Wafer bonding safe floating force application device and use method thereof

Abstract

The invention belongs to the technical field of semiconductor wafer process treatment, and particularly relates to a wafer bonding safety floating force application device and a use method thereof. A power source is fixed to a frame, a lead screw is connected with the output end of the power source, the lead screw is in threaded connection with a nut, the nut is fixedly connected with a sliding table plate, and an air cylinder is installed on the bottom face of the sliding table plate; the pressing disc body is connected with a cylinder rod of the air cylinder, and the supporting disc body is fixed to the bottom of the frame and located below the pressing disc body. A pipeline connector of the air cylinder is connected with the electric proportional valve, the electric proportional valve outputs fixed gas pressure needed by bonding to the air cylinder, and the pressing disc body is in pressing fit with the supporting disc body when the air cylinder is in a floating force application state. By adopting a mode of combining a rapid positioning structure and a floating force application structure, floating press fit of the bonding disc in the vacuum cavity is realized, the press fit adaptivity is improved, the control difficulty is reduced, the press fit force control precision is improved, the production safety is enhanced, and the production yield of the bonding process is further improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor wafer processing, in particular to a wafer bonding safety floating force applying device and a use method thereof. Background Art

[0002] Because the bonding process is located at a stage closer to the back end of the chip manufacturing process, the wafer value is often higher, which places higher demands on some bonding performance, such as precise control of bonding pressure and safety. At present, temporary bonding machines are often used in semiconductor production equipment for bonding processes on the market. Temporary bonding machines also have servo press functions, and use servo presses to complete the bonding and pressing process. Servo presses are usually composed of servo motors, reducers, lead screws, guides, etc. However, due to their rigid structure, overpressure or large fluctuations in force are inevitable during pressing, and they cannot be precisely controlled. At the same time, high positioning accuracy is required for the equipment, which affects the efficiency of the bonding process and increases the difficulty of production and manufacturing. Summary of the Invention

[0003] In view of the above-mentioned problems existing in the bonding process of the existing bonding machine with servo press function, the purpose of the present invention is to provide a wafer bonding safety floating force device and a method of using the same.

[0004] The object of the present invention is achieved through the following technical solutions:

[0005] The floating force-applying device of the present invention includes a power source, a screw, a nut and a frame, wherein the power source is fixed on the frame, the screw is connected to the output end of the power source, and the nut is threadedly connected to the screw; it also includes a slide plate, a cylinder, an electric proportional valve, a pressing disc and a support disc, the nut is fixed to the slide plate, the bottom surface of the slide plate is installed with a cylinder, the pressing disc is connected to the cylinder rod which is the output end of the cylinder, and the support disc is fixed to the bottom of the frame and is located below the pressing disc; the pipe joint of the cylinder is connected to the electric proportional valve, and the electric proportional valve outputs the fixed gas pressure required for bonding to the cylinder, the power source drives the screw to rotate, which is converted into the up and down movement of the slide plate through the spiral pair of the screw and the nut, the cylinder and the pressing disc rise and fall together with the slide plate, and the pressing disc is pressed with the support disc when the cylinder is in a floating force-applying state.

[0006] Wherein: a force sensor for real-time force feedback is provided between the cylinder rod and the pressing disc body, the upper end of the force sensor is connected to the cylinder rod, and the pressing disc body is connected to the lower end of the force sensor through a connecting plate.

[0007] The cylinder, force sensor and pressing disc are one or more groups. When there are multiple groups, they are evenly distributed along the circumferential direction around the outer periphery of the screw. The lower end of the force sensor in each group is connected to the pressing disc through a connecting plate.

[0008] The frame is provided with a guide column, the slide plate is slidably connected to the guide column, and the guide column plays a guiding role in the process of the slide plate moving up and down.

[0009] The axial center line of the guide column is parallel to the axial center line of the lead screw.

[0010] The power source includes a servo motor and a reducer. The reducer is fixed on the top of the frame. The servo motor is connected to the input end of the reducer, and the output end of the reducer is connected to the lead screw.

[0011] The cylinder is fixedly connected to the slide plate through a mounting seat.

[0012] The method for using the wafer bonding safety floating force-applying device of the present invention is as follows:

[0013] In the initial state, the electric proportional valve outputs a fixed gas pressure to the rodless side of the cylinder according to the pressure value required for bonding, so that the cylinder rod of the cylinder extends, thereby driving the pressing disk to move downward to a distance X from the supporting disk; during operation, the power source drives the screw to rotate, and through the spiral pair of the screw and the nut, the slide plate drives the cylinder and the pressing disk to move downward a distance Y, thereby making the pressing disk contact with the supporting disk; because the force generated by the power source is greater than that of the cylinder, the cylinder automatically retracts after reaching the required pressure, and the retracted distance is Z=YX, that is, a floating force effect is generated.

