Electronic expansion valve
By designing the shell, lead parts and plugs in the coil components of the electronic expansion valve, forming a housing cavity and filling the joint areas with potting materials, the problem of insufficient airtightness of the coil components is solved, and higher sealing and service life are achieved.
Patent Information
- Application Number
- CN202420575477.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-03-22
AI Technical Summary
The coil components of existing electronic expansion valves have airtight defects, and external moisture can easily enter the inside of the coil through the tail of the lead, resulting in the failure of the coil.
An electronic expansion valve is designed to introduce a housing, lead parts and plugs into the coil components to form a housing cavity and fill the contact area with potting material to enhance sealing.
It effectively improves the airtightness of the coil components, prevents external water vapor from entering, thereby extending the service life of the coil.
Smart Images
Figure CN222881428U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of refrigeration control, in particular to an electronic expansion valve. Background Art
[0002] The electronic expansion valve mainly includes a valve body for flow regulation and a coil component for driving, wherein the coil component includes: a permanent magnet stepper motor, a gear reduction mechanism with a reduction function, and a threaded substructure that converts the motor's rotational motion into the vertical motion of the screw. The coil component usually includes a lead wire, a protective cover and a gear housing. Due to the sealing performance defects of the lead wire itself, it is easy for external moisture to enter the coil through the tail of the lead wire, causing the coil to fail. Utility Model Content
[0003] The purpose of the utility model is to provide an electronic expansion valve, which can relatively improve the air tightness of the coil component of the electronic expansion valve.
[0004] To achieve the above-mentioned object, the utility model provides an electronic expansion valve, comprising a coil component, the coil component comprising a shell, a lead component and a block, at least part of the block is located in the shell, the lead component comprises a circuit board and a lead, the block is provided with a mounting hole, the circuit board passes through the mounting hole, the coil component is provided with a receiving cavity, the lower end surface of the block located on one side of the mounting hole forms part of the cavity wall of the receiving cavity, the lower end surface of the block located on the other side of the mounting hole forms another part of the cavity wall of the receiving cavity, the connecting area of the lead and the circuit board is located in the receiving cavity, the receiving cavity is at least partly filled with a potting material, and the connecting area is encapsulated by the potting material;
[0005] The electronic expansion valve provided by the present invention comprises a shell, a lead component and a blocking block, the lead component comprises a circuit board and a lead, the connecting area between the lead and the circuit board is located in a accommodating cavity, the accommodating cavity is at least partially filled with a potting material, and the connecting area is encapsulated by the potting material, which can achieve better sealing, prevent external water vapor from entering the interior of the coil component from the tail of the lead, and relatively improve the airtightness of the coil component. BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the specification and, together with the description, serve to explain the principles of the specification.
[0007] Figure 1 It is a structural schematic diagram of an electronic expansion valve in an embodiment of the utility model;
[0008] Figure 2 yes Figure 1 A partial enlarged schematic diagram of the structure, without glue filling;
[0009] Figure 3 yes Figure 1 A partial enlarged schematic diagram of the structure, glue filling state;
[0010] Figure 4 It is a schematic diagram of the structure of the lead component;
[0011] Figure 5 It is a schematic diagram of the structure of the block;
[0012] Figure 6 yes Figure 5 sectional view of
[0013] Figure 7 It is a schematic diagram of the gearbox structure.
[0014] Figure 1-Figure 7 middle:
[0015] 1. Coil component; 11. Shell; 11a. Motor cover; 11b. Gear box; 11b-1. Upper end surface; 11c. Sealing ring; 111. Accommodating cavity; 111a. Glue filling part; 112. Inner cavity; 113. Support part; 113a. Upper surface; 113b. Side; 114. Lead channel; 12. Lead component; 121. Circuit board; 1211. Lower surface; 1211a. Pressing area; 1211b. Suspended area; 122. Lead; 1221. Wire body; 1222. Encapsulation body; 1222a. Head area; 1222b. Tail end; 13. Block; 131. Mounting hole; 131a. First hole section; 131b. Second hole section; 132. Main body; 133. Stop ring; 14. Driving member; 15. Transmission member; 2. Valve body. DETAILED DESCRIPTION
[0016] The utility model provides a coil component of an electronic expansion valve and an electronic expansion valve, wherein the air tightness of the coil component is increased by changing the position of the connection area between the lead wire and the circuit board, thereby passing the air tightness test of the coil component.
