A multi-chip wafer packaging processing system

Abstract

This invention relates to the field of semiconductor packaging technology, and in particular to a multi-chip wafer packaging system, comprising a mounting frame, a first frame and a mounting bracket located circumferentially around the first frame, a first feeding mechanism for placing a first wafer within the first frame, a mounting plate and a drive component for lifting the mounting plate on the mounting bracket, a second frame within the mounting plate, and a second feeding mechanism for placing a second wafer within the second frame, both the first and second wafers having alignment marks, and a reflective component on the mounting frame for simultaneously reflecting the alignment marks on the first and second wafers to the same plane, and a reading device on the mounting frame. This application helps improve the alignment accuracy of the two wafers during the bonding process, thereby improving the bonding accuracy between the two wafers, and further helping to improve the yield after wafer packaging.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a multi-chip wafer packaging system. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits and is the basic material for manufacturing chips. Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product models and functional requirements. Hybrid bonding technology is a new type of semiconductor packaging technology that can integrate homogeneous and heterogeneous materials to achieve vertical stacking, thereby improving chip performance. Compared with traditional thermoforming bonding technology, hybrid bonding technology does not require solder bumps, can achieve higher density interconnects, and reduce chip power consumption. Generally, the hybrid bonding process can be divided into three stages: surface treatment, alignment bonding, and post-processing. Surface treatment uses plasma or acid / alkali to clean and activate the wafer surface to enhance adhesion; alignment bonding involves high-precision alignment of multiple wafers to ensure one-to-one correspondence of pads, followed by direct bonding under pressure through van der Waals forces and inter-molecular and atomic forces; post-processing strengthens bonding through annealing, typically at temperatures between 200 and 300°C.

[0003] In the entire process described above, alignment accuracy is a key indicator affecting the electrical connection and reliability between multiple chips. Any issues with alignment accuracy will significantly impact chip yield. In existing alignment and bonding processes, the main method involves using two separate vision positioning systems to align the alignment marks on the two wafers, determining their positions. Then, through a specific functional relationship, the coordinate systems are transformed to achieve the alignment of the two wafers, thus realizing high-precision bonding between them.

[0004] However, the positioning method using two sets of vision positioning systems is prone to positioning errors due to factors such as mechanical movement, equipment vibration, and motion control, which can easily affect the alignment accuracy between the two wafers, and consequently affect the bonding accuracy between the two wafers. Summary of the Invention

[0005] In order to improve the alignment accuracy of two wafers during the bonding process, thereby improving the bonding accuracy between the two wafers and thus improving the yield of wafer packaging, this application provides a multi-chip wafer packaging system.

[0006] This application provides a multi-chip wafer packaging processing system, which adopts the following technical solution:

[0007] A multi-chip wafer packaging system includes a mounting frame, on which a first frame and a mounting bracket located on the periphery of the first frame are disposed. A first feeding mechanism for placing a first wafer is disposed within the first frame. A mounting plate and a drive component for lifting the mounting plate are disposed on the mounting plate. A second frame is disposed on the mounting plate, and a second feeding mechanism for placing a second wafer is disposed within the second frame. Alignment marks are disposed on both the first and second wafers. A reflective component is disposed on the mounting frame for simultaneously reflecting the alignment marks on the first and second wafers to the same plane. A reading device is also disposed on the mounting frame for reading the position information of the reflected alignment marks.

[0008] By adopting the above technical solution, the reflective component helps to simultaneously reflect the alignment marks on the first wafer and the second wafer onto the reading surface of the reading device. The reading device helps to read the position information of the two alignment marks. After the read information is transmitted to the processor for processing, the first wafer and the second wafer can be accurately positioned, thereby helping to determine whether the first wafer and the second wafer are aligned. Compared with the positioning method using two sets of vision positioning systems, this application helps to minimize the positioning errors caused by mechanical movement, equipment vibration and motion control of the two sets of vision positioning systems, which helps to improve the alignment accuracy of the first wafer and the second wafer during the bonding process, thereby helping to improve the bonding accuracy between the first wafer and the second wafer, and further helping to improve the yield of the first wafer and the second wafer after packaging.

[0009] In one specific implementation, the reflective assembly includes a placement seat, a drive cylinder, an extension rod, and a reflective block. The placement seat is mounted on a fixed frame, the drive cylinder is mounted on the placement seat, the extension rod is coaxially connected to the piston rod of the drive cylinder, and the reflective block is located at the end of the extension rod away from the piston rod of the drive cylinder. The reflective block is symmetrically provided with a first reflective mirror and a second reflective mirror, and the angle between the first reflective mirror and the second reflective mirror and the horizontal plane is 45 degrees.

