Backboard structure and connecting device
By adopting integrated support and backplane design in the backplane structure of the chip connection device, the connection instability caused by deformation of the inlay groove after long-term use is solved, effective support for the circuit board is achieved, and contact stability and signal conduction are improved.
Patent Information
- Application Number
- CN202421421908.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-20
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-06-20
AI Technical Summary
After long-term use of the existing chip connection device, the deformation of the inlay grooves leads to unstable connection of the support inserts, which cannot effectively reduce the deformation of the circuit board, affecting the contact stability of the socket and the chip.
An integrated molded back plate structure is adopted, which includes a support member and a back plate. The surface of the support member is higher than the back plate, forming an avoidance cavity to accommodate the electronic components, and the reaction force of the support member is evenly distributed to the back plate through the integrated molded structure.
It effectively reduces the deformation of the circuit board, improves the contact stability and uniformity between the socket and the chip, enhances the signal conduction stability of the connection device, and maintains a good support effect during long-term use.
Smart Images
Figure CN222884979U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of chip connection devices, in particular to a backplane structure and a connection device. Background Art
[0002] The chip connection device is formed by sequentially stacking and assembling a backplane structure, a circuit board (PCB), a socket, a chip (CPU) and a pressure plate. The connection device is usually assembled and fixed by bolts or various clamping components. During the assembly and fixing process, excessive pressure will be applied to components such as the circuit board, causing a large deformation of the middle area between the socket and the PCB, resulting in unstable contact between the socket terminal and the chip, and then causing the connection signal of the connection device to be non-conductive.
[0003] Based on the above technical problems, the prior art embeds a raised insert in the back panel to support the circuit board. The insert is movably connected in an embedding groove opened in the back panel. The back panel structure supports the circuit board through the insert, thereby reducing the deformation of the circuit board.
[0004] However, the prior art still has the following problems:
[0005] In the backplane structure, an inlay is used to support the circuit board. When the bolts in the connection device are locked, the tightening of the bolts will apply a pulling force to the circuit board. While the inlay provides support for the circuit board, the circuit board will also use a reaction force to squeeze the inlay. The inlay is movably connected to the inlay slot opened on the backplane, so the inlay will also use a reaction force to squeeze the inlay slot. When the inlay squeezes the inlay slot for a long time, the inlay slot will be deformed, which will undoubtedly reduce the connection stability between the inlay slot and the inlay, making the connection between the inlay and the backplane loose and unstable, causing the inlay to deviate when supporting the circuit board or the height difference between the inlay and the backplane is reduced, thereby reducing the supporting effect of the backplane structure on the circuit board, and thus failing to reduce the deformation of the circuit board. In other words, the supporting effect of the inlay on the circuit board of the backplane structure using the inlay will be reduced after long-term use, and there will still be a problem of large deformation in the middle area of the circuit board. Utility Model Content
[0006] The purpose of the utility model is to overcome the deficiencies in the prior art and to provide a back plate structure and a connecting device with better supporting effect during long-term use.
[0007] The purpose of this utility model is achieved through the following technical solutions:
[0008] A back plate structure, comprising a back plate;
[0009] The back plate structure further comprises a support member, which is arranged in the middle area of the back plate and is fixedly connected to the back plate;
[0010] The surface of the support member is higher than the surface of the back plate, and the support member is used to abut against the circuit board;
[0011] A first avoidance cavity is formed between the support member and the back plate, and the first avoidance cavity is used to accommodate a first electronic component on the circuit board;
[0012] Wherein, the back plate and the support member are an integrally formed structure.
[0013] In one embodiment, the back plate is provided with a plurality of second avoidance cavities, and each of the second avoidance cavities is used to accommodate a second electronic component on the circuit board.
[0014] In one embodiment, the back plate and the support member are integrally formed by metal powder injection molding.
[0015] In one embodiment, the back plate and the support member are an integrally cast structure.
[0016] In one embodiment, the backplane structure further includes an insulating sheet, one end of which abuts against one end of the backplane, and the insulating sheet is provided with a first avoidance opening connected to the first avoidance cavity and a second avoidance opening connected to the second avoidance cavity.
[0017] In one of the embodiments, the height difference between the surface of the support member and the surface of the back plate is 0.1 mm to 2 mm.
[0018] In one embodiment, the support member is in the shape of a rectangle, a rhombus, an equilateral triangle, a circle, an ellipse, a regular pentagon, or a regular hexagon.
