Clamping structure for transporting microelectronic chips
By designing a clamping structure including a top cover plate, a vertical plate, a rubber plate, a protective shell, a sponge pad, a limit card block and a limit frame, the transportation stability and safety of microelectronic chips in the prior art are solved, and effective protection and transportation safety improvement of chips of different sizes and shapes are achieved.
Patent Information
- Application Number
- CN202422470574.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-13
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-10-13
AI Technical Summary
When the existing microelectronic chip transport clamping structure faces chips of different sizes and shapes, it is difficult to ensure transportation stability and safety, resulting in the possibility of damage to the chip during transportation.
A clamping structure including a top cover plate, a vertical plate, a rubber plate, a protective shell, a sponge pad, a limiting card block and a limiting frame is designed. Through the cooperation of these components, it can adapt to chips of different sizes and shapes, and buffer the impact and vibration during transportation through the absorption of the rubber plate and a sponge pad.
The clamping structure can effectively protect the microelectronic chip from damage during transportation, improve the service life of the chip, and adapt to chips of different sizes and shapes, improving transportation flexibility and safety.
Smart Images
Figure CN222876646U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic chip transportation, in particular to a clamping structure used for transporting microelectronic chips. Background Art
[0002] The clamping structure design of microelectronic chips during transportation is crucial, because improper clamping may cause chip damage, affecting product reliability and performance. The clamping structure design of microelectronic chips during transportation is crucial, because improper clamping may cause chip damage, affecting product reliability and performance.
[0003] Comparative announcement number CN 216928554 U microelectronic chip transport clamping structure, including a concave block, on which a concave cavity is opened; a bottom plate, which can be slidably arranged in the concave cavity along the opening of the concave cavity; a first buffer pad, arranged on the bottom plate, and a holding groove is opened on the top of the bottom plate, and the size of the holding groove matches the body size of the microelectronic chip; a limit block, arranged on the first buffer pad, a plurality of the limit blocks are located on the outer edge of the top of the first buffer pad and surround the holding groove, and optionally, two oppositely arranged first grooves are arranged on the inner wall of the concave block, the first grooves are arranged along the opening direction of the concave cavity, and the first grooves are close to the concave One end of the cavity opening is open, and the first groove is closed at one end away from the cavity opening. Optionally, along the opening direction of the cavity, the size of the bottom plate matches the size of the cavity; two second grooves arranged opposite to each other are arranged on the bottom plate, and when the bottom plate is arranged in the cavity, the second grooves are aligned with the first grooves, and the first buffer pad provided with a holding groove cooperates with the limit block to effectively limit and fix the microelectronic chip placed on the first buffer pad, so that the microelectronic chip will not slide during transportation, thereby realizing protection of the microelectronic chip and improving the service life of the microelectronic chip.
[0004] The microelectronic chip transport and clamping structure can effectively limit and fix the microelectronic chip placed on the first buffer pad by cooperating with the limit block through the first buffer pad provided with a containing groove, so that the microelectronic chip will not slide during transportation, thereby protecting the microelectronic chip and improving the service life of the microelectronic chip. However, when the equipment as a whole transports and clamps products, it is not convenient to limit the stability during transportation according to the different sizes of products due to the different models of the products. Utility Model Content
[0005] In order to solve the above technical problems, the utility model provides a clamping structure for transporting microelectronic chips.
[0006] The utility model is implemented by the following technical scheme: a clamping structure for transporting microelectronic chips, comprising a top cover plate, the top of the top cover plate is fixedly connected with a vertical plate, the top of the top cover plate is fixedly connected with a first rubber plate, the bottom of the top cover plate is plugged with a protective shell, the inner wall of the protective shell is fixedly connected with a sponge pad, the top of the protective shell is provided with a mounting hole, the top of the protective shell is fixedly connected with a rubber ring, the top of the protective shell is provided with a distance adjustment hole, the top of the protective shell is provided with a sliding groove, the interior of the sliding groove is slidably connected to a limiting block, the left and right ends of the limiting block are fixedly connected with a connecting plate, the interior of the connecting plate is plugged with a limiting frame, and the bottom of the protective shell is fixedly connected with a second rubber plate.
[0007] Through the above technical solution, the overall device can adapt to chips of different sizes and shapes and has a certain adjustment range and flexibility.
[0008] As a further improvement of the above solution, the number of the first rubber plates is set to four, and two of them form a group. The four first rubber plates are symmetrically distributed left and right with the top cover plate as the center, and the number of the mounting holes is set to four.
[0009] As a further improvement of the above solution, a top cover plate is inserted into the interior of the mounting hole, the number of the sponge pads is set to four, the number of the distance adjustment holes is set to several, and each two form a group.
[0010] Through the above technical solution, the sponge pad and the rubber sheet can absorb the impact and vibration that may be encountered during transportation.
[0011] As a further improvement of the above solution, the distance adjustment holes are symmetrically distributed with the sliding groove as the center, the number of the limit blocks is set to four, and the four limit blocks are symmetrically distributed with the protective shell as the center.