[0017] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0018] The up and down directions described in this article are based on the attached Figure 1 For reference setting, Figure 1 In the figure, the height direction of the coil component 1 of the electronic expansion valve is the upward and downward direction.
[0019] Unless otherwise specified, the inward and outward directions described herein are defined with reference to the central axis of the accommodating cavity 111 / mounting hole 131. Figure 1The coil component 1 of the central electronic expansion valve extends in the height direction, with the side closer to the central axis being the inner side and the side farther from the central axis being the outer side.
[0020] Relational terms such as “first” and “second” and the like are merely used to distinguish one component from another having the same name, but do not necessarily require or imply any such actual relationship or order between these components.
[0021] Please refer to Figures 1 to 4 , Figure 1 It is a structural schematic diagram of an electronic expansion valve in an embodiment of the utility model; Figure 2 yes Figure 1 A partial enlarged schematic diagram of the structure, without glue filling; Figure 3 yes Figure 1 A partial enlarged schematic diagram of the structure, glue filling state; Figure 4 1 is a schematic diagram of the structure of the lead component 12.
[0022] As shown in the figure, the coil component 1 of the electronic expansion valve of the utility model serves as a driving component of the electronic expansion valve, and is used to drive the valve needle (not shown in the figure) in the valve body 2 of the electronic expansion valve to move and thus adjust the flow of the valve body 2. The coil component 1 of the electronic expansion valve includes a driving member 14, a transmission member 15 and a housing 11, and a part of the inner wall of the housing 11 is defined as an inner cavity 112 for accommodating the driving member 14 (for example, a motor) and the transmission member 15 (reduction gear set), and the output end of the driving member 14 is connected to the transmission member 15, and the output end of the transmission member 15 is directly or indirectly connected to the valve needle.
[0023] The housing 11 may specifically include a motor cover 11a and a gear box 11b. The motor cover 11a is sleeved on the outside of the gear box 11b and is sealedly connected to the gear box 11b through a sealing structure such as a sealing ring 11c, thereby forming an inner cavity 112 isolated from external gas. Here, the motor cover 11a defines a space in the inner cavity 112 for accommodating the motor, and the gear box 11b defines a space in the inner cavity 112 for accommodating the transmission member 15. The motor cover 11a and the gear box 11b may be a separate structure or an integrated structure, which is not specifically limited here.
[0024] The coil component 1 of the electronic expansion valve also includes a lead component 12 for achieving electrical and signal connections with the motor. A lead channel 114 is also provided in the gear box 11b. The lead channel 114 connects the inner cavity 112 with the outside of the shell 11, thereby providing a path for the lead component 12 to enter the inner cavity 112 from the outside. A block 13 is also provided in the shell 11, and at least a portion of the block 13 is inserted into the lead channel 114 to separate the lead channel 114 from the inner cavity 112 of the shell 11, and the portion of the block 13 inserted into the lead channel 114 and the wall of the lead channel 114 together define the accommodating cavity 111; the lead component 12 specifically includes a circuit board 121 and a lead 122 welded to the circuit board 121, thereby forming a welding area, and the welding area is generally connected and fixed to the circuit board 121 and the lead component 12 by melting lead-free welding wire; the welding area where the lead 122 is welded to the circuit board 121 is located in the accommodating cavity 111, and the accommodating cavity 111 is glued to form a glue-filled portion 111a, and the wall of the accommodating cavity 111 defines the outer structure of the glue-filled portion 111a.
