Device for coupling scintillator with special-shaped structure

Abstract

The utility model relates to the technical field of scintillator coupling, in particular to a device for coupling a scintillator with a special-shaped structure. According to the device for coupling the scintillator with the special-shaped structure, the shape of the scintillator is set according to the design condition of a chip module, and the scintillator placement area is correspondingly matched with the chip coupling area and is matched with a pressing part required by coupling of the scintillator in a small area; therefore, scintillator attachment between uneven chip modules is facilitated, and attachment of uneven surfaces is realized. According to the utility model, through a vacuum adsorption fixing mode of the limiting part and the adsorption hole, the phenomenon of low fitting precision caused by deviation of the fitting direction of the scintillator due to slight movement of the scintillator in the fitting process is reduced or avoided, and the coupling precision of the scintillator is improved. Bubbles generated due to the fact that the tail end of the scintillator falls off in the attaching process can be prevented, and the coupling effect is further improved.

Description

Technical Field

[0001] The utility model relates to the field of scintillator coupling, in particular to a device for coupling scintillators with special-shaped structures. Background Art

[0002] At present, bonding equipment is widely used in the general panel industry. Generally, it is a rubber roller rolling bonding. During the rolling process, a certain angle is formed between the object to be bonded and the substrate, and the roller makes it fit well during the forward movement. This bonding equipment is suitable for products and scenarios with large areas and relatively flat bonding surfaces. Scintillator coupling is an indispensable link in the production of X-ray detectors, and its coupling quality is directly related to the imaging quality of X-ray detectors. For CMOS sensors, their chip modules are different from panels. The electronic devices on the CMOS sensor chip are different in size, shape, height, thickness, etc., which makes the bonding surface between the chip and the scintillator uneven, and the shapes of the bonded products are different, which makes the bonding area or bonding surface shape different. Ordinary equipment cannot meet the requirements. Utility Model Content

[0003] The purpose of the utility model is to provide a scintillator coupling device suitable for uneven bonding surfaces, so as to solve the problem that the existing bonding equipment has a limited scope of application and cannot be applied to uneven bonding surfaces, effectively avoid the influence of the uneven bonding surface, and can also make the bonding position accurate and the bonding effect without bubbles is good.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows.

[0005] A device for coupling a scintillator with a special structure, the device comprising: a first carrier plate, provided with a chip placement area for fixing the chip; a second carrier plate, provided with a scintillator placement area for placing the scintillator, when the second carrier plate is opposite to the first carrier plate, the scintillator placement area corresponds to the coupling area of ​​the chip on the first carrier plate, and the area of ​​the coupling area is smaller than the area of ​​the chip; a plurality of second adsorption holes are provided in the scintillator placement area of ​​the second carrier plate, the second adsorption holes are connected to a negative pressure generating device, and are used to adsorb the scintillator on the second carrier plate through negative pressure; a pressing component located at one end of the second carrier plate, the distance between the pressing component and the first carrier plate being adjustable, so that when the pressing component approaches the first carrier plate, the scintillator can be pushed toward the first carrier plate and pressed. in the coupling area; a driving component for adjusting the distance between the pressing component and the first carrier plate so that the pressing component presses the scintillator in the coupling area of ​​the chip, and for driving the first carrier plate to move relative to the pressing component and the second carrier plate so that the pressing component and the second carrier plate move along the center line of the coupling area, so that during the movement the scintillator is removed from the second carrier plate and coupled to the coupling area of ​​the chip; and / or the first carrier plate moves along the center line of the coupling area so that during the movement the scintillator is removed from the second carrier plate and coupled to the coupling area of ​​the chip; the dimension of the pressing component in a direction perpendicular to the center line of the coupling area does not exceed the minimum dimension of the coupling area in a direction perpendicular to the center line of the coupling area.

[0006] Furthermore, a scintillator placement area on the second supporting plate is provided with a limiting portion for accommodating the scintillator, the shape and size of the limiting portion match the scintillator, the position of the limiting portion corresponds to the coupling area, and the pressing component is parallel and coplanar with the center line of the limiting portion, the center line of the scintillator, and the center line of the coupling area along a center line perpendicular to the moving direction.

[0007] Furthermore, the limiting portion is a groove provided on the second supporting plate, and the depth of the groove is not less than the thickness of the scintillator.

