Testing device of power supply IC chip
By setting partitions and shrapnels at the bottom of the test chamber of the power supply IC chip test device, the problem of poor compatibility of existing test devices is solved, and efficient testing of chips in various packaging forms is achieved, reducing testing costs and time.
Patent Information
- Application Number
- CN202421570317.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-05-20
- Estimated Expiration
- 2034-07-03
AI Technical Summary
The existing power supply IC chip test devices have to be customized according to a specific package form, resulting in poor compatibility, which increases testing cost and time.
A test device for power supply IC chips is designed. By setting a row of partitions at the bottom of the test chamber and clamping a certain elastic and adjustable shrapnel between adjacent partitions, the shrapnel is used to conduct conductive contact with chips of different packaging forms and test circuit boards, and the testing chips in various packaging forms are realized.
It improves the compatibility of the test device and can adapt to the testing needs of power supply IC chips in different packaging forms such as BGA and LGA, reducing the testing cost and time.
Smart Images
Figure CN222887710U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of IC chip testing devices, and particularly relates to a testing device for power supply IC chips. Background Art
[0002] With the rapid development of technology, the requirements for power management in electronic devices are becoming increasingly strict. As a key component in electronic devices, the performance stability and reliability of power supply IC chips directly affect the operation efficiency and safety of the entire device. Therefore, it is particularly important to accurately test power supply IC chips.
[0003] Existing power supply IC chip testing devices usually include a testing platform and a series of test fixtures. The testing platform provides stable support and electrical connection, while the test fixtures are used to fix and connect the power supply IC chips to be tested. Specifically, the testing platform usually has a flat surface for placing the chips, and the test fixtures are customized according to the package form of the chips (such as BGA, LGA, etc.) and fixed on the testing platform by means of screws or buckles. During the testing process, the chips are placed on the testing platform, and then their pins are connected to the electrical interfaces of the testing platform through the test fixtures to perform performance testing. However, since the test fixtures are customized according to chips of specific package forms, the compatibility is poor. Therefore, once chips of different package forms need to be replaced, the corresponding test fixtures need to be replaced, which greatly increases the testing cost and time.
[0004] Therefore, the inventor is committed to designing a testing device to solve the above problems. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a testing device for power supply IC chips, which can be compatible with testing power supply IC chips of multiple package forms and reduce the testing cost and time.
[0006] In order to achieve the above purpose, a technical solution adopted by the utility model is as follows:
[0007] A testing device for power supply IC chips includes a fixed seat and a cover body. The cover body is covered on the fixed seat to form a testing cavity. A row of partition plates are arranged side by side and inlaid at the bottom of the testing cavity. A group of elastic pieces are clamped between adjacent two partition plates. One end of the elastic piece extends into the testing cavity, and the other end of the elastic piece extends out of the fixed seat and is exposed on the bottom surface of the fixed seat.
[0008] As an improvement of the testing device for power supply IC chips of the utility model, the elastic piece is integrally C-shaped. Adjacent two partition plates are mutually covered to form a receiving cavity. The same group of elastic pieces are arranged at intervals in the receiving cavity, and both ends of each elastic piece slide and extend out of all the partition plates.
[0009] As an improvement to the test device for the power supply IC chip of the present utility model, one end of the elastic sheet is U-shaped and is separated by a first groove to form a pair of first bosses, and the other end of the elastic sheet is U-shaped and is separated by a second groove to form a pair of second bosses.
[0010] As an improvement to the test device for the power supply IC chip of the present utility model, the first groove is arc-shaped and is used to cooperate with the solder balls at the bottom of the BAG chip. The first groove and the pair of first bosses are both located in the test cavity, and the second groove and the pair of second bosses are both exposed on the bottom surface of the fixing base.
[0011] As an improvement to the test device for the power supply IC chip of the present utility model, the second groove and the pair of second bosses are both located in the test cavity, and the first groove and the pair of first bosses are both exposed on the bottom surface of the fixing base.
[0012] As an improvement to the test device for the power supply IC chip of the present utility model, the cover body includes a cover plate, a fixing shell and a pressing plate. The fixing shell is embedded in the upper fixing groove on the cover closing surface of the cover plate, and the pressing plate protrudes and is inserted into the fixing shell and is floatingly connected to the fixing frame.