[0019] In one of the embodiments, the back plate structure further comprises a plurality of threaded fasteners;
[0020] The back plate is also provided with a plurality of mounting holes;
[0021] The insulating sheet is also provided with a plurality of penetration holes;
[0022] One end of each of the threaded fasteners is disposed in the corresponding mounting hole, and the other end of each of the threaded fasteners is passed through the corresponding passing hole;
[0023] A connecting device comprises the backplane structure described in any one of the above embodiments.
[0024] Compared with the prior art, the utility model has at least the following advantages:
[0025] 1. By providing a support member in the backplane structure, and the surface of the other end of the support member is higher than the upper surface of the backplane, the support member can provide a supporting force to the middle area of the circuit board and the socket board when the backplane structure is used for assembling the connecting device, effectively reducing the deformation of the circuit board, thereby effectively improving the contact stability and uniformity between the socket and the chip, and further effectively improving the stability of the signal conduction of the connecting device.
[0026] 2. A first avoidance cavity is provided in the backplane structure, so that the first electronic component on the circuit board can be accommodated in the first avoidance cavity, thereby avoiding the first electronic component of the circuit board being directly squeezed onto the backplane and causing damage to the circuit board, thereby effectively improving the practicality of the backplane structure.
[0027] 3. The back plate and the support member are formed into an integral structure. When the support member is squeezed by the reaction force of the circuit board, the integral structure can evenly disperse the reaction force on the support member to the back plate, so that the back plate and the support member are evenly stressed and not easily deformed, thereby improving the structural stability of the back plate structure, so that the support member can maintain a good supporting effect during long-term use, thereby effectively reducing the deformation of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0029] Figure 1 is a structural schematic diagram of a backplane structure in one embodiment;
[0030] Figure 2 for Figure 1 A schematic diagram of the structure of the back plate structure shown when no insulating sheet is installed;
[0031] Figure 3 for Figure 2 An enlarged schematic diagram of the back plate structure at point A is shown;
[0032] Figure 4 for Figure 1 Schematic diagram of the exploded structure of the back plate structure shown. DETAILED DESCRIPTION
[0033] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.
[0034] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.
[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0036] See also Figures 1 to 4 In order to better understand the backplane structure 10 of the present disclosure, the backplane structure 10 is further explained below:
[0037] A backplane structure 10 of an embodiment includes a backplane 100 and a support member 200, wherein the support member 200 is disposed in the middle area of the backplane 100, and the support member 200 is fixedly connected to the backplane 100. One end of the support member 200 is fixedly connected to one end of the backplane 100. The surface of the support member 200 is higher than the surface of the backplane 100, so as to abut against the circuit board. A first avoidance cavity 101 is formed between the support member 200 and the backplane 100, and the first avoidance cavity 101 is used to accommodate a first electronic component on the circuit board. The backplane 100 and the support member 200 are an integrally formed structure.
[0038] In this embodiment, by providing a support member 200 in the backplane structure 10, the support member 200 supports the circuit board during the assembly of the connecting device, thereby effectively reducing the deformation caused by the pulling force generated when the bolts of the connecting device are locked and fixed on the circuit board. In this way, the concave deformation of the circuit board can be reduced, and the contact between the socket on the circuit board and the terminal on the chip is more uniform and stable, which effectively improves the signal conduction between the chip and the circuit board.
[0039] It should be noted that the first avoidance cavity 101 is adapted to the first electronic component in the circuit board, so that the first electronic component on the circuit board can be accommodated in the first avoidance cavity 101. When the connecting device is assembled, it is avoided that the electronic components of the circuit board are directly squeezed onto the back plate 100 to cause damage to the circuit board, thereby effectively improving the practicality of the back plate structure 10.
[0040] It can be understood that the back plate 100 and the support member 200 are an integrally formed structure, which makes the back plate structure 10 have better structural stability. When the connecting device is assembled, the support member 200 provides support force for the circuit board while the support member 200 is squeezed by the reaction force of the circuit board. The integrally formed structure enables the support member 200 to evenly disperse the reaction force received to the back plate 100, so that the back plate 100 and the support member 200 are evenly stressed and not easy to deform, so that the support member 200 can maintain a good supporting effect during long-term use, thereby effectively reducing the deformation of the circuit board.