[0008] Furthermore, the driving component is connected to the pressing component and the second supporting plate, the pressing component is a roller, both ends of the axle of the roller are passed through the first bracket, the first bracket is a group of brackets that are symmetrical about the roller and are spaced apart from the driving component, the second supporting plate and the first bracket are connected to the driving component via a guide rail, and the guide rail is parallel to the center line of the coupling area.

[0009] Furthermore, the surface of the coupling region is lower than the surface of the highest module on the chip, and the roller radius, the wheel axle radius and the height of the highest module on the chip protruding from the chip surface satisfy the following relationship:

[0010] Rr>H,

[0011] Among them, R is the roller radius, r is the radius of the wheel axle, and H is the height of the highest module on the chip protruding from the chip surface.

[0012] Furthermore, the roller surface of the roller is coated with a glue layer for compensating for the uneven surface of the scintillator after coupling caused by the uneven coupling surface.

[0013] Furthermore, the device also includes a base, the base is provided with a second bracket and a fixed support at intervals, the first bearing plate is rotatably connected to the second bracket, and the fixed support is provided with a support platform and a locking component for supporting and locking the first bearing plate.

[0014] Furthermore, the first carrier plate is connected to a negative pressure generating device, and a plurality of first adsorption holes are provided in the chip placement area of ​​the first carrier plate. The first adsorption holes are connected to the negative pressure generating device and are used to adsorb the chip on the first carrier plate through negative pressure.

[0015] Furthermore, the coupling region is in the shape of an elongated strip, and the moving direction of the pressing component and the second supporting plate is consistent with the length direction of the elongated strip.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] The device for coupling scintillators of special structures of the utility model is designed to place the scintillator on the second carrier plate according to the coupling area on the chip on the first carrier plate where the scintillator needs to be bonded, so that when the second carrier plate is opposite to the first carrier plate, the scintillator placement area just corresponds to the coupling area of ​​the chip on the first carrier plate, and the pressing parts required for the coupling of small-area scintillators are designed accordingly, so as to facilitate the bonding of scintillators between uneven chip modules and achieve bonding of uneven surfaces. The upper limit portion of the second carrier plate is set to limit the position of the scintillator perpendicular to the bonding direction, reducing or avoiding the phenomenon of low bonding accuracy caused by the left-right swing of the scintillator during the bonding process, which causes the scintillator bonding direction to be offset. Furthermore, the scintillator is adsorbed in the limit portion by vacuum adsorption to prevent the scintillator from detaching from the second carrier plate, further improving the accuracy of scintillator coupling. The utility model also achieves adjustable position of the pressing component and the first carrier plate through a driving component, so that the pressure of the pressing component on the scintillator can be appropriately adjusted according to actual use, so that scintillators in different parts or areas can be well coupled to the coupling area of ​​the chip. At the same time, the utility model simultaneously completes multiple continuous actions such as removing the scintillator from the second carrier plate, approaching the chip coupling area, bonding and pressing the scintillator, thereby driving away bubbles between the scintillator and the coupling area during bonding, and also preventing bubbles generated by the falling of the tail end of the scintillator during the bonding process, thereby further improving the coupling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0019] Figure 1 This is a schematic diagram of the structure of a device for coupling a scintillator with a special structure according to Embodiment 1 of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the first load-bearing plate of Embodiment 1 of the utility model;

[0021] Figure 3 This is a schematic diagram of the scintillation coupling principle of the device for coupling scintillators of a special structure in Embodiment 1 of the utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the second bearing plate of Embodiment 2 of the present utility model;

[0023] Figure 5 It is a schematic diagram of the groove structure of Example 2 of the utility model.

[0024] Figure identification: 1-first supporting plate, 1-1-first adsorption hole, 2-second supporting plate, 2-1-second adsorption hole, 2-2-groove, 3-roller, 4-base, 5-first bracket, 6-second bracket, 7-clip, 8-guide rail, 9-scintillator. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the utility model clearer, the utility model is further described in detail below in combination with the embodiments and drawings. The schematic implementation mode and description of the utility model are only used to explain the utility model and are not intended to limit the utility model. The various technical features in the utility model can be combined with each other to form different schemes, and various combinations also fall within the scope of protection of the utility model.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. When an element is referred to as being "provided with" another element, it may be provided on the surface or inside of the element.