[0014] Wherein: a force sensor is provided between the cylinder rod of the cylinder and the pressing disc body, and the force sensor feeds back the pressure value in real time.

[0015] The advantages and positive effects of the present invention are:

[0016] 1. The present invention adopts a combination of a rapid positioning structure and a floating force-applying structure to achieve floating pressing of the bonding disk in the vacuum chamber, increase the pressing adaptability, reduce the control difficulty, improve the pressing force control accuracy, enhance production safety, and thus improve the production yield of the bonding process.

[0017] 2. The floating position of the present invention is controllable, and there is no need to precisely control the movement position, thus reducing the accuracy requirements of the equipment.

[0018] 3. The present invention has a real-time force feedback function.

[0019] 4. The floating pressure of the present invention is flexible and avoids rigid contact. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a front view of the internal structure of the floating force-applying device of the present invention;

[0021] Figure 2 A side view of the internal structure of the floating force-applying device of the present invention;

[0022] Figure 3 This is a schematic diagram of the working state structure of the floating force-applying device of the present invention (cylinder action);

[0023] Figure 4 This is the second schematic diagram of the working state structure of the floating force-applying device of the present invention (screw action);

[0024] Among them: 1 is the servo motor, 2 is the reducer, 3 is the screw, 4 is the guide column, 5 is the slide plate, 6 is the cylinder, 601 is the cylinder rod, 602 is the pipe joint, 603 is the rodless side, 604 is the mounting seat, 7 is the force sensor, 8 is the electric proportional valve, 9 is the pressing disc, 10 is the support disc, 11 is the frame, 12 is the nut, 13 is the connecting plate, and 14 is the bonding sheet. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with the accompanying drawings.

[0026] like Figure 1 、 Figure 2 As shown, the floating force-applying device of the present invention includes a power source, a screw 3, a slide plate 5, a cylinder 6, a force sensor 7, an electric proportional valve 8, a pressing disc 9, a support disc 10, a frame 11 and a nut 12, wherein the power source is fixed on the frame 11, the screw 3 is connected to the output end of the power source, the nut 12 is threadedly connected to the screw 3, the nut 12 is fixed to the slide plate 5, the bottom surface of the slide plate 5 is installed with the cylinder 6, and the cylinder body of the cylinder 6 is fixed to the bottom surface of the slide plate 5 through the mounting seat 604; the upper end of the force sensor 7 is connected to the cylinder rod 601 serving as the output end of the cylinder 6, and the pressing disc 9 is connected to the lower end of the force sensor 7 through the connecting plate 13. The supporting disc 10 is fixed at the bottom of the frame 11, below the pressing disc 9, and the bonding sheet 14 is placed on the upper surface of the supporting disc 10; the space on both sides of the cylinder rod 601 in the cylinder 6 is provided with a pipe joint 602, and the two pipe joints 602 are respectively connected to the electric proportional valve 8, which outputs the fixed gas pressure required for bonding to the cylinder 6. The power source drives the screw 3 to rotate, which is converted into the up and down movement of the slide plate 5 through the spiral pair of the screw 3 and the nut 12. The cylinder 6, the force sensor 7 and the pressing disc 9 rise and fall together with the slide plate 5, and the pressing disc 9 is in a floating force-applying state in the cylinder 6 to be pressed with the supporting disc 10.

[0027] The cylinder 6, force sensor 7, and press-fit disc 9 form one or more groups. If there are multiple groups, they are evenly distributed along the circumference of the outer periphery of the lead screw 3. In this embodiment, two groups of cylinders 6, force sensors 7, and press-fit discs 9 are provided, symmetrically arranged on either side of the lead screw 3. The lower ends of the force sensors 7 in the two groups are connected to the press-fit disc 9 via a connecting plate 13.

[0028] The frame 11 of this embodiment is provided with multiple guide columns 4, and the axial center line of each guide column 4 is parallel to the axial center line of the screw 3; the slide plate 5 is slidingly connected to each guide column 4, and each guide column 4 plays a guiding role during the up and down movement of the slide plate 5.

[0029] The power source of this embodiment includes a servo motor 1 and a reducer 2 . The reducer 2 is fixed to the top of the frame 11 . The servo motor 1 is connected to the input end of the reducer 2 , and the output end of the reducer 2 is connected to the lead screw 3 .