[0010] By adopting the above technical solution, when the distance between the first wafer and the second wafer reaches a set distance, the driving cylinder helps to move the reflective block horizontally to the middle position of the first wafer and the second wafer via the extension rod. This helps to reflect the alignment marks on the first wafer and the second wafer simultaneously onto the reading surface of the reading device using the first and second reflective mirrors. The reading device helps to read the position information of the two alignment marks, and after the read information is transmitted to the processor for processing, the first wafer and the second wafer can be accurately positioned. This helps to determine whether the first wafer and the second wafer are aligned, which helps to improve the alignment accuracy of the first wafer and the second wafer during the bonding process, thereby improving the bonding accuracy between the first wafer and the second wafer, and further improving the yield of the first wafer and the second wafer after packaging.

[0011] In one specific implementation scheme, the first feeding mechanism includes a first support platform disposed inside a first frame, a first placement slot for placing a first wafer disposed on the first support platform, a positioning component for positioning the placement position of the first support platform disposed inside the first frame, and a limiting component for limiting the first wafer placed in the first placement slot disposed inside the first support platform.

[0012] By adopting the above technical solution, after the first wafer is placed into the first placement slot, the limiting component helps to clamp and limit the first wafer, thereby improving the stability of the first wafer placed in the first placement slot. The positioning component helps to position the first support stage and also helps to adjust the placement position of the first support stage within the first frame, thereby helping to adjust the position of the first wafer.

[0013] In one specific implementation scheme, the positioning component includes a first electric push rod, a first locking block, a second electric push rod, and a second locking block. A first locking groove and a second locking groove are respectively provided on adjacent side walls of the first support platform. Both the first and second locking grooves are horizontally arranged. The first electric push rod is located within the first frame on the side closest to the first locking groove. The first locking block is located at the output end of the first electric push rod and slidably engages with the first locking groove. The second electric push rod is located within the first frame on the side closest to the second locking groove. The second locking block is located at the output end of the second electric push rod and slidably engages with the second locking groove.

[0014] By adopting the above technical solution, the first electric push rod helps to move the first latching block, and the sliding of the second latching block in the second latching groove helps to guide and restrict the movement direction of the first carrier stage, thereby helping to drive the first carrier stage to move horizontally along the length direction of the first electric push rod; the second electric push rod helps to move the second latching block, and the sliding of the first latching block in the first latching groove helps to guide and restrict the movement direction of the first carrier stage, thereby helping to drive the first carrier stage to move horizontally along the length direction of the second electric push rod; the cooperation of the first electric push rod and the second electric push rod helps to finely adjust the position of the first carrier stage within the first frame, thereby helping to finely adjust the position of the first wafer.

[0015] In one specific implementation scheme, the limiting component includes a lifting cylinder. A blind mounting hole communicating with a first placement slot is provided in the first support platform. The lifting cylinder is disposed within the blind mounting hole. An I-shaped shaft disc is provided on the piston rod of the lifting cylinder. Installation slots are symmetrically arranged on both sides of the blind mounting hole within the first support platform. The installation slots communicate with the blind mounting hole. A first rotating plate and a second rotating plate are rotatably mounted within the installation slots. The first and second rotating plates are connected by a connecting plate and arranged parallel to each other. The end of the first rotating plate away from the connecting plate is inserted into the I-shaped shaft disc. A limiting block is provided at the end of the second rotating plate away from the connecting plate. A lifting plate is provided on the I-shaped shaft disc.

[0016] By adopting the above technical solution, when clamping and limiting the first wafer, the lifting cylinder helps to move the I-shaped shaft disk downwards in the vertical direction, thereby helping to rotate the first rotating plate. This, in turn, helps the second rotating plate and the limiting block rotate synchronously under the action of the connecting plate. This allows the two limiting blocks to clamp and limit the first wafer, thus improving the stability of the first wafer placed in the first placement slot. When ejecting the first wafer from the first placement slot, the lifting cylinder helps to move the I-shaped shaft disk upwards in the vertical direction, thereby helping to rotate the first rotating plate in the opposite direction. This, in turn, helps the second rotating plate and the limiting block rotate synchronously in the opposite direction under the action of the connecting plate. This helps to release the clamping and limiting effect of the two limiting blocks on the first wafer. Simultaneously, as the I-shaped shaft disk moves upwards, it also moves the lifting plate upwards. The upward-moving lifting plate helps to lift the first wafer, which has been released from its limiting position, thus helping to eject the first wafer from the first placement slot.

[0017] In one specific implementation scheme, the second feeding mechanism includes a second support platform disposed inside the second frame. The second frame and the second support platform together form a closed chamber. A second placement slot for placing a second wafer is provided on the side of the second support platform located outside the closed chamber. A connecting hole for connecting the closed chamber and the second placement slot is provided through the second support platform. An electric cylinder is provided on the mounting plate. A connecting plate is provided at the output end of the electric cylinder. A connecting rod is provided at both ends of the connecting plate. The end of the connecting rod away from the connecting plate is inserted into the second frame. A piston is provided at the end of the connecting rod inserted into the second frame, and the circumferential sidewall of the piston is slidably attached to the inner sidewall of the closed chamber.