[0025] It can be seen that when the welding area where the lead 122 and the circuit board 121 are welded is located inside the accommodating cavity 111, the glue-filled portion 111a formed after the accommodating cavity 111 is glue-filled will wrap the position where the lead 122 and the circuit board 121 are connected, and the connected position is defined as the connecting area between the lead 122 and the circuit board 121, thereby ensuring that the electronic expansion valve passes the airtightness test. Therefore, the connecting area includes the aforementioned welding area.
[0026] This is because, on the one hand, the lead 122 no longer extends into the inner cavity 112, but is directly arranged in the accommodating cavity 111, which can avoid leakage when the lead 122 is located in the inner cavity 112. This leakage is usually caused by the structure of the lead 122 itself. For details, see Figure 4It is understood that the lead 122 generally includes a wire body 1221 connected to the circuit board 121 and an enclosure 1222 wrapped around the wire body 1221. The top of the wire body 1221 extends from the head area 1222a of the enclosure 1222. The head area here is the area where the head end of the enclosure 1222 is located. The top of the wire body 1221 extends from the head area 1222a of the enclosure 1222 and connects to the side of the circuit board 121. Therefore, it can be determined that in the technical solution of the present invention, the connecting area of the lead 122 and the circuit board 121 is located in the accommodating cavity, and the connecting area includes the aforementioned welding area and the head area of the enclosure 1222 of the lead close to the welding area. The bottom end 1222b of the encapsulation body 1222 is arranged outside, so the external gas or vapor will enter from the bottom end 1222b of the encapsulation body 1222, and flow to the head area 1222a through the tiny gap between the wire body 1221 and the encapsulation body 1222, thereby forming a leakage point in the head area 1222a. In the present application, the area where the lead wire 122 and the circuit board 121 are connected is located in the accommodating cavity 111, thus avoiding the situation where the bottom end is located in the inner cavity 112 and the gas or vapor leaks into the inner cavity 112; On the one hand, the glue potting part 111a wraps the connecting area between the lead 122 and the circuit board 121, thereby forming a package relative to the welding area between the lead 122 and the circuit board 121. At the same time, since the head area 1222a of the encapsulation body 1222 is close to the aforementioned welding area and belongs to the connecting area between the wire body 1221 and the circuit board 121, the glue potting part 111a also blocks the head area 1222a of the encapsulation body 1222, thereby preventing external gas or vapor from leaking into the accommodating cavity 111.
[0027] In an optional manner, in order to facilitate the filling of the accommodating cavity 111 and to facilitate the installation of the lead component 12, the accommodating cavity 111 is located on the side of the block 13 away from the inner cavity 112, and the accommodating cavity 111 is connected to the outside of the housing 11. In the above embodiment, the filling of the accommodating cavity 111 can be performed by filling and curing the accommodating cavity 111 with liquid resin, and the liquid resin can directly fill the accommodating cavity 111 after the filling of the glue.
[0028] Please refer to Figure 5 , Figure 6 , Figure 5 is a schematic diagram of the structure of the block 13; Figure 6 yes Figure 5 Cross-sectional view of .
[0029] As shown in the figure, the block 13 has a mounting hole 131, and the mounting hole 131 passes through the block 13 to connect the inner cavity 112 and the lead channel 114. Part of the circuit board 121 is located in the mounting hole 131, and part of it is located in the lead channel 114. In this way, the traditional way of setting the lead 122 in the mounting hole 131 through the lead channel 114 is changed, and part of the circuit board 121 is passed through the mounting hole 131, and part of it is extended into the lead channel 114 and welded with the lead 122. Since the structure of the circuit board 121 is more regular than that of the lead 122, the gap between the lead channel 114 and the circuit board 121 can be reduced. At the same time, the block 13 plays a role in fixing the circuit board 121, simplifying the original fixing structure of the circuit board 121.
[0030] Furthermore, in order for the blocking block 13 to provide better support for the circuit board 121, the portion of the circuit board 121 located in the mounting hole 131 is in contact with at least a portion of the hole wall of the mounting hole 131. At the same time, during the assembly process, the mounting hole 131 can also play a certain guiding role for the circuit board 121.