[0041] like Figure 4 As shown, in one of the embodiments, the back plate 100 is provided with a plurality of second avoidance cavities 102, and each second avoidance cavity 102 is used to accommodate the second electronic component on the circuit board. It should be noted that the shape and depth of the second avoidance cavity 102 can be set according to the shape, height and other properties of the second electronic component in the circuit board, that is, the second avoidance cavity 102 is adapted to the second electronic component on the circuit board. It can be understood that the provision of a plurality of second avoidance cavities 102 on the back plate 100 can effectively improve the fault tolerance of the back plate structure 10 for supporting the circuit board, thereby enhancing the practicality of the back plate structure 10.
[0042] like Figure 4 As shown, in one embodiment, the back plate 100 and the support member 200 are metal powder injection integrally formed structures. During molding, the back plate structure 10 is integrally formed by metal powder injection, so that the back plate structure 10 has good structural stability and high scalability. Through metal powder injection integrally formed, the support member 200, the first avoidance cavity 101 and the second avoidance cavity 102 in the back plate structure 10 can be made into any shape and depth, which can match the shapes of different electronic components in the circuit board, thereby accommodating the electronic components in the circuit board, avoiding the problem of circuit board damage, and saving the use of materials, thereby effectively improving the practicality of the back plate structure 10.
[0043] In other embodiments, the back plate 100 and the support member 200 are not limited to being an integrally formed structure formed by metal powder injection molding. Figure 4As shown, in one of the embodiments, the back plate 100 and the support member 200 are an integrally cast structure, so that the integrally cast back plate 100 and the support member 200 have good structural stability, can effectively support the circuit board, reduce the deformation of the circuit board, and thus effectively enhance the contact uniformity and stability between the socket and the chip.
[0044] like Figure 1 and Figure 4 As shown, in one embodiment, the back plate structure 10 also includes an insulating sheet 300, one end of the insulating sheet 300 is abutted against one end of the back plate 100, and the insulating sheet 300 is provided with a first avoidance opening 301 connected to the first avoidance cavity 101 and a second avoidance opening 302 connected to the second avoidance cavity 102. It should be noted that the circuit board needs to be powered on to enable the socket to provide power to the chip to work normally. In this process, if electrical conduction is formed between the back plate structure 10 and the circuit board, part of the current provided to the circuit board will be diverted to the back plate structure 10, which will undoubtedly threaten the personal safety of the operator. It is understandable that the insulating sheet 300 can effectively avoid electrical conduction between the back plate structure 10 and the circuit board. By providing the first avoidance opening 301 and the second avoidance opening 302, the insulating sheet 300 is reduced in material, and the insulating sheet 300 can also be prevented from interfering with the electronic components on the circuit board to be accommodated in the first avoidance cavity 101 and the second avoidance cavity 102. It should be supplemented that the electronic components on the circuit board have an insulating shell and will not be electrically connected to the backplane structure 10 .
[0045] like Figure 3 As shown, in one embodiment, the height difference between the surface of the support member 200 and the surface of the back plate 100 is 0.1 mm to 2 mm. It can be understood that the height difference between the surface of the support member 200 and the surface of the back plate 100 is 0.1 mm to 2 mm, which enables the support member 200 to provide effective support for the circuit board, while avoiding the middle area of the circuit board bulging outward and deforming due to the excessive height of the support member 200, that is, avoiding the socket and the circuit board from being squeezed, resulting in the terminals on the socket and the circuit board being damaged and unusable.
[0046] like Figure 1 and Figure 4As shown, in one embodiment, the shape of the support member 200 is a rectangle, a rhombus, an equilateral triangle, a circle, an ellipse, a regular pentagon, or a regular hexagon. It can be understood that in this embodiment, the shape of the support member 200 is a rectangle, so that the support member 200 has good structural stability and symmetry, and can make the supporting force provided by the support member 200 act on the force points in the circuit board evenly distributed, so that the supporting force provided by the support member 200 on the circuit board is evenly distributed, that is, the circuit board is evenly stressed, which can effectively improve the uniformity of the contact between the socket and the chip, and further enhance the practicality of the backplane structure 10.
[0047] like Figure 4 As shown, in one embodiment, the back plate structure 10 further includes a plurality of threaded fasteners 400, the back plate 100 further includes a plurality of mounting holes 103, and the insulating sheet 300 further includes a plurality of through holes 303. One end of each threaded fastener 400 is disposed in the corresponding mounting hole 103, and the other end of each threaded fastener 400 is through the corresponding through hole 303. It can be understood that, by abutting one end of each threaded fastener 400 in the corresponding mounting hole 103, and the other end of each threaded fastener 400 is through the corresponding through hole 303, the back plate 100 and the insulating sheet 300 are connected in series. Each threaded fastener 400 is used to lock and fix the back plate structure 10 with other components of the connecting device, so that the back plate structure 10 is tightly connected to the circuit board, and the support member 200 can better provide support force for the circuit board, slow down the deformation of the circuit board caused by bolt fixing, thereby effectively enhancing the stability of the contact between the chip and the socket on the circuit board.