[0018] By adopting the above technical solution, when the second wafer is placed into the second placement slot, the electric cylinder helps to move the connecting plate and connecting rod upward, which in turn helps to move the piston away from the second support stage in the closed chamber. This helps to generate negative pressure between the piston and the second support stage, which helps to generate suction force on the second wafer placed in the second placement slot through the connecting hole, thereby helping to improve the stability of the second wafer placed in the second placement slot.

[0019] In one specific implementation scheme, the mounting bracket includes a mounting top plate and multiple columns. The multiple columns are fixedly mounted on a fixed frame and located on the circumferential periphery of the first frame. The mounting top plate is located at the top of the multiple columns. Each column is slidably fitted with a bushing. The mounting plate is fixedly fitted on the multiple bushings. Each column is provided with a stop mechanism for limiting the lifting and lowering of the mounting plate.

[0020] By adopting the above technical solution, when the driving component drives the mounting plate to slide down the column to the set position, the blocking mechanism helps to stop the mounting plate, thereby helping to make the first wafer and the second wafer symmetrically distributed on both sides of the reflective block, which in turn helps to improve the accuracy of the reflection position of the alignment mark on the first wafer and the second wafer.

[0021] In one specific implementation, the stopping mechanism includes a top support spring, which is mounted on a fixed frame and sleeved around the circumference of the column. A stopping collar is sleeved on the column and connected to the top support spring. A through hole is provided through the side wall of the stopping collar. A plug hole is provided on the side wall of the column for communicating with the through hole. A plug assembly is provided on the fixed frame for sequentially inserting into the through hole and the plug hole.

[0022] By adopting the above technical solution, the plug-in component can be inserted into the through hole and the plug hole in sequence, which helps to position the stop ring on the column, and thus helps to stop the mounting plate by using the stop ring.

[0023] In one specific implementation, the plug-in assembly includes a mounting base mounted on a fixed frame. An opening is provided through the mounting base, and a lifting plate is retractably engaged within the opening. A connecting rod is hinged to the top of the lifting plate, and a horizontally positioned plug-in rod is hinged to the end of the connecting rod away from the lifting plate. The plug-in rod passes through the mounting base and is slidably connected to it. The plug-in rod is flush with the insertion hole. A through groove is provided through the lifting plate, and a strip-shaped tooth is provided on one vertical sidewall of the through groove. A transmission gear is rotatably mounted on the mounting base, located inside the through groove and meshing with the strip-shaped tooth. The extension rod is a threaded rod, passing through the transmission gear and threadedly connected to it.

[0024] By adopting the above technical solution, the extension of the extension rod helps to drive the transmission gear to rotate, which in turn helps to drive the lifting plate to rise through the bar teeth. This, in turn, helps to drive the plug rod to move horizontally towards the insertion hole through the connecting rod until the plug rod passes through the insertion hole and is inserted into the insertion hole. This helps to use the plug rod to position the stop ring on the column, which in turn helps to use the stop ring to stop the mounting plate.

[0025] In one specific implementation scheme, a mounting ring groove is provided on the side of the first frame facing the second frame, and a buffer pad ring for buffering and shock absorption is snapped into the mounting ring groove.

[0026] By adopting the above technical solution, the buffer pad ring helps to buffer and reduce shock during the contact between the first frame and the second frame, thereby improving the stability of the first wafer placed in the first placement slot and the stability of the second wafer placed in the second placement slot, and thus helping to ensure the alignment accuracy of the first wafer and the second wafer.

[0027] In summary, this application includes at least one of the following beneficial technical effects:

[0028] 1. This application, through the arrangement of a reflective component and a reading device, allows the reflective component to simultaneously reflect alignment marks on the first wafer and the second wafer onto the reading surface of the reading device. The reading device then helps to read the position information of the two alignment marks. After the read information is transmitted to the processor for processing, the first wafer and the second wafer can be accurately positioned, thereby helping to determine whether the first wafer and the second wafer are aligned. Compared with the positioning method using two sets of vision positioning systems, this application helps to minimize the positioning errors caused by mechanical movement, equipment vibration, and motion control of the two sets of vision positioning systems. This helps to improve the alignment accuracy of the first wafer and the second wafer during the bonding process, thereby helping to improve the bonding accuracy between the first wafer and the second wafer, and further helping to improve the yield of the first wafer and the second wafer after packaging.

[0029] 2. By setting up a limiting component and a positioning component, the limiting component helps to clamp and limit the first wafer placed in the first placement slot, thereby helping to improve the stability of the first wafer placed in the first placement slot; the positioning component helps to position the first support stage in the first frame, and at the same time helps to make fine adjustments to the placement position of the first support stage in the first frame, thereby helping to make fine adjustments to the position of the first wafer. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0031] Figure 2 This is a schematic diagram illustrating the specific structure of the positioning component.

[0032] Figure 3 This is a schematic diagram illustrating the specific structure of the limiting component.

[0033] Figure 4 It is a sectional view showing the specific internal structure of the second frame.

[0034] Figure 5 It is a schematic diagram showing the specific structure of the plug-in component.