[0013] As an improvement to the test device for the power supply IC chip of the present utility model, a limiting shaft is commonly inserted through the cover plate and the fixing shell. The bottom cover closing surface of the fixing shell is hollowed out to form a floating groove. The limiting shaft is located in the floating groove. The pressing plate is inserted into the floating groove. A limiting through groove is provided at the top of the pressing plate, and the limiting shaft is located in the limiting through groove. The depth of the limiting through groove is greater than the diameter of the limiting groove.
[0014] As an improvement to the test device for the power supply IC chip of the present utility model, a plurality of upper buckles are provided at the top of the pressing plate, and a plurality of upper clamping holes are provided in the floating groove at the bottom of the fixing shell. All the upper buckles pass through all the upper clamping holes one by one and are movably hung on the fixing shell.
[0015] As an improvement to the test device for the power supply IC chip of the present utility model, one end of the cover body is hinged to the fixing base, and a buckling cover is hinged to the other end of the cover body. The buckling cover is buckled with the fixing base.
[0016] As an improvement to the test device for the power supply IC chip of the present utility model, the fixing base includes a base and a limiting frame. A lower fixing groove is provided on the cover closing surface of the base, and a through hole is provided at the bottom of the lower fixing groove. All the partition plates and all the elastic sheets are located in the through hole. The limiting frame is located in the lower fixing groove and is snap-fitted with the base for limiting.
[0017] Compared with the prior art, the test device for the power supply IC chip of the present utility model realizes the test of the power supply IC chip by arranging a row of partitions at the bottom of the test cavity, and clamping a set of elastic and adjustable shrapnel between two adjacent partitions. One end of the shrapnel is in conductive contact with the power supply IC chips of different packaging forms in the test cavity, and the other end of the shrapnel is in conductive contact with the test circuit board. By adjusting the upright or inverted state of the shrapnel, the test requirements of power supply IC chips with different packaging forms such as BGA and LGA are met, greatly improving the compatibility of the test device and reducing the test cost and time. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a perspective view of the test device for the power supply IC chip according to the first embodiment of the present utility model;
[0019] Figure 2 is a perspective view of the test device for the power supply IC chip according to the first embodiment of the present utility model from another perspective;
[0020] Figure 3 is an exploded perspective view of the cover body according to the first embodiment of the present utility model;
[0021] Figure 4 is an exploded perspective view of the cover body according to the first embodiment of the present utility model from another perspective;
[0022] Figure 5 is an exploded perspective view of the fixed seat and a row of partitions according to the first embodiment of the present utility model;
[0023] Figure 6 is a partially enlarged exploded perspective view of a row of partitions and multiple groups of shrapnel according to the first embodiment of the present utility model;
[0024] Figure 7 is an enlarged perspective view of the shrapnel according to the first embodiment of the present utility model;
[0025] Figure 8 is a cross-sectional view of the test device for the power supply IC chip according to the first embodiment of the present utility model;
[0026] Figure 9 is Figure 8 the enlarged view of part A in
[0027] Figure 10 is a perspective view of the test device for the power supply IC chip according to the second embodiment of the present utility model;
[0028] Figure 11 is a perspective view of the test device for the power supply IC chip according to the second embodiment of the present utility model from another perspective;
[0029] Figure 12It is an enlarged three-dimensional exploded view of a row of partition plates and multiple groups of elastic pieces in the second embodiment of the present utility model;
[0030] Figure 13 It is a cross-sectional view of a test device for a power supply IC chip in the second embodiment of the present utility model;
[0031] Figure 14 It is Figure 13 an enlarged view of part B in
[0032] Illustration:
[0033] 1. Base; 11. Lower fixing groove; 12. Lower buckle; 13. Limit pin; 14. Through hole; 15. Clamping table; 2. Limit frame; 21. Lower clamping hole; 22. Fixed seat; 221. Test cavity; 3. Partition plate; 31. Receiving cavity; 4. Elastic piece; 41. First groove; 42. First boss; 43. Second groove; 44. Second boss; 5. Cover plate; 51. Upper fixing groove; 52. Limit shaft; 53. Cover body; 6. Fixed shell; 61. Fixed hole; 62. Floating groove; 63. Upper clamping hole; 7. Pressing plate; 71. Upper buckle; 72. Limit through groove; 8. Buckling cover; 81. Buckling part; 9. BGA chip; 91. Solder ball; 92. Test circuit board; 93. Conductive copper foil; 94. LGA chip; 95. Metal contact point. Specific implementation mode
[0034] The following combines the drawings to specifically illustrate the implementation mode of the present utility model. The drawings are only for reference and illustration, and do not constitute a limitation to the scope of patent protection of the present utility model.