[0048] The present disclosure also provides a connection device, comprising the backplane structure described in any of the above embodiments.
[0049] In this embodiment, by adopting a backplane structure in the connection device, and by providing a support member in the backplane structure to support the circuit board, the deformation of the middle area of the circuit board caused by bolt fixing can be effectively reduced, thereby effectively enhancing the stability and uniformity of the contact between the socket on the circuit board and the chip. In addition, in the connection device, while the support member provides support force for the circuit board, the support member is squeezed by the reaction force of the circuit board, and the one-piece molding structure enables the support member to evenly disperse the reaction force received to the backplane. Even after long-term use, the support member can still provide sufficient and effective support force on the circuit board, that is, the backplane structure adopts one-piece molding and has good structural stability. Furthermore, the use of an one-piece molding process for the backplane structure can also simplify the production process of the backplane structure and reduce the production cost of the backplane structure.
[0050] Compared with the prior art, the utility model has at least the following advantages:
[0051] 1. By providing a support member in the backplane structure, and the surface of the other end of the support member is higher than the upper surface of the backplane, the support member can provide a supporting force to the middle area of the circuit board and the socket board when the backplane structure is used for assembling the connecting device, effectively reducing the concave deformation of the circuit board, thereby effectively improving the contact stability and uniformity between the socket and the chip, and further effectively improving the stability of the signal conduction of the connecting device.
[0052] 2. A first avoidance cavity is provided in the backplane structure, so that the electronic components on the circuit board can be accommodated in the first avoidance cavity, thereby avoiding the electronic components of the circuit board being directly squeezed onto the backplane and causing damage to the circuit board, thereby effectively improving the practicality of the backplane structure.
[0053] 3. The back plate and the support member are formed into an integral structure. When the support member is squeezed by the reaction force of the circuit board, the integral structure can evenly disperse the reaction force on the support member to the back plate, so that the back plate and the support member are evenly stressed and not easily deformed, thereby improving the structural stability of the back plate structure, so that the support member can maintain a good supporting effect during long-term use, thereby effectively reducing the deformation of the circuit board.
[0054] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A backplane structure, comprising a backplane, characterized in that: The back plate structure further comprises a support member, which is arranged in the middle area of the back plate and is fixedly connected to the back plate; The surface of the support member is higher than the surface of the back plate, and the support member is used to abut against the circuit board; A first avoidance cavity is formed between the support member and the back plate, and the first avoidance cavity is used to accommodate a first electronic component on the circuit board; Wherein, the back plate and the support member are an integrally formed structure.
2. The backplane structure according to claim 1, characterized in that: The back plate is provided with a plurality of second avoidance cavities, and each of the second avoidance cavities is used to accommodate a second electronic component on the circuit board.
3. The backplane structure according to claim 1, characterized in that: The back plate and the support member are integrally formed by metal powder injection molding.
4. The backplane structure according to claim 1, characterized in that: The back plate and the support member are an integrally cast structure.
5. The back plate structure according to claim 2, characterized in that: The back plate structure also includes an insulating sheet, one end of which abuts against one end of the back plate, and the insulating sheet is provided with a first avoidance opening and a second avoidance opening, the first avoidance opening is connected to the first avoidance cavity, and the second avoidance opening is connected to the second avoidance cavity.
6. The back plate structure according to claim 1, characterized in that: The height difference between the surface of the support member and the surface of the back plate is 0.1 mm to 2 mm.
7. The back plate structure according to claim 1, characterized in that: The support member is in the shape of a rectangle, a rhombus, an equilateral triangle, a circle, an ellipse, a regular pentagon, or a regular hexagon.
8. The back plate structure according to claim 5, characterized in that: The back plate structure also includes a plurality of threaded fasteners; The back plate is provided with a plurality of mounting holes, and the insulating sheet is provided with a plurality of penetration holes; One end of each of the threaded fasteners is arranged in the corresponding mounting hole, and the other end of each of the threaded fasteners is penetrated through the corresponding penetration hole.
9. A connection device, characterized in that: The backplane structure comprises the backplane structure described in any one of claims 1 to 8.