[0035] Explanation of reference numerals in the attached drawings: 1. Fixing frame; 2. First frame; 3. Mounting bracket; 31. Mounting top plate; 32. Column; 4. Mounting plate; 5. Driving component; 6. Second frame; 7. Alignment mark; 8. Reflecting assembly; 81. Placement seat; 82. Driving cylinder; 83. Extension rod; 84. Reflecting block; 841. First reflecting mirror; 842. Second reflecting mirror; 9. Reading device; 10. First support platform; 11. First placement slot; 12. Positioning assembly; 121. First electric push rod; 122. First locking block; 123. Second electric push rod; 124. Second locking block; 13. First locking slot; 14. Second locking slot; 15. Limiting assembly; 151. Lifting cylinder; 152. I-shaped shaft disc; 1 53. First rotating plate; 154. Second rotating plate; 155. Connecting plate; 156. Limiting block; 16. Mounting blind hole; 17. Mounting groove; 18. Lifting plate; 19. Second bearing platform; 20. Enclosed chamber; 21. Second placement groove; 22. Connecting hole; 23. Electric cylinder; 24. Connecting plate; 25. Connecting rod; 26. Piston; 27. Bushing; 28. Top support spring; 29. ​​Stop ring; 30. Through hole; 33. Insertion hole; 34. Insertion assembly; 35. Mounting base; 36. Opening; 37. Lifting plate; 38. Connecting rod; 39. Insertion rod; 40. Through groove; 41. Strip tooth; 42. Transmission gear; 43. Mounting ring groove; 44. Buffer pad ring; 45. First wafer; 46. Second wafer. Detailed Implementation

[0036] The present application will be further described in detail below with reference to the accompanying drawings.

[0037] This application discloses a multi-chip wafer packaging processing system, referring to... Figure 1 The system includes a fixed frame 1, on the top surface of which a first frame 2 and a mounting bracket 3 are fixedly mounted. In this embodiment, the mounting bracket 3 includes a mounting top plate 31 and four columns 32. The four columns 32 are fixedly mounted on the top surface of the fixed frame 1 and distributed around the four corners of the first frame 2. The mounting top plate 31 is fixedly mounted on the top of the four columns 32. Each column 32 has a bushing 27 slidably fitted around its circumference. A mounting plate 4 is fitted onto all four bushings 27. Two driving components 5 are fixedly fixed at intervals on the bottom surface of the mounting top plate 31. In this embodiment, the driving components 5 are electric push rods. The output ends of the two electric push rods are fixedly connected to the top surface of the mounting plate 4. A second frame 6 is fixedly mounted on the bottom surface of the mounting plate 4.

[0038] Reference Figure 2 and Figure 3The first frame 2 is equipped with a first feeding mechanism, which includes a first support platform 10 movably placed inside the first frame 2. A first placement groove 11 is formed on the top surface of the first support platform 10, and a first wafer 45 is held in place within the first placement groove 11. The first wafer 45 has alignment marks 7. A mounting ring groove 43 is formed on the top surface of the first frame 2, and a buffer pad ring 44 is held in place within the mounting ring groove 43.

[0039] Reference Figure 2 and Figure 3 The first frame 2 is equipped with a positioning component 12, which includes a first electric push rod 121, a first locking block 122, a second movable push rod 123, and a second locking block 124. The adjacent side walls of the first support platform 10 are respectively provided with a first locking groove 13 and a second locking groove 14. The first locking groove 13 and the second locking groove 14 are both horizontally arranged. The first electric push rod 121 is fixedly installed in the first frame 2 on the side near the first locking groove 13, and the output end of the first electric push rod 121 extends toward the first locking groove 13. The first locking block 122 is fixedly installed in the output end of the first electric push rod 121 and slides into the first locking groove 13. The second electric push rod 123 is fixedly installed in the first frame 2 on the side near the second locking groove 14, and the output end of the second electric push rod 123 extends toward the second locking groove 14. The second locking block 124 is fixedly installed in the output end of the second electric push rod 123 and slides into the second locking groove 14.

[0040] Reference Figure 3 The first support platform 10 has a blind mounting hole 16 on the bottom wall of the first placement groove 11. The first support platform 10 also has symmetrical mounting grooves 17 on both sides of the top of the blind mounting hole 16, communicating with it. Limiting components 15 are provided in the blind mounting hole 16 and the two mounting grooves 17. Each limiting component 15 includes a lifting cylinder 151, which is fixedly installed in the blind mounting hole 16 with its piston rod extending upwards. An I-shaped shaft disc 152 is fixed to the top of the piston rod of the lifting cylinder 151, and a lifting plate 18 is fixedly installed on the top surface of the I-shaped shaft disc 152. Each mounting slot 17 contains a first rotating plate 153 and a second rotating plate 154 arranged in parallel. The end of the first rotating plate 153 away from the lifting cylinder 151 is hinged to a connecting plate 155. The end of the connecting plate 155 away from the first rotating plate 153 is hinged to the second rotating plate 154. The end of the first rotating plate 153 away from the connecting plate 155 is inserted into the I-shaped shaft disk 152. The end of the second rotating plate 154 away from the connecting plate 155 is fixed with a limit block 156.