[0035] Embodiment 1
[0036] Refer to Figures 1 to 9 , a test device for a power supply IC chip, including a fixed seat 22, a cover body 53, a row of partition plates 3 and multiple groups of elastic pieces 4. The cover body 53 is covered on the fixed seat 22 to form a test cavity 221. A row of partition plates 3 are arranged side by side and embedded in the bottom of the test cavity 221. The same group of elastic pieces 4 are clamped between two adjacent partition plates 3. One end of each elastic piece 4 extends into the test cavity 221, and the other end of the elastic piece 4 extends outside the fixed seat 22 and is exposed on the bottom surface of the fixed seat 22.
[0037] Refer to Figure 1 , Figure 2 and Figure 5, the fixing base 22 includes a base 1 and a limiting frame 2. The top surface of the base 1 is its covering surface. The covering surface of the base 1 is hollowed out to form a lower fixing groove 11. A through hole 14, four lower buckles 12 and two limiting pins 13 are provided at the bottom of the lower fixing groove 11. Among them, the through hole 14 is located at the center of the bottom of the lower fixing groove 11. The two limiting pins 13 and the four lower buckles 12 are arranged at intervals in a circle around the through hole 14 and are vertically arranged at the bottom of the lower fixing groove 11. The two limiting pins 13 are arranged along the diagonal of the lower fixing groove 11. A long strip-shaped clamping platform 15 is provided at one edge of the base 1. The limiting frame 2 is integrally in a frame shape and is located in the lower fixing groove 11. Four lower clamping holes 21 are provided on the limiting frame 2. The four lower buckles 12 are respectively and correspondingly clamped with the four lower clamping holes 21, so that the limiting frame 2 is snap-connected with the base 1. Two limiting holes are provided at the bottom of the limiting frame 2. The two limiting pins 13 are respectively and correspondingly in limiting cooperation with the two limiting holes, so that the limiting frame 2 is in limiting connection with the base 1.
[0038] Referring to Figure 6 and Figure 7 , all the partition plates 3 and all the elastic pieces 4 are located in the through hole 14 of the base 1. In the present utility model, the partition plates 3 in the same row are composed of a plurality of single partition plates 3 arranged in a row. Each partition plate 3 is in a long strip shape. One side of the partition plate 3 is concave. Two adjacent partition plates 3 are covered with each other to form a receiving cavity 31. The same group of elastic pieces 4 are arranged at intervals in the same receiving cavity 31. Each elastic piece 4 is integrally in a C shape. Both ends of each elastic piece 4 slide out of all the partition plates 3. When the elastic piece 4 is compressed up and down, the C-shaped part in the middle of the elastic piece 4 deforms. At this time, its resilience can achieve the purpose of contacting up and down. Because the length of the C-shaped structure can be made very short and the relative impedance of itself can be made very low, therefore, in actual tests, a larger test current, a higher voltage and a higher test frequency can be passed to meet the increasingly higher test requirements. Both ends of each elastic piece 4 are in a U shape. One end of each elastic piece 4 is separated by a first groove 41 to form a pair of first convex platforms 42. The other end of the elastic piece 4 is separated by a second groove 43 to form a pair of second convex platforms 44. Specifically, in this embodiment, all the elastic pieces 4 are in the normal installation state, that is: the first groove 41 and the pair of first convex platforms 42 on each elastic piece 4 are both located at its top. The first groove 41 is in an arc shape and is used to cooperate with the solder balls 91 at the bottom of the BGA chip 9. The first groove 41 and the pair of first convex platforms 42 on each elastic piece 4 are both located in the test cavity 221. The second groove 43 and the pair of second convex platforms 44 are both exposed on the bottom surface of the base 1, so that the pair of second convex platforms 44 can be in electrical contact with the conductive copper foil 93 on the test circuit board 92.