[0027] Since the X-ray detector chip involves a variety of electrical or optical devices or modules, the area on the chip surface that needs to be coupled with the scintillator is not flat. For some X-ray detectors, the bonding surface is not necessarily a flat large area. For example, the chip module of the CMOS sensor is different from the panel. The various electronic devices on the CMOS sensor chip have different volumes, shapes, heights, thicknesses, etc., which makes the bonding surface of the chip and the scintillator coupling uneven. In addition, the shapes of the bonded products are different, which makes the bonding area or bonding surface shape different. Ordinary equipment cannot meet the requirements. Therefore, the utility model provides a scintillator coupling device suitable for uneven bonding surfaces, thereby solving the problem that the existing bonding equipment has a limited scope of application and cannot be applied to uneven bonding surfaces, effectively avoiding the impact of the uneven bonding surface, and can also make the bonding position accurate and the bonding effect without bubbles is good.

[0028] It should be noted that, in the present invention, "irregular shape" means that the shape of the scintillator is not a large area as a whole and is laid on the chip, but is in a certain shape, which may be a narrow strip. The narrow strip may be in the shape of a straight line, a curve, a broken line, etc. The present invention is described in detail below through specific embodiments.

[0029] Example 1

[0030] Embodiment 1 provides a device for coupling a scintillator with a special structure, such as Figure 1As shown, the device includes a first carrier plate 1, a second carrier plate 2, a pressing component located at one end of the second carrier plate 2, and a driving component. The first carrier plate 1 is used to fix the chip and is provided with a chip placement area. In this embodiment, a COMS flat panel detector chip is taken as an example. The first carrier plate 1 can fix the chip in a detachable connection manner, such as a snap connection, a screw connection, an elastic connection, a key connection, a hinge, or any other method that can facilitate the fixing and removal of the chip. In this embodiment, a vacuum adsorption connection method is selected, such as Figure 2As shown, a plurality of first adsorption holes 1-1 are provided in the chip placement area on the first receiving plate, and the first adsorption holes 1-1 are connected to the negative pressure generating device, and are used to adsorb the chip on the first carrier plate 1 by negative pressure. The second carrier plate 2 is used to place and fix the scintillator 9, and is provided with a scintillator placement area for placing the scintillator 9. The positions of the first carrier plate 1 and the second carrier plate 2 are not fixed. Before laminating, the scintillator 9 can be placed on the second carrier plate 2, and then the second carrier plate 2 and the first carrier plate 1 are moved together so that the two are opposite. When the second carrier plate 2 is opposite to the first carrier plate 1, the scintillator placement area corresponds to the coupling area of ​​the chip on the first carrier plate 1. Since the utility model is used for laminating with complex chip module components, different heights, and non-overall large-area coupling areas, the area of ​​the coupling area described in this embodiment is smaller than the area of ​​the chip. Take the elongated coupling area of ​​this embodiment as an example, that is, the coupling area is elongated, and the direction of movement of the pressing component and the second carrier plate 2 is consistent with the length direction of the elongated strip. In this embodiment, the second carrier plate 2 also fixes the scintillator 9 by vacuum adsorption (the fixation mentioned here does not mean that the scintillator 9 cannot be moved at all, but that under a certain adsorption force, the scintillator 9 will not move in a way that is not conducive to coupling due to the shaking or inversion of the equipment or slight pulling during the bonding process). The scintillator placement area is provided with a plurality of second adsorption holes 2-1, which are connected to the negative pressure generating device and are used to adsorb the scintillator 9 to the second carrier plate 2 by negative pressure. During the bonding process of the scintillator 9, the scintillator 9 can slide close to the second carrier plate 2 under the action of the adsorption force and the pressing component, so as to gradually fit to the coupling area. The first carrier plate 1 and the second carrier plate 2 can be connected to the same negative pressure generating device, or they can be connected to their own negative pressure generating devices respectively.The pressing component is located at one end of the second carrier plate 2, and the distance between the pressing component and the first carrier plate 1 is adjustable, so that when the pressing component approaches the first carrier plate 1, the scintillator 9 can be pushed toward the first carrier plate 1 and pressed into the coupling area; a driving component is used to adjust the distance between the pressing component and the first carrier plate 1, so that the pressing component presses the scintillator 9 into the coupling area of ​​the chip, and is used to drive the first carrier plate 1 and the pressing component and the second carrier plate 2 to move relative to each other, so that the pressing component and the second carrier plate 2 move along the center line of the coupling area, so that during the movement, the scintillator 9 is removed from the second carrier plate 2 and coupled to the coupling area of ​​the chip; and / or the first carrier plate 1 moves along the center line of the coupling area so that During the movement, the scintillator 9 is removed from the second carrier plate 2 and coupled to the coupling area of ​​the chip; in this embodiment, the pressing component and the second carrier plate 2 move together. According to the above scheme, the coupling method of the utility model can be realized in three ways. One is that the first carrier plate 1 moves relative to the pressing component and the second carrier plate 2, that is, the first carrier plate 1 moves, and the pressing component and the second carrier plate 2 do not move; the second way is that the pressing component and the second carrier plate 2 move relative to the first carrier plate 1 together, and the first carrier plate 1 does not move, so that the scintillator 9 is attached to the coupling area; the third way is that the first carrier plate 1 and the pressing component and the second carrier plate 2 all move, and both sides operate at the same time, so as to realize the relative movement between the first carrier plate 1 and the pressing component and the second carrier plate 2, so as to attach the scintillator 9 to the coupling area. This embodiment takes the second way as an example for explanation, that is, the pressing component and the second carrier plate 2 move relative to the first carrier plate 1 together, and the first carrier plate 1 does not move, so as to attach the scintillator 9 to the coupling area.