[0041] Reference Figure 2 and Figure 3The operator places the first wafer 45 into the first placement slot 11. The piston rod of the lifting cylinder 151 retracts, causing the I-shaped shaft disk 152 to move down synchronously. This causes the first rotating plates 153 on both sides to rotate, and then, driven by the connecting plate 155, the second rotating plate 154 and the limiting block 156 to rotate synchronously. This helps to clamp and limit the first wafer 45 using the two limiting blocks 156 after rotation, thereby improving the stability of the first wafer 45 placed in the first placement slot 11.

[0042] Reference Figure 1 and Figure 4 The second frame 6 is equipped with a second feeding mechanism, which includes a second support platform 19 fixedly installed inside the second frame 6. A second placement groove 21 is formed on the bottom surface of the second support platform 19, and a second wafer 46 is held in place within the second placement groove 21. The second wafer 46 has alignment marks 7 on its relative position to the first wafer 45. The second support platform 19 and the second frame 6 together form a closed chamber 20. The second support platform 19 has multiple connecting holes 22 that connect the closed chamber 20 and the second placement groove 21. An electric cylinder 23 is fixedly installed on the top surface of the mounting plate 4. The output end of the electric cylinder 23 extends upward and is fixedly installed with a connecting plate 24. Vertical connecting rods 25 are fixedly installed on the bottom surfaces of both ends of the connecting plate 24. The bottom ends of the two connecting rods 25 are inserted into the closed chamber 20, and a piston 26 is installed on the bottom ends of the two piston rods. The circumferential sidewall of the piston 26 slides against the inner sidewall of the closed chamber 20.

[0043] Reference Figure 1 and Figure 4 The operator places the second wafer 46 into the second placement slot 21. The piston rod of the electric cylinder 23 extends, driving the connecting plate 24 and the connecting rod 25 to move upward, thereby driving the piston 26 to move away from the second support stage 19 in the closed chamber 20. This creates a negative pressure between the piston 26 and the second support stage 19, which helps to generate suction on the second wafer 46 placed in the second placement slot 21 through the connecting hole 22, thereby helping to improve the stability of the second wafer 46 placed in the second placement slot 21.

[0044] Reference Figure 1A reflective assembly 8 is provided on one side of the first frame 2 on the mounting frame 1, and a reading device 9 is installed on the side of the first frame 2 away from the reflective assembly 8 on the mounting frame 1. The reflective assembly 8 includes a placement seat 81, a drive cylinder 82, an extension rod 83, and a reflective block 84. The placement seat 81 is fixedly installed on the mounting frame 1, and the drive cylinder 82 is fixedly installed on the top surface of the placement seat 81. The piston rod of the drive cylinder 82 extends horizontally toward the first frame 2. The extension rod 83 is coaxially fixedly connected to the piston rod of the drive cylinder 82. The reflective block 84 is fixedly installed at the end of the extension rod 83 away from the piston rod of the drive cylinder 82. The reflective block 84 has a first reflective mirror 841 and a second reflective mirror 842 symmetrically arranged, and the angle between the first reflective mirror 841 and the second reflective mirror 842 and the horizontal plane is 45 degrees.

[0045] Reference Figure 1 and Figure 5 A stopping mechanism is provided on all four columns 32. The stopping mechanism includes a top support spring 28, which is fixedly installed on the fixed frame 1 and sleeved around the periphery of the column 32. A stopping collar 29 is slidably sleeved on the column 32, and the bottom surface of the stopping collar 29 is connected to the top surface of the top support spring 28. An insertion hole 30 is provided through the side wall of the stopping collar 29. An insertion hole 33 is provided on the side wall of the column 32, and the insertion hole 33 has the same diameter as the insertion hole 30. An insertion component 34 is provided on the fixed frame 1.

[0046] Reference Figure 5 The plug-in assembly 34 includes a mounting base 35 fixed on a mounting frame 1. An opening 36 is provided through the mounting base 35, and a lifting plate 37 is mounted within the opening 36 in a height-adjustable manner. A connecting rod 38 is hinged to the top of the lifting plate 37, and a horizontally positioned plug-in rod 39 is hinged to the end of the connecting rod 38 away from the lifting plate 37. The plug-in rod 39 passes through the mounting base 35 and is slidably connected to it, and is flush with the insertion hole 30. A through groove 40 is provided through the lifting plate 37, and a strip-shaped tooth 41 is integrally formed on one vertical sidewall of the through groove 40. A transmission gear 42 is rotatably connected to the mounting base 35, and the transmission gear 42 is located inside the through groove 40 and meshes with the strip-shaped tooth 41. In this embodiment, the extension rod 83 is a threaded rod, which passes through the transmission gear 42 and is threadedly connected to it.