[0039] Referring to Figures 1 to 4, the cover body 53 includes a cover plate 5, a fixed shell 6 and a pressing plate 7. The bottom surface of the cover plate 5 is its covering surface. The covering surface of the cover plate 5 is hollowed out to form an upper fixing groove 51. A limiting shaft 52 is arranged in the upper fixing groove 51. The limiting shaft 52 vertically penetrates through the two opposite side walls of the upper fixing groove 51. One end of the cover plate 5 is hinged to the base 1, and a Y-shaped fastening cover 8 is hinged to the other end of the cover plate 5. A fastening portion 81 is arranged at the bottom of the fastening cover 8. When the cover plate 5 is covered with the base 1, the fastening portion 81 is fastened to the clamping platform 15, so that the fastening cover 8 is fastened to the base 1. The whole fixed shell 6 is embedded in the upper fixing groove 51 of the cover plate 5. The covering surface at the bottom of the fixed shell 6 is hollowed out to form a floating groove 62. Four upper clamping holes 63 are arranged in the floating groove 62. Fixing holes 61 are respectively arranged on the two opposite side walls of the floating groove 62. The limiting shaft 52 passes through the two fixing holes 61, so that the central part of the limiting shaft 52 is located in the floating groove 62. The pressing plate 7 protrudes and is inserted into the fixed shell 6 and is floatingly connected with the fixed shell 6. Specifically, a long strip-shaped limiting through groove 72 and four upper buckles 71 are arranged at the top of the pressing plate 7. The depth of the limiting through groove 72 is greater than the diameter of the limiting shaft 52. When the upper end of the pressing plate 7 is inserted into the floating groove 62, the limiting shaft 52 is located in the limiting through groove 72, so that the limiting shaft 52 is jointly inserted on the cover plate 5 and the fixed shell 6. The four upper buckles 71 respectively pass through the four upper clamping holes 63 and are movably hung on the fixed shell 6. The lower end of the pressing plate 7 is located outside the cover plate 5 and the fixed shell 6.
[0040] Referring to Figures 1 to 9 , the test device for the power IC chip in this embodiment is mainly used for testing the BGA chip 9. The test method of this test device is as follows:
[0041] Fix the base 1 of the whole test device on a test circuit board 92, so that multiple pairs of second convex platforms 44 exposed at the bottom of the base 1 are in one-to-one correspondence and conductive connection with multiple conductive copper foils 93 on the upper surface of the test circuit board 92;
[0042] Place the BGA chip 9 in the limiting frame 2. At this time, multiple first grooves 41 in the test cavity 221 are in one-to-one correspondence and fit with multiple solder balls 91 at the bottom of the BGA chip 9, reducing the indentation of the elastic sheet 4 on the solder balls 91, making the transmission path of the elastic sheet 4 short and the overcurrent large;
[0043] Cover the cover body 53, and the pressing plate 7 floats and presses down the BGA chip 9, so that multiple groups of elastic sheets 4 are elastically deformed, and the BGA chip 9 can be tightly pressed and conductively connected with the test circuit board 92 through multiple groups of elastic sheets 4 (as Figure 9 shown). At this time, the performance of the BGA chip 9 can be tested by using the circuit on the test circuit board 92.
[0044] Embodiment Two
[0045] Referring to Figures 10 to 14, which is the second embodiment of the present utility model. The difference between this embodiment and the first embodiment is that the test device for the power supply IC chip in this embodiment is mainly used to test the LGA chip 94. All the elastic pieces 4 in this embodiment are in a flipped and inverted state, that is: the second groove 43 and a pair of second bosses 44 of each elastic piece 4 are located at its top, and the first groove 41 and a pair of first bosses 42 of each elastic piece 4 are located at its bottom. Specifically, the second groove 43 and a pair of second bosses 44 on each elastic piece 4 are located in the test cavity 221, and the first groove 41 and a pair of first bosses 42 on each elastic piece 4 are exposed on the bottom surface of the base 1. Other structures are the same as those in the first embodiment and will not be elaborated here.
[0046] Referring to Figures 10 to 14 , the test device for the power supply IC chip in this embodiment can directly invert each elastic piece 4 in the first embodiment to test the LGA chip 94. During the test, a pair of second bosses 44 at the upper end of the elastic piece 4 are in conductive contact with the metal contact points 95 at the bottom of the LGA chip 94, and a pair of first bosses 42 at the lower end of the elastic piece 4 are in conductive contact with the conductive copper foil 93 on the top surface of the test circuit board 92. The LGA chip 94 can be tightly pressed and conductively connected to the test circuit board 92 through multiple groups of elastic pieces 4. The test method for the LGA chip 94 in this embodiment is basically the same as that in the first embodiment and will not be elaborated here.