[0031] The pressing component can be any component that can effectively press the scintillator 9 onto the chip and can smoothly move on the surface of the scintillator 9 during the relative movement to smoothly and evenly fit the scintillator 9 to the coupling area in turn, such as a roller 3, similar to a roller brush used for roller coating, which can smoothly and evenly move forward while rolling the roller on the surface of the scintillator 9 to press the scintillator 9, and successively fit the rear end scintillator 9 to the coupling area in turn. The pressing component here can also be other than the roller 3, such as a smooth plane or curved object, as long as it can achieve pressing and smooth movement.

[0032] Regarding the mode in which the pressing component and the second supporting plate 2 move together relative to the first supporting plate 1, while the first supporting plate 1 remains stationary, the driving component is connected to the pressing component and the second supporting plate 2, the pressing component is a roller 3, and both ends of the axle of the roller 3 are passed through the first bracket 5, the first bracket 5 is a group of brackets symmetrical about the roller 3 and spaced apart from the driving component, the second supporting plate 2 and the first bracket 5 are connected to the driving component via a guide rail 8, and the guide rail 8 is parallel to the center line of the coupling area. The device also includes a base 4, and the base 4 is spaced apart from a second bracket 6 and a fixed support, the first supporting plate 1 is rotatably connected to the second bracket 6, and the fixed support is provided with a support platform and a locking component for supporting and locking the first supporting plate 1. The locking component here can be a buckle, or other forms of locking components. In this embodiment, a buckle 7 is used as the locking component, such as Figure 1 As shown, when the first carrier plate 1 is turned over and covers the second carrier plate 2, the first carrier plate 1 is fixed on the fixed support to prevent the roller 3 from lifting the first carrier plate 1 when pressing the scintillator 9 during the coupling process of the scintillator 9, thereby affecting the coupling effect. In order not to affect the movement of the pressing component and the second carrier plate 2 relative to the first carrier plate 1, the second bracket 6 can be arranged on the outside of the first bracket 5 and the guide rail 8, that is, the distance between the two brackets in the second bracket 6 is greater than the distance between the two brackets in the first bracket 5 and the total space width occupied by the guide rail 8, and the first bracket 5 and the guide rail 8 are included in the second bracket 6. The scintillator 9 can also be adsorbed on the top of the module by adsorbing soft steel or other soft materials, and the roller 3 is directly pressed onto the soft steel or other material with the scintillator 9 adsorbed.