[0047] Reference Figure 1 and Figure 5The piston rod of the electric push rod extends, causing the mounting plate 4 to slide down the column 32. At the same time, the piston rod of the drive cylinder 82 extends, causing the reflector block 84 to move horizontally to the set position via the extension rod 83. As the extension rod 83 moves, the transmission gear 42 rotates under the action of the extension rod 83, thereby causing the lifting plate 37 to rise via the strip tooth 41. This causes the connecting rod 38 to push the insertion rod 39 horizontally toward the insertion hole 30 until the insertion rod 39 passes through the insertion hole 30 and inserts into the insertion hole 33. This helps to position the stop ring 29 on the column 32 using the insertion rod 39, thereby helping to stop the mounting plate 4 using the stop ring 29. This also helps to ensure that the first wafer 45 and the second wafer 46 are symmetrically distributed on both sides of the reflector block 84.

[0048] Reference Figure 1 and Figure 3 When the first wafer 45 and the second wafer 46 are symmetrically distributed on both sides of the reflective block 84, the first reflective mirror 841 and the second reflective mirror 842 simultaneously reflect the alignment marks 7 on the first wafer 45 and the second wafer 46 to the reading surface of the reading device 9. The reading device 9 reads the position information of the two alignment marks 7, and then transmits the read information to the processor for processing, so as to accurately position the first wafer 45 and the second wafer 46. This helps to improve the alignment accuracy of the first wafer 45 and the second wafer 46 during the bonding process, thereby helping to improve the bonding accuracy between the first wafer 45 and the second wafer 46, and further helping to improve the yield of the first wafer 45 and the second wafer 46 after packaging.

[0049] Reference Figure 2 and Figure 3 When the first wafer 45 and the second wafer 46 are not aligned, the first electric push rod 121 is activated, which drives the first carrier stage 10 to move horizontally along the length direction of the first electric push rod 121 via the first locking block 122; the second electric push rod 123 is activated, which drives the second carrier stage 19 to move horizontally along the length direction of the second electric push rod 123 via the second locking block 124. This helps to make fine adjustments to the position of the first carrier stage 10 within the first frame 2, thereby helping to make fine adjustments to the position of the first wafer 45, and thus helping to improve the alignment accuracy of the first wafer 45 and the second wafer 46.

[0050] Reference Figure 1 and Figure 3After the alignment accuracy of the first wafer 45 and the second wafer 46 is checked, the piston rod of the drive cylinder 82 retracts, causing the extension rod 83 to move toward the drive cylinder 82. The transmission gear 42 rotates in the opposite direction under the action of the extension rod 83, thereby driving the lifting plate 37 to descend through the strip tooth 41. This causes the connecting rod 38 to pull the insertion rod 39, causing the insertion rod 39 to disengage from the insertion hole 33 and the through hole 30. This helps to release the blocking effect of the stop ring 29 on the mounting plate 4, and further helps the electric push rod to drive the mounting plate 4 to continue to move down, completing the bonding process of the first wafer 45 and the second wafer 46.

[0051] Reference Figure 1 and Figure 3 After the first wafer 45 and the second wafer 46 are bonded, the piston rod of the lifting cylinder 151 extends, driving the I-shaped shaft disk 152 to move upward in the vertical direction. This helps to drive the first rotating plate 153 to rotate in the opposite direction. Then, under the drive of the connecting plate 155, the second rotating plate 154 and the limiting block 156 rotate in the opposite direction synchronously, which helps to release the clamping and limiting of the two limiting blocks 156 on the first wafer 45. At the same time, during the upward movement of the I-shaped shaft disk 152, the lifting plate 18 moves upward synchronously. The upward-moving lifting plate 18 lifts the first wafer 45 that has been released from the limiting, which helps to push the bonded first wafer 45 and the second wafer 46 out of the first placement slot 11.

[0052] The implementation principle of this application embodiment is as follows: The operator places the first wafer 45 into the first placement slot 11, the piston rod of the lifting cylinder 151 retracts, driving the I-shaped shaft disk 152 to move down synchronously, thereby driving the first rotating plates 153 on both sides to rotate, and then driving the second rotating plate 154 and the limiting block 156 to rotate synchronously under the drive of the connecting plate 155. This helps to use the two limiting blocks 156 after rotation to clamp and limit the first wafer 45, thereby helping to improve the stability of the first wafer 45 placed in the first placement slot 11.

[0053] The operator places the second wafer 46 into the second placement slot 21. The piston rod of the electric cylinder 23 extends, driving the connecting plate 24 and the connecting rod 25 to move upward, thereby driving the piston 26 to move away from the second support stage 19 in the closed chamber 20. This creates a negative pressure between the piston 26 and the second support stage 19, which helps to generate suction on the second wafer 46 placed in the second placement slot 21 through the connecting hole 22, thereby helping to improve the stability of the second wafer 46 placed in the second placement slot 21.