[0047] For the test device of the power supply IC chip of the present utility model, a row of partitions 3 is arranged at the bottom of the test cavity 221, and a group of elastic pieces 4 with certain elasticity and adjustability are clamped between two adjacent partitions 3. One end of the elastic piece 4 is in conductive contact with the power supply IC chips with different package forms in the test cavity 221, and the other end of the elastic piece 4 is in conductive contact with the test circuit board 92, so as to realize the test of the power supply IC chip. By adjusting the upright or inverted state of the elastic piece 4, it can adapt to the test requirements of power supply IC chips with different package forms such as BGA and LGA, greatly improving the compatibility of the test device and reducing the test cost and time.
[0048] The above-disclosed are only the preferred embodiments of the present utility model, and the scope of the patent protection of the present utility model cannot be limited thereby. Therefore, equivalent changes made according to the scope of the patent application of the present utility model still fall within the scope covered by the present utility model.
Claims
1. A power IC chip testing device, comprising a fixing seat and a cover, characterized in that: The cover body is arranged on the fixing seat to form a test cavity, a row of partitions are inlaid side by side at the bottom of the test cavity, a group of spring sheets are sandwiched between two adjacent partitions, one end of the spring sheet extends into the test cavity, and the other end of the spring sheet extends out of the fixing seat and is exposed on the bottom surface of the fixing seat.
2. The power IC chip testing device according to claim 1, characterized in that: The spring pieces are in a C shape as a whole, and two adjacent partitions cover each other to form a receiving cavity. The spring pieces of the same group are arranged in the receiving cavity at intervals, and both ends of each spring piece slide and extend outside all the partitions.
3. The power IC chip testing device according to claim 1, characterized in that: One end of the spring sheet is U-shaped and is separated by a first groove to form a pair of first bosses, and the other end of the spring sheet is U-shaped and is separated by a second groove to form a pair of second bosses.
4. The power IC chip testing device according to claim 3, characterized in that: The first groove is arc-shaped and is used to cooperate with the solder ball at the bottom of the BAG chip. The first groove and the pair of the first bosses are both located in the test cavity, and the second groove and the pair of the second bosses are both exposed on the bottom surface of the fixing seat.
5. The power IC chip testing device according to claim 3, characterized in that: The second groove and the pair of the second bosses are both located in the test cavity, and the first groove and the pair of the first bosses are both exposed on the bottom surface of the fixing seat.
6. The power IC chip testing device according to claim 1, characterized in that: The cover body comprises a cover plate, a fixing shell and a pressing plate. The fixing shell is embedded in an upper fixing groove on the covering surface of the cover plate. The pressing plate is protrudingly inserted on the fixing shell and is floatingly connected with the fixing shell.
7. The power IC chip testing device according to claim 6, characterized in that: A limiting shaft is inserted into the cover plate and the fixed shell together, the bottom covering surface of the fixed shell is hollowed out to form a floating groove, the limiting shaft is located in the floating groove, the pressure plate is inserted into the floating groove, a limiting through groove is provided on the top of the pressure plate, the limiting shaft is located in the limiting through groove, and the depth of the limiting through groove is greater than the diameter of the limiting through groove.
8. The power IC chip testing device according to claim 6, characterized in that: A plurality of upper buckles are arranged on the top of the pressure plate, a plurality of upper buckle holes are arranged in the floating groove at the bottom of the fixed shell, and all the upper buckles pass through all the upper buckle holes in a one-to-one correspondence and are movably hung on the fixed shell.
9. The power IC chip testing device according to claim 1, characterized in that: One end of the cover body is hinged to the fixing seat, and the other end of the cover body is hinged to a buckle cover, and the buckle cover is buckled with the fixing seat.
10. The power IC chip testing device according to claim 1, characterized in that: The fixing seat includes a base and a limit frame, a lower fixing groove is provided on the covering surface of the base, a through hole is provided at the bottom of the lower fixing groove, all the partitions and all the spring sheets are located in the through hole, and the limit frame is located in the lower fixing groove and is limit-locked with the base.