[0031] In a more specific implementation, the mounting hole 131 specifically includes a first hole segment 131a and a second hole segment 131b. The portion of the circuit board 121 located in the first hole segment 131a fits against the hole wall of the first hole segment 131a. The hole wall of the second hole segment 131b constitutes part of the wall of the accommodating cavity 111. The inner diameter of the second hole segment 131b increases toward the side away from the first hole segment 131a. The increase is defined as including two methods of gradual increase and step-by-step increase. The gradual increase will cause the second hole segment 131b to form an inverted funnel shape, and the step-by-step increase will cause the second hole segment 131b to form an approximately trapezoidal structure as shown in the figure. Regardless of the increasing method, a structure in which the inner diameter of the second hole segment 131b is larger than the inner diameter of the first hole segment 131a will be formed.
[0032] In this way, on the one hand, the inner diameter of the second hole section 131b is larger, which is convenient for installing the lead component 12; on the other hand, the contact area between the glue filling part 111a and the mounting hole 131 is increased. That is to say, here, the wall of the second hole section 131b also defines the outer structure of part of the glue filling part 111a. The glue filling part 111a will be filled into the second hole section 131b during the glue filling process, and at the same time wrap the part of the circuit board 121 located in the second hole section 131b. The glue filling part 111a located in the second hole section 131b also blocks the mounting hole 131, thereby forming an airtight seal between the inner cavity 112 and the outside.
[0033] In this implementation, the area where the lead 122 and the circuit board 121 meet is located outside the second hole section 131b, thereby increasing the area of the lead component 12 covered by the glue potting part 111a and improving the sealing performance. Of course, the part where the lead 122 and the circuit board 121 meet can also be located inside the second hole section 131b.
[0034] Please continue to refer to Figure 2 as well as Figure 7 , Figure 7 It is a schematic structural diagram of the gear box 11b.
[0035] As shown in the figure, in order to increase the supporting strength of the circuit board 121, the lead channel 114 is provided with a supporting portion 113, and the supporting portion 113 of the lead channel 114 is integrally formed with the wall portion of the lead channel 114, and the supporting portion 113 is formed by protruding inwardly from the inner wall of the lead channel 114, and the lower surface 1211 of the circuit board 121 is at least partially pressed against the upper surface 113a of the supporting portion 113, so that the upper surface 113a of the supporting portion 113 supports the circuit board 121 in the height direction.
[0036] Furthermore, the lower surface 1211 of the circuit board 121 is provided with a pressing area 1211a and a suspended area 1211b in sequence in the thickness direction thereof, the pressing area 1211a is pressed against the upper surface 113a of the support portion 113, the suspended area 1211b is staggered from the upper surface 113a of the support portion 113, and the suspended area 1211b is suspended in the lead channel 114 when no glue is poured; the head area 1222a of the wire body 1221 is connected to the side of the circuit board 121, and the end surface of the head area 1222a of the encapsulation body 1222 is pressed against the suspended area 1211b. Therefore, in the height direction, the lower surface 1211 of the circuit board 121 is partially pressed against the upper surface 113a of the support portion 113, and the end surface of the head area 1222a of the enclosure 1222 is basically located at the same height as the upper surface 113a of the support portion 113. In this way, during the installation process, the circuit board 121 and the support portion 113 form a positioning fit, and the end surface of the head area 1222a of the enclosure 1222 forms a positioning fit with the circuit board 121, thereby increasing the accuracy of the installation position of the circuit board 121 and the lead 122.
[0037] Optionally, in order to support, guide and position the side of the lead 122 during installation, the support portion 113 also includes a side surface 113b connected to the upper surface 113a, and the upper surface 113a is arranged at an angle to the side surface 113b, and the upper surface 113a is perpendicular to the side surface 113b. For example, part of the outer wall of the encapsulation body 1222 is in contact with the side surface 113b.