[0012] As a further improvement of the above solution, the number of the limiting frames is set to four, and the four limiting frames are symmetrically distributed left and right with the top cover plate as the center.
[0013] As a further improvement of the above solution, the limit frame passes through the connecting plate and extends to the inside of the protective shell and the distance adjustment hole.
[0014] As a further improvement of the above solution, the top of the sponge pad contacts the surface of the top cover plate, the number of the second rubber plates is set to four, and the four second rubber plates are symmetrically distributed left and right with the protective shell as the center.
[0015] Compared with the prior art, the beneficial effects of the present invention are:
[0016] The utility model drives the top cover plate to slide out from the inside of the protective shell and the mounting hole by pulling the vertical plate, and when the microelectronic chip is placed on the rubber ring, it is slid out from the inside of the connecting plate and the distance-adjusting hole by pulling the limiting frame, and the limiting card block is pushed to slide in the sliding groove and the inside of the protective shell. When the limiting card block moves to a corner close to the microelectronic chip, the limiting frame is inserted into the inside of the protective shell and the distance-adjusting hole, so that four limiting card blocks can limit the microelectronic chip placed on the top of the rubber ring, so as to prevent the microelectronic chip from shaking inside the device when the whole device is moved and transported, thereby causing damage to the microelectronic chip inside the top cover plate and the protective shell.
[0017] The utility model can protect and buffer the microelectronic chip inside the top cover plate from a relatively small external impact force by arranging the first rubber plate on the top of the top cover plate and the second rubber plate on the bottom of the protective shell, so as to avoid the top cover plate and the protective shell being deformed and damaging the microelectronic chip inside when the external impact force contacts the surfaces of the top cover plate and the protective shell, thereby improving the safety of the whole device when transporting the microelectronic chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0019] Figure 2 This is a schematic diagram of the split structure of the top cover plate of the utility model;
[0020] Figure 3 This is an enlarged schematic diagram of the structure at A of the utility model;
[0021] Figure 4 This is a schematic diagram of the front anatomical structure of the utility model;
[0022] Figure 5 It is a schematic diagram of the structure of the utility model when viewed from above.
[0023] Description of main symbols:
[0024] 1. Top cover plate; 2. Vertical plate; 3. First rubber plate; 4. Protective shell; 5. Sponge pad; 6. Mounting hole; 7. Rubber ring; 8. Adjustment hole; 9. Sliding groove; 10. Limit block; 11. Connecting plate; 12. Limit frame; 13. Second rubber plate. DETAILED DESCRIPTION
[0025] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.
[0026] Example:
[0027] Please combine Figure 1-5 A clamping structure for transporting microelectronic chips in this embodiment includes a top cover plate 1, a vertical plate 2 is fixedly connected to the top of the top cover plate 1, a first rubber plate 3 is fixedly connected to the top of the top cover plate 1, a protective shell 4 is plugged into the bottom of the top cover plate 1, a sponge pad 5 is fixedly connected to the inner wall of the protective shell 4, a mounting hole 6 is opened on the top of the protective shell 4, a rubber ring 7 is fixedly connected to the top of the protective shell 4, a distance adjustment hole 8 is opened on the top of the protective shell 4, a sliding groove 9 is opened on the top of the protective shell 4, a limited card block 10 is slidably connected inside the sliding groove 9, a connecting plate 11 is fixedly connected to the left and right ends of the limiting card block 10, a limiting frame 12 is plugged into the inside of the connecting plate 11, and a second rubber plate 13 is fixedly connected to the bottom of the protective shell 4, The top cover plate 1 is driven to slide out from the inside of the protective shell 4 and the mounting hole 6 by pulling the vertical plate 2. When the microelectronic chip is placed on the rubber ring 7, it is slid out from the inside of the connecting plate 11 and the distance adjustment hole 8 by pulling the limit frame 12, and the limit card block 10 is pushed to slide in the sliding groove 9 and the inside of the protective shell 4. When the limit card block 10 moves to a corner close to the microelectronic chip, the limit frame 12 is inserted into the inside of the protective shell 4 and the distance adjustment hole 8, so that the four limit card blocks 10 can be used to limit the microelectronic chip placed on the top of the rubber ring 7, so as to prevent the microelectronic chip from shaking inside the device when the device is moved and transported as a whole, causing damage to the microelectronic chip inside the top cover plate 1 and the protective shell 4.
[0028] The device as a whole can adapt to chips of different sizes and shapes, and has a certain adjustment range and flexibility.
[0029] The number of the first rubber plates 3 is set to four, and two of them form a group. The four first rubber plates 3 are symmetrically distributed with the top cover plate 1 as the center, and the number of the mounting holes 6 is set to four.
[0030] The top cover plate 1 is inserted into the interior of the mounting hole 6, the number of the sponge pads 5 is set to four, the number of the distance adjustment holes 8 is set to a plurality, and each two form a group.
[0031] Sponge pads 5 and rubber sheets are used to absorb the impact and vibration that may be encountered during transportation.
[0032] The distance adjustment holes 8 are symmetrically distributed with the sliding groove 9 as the center. The number of the limit blocks 10 is set to four, and the four limit blocks 10 are symmetrically distributed with the protective shell 4 as the center.