[0033] In the utility model, the surface of the coupling area may be lower than the height of the module device on the chip, or it may be flush with the height of the module device. For the flush situation, the coupling of the scintillator 9 is relatively simple, and only the size of the bonding area needs to be considered, without considering the problem of spatial steric hindrance during bonding. For the situation where the surface of the coupling area is lower than the surface of the highest module on the chip, further, in order to prevent the pressing component from being obstructed by the chip module device during the process of bonding the scintillator 9, and other areas of the product cannot be pressed, it is necessary to formulate a roller 3 of corresponding size, the width of the roller 3 is consistent with the width of the surface to be bonded, and the size of the pressing component in the direction perpendicular to the center line of the coupling area does not exceed the minimum size of the coupling area in the direction perpendicular to the center line of the coupling area. The radius of the roller 3, the radius of the wheel axle and the height of the highest module on the chip protruding from the chip surface satisfy the following relationship:

[0034] Rr>H,

[0035] Wherein, R is the radius of the roller 3, r is the radius of the wheel axle, and H is the height of the highest module on the chip protruding from the chip surface. In this way, it can be ensured that when the roller 3 and the second carrier plate 2 move relative to the first carrier plate 1, the roller 3 will not be blocked by the components on the chip, thereby affecting the coupling of the scintillator 9.

[0036] Furthermore, in order to compensate for the uneven surface of the coupled scintillator 9 due to the uneven coupling surface, the roller 3 surface of the roller 3 is coated with a glue layer, which can level the surface of the coupled scintillator 9 in turn while coupling the scintillator 9 to the chip, thereby further improving the coupling effect of the scintillator 9 and providing favorable conditions for X-ray detector imaging.

[0037] When the above-mentioned device couples the scintillator 9, first place the CMOS sensor chip module (referred to as the module) on the right flip plate, that is, the first carrier plate 1, with the functional surface facing upward. The first carrier plate 1 has vacuum air holes that can adsorb products. The scintillator 9 is placed on the left bottom plate, that is, the second carrier plate 2, with the functional surface facing upward. The second carrier plate 2 has a strip-shaped limiting groove 2-2, and the scintillator 9 is placed in the groove, and the groove 2-2 has a second adsorption hole 2-1. During operation, the right flip plate, that is, the first carrier plate 1, is turned over so that the module is located directly above the scintillator 9. The control drive component drives the roller 3 to move upward so that the scintillator 9 is pressed against the module. Then the left bottom plate, that is, the second carrier plate 2, moves to the right together with the roller 3, while the scintillator 9 does not move, but is slowly attached to the module under the action of the roller 3 until the entire functional surface is attached. Figure 3 shown.

[0038] Example 2

[0039] In the actual implementation of Example 1, the applicant found that as the pressing component and the second carrier plate 2 move together, the scintillator 9 will gradually deviate from the lamination direction, resulting in low lamination accuracy. After a lot of research, the applicant found that because the scintillator 9 is made of a relatively soft material, if there is no limit, the scintillator 9 will swing left and right during the roller lamination process, causing the scintillator 9 to deviate from the effective area. The device of Example 1 is further improved, such as Figure 4As shown, on the basis of Example 1, a limiting portion is provided in the scintillator placement area on the second carrier plate 2 for accommodating the scintillator 9, the shape and size of the limiting portion match the scintillator 9, the position of the limiting portion corresponds to the coupling area, and the center line of the pressing component along a center line perpendicular to the moving direction is parallel and coplanar with the center line of the limiting portion, the center line of the scintillator 9, and the center line of the coupling area. The pressing component should be centered to prevent uneven force at both ends, and its center line is parallel to the center line of the limiting portion, the center line of the scintillator 9, and the center line of the coupling area and is in the same plane, which can ensure that the scintillator 9 is offset during the coupling process and ensure the coupling accuracy. Since there is a very thin film on the surface of the scintillator 9, in order to prevent scratches, the surface where the inner wall of the limiting portion contacts the scintillator 9 needs to be designed to be a smooth surface. If there is no limit, during the process of roller lamination, the scintillator 9 will swing left and right, causing the scintillator 9 to deviate from the effective area. After adding the limit part, the left and right positions of the scintillator 9 can be limited. The second adsorption hole 2-1 can be set in the limit part to limit the up and down position of the scintillator 9, so that the scintillator 9 cannot be separated in the vertical direction and is always in the limit part. Figure 5 As shown. The limiting part can be a combination of limiting plates protruding from the surface of the chip coupling area, or a groove 2-2 recessed into the chip surface. In this embodiment, the limiting part is a groove 2-2 provided on the second carrier plate 2, and the depth of the groove 2-2 is not less than the thickness of the scintillator 9. The scintillator 9 and the module have similar bonding surfaces, which are long strips with a thickness of about 1 mm. Therefore, the shape of the groove 2-2 should also be the same long strip as the scintillator 9, and the depth should be not less than 1 mm.

