learning and optimization of the processing system.

[0046] S2. False point filtering: The standard images and false point judgment criteria of all set detection positions have been entered into the AI ​​information processing module. The AI ​​information processing module compares the actual image with the standard image, first filters out abnormal points, and then removes the false points in the abnormal points according to the false point judgment criteria to obtain the coordinate information of non-false points. Non-false points include real points and unrecognized false points. The coordinate information of non-false points is sent to the automatic marking machine.

[0047] Theoretically, the surface of a qualified PCB board should be the same as that of a standard board, but there are always some differences. These are abnormal points, which need to be discovered by comparing the actual image with the standard image. Abnormal points are not necessarily true points, but true points are definitely abnormal points. The other part of abnormal points is false points. True points are surface defects that affect the performance of the PCB board due to abnormalities, such as scratches that cause copper wire disconnection and serious defects or deformation of the substrate; false points are surface defects that do not affect the performance of the PCB board despite abnormalities, such as metal wire hanging that does not affect the copper wire path, scratches on the substrate, and nickel leakage without copper leakage. Compared with true points, false points are a common phenomenon. False points may exist in some unimportant positions on the PCB board and have certain appearance rules, so the above-mentioned false point judgment criteria can be summarized according to past experience. The false point judgment criteria here will be the system logic used to ensure that the screened abnormal points are definitely false points. The AI ​​information processing module can first screen out a large number of false points, so even if there are still false points that are missed, the proportion will not be large. For example, if there are dozens of false points on a PCB board, 95% of the false points can be removed by the false point judgment standard, and then there will be only two or three false points mixed in the real points, and these are non-false points. The workload left for the maintenance personnel will be greatly reduced.

[0048] S3. Automatic circle: The automatic marking machine marks the positions of all non-false points according to the coordinate information of non-false points. If there are no abnormal points on the PCB board or all abnormal points are false points, it will directly enter the post-process, otherwise it will enter the repair station.

[0049] When a non-false point has been detected, the automatic marking machine can directly mark it. Although the AI ​​information processing module already knows the location of the non-false point, it needs to be communicated to the maintenance personnel in a more direct way, and the location is highlighted by marking. The marking method of the automatic marking machine is to spray ink around the non-false point, so that the maintenance personnel can observe it with the naked eye. The marking operation no longer requires the accuracy of the detection, but highlights the location of the suspected real point. The final judgment is still made by the maintenance personnel.

[0050] S4, Repair: The inspector only makes a secondary judgment on the position of non-false points, repairs the real points, and does not process the unidentified false points. After the repair is completed, the PCB board enters the post-process.

[0051] There may be real points or all false points in the marked area of ​​the PCB board flowing into the repair station, but the number is only in the single digits. After the secondary judgment of the inspector, it can be quickly screened. For the latter, the inspector can directly transfer to the post-process, and for the former, the inspector can only transfer to the post-process after repairing the real points. For this step, the inspector does not need to consider the accuracy of the detection, but only needs to perform repeated inspection actions, so the work efficiency is high.

[0052] After completing a day or a batch of inspection and processing work, the actual image corresponding to the repaired PCB board can be retrieved, and the unidentified false points can be manually judged, and then the false point judgment standard can be improved. This will enable the system to improve the accuracy of the next false point filtering and further reduce the judgment workload of the maintenance personnel.

[0053] This method can use the AI ​​information processing module to exclude most of the false points, and use the automatic marking machine to directly mark the real points and unidentified false points; the maintenance personnel only need to conduct secondary confirmation on a small number of abnormal points, which significantly reduces the recognition time of the maintenance personnel, and only repairs the position of the real points to ensure the factory qualified rate of the PCB board. A balance is achieved between compressing the inspection processing cycle and ensuring the qualified rate of the product. Assuming that the original company's AOI VRS has 40 devices, two shifts require 80 inspectors. After introducing this method, the automatic marking machine replaces the VRS, and only 10-20 automatic marking machines are needed, and no inspectors are required.

[0054] The marking method of the automatic marking machine is to spray ink around the non-false dots. The shape of the non-false dots reflects different types of abnormalities, and the color of the non-false dots reflects different degrees of abnormalities.

[0055] For example, a circle can be used to represent defects on the substrate, and a square can be used to represent defects on the circuit; red can be used to represent extra dirty spots on the substrate or short circuits on the circuit, and black can be used to represent basic damage or open circuits on the circuit.

[0056] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A PCB circuit defect fast automatic marking machine, characterized by: It includes a loading area, a unloading area, a loading unit, an unloading unit and a marking unit. The loading area is stacked with PCB boards containing false points in the AOI automatic optical inspection results. The loading unit moves the PCB boards from the loading area to the marking unit. The marking unit marks the false points on the PCB boards. The unloading unit moves the marked PCB boards from the marking unit to the unloading area. The marking unit includes a translation adsorption platform, a first translation module that drives the translation adsorption platform to move from a first working position to a second working position, and a first surface marking component fixed between the first working position and the second working position. A plurality of adsorption holes are arranged on the upper surface of the translation adsorption platform. The first surface marking component includes a fixed beam located above the upper surface of the translation adsorption platform and a plurality of first surface marking heads arranged along the length direction of the fixed beam.

2. The PCB circuit defect fast automatic marking machine according to claim 1, characterized in that: The marking unit also includes a flipping adsorption table located at the second working position, a flipping mechanism driving the flipping adsorption table to flip up and down 180 degrees, a second translation module parallel to the first translation module, and a second surface marking component passing above the flipping adsorption table in a horizontal posture under the drive of the second translation module, and a plurality of adsorption holes are arranged on the front and back sides of the flipping adsorption table; the second surface marking component includes a moving beam parallel to the fixed beam and a plurality of second surface marking heads arranged along the length direction of the moving beam, and the second surface marking component can be translated to outside the flipping range of the flipping adsorption table.

3. The PCB circuit defect fast automatic marking machine according to claim 1 or 2, characterized in that: At least one X-direction reference convex edge and one Y-direction reference convex edge are provided on the adsorption surface of the translation adsorption platform.

4. The PCB circuit defect fast automatic marking machine according to claim 1 or 2, characterized in that: The first surface marking heads are alternately distributed on the fixed beam in two rows, and the center distances of adjacent first surface marking heads in the same row are both twice the preset marking distance.

5. The PCB circuit defect fast automatic marking machine according to claim 2, characterized in that: The second surface marking heads are alternately distributed on the moving beam in two rows, and the center distances of adjacent second surface marking heads in the same row are both twice the preset marking distance.

6. The PCB circuit defect fast automatic marking machine according to claim 2, characterized in that: It also includes a paper partition moving unit, the loading area and the unloading area are located at adjacent positions in the Y direction, and the paper partition moving unit includes a paper partition moving module straddling above the loading area and the unloading area, a paper partition lifting module moving along the Y direction driven by the paper partition moving module, and a paper partition suction and release mechanism driven to be lifted and lowered by the paper partition lifting module.

7. The PCB circuit defect fast automatic marking machine according to claim 2, characterized in that: The loading unit and the unloading unit both include an X-direction translation module, an angle adjustment mechanism driven by the X-direction translation module to move along the X-direction, and a suction head mechanism whose angle is adjusted around a vertical axis by the angle adjustment mechanism.

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