[0054] The piston rod of the electric push rod extends, causing the mounting plate 4 to slide down the column 32; simultaneously, the piston rod of the drive cylinder 82 extends, causing the reflector block 84 to move horizontally to a set position via the extension rod 83. As the extension rod 83 moves, the transmission gear 42 rotates under the action of the extension rod 83, thereby causing the lifting plate 37 to rise via the strip tooth 41, which in turn causes the connecting rod 38 to push the insertion rod 39 horizontally toward the insertion hole 30 until the insertion rod 39 passes through the insertion hole 30 and inserts into the insertion hole 33. This helps to position the stop ring 29 on the column 32 using the insertion rod 39, thereby helping to stop the mounting plate 4 using the stop ring 29, and thus helping to ensure that the first wafer 45 and the second wafer 46 are symmetrically distributed on both sides of the reflector block 84.

[0055] After the first wafer 45 and the second wafer 46 are symmetrically distributed on both sides of the reflective block 84, the first reflective mirror 841 and the second reflective mirror 842 simultaneously reflect the alignment marks 7 on the first wafer 45 and the second wafer 46 to the reading surface of the reading device 9. The reading device 9 reads the position information of the two alignment marks 7, and then transmits the read information to the processor for processing, so as to accurately position the first wafer 45 and the second wafer 46. This helps to improve the alignment accuracy of the first wafer 45 and the second wafer 46 during the bonding process, thereby helping to improve the bonding accuracy between the first wafer 45 and the second wafer 46, and further helping to improve the yield of the first wafer 45 and the second wafer 46 after packaging.

[0056] When the first wafer 45 and the second wafer 46 are not aligned, the first electric push rod 121 is activated, which drives the first carrier stage 10 to move horizontally along the length direction of the first electric push rod 121 via the first locking block 122; the second electric push rod 123 is activated, which drives the second carrier stage 19 to move horizontally along the length direction of the second electric push rod 123 via the second locking block 124. This helps to make fine adjustments to the position of the first carrier stage 10 within the first frame 2, thereby helping to make fine adjustments to the position of the first wafer 45, and thus helping to improve the alignment accuracy of the first wafer 45 and the second wafer 46.

[0057] After the alignment accuracy of the first wafer 45 and the second wafer 46 is checked, the piston rod of the drive cylinder 82 retracts, causing the extension rod 83 to move toward the drive cylinder 82. The transmission gear 42 rotates in the opposite direction under the action of the extension rod 83, thereby driving the lifting plate 37 to descend through the strip tooth 41. This causes the connecting rod 38 to pull the insertion rod 39, causing the insertion rod 39 to disengage from the insertion hole 33 and the through hole 30. This helps to release the blocking effect of the stop collar 29 on the mounting plate 4, and further helps the electric push rod to drive the mounting plate 4 to continue to move down, completing the bonding process of the first wafer 45 and the second wafer 46.

[0058] After the first wafer 45 and the second wafer 46 are bonded, the piston rod of the lifting cylinder 151 extends, driving the I-shaped shaft disk 152 to move upward in the vertical direction. This helps to drive the first rotating plate 153 to rotate in the opposite direction. Then, under the drive of the connecting plate 155, the second rotating plate 154 and the limiting block 156 rotate in the opposite direction synchronously, which helps to release the clamping and limiting of the two limiting blocks 156 on the first wafer 45. At the same time, during the upward movement of the I-shaped shaft disk 152, the lifting plate 18 moves upward synchronously. The upward-moving lifting plate 18 lifts the first wafer 45 that has been released from the limiting, which helps to push the bonded first wafer 45 and the second wafer 46 out of the first placement slot 11.