[0033] The number of the limit frames 12 is set to four, and the four limit frames 12 are symmetrically distributed left and right with the top cover plate 1 as the center. By arranging the first rubber plate 3 on the top of the top cover plate 1 and the second rubber plate 13 at the bottom of the protective shell 4, the microelectronic chip inside the two can be protected and buffered from a small external impact force, thereby preventing the top cover plate 1 and the protective shell 4 from being deformed when the external impact force contacts the surface of the top cover plate 1 and the protective shell 4, thereby damaging the internal microelectronic chip, thereby improving the safety of the overall equipment when transporting the microelectronic chip.
[0034] The limiting frame 12 passes through the connecting plate 11 and extends to the inside of the protective housing 4 and the distance adjustment hole 8 .
[0035] The top of the sponge pad 5 contacts the surface of the top cover plate 1 . The number of the second rubber plates 13 is set to four, and the four second rubber plates 13 are symmetrically distributed around the protective shell 4 .
[0036] The implementation principle of a clamping structure for transporting microelectronic chips in the embodiment of the present application is as follows: by pulling the vertical plate 2, the top cover plate 1 is driven to slide out from the inside of the protective shell 4 and the mounting hole 6. When the microelectronic chip is placed on the rubber ring 7, the limit frame 12 is pulled to slide out from the inside of the connecting plate 11 and the distance adjustment hole 8, and the limit card block 10 is pushed to slide in the sliding groove 9 and the inside of the protective shell 4. When the limit card block 10 moves to a corner close to the microelectronic chip, the limit frame 12 is inserted into the inside of the protective shell 4 and the distance adjustment hole 8, so that the four limit card blocks 10 can be used to adjust the microelectronic chip placed on the top of the rubber ring 7. The limiting function prevents the microelectronic chip from shaking inside the device when the device as a whole is moved and transported, which may cause damage to the microelectronic chip inside the top cover plate 1 and the protective shell 4. By providing the first rubber plate 3 on the top of the top cover plate 1 and the second rubber plate 13 on the bottom of the protective shell 4, the microelectronic chip inside the two can be protected and buffered from smaller external impact forces, which prevents the top cover plate 1 and the protective shell 4 from being deformed when the external impact force contacts the surface of the top cover plate 1 and the protective shell 4, thereby damaging the internal microelectronic chip, thereby improving the safety of the device as a whole when transporting the microelectronic chip.
[0037] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.
Claims
1. A clamping structure for transporting microelectronic chips, characterized in that: The invention comprises a top cover plate (1), the top of the top cover plate (1) is fixedly connected to a vertical plate (2), the top of the top cover plate (1) is fixedly connected to a first rubber plate (3), the bottom of the top cover plate (1) is plugged with a protective shell (4), the inner wall of the protective shell (4) is fixedly connected to a sponge pad (5), the top of the protective shell (4) is provided with a mounting hole (6), the top of the protective shell (4) is fixedly connected to a rubber ring (7), the top of the protective shell (4) is provided with a distance adjustment hole (8), the top of the protective shell (4) is provided with a sliding groove (9), the interior of the sliding groove (9) is slidably connected to a limit block (10), the left and right ends of the limit block (10) are fixedly connected to a connecting plate (11), the interior of the connecting plate (11) is plugged with a limit frame (12), and the bottom of the protective shell (4) is fixedly connected to a second rubber plate (13).
2. A clamping structure for transporting microelectronic chips as claimed in claim 1, characterized in that: The number of the first rubber plates (3) is set to four, with two forming a group; the four first rubber plates (3) are symmetrically distributed with the top cover plate (1) as the center; and the number of the mounting holes (6) is set to four.
3. A clamping structure for transporting microelectronic chips as claimed in claim 1, characterized in that: The top cover plate (1) is inserted into the interior of the mounting hole (6), the number of the sponge pads (5) is set to four, and the number of the distance adjustment holes (8) is set to a plurality of holes, and each two holes form a group.
4. A clamping structure for transporting microelectronic chips as claimed in claim 3, characterized in that: The distance adjustment holes (8) are symmetrically distributed with the sliding groove (9) as the center, the number of the limit blocks (10) is set to four, and the four limit blocks (10) are symmetrically distributed with the protective shell (4) as the center.
5. A clamping structure for transporting microelectronic chips as claimed in claim 1, characterized in that: The number of the limiting frames (12) is set to four, and the four limiting frames (12) are symmetrically distributed left and right with the top cover plate (1) as the center.
6. A clamping structure for transporting microelectronic chips as claimed in claim 5, characterized in that: The limiting frame (12) penetrates the connecting plate (11) and extends to the inside of the protective housing (4) and the distance adjustment hole (8).
7. A clamping structure for transporting microelectronic chips as claimed in claim 6, characterized in that: The top of the sponge pad (5) contacts the surface of the top cover plate (1), and the number of the second rubber plates (13) is set to four, and the four second rubber plates (13) are symmetrically distributed with the protective shell (4) as the center.