[0030] The method for using the wafer bonding safety floating force-applying device of the present invention is as follows:

[0031] In the initial state, the electric proportional valve 8 outputs a fixed gas pressure to the rodless side 603 of the cylinder 6 according to the pressure value required for bonding, so that the cylinder rod 601 of the cylinder 6 extends, thereby driving the pressing plate 9 to move downward to a distance X from the supporting plate 10, as shown in FIG. Figure 3 As shown; when working, the servo motor 1 drives the reducer 2 and the screw 3 to rotate, and through the screw pair of the screw 3 and the nut 12, the slide plate 5 drives the cylinder 6, the force sensor 7 and the pressing plate 9 to move downward along the guide column 4 by a distance Y, as shown Figure 4 As shown, the pressing plate 9 is brought into contact with the supporting plate 10; since the force generated by the servo motor 1 is greater than the cylinder 6, the cylinder 6 automatically retracts after reaching the required pressure, and the retracted distance is Z=YX (as shown in FIG. Figure 4 As shown), a floating force effect is generated to ensure the safety of the pressing and the floating adaptability. During the pressing, the force sensor 7 can provide real-time feedback of the pressure value.

[0032] When the pressing plate 9 contacts the supporting plate 10 , the slide plate 5 is still located above the bottom of the lead screw 3 , preventing the slide plate 5 from falling off the lead screw 3 .

Claims

1. A wafer bonding safety floating force-applying device, comprising a power source, a lead screw (3), a nut (12) and a frame (11), wherein the power source is fixed to the frame (11), the lead screw (3) is connected to the output end of the power source, and the nut (12) is threadedly connected to the lead screw (3); characterized in that: It also includes a slide plate (5), a cylinder (6), an electric proportional valve (8), a pressing disc (9) and a supporting disc (10), wherein the nut (12) is fixedly connected to the slide plate (5), the cylinder (6) is installed on the bottom surface of the slide plate (5), the pressing disc (9) is connected to the cylinder rod (601) as the output end of the cylinder (6), and the supporting disc (10) is fixed to the bottom of the frame (11) and is located below the pressing disc (9); the pipeline of the cylinder (6) is connected to the cylinder rod (601) as the output end of the cylinder (6). The head (602) is connected to the electric proportional valve (8), and the electric proportional valve (8) outputs the fixed gas pressure required for bonding to the cylinder (6). The power source drives the screw (3) to rotate, which is converted into the up and down movement of the slide plate (5) through the spiral pair of the screw (3) and the nut (12). The cylinder (6) and the pressing plate (9) rise and fall together with the slide plate (5), and the pressing plate (9) is pressed with the support plate (10) in a floating force-applying state in the cylinder (6).

2. The wafer bonding safety floating force-applying device according to claim 1, characterized in that: A force sensor (7) for real-time force feedback is provided between the cylinder rod (601) and the pressing disc (9); the upper end of the force sensor (7) is connected to the cylinder rod (601), and the pressing disc (9) is connected to the lower end of the force sensor (7) via a connecting plate (13).

3. The wafer bonding safety floating force-applying device according to claim 2, characterized in that: The cylinder (6), force sensor (7) and pressing disc (9) are one or more groups. When there are multiple groups, they are evenly distributed along the circumferential direction around the outer periphery of the lead screw (3). The lower end of the force sensor (7) in each group is connected to the pressing disc (9) via a connecting plate (13).

4. The wafer bonding safety floating force-applying device according to claim 1, characterized in that: The frame (11) is provided with a guide column (4), the slide plate (5) is slidably connected to the guide column (4), and the guide column (4) plays a guiding role in the process of the slide plate (5) moving up and down.

5. The wafer bonding safety floating force-applying device according to claim 4, characterized in that: The axial center line of the guide column (4) is parallel to the axial center line of the lead screw (3).

6. The wafer bonding safety floating force-applying device according to claim 1, characterized in that: The power source comprises a servo motor (1) and a reducer (2), wherein the reducer (2) is fixed on the top of the frame (11), the servo motor (1) is connected to the input end of the reducer (2), and the output end of the reducer (2) is connected to the lead screw (3).

7. The wafer bonding safety floating force-applying device according to claim 1, characterized in that: The cylinder (6) is fixedly connected to the slide plate (5) via a mounting seat (604).

8. A method for using the wafer bonding safety floating force-applying device according to any one of claims 1 to 7, characterized in that: In the initial state, the electric proportional valve (8) outputs a fixed gas pressure to the rodless side (603) of the cylinder (6) according to the pressure value required for bonding, so that the cylinder rod (601) of the cylinder (6) extends, thereby driving the pressing disc (9) to move downward to a distance X from the supporting disc (10); during operation, the power source drives the screw (3) to rotate, and through the screw pair of the screw (3) and the nut (12), the slide plate (5) drives the cylinder (6) and the pressing disc (9) to move downward a distance Y, thereby making the pressing disc (9) contact with the supporting disc (10); because the force generated by the power source is greater than that of the cylinder (6), the cylinder (6) automatically retracts after reaching the required pressure, and the retracted distance is Z=YX, that is, a floating force effect is generated.

9. The method of use according to claim 8, characterized in that: A force sensor (7) is provided between the cylinder rod (601) of the cylinder (6) and the pressing disc (9), and the force sensor (7) feeds back the pressure value in real time.

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