[0040] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0041] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit them. Although the utility model is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A device for coupling a scintillator with a special structure, characterized in that: The device comprises: The first carrier plate is provided with a chip placement area for fixing the chip; The second carrier plate is provided with a scintillator placement area for placing the scintillator. When the second carrier plate is opposite to the first carrier plate, the scintillator placement area corresponds to the coupling area of ​​the chip on the first carrier plate, and the area of ​​the coupling area is smaller than the area of ​​the chip. The scintillator placement area of ​​the second carrier plate is provided with a plurality of second adsorption holes, and the second adsorption holes are connected to the negative pressure generating device, and are used to adsorb the scintillator on the second carrier plate through negative pressure. a pressing component located at one end of the second carrier plate, wherein the distance between the pressing component and the first carrier plate is adjustable, so that when the pressing component approaches the first carrier plate, the scintillator can be pushed toward the first carrier plate and pressed against the coupling region; A driving component is used to adjust the distance between the pressing component and the first carrier plate so that the pressing component presses the scintillator on the coupling area of ​​the chip, and to drive the first carrier plate to move relative to the pressing component and the second carrier plate. The pressing component and the second carrier plate move along the center line of the coupling region, so that during the movement, the scintillator is removed from the second carrier plate and coupled to the coupling region of the chip; and / or The first carrier plate moves along the center line of the coupling region, so that during the movement, the scintillator is removed from the second carrier plate and coupled to the coupling region of the chip; The dimension of the pressing component in a direction perpendicular to the center line of the coupling region does not exceed the minimum dimension of the coupling region in a direction perpendicular to the center line of the coupling region.

2. The device for coupling a scintillator with a special structure according to claim 1, characterized in that: A limiting portion is provided in the scintillator placement area on the second supporting plate for accommodating the scintillator. The shape and size of the limiting portion match the scintillator, the position of the limiting portion corresponds to the coupling area, and the pressing component is parallel and coplanar with the center line of the limiting portion, the center line of the scintillator, and the center line of the coupling area along a center line perpendicular to the moving direction.

3. The device for coupling a scintillator with a special structure according to claim 2, characterized in that: The limiting portion is a groove provided on the second supporting plate, and the depth of the groove is not less than the thickness of the scintillator.

4. The device for coupling a scintillator with a special structure according to claim 1, characterized in that: The driving component is connected to the pressing component and the second supporting plate, the pressing component is a roller, both ends of the axle of the roller are passed through the first bracket, the first bracket is a group of brackets symmetrical about the roller and spaced apart from the driving component, the second supporting plate and the first bracket are connected to the driving component via a guide rail, and the guide rail is parallel to the center line of the coupling area.

5. The device for coupling a scintillator with a special structure according to claim 4, characterized in that: The surface of the coupling area is lower than the surface of the highest module on the chip, and the roller radius, the wheel axle radius and the height of the highest module on the chip protruding from the chip surface satisfy the following relationship: Rr>H Among them, R is the roller radius, r is the radius of the wheel axle, and H is the height of the highest module on the chip protruding from the chip surface.

6. The device for coupling a scintillator with a special structure according to claim 5, characterized in that: The roller surface of the roller is coated with a glue layer, which is used to compensate for the uneven surface of the scintillator after coupling caused by the uneven coupling surface.

7. The device for coupling a scintillator with a special structure according to claim 6, characterized in that: The device also includes a base, on which a second bracket and a fixed support are spaced apart, the first bearing plate is rotatably connected to the second bracket, and the fixed support is provided with a support platform and a locking component for supporting and locking the first bearing plate.

8. The device for coupling a scintillator with a special structure according to claim 1, characterized in that: The first carrier plate is connected to a negative pressure generating device, and a plurality of first adsorption holes are provided in the chip placement area of ​​the first carrier plate. The first adsorption holes are connected to the negative pressure generating device and are used to adsorb the chip on the first carrier plate through negative pressure.

9. The device for coupling a scintillator with a special structure according to claim 1, characterized in that: The coupling region is in the shape of an elongated strip, and the moving directions of the pressing component and the second supporting plate are consistent with the length direction of the elongated strip.

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