[0038] Please continue to see Figure 1 , Figure 2 as well as Figure 7 As shown in the figure, the lead-in channel 114 passes through the gear box 11b and forms an opening on its upper end surface 11b-1. The block 13 includes a main body 132 and a stop ring 133 arranged on the outside of the main body 132. Part of the main body 132 is inserted into the lead-in channel 114 from the opening, and the stop ring 133 is pressed against the upper end surface 11b-1. The stop ring 133 can be provided to form a limited fit with the upper end surface 11b-1 of the gear box 11b during installation, thereby improving the installation accuracy of the block 13 and the gear box 11b. In this solution, the gear box 11b can be integrally cast from a zinc-aluminum alloy and is roughly cylindrical. Of course, it can also be other shapes, which are not specifically limited here.
[0039] The above is a detailed introduction to the instrument supply device provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the core idea of the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.
Claims
1. An electronic expansion valve, characterized in that: The invention comprises a coil component, wherein the coil component comprises a shell, a lead component and a blocking block, wherein at least a portion of the blocking block is located in the shell, the lead component comprises a circuit board and a lead, the blocking block is provided with a mounting hole, the circuit board passes through the mounting hole, the coil component is provided with a accommodating cavity, the lower end surface of the blocking block located on one side of the mounting hole forms a portion of the cavity wall of the accommodating cavity, the lower end surface of the blocking block located on the other side of the mounting hole forms another portion of the cavity wall of the accommodating cavity, the connecting area between the lead and the circuit board is located in the accommodating cavity, the accommodating cavity is at least partially filled with a potting material, and the connecting area is encapsulated by the potting material.
2. The electronic expansion valve according to claim 1, characterized in that: The lead wire comprises a wire body and an enclosure wrapped around the wire body, the top end of the wire body extends out from the head area of the enclosure and is connected to the side of the circuit board; The connecting area includes a welding area between the lead and the circuit board and a head area of the package of the lead close to the welding area.
3. The electronic expansion valve according to claim 2, characterized in that: The portion of the circuit board located in the mounting hole is in contact with at least a portion of the hole wall of the mounting hole.
4. The electronic expansion valve according to claim 2, characterized in that: The mounting hole comprises a first hole section and a second hole section, the hole wall of the second hole section constitutes part of the wall portion of the accommodating cavity, and the inner diameter of the second hole section increases toward the side away from the first hole section.
5. The electronic expansion valve according to claim 4, characterized in that: The connecting area between the lead wire and the circuit board is located outside the second hole segment.
6. The electronic expansion valve according to claim 2, characterized in that: The accommodating cavity is provided with a supporting portion, and the supporting portion is formed by protruding inwardly from the inner wall of the accommodating cavity, and the lower surface of the circuit board is at least partially pressed against the upper surface of the supporting portion.
7. The electronic expansion valve according to claim 6, characterized in that: The lower surface of the circuit board is provided with a pressing area and a suspended area in sequence in the thickness direction thereof, the pressing area is pressed tightly against the upper surface of the support portion, and the suspended area is staggered from the upper surface of the support portion; The lead includes a wire body and an enclosure wrapped around the wire body, the head area of the wire body extends from the head area of the enclosure and connects to the side of the circuit board, and the end surface of the head area of the enclosure abuts against the suspended area.
8. The electronic expansion valve according to claim 7, characterized in that: The support portion further includes a side surface connected to the upper surface, the upper surface and the side surface are arranged at an angle, and a portion of the outer wall of the enclosure is in contact with the side surface.
9. The electronic expansion valve according to claim 7, characterized in that: It also includes a glue filling part, which is located in the accommodating cavity and covers at least the end surface of the head area of the encapsulation body.
10. The electronic expansion valve according to any one of claims 1 to 9, characterized in that: The housing comprises a motor cover and a gear box, wherein the motor cover is sleeved on the outside of the gear box and is sealed and connected to the gear box; The guide wire channel passes through the gear box and forms an opening on its upper end surface. The block includes a main body and a stop ring arranged on the outside of the main body. Part of the main body is inserted into the guide wire channel through the opening, and the stop ring is pressed against the upper end surface.