[0059] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A multi-chip wafer packaging processing system, characterized in that: The device includes a mounting frame (1), on which a first frame (2) and a mounting bracket (3) located around the periphery of the first frame (2) are provided. A first feeding mechanism for placing a first wafer (45) is provided inside the first frame (2). A mounting plate (4) and a drive component (5) for driving the mounting plate (4) to move up and down are provided on the mounting plate (4). A second frame (6) is provided on the mounting plate (4). A second feeding mechanism for placing a second wafer (46) is provided inside the second frame (6). Alignment marks (7) are provided on both the first wafer (45) and the second wafer (46). A reflective component (8) is provided on the mounting frame (1) for simultaneously reflecting the alignment marks (7) on the first wafer (45) and the second wafer (46) to the same plane. A reading device (9) is also provided on the mounting frame (1) for reading the position information of the reflected alignment marks (7). The reflective assembly (8) includes a placement base (81), a drive cylinder (82), an extension rod (83), and a reflective block (84). The placement base (81) is mounted on a fixed frame (1), and the drive cylinder (82) is mounted on the placement base (81). The extension rod (83) is coaxially connected to the piston rod of the drive cylinder (82). The reflective block (84) is located at the end of the extension rod (83) away from the piston rod of the drive cylinder (82). A first reflective mirror (841) and a second reflective mirror (842) are symmetrically arranged on the reflective block (84), and the angle between the first reflective mirror (841) and the second reflective mirror (842) and the horizontal plane is 45 degrees. The drive cylinder (82) helps to drive the reflective block (84) horizontally to the middle position between the first wafer (45) and the second wafer (46) via the extension rod (83). The first feeding mechanism includes a first support platform (10) disposed inside the first frame (2), the first support platform (10) is provided with a first placement slot (11) for placing the first wafer (45), the first frame (2) is provided with a positioning component (12) for positioning the placement position of the first support platform (10), and the first support platform (10) is provided with a limiting component (15) for limiting the first wafer (45) placed in the first placement slot (11); The positioning component (12) includes a first electric push rod (121), a first locking block (122), a second electric push rod (123), and a second locking block (124). The first support platform (10) is provided with a first locking groove (13) and a second locking groove (14) on its adjacent side walls. The first locking groove (13) and the second locking groove (14) are both horizontally arranged. The first electric push rod (121) is located in the first frame (2) on the side close to the first locking groove (13). The first locking block (122) is located at the output end of the first electric push rod (121) and is slidably locked in the first locking groove (13). The second electric push rod (123) is located in the first frame (2) on the side close to the second locking groove (14). The second locking block (124) is located at the output end of the second electric push rod (123) and is slidably locked in the second locking groove (14). The limiting component (15) includes a lifting cylinder (151). A blind mounting hole (16) communicating with a first placement groove (11) is provided in the first support platform (10). The lifting cylinder (151) is disposed within the blind mounting hole (16). An I-shaped shaft disc (152) is provided on the piston rod of the lifting cylinder (151). Installation grooves (17) are symmetrically arranged on both sides of the blind mounting hole (16) within the first support platform (10). The installation grooves (17) communicate with the blind mounting hole (16). A first rotating plate (153) and a second rotating plate (154) are rotatably installed in the mounting slot (17). The first rotating plate (153) and the second rotating plate (154) are connected by a connecting plate (155) and arranged in parallel. The end of the first rotating plate (153) away from the connecting plate (155) is inserted into the I-shaped shaft disk (152). The end of the second rotating plate (154) away from the connecting plate (155) is provided with a limit block (156). A lifting plate (18) is provided on the I-shaped shaft disk (152). The second feeding mechanism includes a second support platform (19) disposed inside the second frame (6). The second frame (6) and the second support platform (19) together form a closed chamber (20). The second support platform (19) has a second placement slot (21) for placing the second wafer (46) on one side outside the closed chamber (20). A connecting hole (22) is provided through the second support platform (19) for connecting the closed chamber (20) and the second placement slot (21). An electric cylinder (23) is provided on the mounting plate (4). A connecting plate (24) is provided at the output end of the electric cylinder (23). A connecting rod (25) is provided at both ends of the connecting plate (24). The end of the connecting rod (25) away from the connecting plate (24) is inserted into the interior of the second frame (6). A piston (26) is provided at the end of the connecting rod (25) inserted into the interior of the second frame (6). The circumferential sidewall of the piston (26) slides against the inner sidewall of the closed chamber (20).

2. The multi-chip wafer packaging system according to claim 1, characterized in that: The mounting bracket (3) includes a mounting top plate (31) and multiple columns (32). The multiple columns (32) are fixedly mounted on the fixed frame (1) and located on the circumferential periphery of the first frame (2). The mounting top plate (31) is located at the top of the multiple columns (32). Each column (32) is slidably fitted with a bushing (27). The mounting plate (4) is fixedly fitted on the multiple bushings (27). The column (32) is provided with a stop mechanism for limiting the lifting and lowering of the mounting plate (4).

3. The multi-chip wafer packaging processing system according to claim 2, characterized in that: The stopping mechanism includes a top support spring (28), which is mounted on the fixed frame (1) and sleeved around the circumferential periphery of the column (32). A stopping collar (29) is sleeved on the column (32) and connected to the top support spring (28). A through hole (30) is provided through the side wall of the stopping collar (29). A plug hole (33) for communicating with the through hole (30) is provided on the side wall of the column (32). A plug assembly (34) for sequentially inserting into the through hole (30) and the plug hole (33) is provided on the fixed frame (1).

4. The multi-chip wafer packaging system according to claim 3, characterized in that: The plug-in assembly (34) includes a mounting base (35) disposed on a fixed frame (1). An opening (36) is provided through the mounting base (35). A lifting plate (37) is vertically and lockably disposed within the opening (36). A connecting rod (38) is hinged to the top of the lifting plate (37). A horizontally disposed plug-in rod (39) is hinged to the end of the connecting rod (38) away from the lifting plate (37). The plug-in rod (39) passes through the mounting base (35) and is slidably connected to the mounting base (35). The plug rod (39) is flush with the through hole (30). A through groove (40) is provided on the lifting plate (37). A strip tooth (41) is provided on one side wall of the vertical direction of the through groove (40). A transmission gear (42) is rotatably provided on the mounting base (35). The transmission gear (42) is located inside the through groove (40) and meshes with the strip tooth (41). The extension rod (83) is a threaded rod. The extension rod (83) passes through the transmission gear (42) and is threadedly connected to the transmission gear (42).

5. The multi-chip wafer packaging system according to claim 1, characterized in that: The first frame (2) is provided with a mounting ring groove (43) on the side facing the second frame (6), and a buffer pad ring (44) for buffering and shock absorption is snapped into the mounting ring groove (43).

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